Datasheet IP4281CZ10 Datasheet (Philips)

IP4281CZ10

ESD protection for high-speed interfaces

Rev. 01 — 25 September 2008 Product data sheet

1. Product profile

1.1 General description

The IP4281CZ10 is designed for HDMI interface protection. The device includes
high-level ElectroStatic Discharge (ESD) protection diodes for the TMDS signal lines.

All TMDS intra-pairs are protected by a special diode configuration offering a low line
capacitance of only 0.7 pF. These diodes provide protection to downstream components
from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.

1.2 Features

n Pb-free, RoHS compliant and free of Halogen and Antimony (dark green compliant)
n ESD protection for HDMI and other LVDS data lines
n All TMDS lines with integrated rail-to-rail clamping diodes for downstream ESD

protection of ±8 kV according to IEC61000-4-2, level 4

n Matched 0.5 mm trace spacing
n TMDS lines with ≤ 0.05 pF matching capacitance between TMDS pairs
n Line capacitance of only 0.7 pF for each channel
n 4-channel, 10-terminal Ultra-Thin Leadless Package (UTLP)
n HDMI 1.3a compliant

1.3 Applications

The IP4281CZ10 is designed for HDMI receiver and transmitter port protection:

n TV, monitor
n Notebook, main board graphics card and ports
n Set-top box and game consoles
n DVD recorder and player

NXP Semiconductors

IP4281CZ10

ESD protection for high-speed interfaces

2. Pinning information

Table 1. Pinning

Pin Symbol Description Simplified outline Graphic symbol

1 TMDS_CH1− negative channel 1 ESD protection
2 TMDS_CH1+ positive channel 1 ESD protection
3 GND GND
4 TMDS_CH2− negative channel 2 ESD protection
5 TMDS_CH2+ positive channel 2 ESD protection
6 n.c. not connected
7 n.c. not connected
8 GND GND
9 n.c. not connected
10 n.c. not connected

1

2

3

4

5

Transparent top view

10

9

8

7

6

24

1 5

3, 8

001aai619

3. Ordering information

Table 2. Ordering information

Type number Package

Name Description Version

IP4281CZ10 XSON10U plastic extremely thin small outline package; no leads;

10 terminals; UTLP based; body 1 × 2.5× 0.5 mm

4. Limiting values

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

I

V

esd

input voltage GND − 0.5 +3.63 V
electrostatic discharge

voltage

all pins to ground;
IEC 61000-4-2, level 4

contact −8+8kV
air discharge −15 +15 kV

T

stg

storage temperature −55 +125 °C

5. Recommended operating conditions

SOT1059-1

Table 4. Operating conditions

Symbol Parameter Conditions Min Max Unit

T

amb

IP4281CZ10_1 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 01 — 25 September 2008 2 of 8

ambient temperature −40 +85 °C

NXP Semiconductors

IP4281CZ10

ESD protection for high-speed interfaces

6. Characteristics

Table 5. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

V

BRzd

I

LRzd

V

F

C

ch(TMDS)

∆C

ch(TMDS)

C

ch(mutual)

R

dyn

V

CL(ch)trt(pos)

Zener diode breakdown voltage I = 1 mA 6 - 9 V
Zener diode reverse leakage current per TMDS channel; V = 3.0 V - - 1 µA
forward voltage - 0.7 - V
TMDS channel capacitance f = 1 MHz; V
TMDS channel capacitance difference f = 1 MHz; V

bias
bias

= 2.5 V
= 2.5 V

mutual channel capacitance between signal pin and pin n.c.;

f = 1 MHz; V

dynamic resistance I = 1 A, T

= 2.5 V

bias

= 25 °C; IEC 61000-4-5/9

amb

[1]

- 0.7 - pF

[1]

- 0.05 - pF

[1]

- 0.07 - pF

positive transient - 2.4 - Ω
negative transient - 1.3 - Ω

positive transient channel clamping

V

= 8 kV HBM; T

esd

=25°C-8-V

amb

voltage

[1] This parameter is guaranteed by design.

IP4281CZ10_1 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 01 — 25 September 2008 3 of 8

NXP Semiconductors

7. Application information

The IP4281CZ10 is mainly designed to provide high-level ESD protection for high-speed
serial data buses such as HDMI and other LVDS data lines.

Therefore, careful printed-circuit board design with respect to impedance matching,
coupling to other signals etc. is recommended. An example showing a basic abstract view
of a layout for an HDMI interface is shown in Figure 1.

IP4281CZ10

ESD protection for high-speed interfaces

HDMI

RECEIVER

TMDS_D2+

TMDS_D2−

TMDS_D1+

TMDS_D1−

TMDS_D0+

TMDS_D0−

TMDS_CLK+

TMDS_CLK−

IP4281CZ10

IP4281CZ10

TMDS_CH2+

5

TMDS_CH2−

4

GND

3

TMDS_CH1+

2

TMDS_CH1−

1

TMDS_CH2+

5

TMDS_CH2−

4

GND

3

TMDS_CH1+

2

TMDS_CH1−

1

TMDS_D2+

TMDS_GND

TMDS_D2−

TMDS_D1+

TMDS_GND

TMDS_D1−

TMDS_D0+

TMDS_GND

TMDS_D0−

TMDS_CLK+

TMDS_GND

TMDS_CLK−

CEC

n.c.

DDC_CLK

HDMI

CONNECTOR

DDC_DAT

GND

+5 V

HOT PLUG DETECTION

001aai620

Fig 1. Application diagram

IP4281CZ10_1 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 01 — 25 September 2008 4 of 8

NXP Semiconductors

8. Package outline

XSON10U: plastic extremely thin small outline package; no leads;
10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm

IP4281CZ10

ESD protection for high-speed interfaces

SOT1059-1

terminal 1
index area

L

1

L

2

L

DIMENSIONS (mm are the original dimensions)

A

UNIT

mm 0.5

max

A

0.05

0.00

1

b D

0.25

0.15

e

E e e1e

1.1

2.6

0.9

2.4

0.5 2 0.6

51

610

0.4

0.2

L

scale

B A

v

e

2

L1L

0.15

0.00

M
M

E

Cw

0.45

0.25

A

A

1

detail X

B

AC

v

2

0.1

w y

0.05

y

1

0.05

C

y

1

0.1

C

y

X

D

e

1

b

0 0.5 1 mm

2

OUTLINE
VERSION

SOT1059-1 - - -- - -

IEC JEDEC JEITA

REFERENCES

EUROPEAN

PROJECTION

ISSUE DATE

07-12-20
08-01-18

Fig 2. Package outline SOT1059-1 (XSON10U)

IP4281CZ10_1 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 01 — 25 September 2008 5 of 8

NXP Semiconductors

ESD protection for high-speed interfaces

IP4281CZ10

9. Abbreviations

Table 6. Abbreviations

Acronym Description

DVD Digital Video Disk
ESD ElectroStatic Discharge
HBM Human Body Model
HDMI High-Definition Multimedia Interface
LVDS Low-Voltage Differential Signaling
RoHS Restriction of Hazardous Substances
TMDS Transition Minimized Differential Signaling

10. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4281CZ10_1 20080925 Product data sheet - -

IP4281CZ10_1 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 01 — 25 September 2008 6 of 8

NXP Semiconductors

11. Legal information

11.1 Data sheet status

IP4281CZ10

ESD protection for high-speed interfaces

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The productstatus of device(s)described in thisdocument may have changed sincethis document waspublished and maydiffer incase of multipledevices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information includedherein and shall haveno liability for theconsequences of
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with thesame product type number(s) andtitle. A short data sheet isintended
for quickreference only and should not be relied upon to containdetailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However,NXP Semiconductors does not give any representations or
warranties, expressedor implied, as to the accuracy orcompleteness of such
information and shall have no liability for the consequences of use of such
information.

Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedesand replaces all information supplied prior
to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or

[3]

http://www.nxp.com.

Definition

malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute MaximumRatings System of IEC 60134) may cause permanent
damage to thedevice. Limiting values arestress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at

http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights,patents
or other industrial or intellectual property rights.

11.4 Trademarks

Notice: Allreferenced brands, productnames, service names andtrademarks
are the property of their respective owners.

12. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

IP4281CZ10_1 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 01 — 25 September 2008 7 of 8

NXP Semiconductors

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Recommended operating conditions. . . . . . . . 2

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Application information. . . . . . . . . . . . . . . . . . . 4

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Contact information. . . . . . . . . . . . . . . . . . . . . . 7

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

IP4281CZ10

ESD protection for high-speed interfaces

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2008. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

Date of release: 25 September 2008
Document identifier: IP4281CZ10_1