NXP BFQ591 Schematic [ru]

BFQ591
NPN 7 GHz wideband transistor
Rev. 04 — 2 October 2007 Product data sheet
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NXP Semiconductors
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
2 of 11
NPN 7 GHz wideband transistor BFQ591

FEATURES

High power gain
Low noise figure
High transition frequency
Gold metallization ensures excellent reliability.

APPLICATIONS

Intended for applications intheGHz range such as MATV or CATV amplifiers and RF communications subscribers equipment.

DESCRIPTION

NPN wideband transistor in a SOT89 plastic package.

MARKING

TYPE NUMBER MARKING CODE
BFQ591 BCp

QUICK REFERENCE DATA

PINNING

PIN DESCRIPTION
1 emitter 2 collector 3 base
321
Fig.1 Simplified outline (SOT89).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V V I P h C f
CBO CEO
C
tot FE
re
T
collector-base voltage open emitter −−20 V collector-emitter voltage open base −−15 V collector current (DC) −−200 mA total power dissipation Ts≤ 90 °C; note 1 −−2.25 W DC current gain IC= 70 mA; VCE=8V 6090250 feedback capacitance IC= 0; VCB= 12 V; f = 1 MHz 0.8 pF transition frequency IC= 70 mA; VCE=12V;
7 GHz
f = 1 GHz
G
UM
2
|s
|
21
maximum unilateral power gain IC= 70 mA; VCE=12V;
f = 900 MHz; T
amb
=25°C
insertion power gain IC= 70 mA; VCE=12V;
f = 900 MHz; T
amb
=25°C
11 dB
10 dB
Note
1. T
is the temperature at the soldering point of the collector pin.
s
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
3 of 11
NPN 7 GHz wideband transistor BFQ591

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. Tsis the temperature at the soldering point of the collector pin.

THERMAL CHARACTERISTICS

collector-base voltage open emitter 20 V collector-emitter voltage open base 15 V emitter-base voltage open collector 3V collector current (DC) 200 mA total power dissipation Ts≤ 90 °C; note 1 2.25 W storage temperature 65 +150 °C junction temperature 175 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
thermal resistance from junction
Ts≤ 90 °C; note 1 38 K/W
to soldering point
Note
1. Tsis the temperature at the soldering point of the collector pin.
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
4 of 11
NPN 7 GHz wideband transistor BFQ591

CHARACTERISTICS

Tj=25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CES
V
(BR)EBO
I
CBO
h
FE
C
re
f
T
G
UM
|s21|
V
o
2
collector-base breakdown voltage IC= 0.1 mA; IE=0 −−20 V collector-emitter breakdown
IC= 0.1 mA; IB=0 −−15 V
voltage emitter-base breakdown voltage IE= 0.1 mA; IC=0 −−3V collector-base leakage current IE= 0; VCB=10 −−100 nA DC current gain IC=70mA; VCE=8V 6090250 feedback capacitance IC= 0; VCB= 12 V; f = 1 MHz 0.8 pF transition frequency IC= 70 mA; VCE=12V;
7 GHz
f = 1 GHz
maximum unilateral power gain; note 1
IC= 70 mA; VCE=12V; T
=25°C
amb
f = 900 MHz 11 dB f = 2 GHz 5.5 dB
insertion power gain IC= 70 mA; VCE=12V;
f = 1 GHz; T
amb
=25°C
10 dB
output voltage note 2 700 mV
Notes
2
s
1. G
is the maximum unilateral power gain, assuming s12is zero and .
UM
G
UM
10 log
-------------------------------------------------------­1s
21
2
()1s
11
()
2. dim= 60 dB (DIN45004B); Vp=Vo; Vq=Vo −6 dB; fp= 795.25 MHz; fq= 803.25 MHz; fr= 803.25 MHz; measured at f
= 793.25 MHz.
(p+q+r)
dB=
2
22
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
5 of 11
NPN 7 GHz wideband transistor BFQ591
P
(W)
3
tot
2
1
0
0
handbook, halfpage
50 100 200
150
Fig.2 Power derating curve.
MLD796
Ts (°C)
250
handbook, halfpage
h
FE
200
150
100
50
0
2
10
VCE=12V.
1
10
11010
MRA749
IC (mA)
Fig.3 DC current gain as a function of collector
current; typical values.
2
1.2
handbook, halfpage
C
re
(pF)
0.8
0.4
0
0
IC= 0; f = 1 MHz.
48 16
12
VCB (V)
Fig.4 Feedback capacitance as a function of
collector-base voltage; typical values.
MLD797
handbook, halfpage
8
f
T
(GHz)
6
4
2
0
1
VCE= 12 V; f = 1 GHz.
10 10
IC (mA)
Fig.5 Transition frequency as a function of
collector current.
MLD798
2
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
6 of 11
NPN 7 GHz wideband transistor BFQ591
25
handbook, halfpage
gain (dB)
20
15
10
5
0
0
VCE= 12 V; f = 900 MHz.
40 80
IC (mA)
Fig.6 Gain as a function of collector current;
typical values.
MLD799
G
max
G
UM
120
10
handbook, halfpage
gain (dB)
8
6
4
2
0
0
VCE= 12 V; f = 2 GHz.
40 80
IC (mA)
Fig.7 Gain as a function of collector current;
typical values.
MLD800
MSG G
UM
120
40
handbook, halfpage
gain (dB)
30
MSG
20
10
0
10
IC= 70 mA; VCE=12V.
G
UM
2
10
G
max
MSG
3
10
f (MHz)
Fig.8 Gain as a function of frequency; typical
values.
MLD801
4
10
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
7 of 11
NPN 7 GHz wideband transistor BFQ591
30
handbook, halfpage
d
im
(dB)
40
50
60
70
04080
Vo= 700 mV; VCE= 12 V; T
amb
=25°C; f
(p+q+r)
IC (mA)
= 793.25 MHz.
Fig.9 Intermodulation distortion as function of
collector current; typical values.
MLD802
120
30
handbook, halfpage
d
2
(dB)
40
50
60
70
80
04080
Vo= 316 mV; VCE= 12 V; f
(p+q)
= 810 MHz.
MLD803
IC (mA)
Fig.10 Second order intermodulation distortion as
function of collector current; typical values.
120
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
8 of 11
NPN 7 GHz wideband transistor BFQ591
SPICE parameters for the BFQ591 die.
SEQUENCE No. PARAMETER VALUE UNIT
1 IS 1.341 fA 2 BF 123.5 3 NF .988 4 VAF 75.85 V 5 IKF 9.656 mA 6 ISE 232.2 fA 7 NE 2.134 8 BR 10.22 9 NR 1.016 10 VAR 1.992 V 11 IKR 294.1 mA 12 ISC 211.0 aA 13 NC 997.2 14 RB 5.00 15 IRB 1.000 µA 16 RBM 5.00 17 RE 1.275 18 RC 920.6
(1)
19 20 21
(1) (1)
XTB 0.000 EG 1.110 eV
XTI 3.000 22 CJE 3.821 pF 23 VJE 600.0 mV 24 MJE 348.5 25 TF 13.60 ps 26 XTF 71.73 27 VTF 10.28 V 28 ITF 1.929 mA 29 PTF 0.000 deg 30 CJC 1.409 fF 31 VJC 219.4 mV 32 MJC 166.5 33 XCJ 2.340 34 TR 543.7 ps
(1)
35 36 37
(1) (1)
CJS 0.000 F
VJS 750.0 mV
MJS 0.000 38 FC 733.2
handbook, halfpage
L1 L2
B
C
QLB= 50;QLE= 50;QL
= scaling frequency = 1 GHz.
f
c
L
be ce
B,E
Fig.11 Package equivalent circuit SOT89.
List of components (see Fig.11)
DESIGNATION VALUE UNIT
C
be
C
cb
C
ce
L1 1 nH L2 0.01 nH L3 1 nH L
B
L
E
C
cb
B
E'
L
L3
E
(f)=QL
B,E
(f/fc);
16 fF 150 fF 150 fF
1.2 nH
1.2 nH
CB' C'
C
E
MBC964
Note
1. These parameters have not been extracted, the default values are shown.
NXP Semiconductors Product specification
Rev. 04 - 2 October 2007
9 of 11
NPN 7 GHz wideband transistor BFQ591

PACKAGE OUTLINE

Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89
w M
D
b
p3
123
b
p2
B
b
p1
e
1
e
B
A
E
L
p
H
E
c
DIMENSIONS (mm are the original dimensions)
UNIT
mm
0 2 4 mm
scale
A
1.6
1.4
OUTLINE
VERSION
SOT89 TO-243 SC-62
b
p1
0.48
0.35
b
p2
0.53
0.40
IEC JEDEC JEITA
b
1.8
1.4
p3
c
0.44
0.23
D
E
4.6
2.6
4.4
2.4
REFERENCES
e
3.0
1.5
H
L
1.2
0.8
w
p
0.13
EUROPEAN
PROJECTION
ISSUE DATE
06-03-16 06-08-29
e
E
1
4.25
3.75
NXP Semiconductors
Rev. 04 - 2 October 2007
10 of 11

Legal information

Data sheet status

BFQ591
NPN 7 GHz wideband transistor
Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product statusof device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
[1][2]
Product status
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.
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reliable. However,NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
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[3]
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Definition
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
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Contact information

For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
NXP Semiconductors
BFQ591
NPN 7 GHz wideband transistor

Revision history

Revision history
Document ID Release date Data sheet status Change notice Supersedes
BFQ591_N_4 20071002 Product data sheet - BFQ591_3 Modifications: BFQ591_3 20020204 Product specification - BFQ591_N_2 BFQ591_N_2
(9397 750 09252) BFQ591_N_1
(9397 750 09013)
Fig. 1 and package outline updated
20020102 Preliminary specification BFQ591_N_1
20011203 Preliminary specification - -
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 October 2007
Document identifier: BFQ591_N_4
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