1. Device mounted on a ceramic substrate; area = 2.5 cm2; thickness = 0.7 mm.
GRAPHICAL DATA
thermal resistance from junction to tie-point15K/W
thermal resistance from junction to ambientnote 1125K/W
3
10
handbook, halfpage
P
ZSM
(W)
2
10
10
1
−1
10
(1) Tj = 25 °C (prior to surge).
(2) Tj = 150 °C (prior to surge).
(1)
(2)
1duration (ms)
MBG801
Fig.2Maximum permissible non-repetitive peak
reverse power dissipation versus duration.
300
handbook, halfpage
I
F
(mA)
200
100
0
10
0.61
Tj = 25 °C.
0.8
MBG781
VF (V)
Fig.3Forward current as a function of forward
voltage; typical values.
2005 Feb 036
NXP SemiconductorsProduct data sheet
Voltage regulator diodesBZV49 series
handbook, full pagewidth
1
S
Z
(mV/K)
0
−1
−2
−3
-3
10
BZV49-C2V4 to C4V3.
= 25 to 150 °C.
T
j
4V3
3V9
3V6
3V3
3V0
2V7
2V4
-2
10
-1
10
IZ (A)
Fig.4 Temperature coefficient as a function of working current; typical values.
MBG927
1
10
handbook, halfpage
S
Z
(mV/K)
5
0
−5
02016
BZV49-C4V7 to C10.
T
= 25 to 150 °C.
j
10
9V1
8V2
7V5
6V8
4812
6V2
5V6
5V1
4V7
MBG924
IZ (mA)
Fig.5Temperature coefficient as a function of
working current; typical values.
2005 Feb 037
NXP SemiconductorsProduct data sheet
9
Voltage regulator diodesBZV49 series
PACKAGE OUTLINE
Plastic surface-mounted package; collector pad for good heat transfer; 3 leadsSOT8
w M
D
b
p3
123
b
p2
b
p1
e
1
e
B
A
E
L
p
H
E
c
024 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
1.6
mm
1.4
OUTLINE
VERSION
SOT89TO-243SC-62
b
p1
0.48
0.35
b
p2
0.53
0.40
IEC JEDEC JEITA
b
1.8
1.4
p3
c
0.44
0.23
D
E
4.6
2.6
4.4
2.4
REFERENCES
3.0
H
4.25
3.75
L
1.2
0.8
w
p
0.13
EUROPEAN
PROJECTION
ISSUE DATE
04-08-03
06-03-16
E
e
e
1
1.5
2005 Feb 038
NXP SemiconductorsProduct data sheet
Voltage regulator diodesBZV49 series
DATA SHEET STATUS
DOCUMENT
STATUS
Objective data sheetDevelopmentThis doc ument contains data from the objective specification for product
Preliminary data sheetQualificationThis document contains data from the preliminary specification.
Product data sheetProductionThis document contains the product specific ation.
Notes
1. Please consult the most recently issued document before initiating or comple ting a design.
2. The product status of device(s) desc ribed in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be su itable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveya nce or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
the device. Limiting values are stress ratings only an d
operation of the device at these or any other conditions
2005 Feb 039
60134) may cause permanent damage to
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
The information presented in this documen t d oes not form part of any quotation or contract, is believe d to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industri al or intellectual property rights.
Printed in The Netherlands R76/04/pp10 Date of release: 2005 Feb 03Document order number: 9397 750 13926
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