NXP IP4223CZ6 Schematic [ru]

Download

SOT457

IP4223CZ6

Dual USB 2.0 integrated ESD protection

Rev. 1 — 17 October 2011 Product data sheet

1. Product profile

1.1 General description

The IP4223CZ6 is designed to protect I/O lines sensitive to capacitive load, such as USB 2.0, ethernet, Digital Video Interface (DVI) and so on, from damage due to ElectroSt atic Discharge (ESD). It incorporates four pairs of ultra low capacitance rail-to- rail ESD protection diodes plus a Zener diode to provide protection to signal and supply components from ESD voltages up to 8 kV contact discharge. Protection is supply voltage independent due to the rail-to-rail diodes being connected to the Zener diode. The device is encapsulated in a small 6-lead SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (Dark Green compliant)

 ESD protection up to 8 kV contact discharge; IEC 61000-4-2, level 4 compliant  Four pairs of ultra low input cap acitance (C

diodes

 Low voltage clamping due to integrated Zener diode  Small 6-lead TSOP6 (SOT457) SMD package

(I/O-GND)

= 1.5 pF) ESD rail-to-rail protection

1.3 Applications

 General-purpose downstream ESD protection for high-frequency analog signal ports

and high-speed serial data transmission ports in:

 Cellular phone and Personal Communication System (PCS) mobile handsets  PC/notebook USB 2.0/IEEE1394 ports  DVI  Cordless telephones  Wireless data (WAN/LAN) systems  Mobile Internet Devices (MID)  Portable Media Players (PMP)  High-Definition Multimedia Interface (HDMI)

NXP Semiconductors

132

018aaa142

2. Pinning information

Table 1. Pinning

Pin Symbol Description Simplified outline Graphic symbol

1 I/O 1 ESD protection 2 GND ground 3 I/O 2 ESD protection 4 I/O 3 ESD protection 5V 6 I/O 4 ESD protection

3. Ordering information

Table 2. Ordering information

Type number Package

IP4223CZ6 SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457

IP4223CZ6

Dual USB 2.0 integrated ESD protection

supply voltage

Name Description Version

4. Marking

Table 3. Marking codes

Type number Marking code

IP4223CZ6 21

5. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

ESD

stg

input voltage 0 5.5 V electrostatic discharge

voltage

IEC 61000-4-2, level 4, contact; all pins

8+8kV

storage temperature 55 +125 C

6. Recommended operating conditions

Table 5. Operating conditions

Symbol Parameter Conditions Min Typ Max Unit

amb

ambient temperature 40 - +85 C

Product data sheet Rev. 1 — 17 October 2011 2 of 9

NXP Semiconductors

018aaa159

USB 2.0

IEEE1394

CONTROLLER

BUS

D+ D– GND

BUS

D+ D– GND

IP4223CZ6

7. Characteristics

Table 6. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

(I/O-GND)

(zd-GND)

BRzd

[1] Pins 1, 3, 4 and 6. [2] Pin 5 to pin 2. [3] Pins 1, 3, 4 and 6 to ground.

IP4223CZ6

Dual USB 2.0 integrated ESD protection

=25C; unless otherwise specified.

input/output to ground capacitance

Zener diode to ground capacitance

VI=0V; f=1MHz;

=3V

VI=0V; f=1MHz;

VP=3V reverse leakage current VI=3V Zener diode breakdown

I=1mA voltage

forward voltage - 0.7 - V

[1]

--1.5pF

[2]

-40-pF

[3]

- - 100 nA

[2]

6- 9V

8. Application information

8.1 Universal serial bus 2.0 protection

The device is optimized to protect, for example, two USB 2.0 ports from ESD. Each device can protect both USB data lines and the V

Figure 1

supply line. A typical application is shown in

BUS

Fig 1. Typical application of IP4223CZ6

Product data sheet Rev. 1 — 17 October 2011 3 of 9

NXP Semiconductors

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

SOT457 SC-74

wBM

pin 1 index

detail X

v M

scale

132

0 1 2 mm

Plastic surface-mounted package (TSOP6); 6 leads SOT457

UNIT

Qywv

0.1

0.013

0.40

0.25

3.1

2.7

0.26

0.10

1.7

1.3

0.95

3.0

2.5

0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2

0.33

0.23

1.1

0.9

05-11-07 06-03-16

IP4223CZ6

Dual USB 2.0 integrated ESD protection

9. Package outline

Fig 2. Package outline SOT457 (SC-74)

Product data sheet Rev. 1 — 17 October 2011 4 of 9

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot457_fr

3.45

1.95

2.8253.3

0.45 (6×)

0.55 (6×)

0.7

(6×)

0.8

(6×)

2.4

0.95

Dimensions in mm

sot457_fw

5.3

5.05

1.45 (6×)

0.45 (2×)

1.5

(4×)

2.85

1.475

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

10. Soldering

IP4223CZ6

Dual USB 2.0 integrated ESD protection

Fig 3. Reflow soldering footprint SOT457 (SC-74)

Fig 4. Wave soldering footprint SOT457 (SC-74)

Product data sheet Rev. 1 — 17 October 2011 5 of 9

NXP Semiconductors

IP4223CZ6

Dual USB 2.0 integrated ESD protection

11. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4223CZ6 v.1 20111017 Product data sheet - -

Product data sheet Rev. 1 — 17 October 2011 6 of 9

NXP Semiconductors

IP4223CZ6

Dual USB 2.0 integrated ESD protection

12. Legal information

12.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have change d since this d ocument was p ublished and may dif fe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default ,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third part y

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

, unless otherwise

Product data sheet Rev. 1 — 17 October 2011 7 of 9

NXP Semiconductors

IP4223CZ6

Dual USB 2.0 integrated ESD protection

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neit her qua lif ied nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, custome r (a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, da mages or failed produ ct claims result ing from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks

are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 1 — 17 October 2011 8 of 9

NXP Semiconductors

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Recommended operating conditions. . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Application information. . . . . . . . . . . . . . . . . . . 3

8.1 Universal serial bus 2.0 protection . . . . . . . . . . 3

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

IP4223CZ6

Dual USB 2.0 integrated ESD protection

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 October 2011

Document identifier: IP4223CZ6

NXP IP4223CZ6 Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features and benefits

1.3 Applications

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Recommended operating conditions

7. Characteristics

8. Application information

8.1 Universal serial bus 2.0 protection

9. Package outline

10. Soldering

11. Revision history

12. Legal information

12.1 Data sheet status

12.2 Definitions

12.3 Disclaimers

12.4 Trademarks

13. Contact information

14. Contents