NXP BFG520W, BFG520W/X Schematic [ru]

BFG520W; BFG520W/X
NPN 9 GHz wideband transistors
Rev. 04 — 21 November 2007 Product data sheet
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NXP Semiconductors
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
2 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X

FEATURES

High power gain
Low noise figure
High transition frequency
Gold metallization ensures excellent reliability.

APPLICATIONS

RF front end wideband applications in the GHz range, such as analog and digital cellular telephones, cordless telephones (CT2, CT3, PCN, DECT, etc.), radar detectors, pagers, satellite television tuners (SATV) and repeater amplifiers in fibre-optic systems.

DESCRIPTION

NPN silicon planar epitaxial transistor in a 4-pin dual-emitter SOT343N plastic package.

MARKING

TYPE NUMBER CODE
BFG520W N3 BFG520W/X N4

PINNING

DESCRIPTION
PIN
BFG520W BFG520W/X
1 collector collector 2 base emitter 3 emitter base 4 emitter emitter
handbook, halfpage
Top view
Fig.1 Simplified outline SOT343N.
34
21
MBK523

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V V I P h C f G
CBO CES
C
tot
FE
re
T
UM
collector-base voltage open emitter −−20 V collector-emitter voltage RBE=0 −−15 V collector current (DC) −−70 mA total power dissipation Ts≤ 85 °C −−500 mW DC current gain IC= 20 mA; VCE= 6 V 60 120 250 feedback capacitance IC= 0; VCB= 6 V; f = 1 MHz 0.35 pF transition frequency IC= 20 mA; VCE= 6 V; f = 1 GHz; T maximum unilateral
IC= 20 mA; VCE= 6 V; f = 900 MHz; T
=25°C 9 GHz
amb
=25°C 17 dB
amb
power gain
2
|
|S
21
F noise figure Γ
insertion power gain IC= 20 mA; VCE= 6 V; f = 900 MHz; T
; IC= 5 mA; VCE= 6 V; f = 900 MHz 1.1 1.6 dB
s=Γopt
=25°C16 17 dB
amb
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
3 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
s

THERMAL CHARACTERISTICS

collector-base voltage open emitter 20 V collector-emitter voltage RBE=0 15 V emitter-base voltage open collector 2.5 V collector current (DC) 70 mA total power dissipation Ts≤ 85 °C; see Fig.2; note 1 500 mW storage temperature 65 +150 °C junction temperature 175 °C
is the temperature at the soldering point of the collector pin.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point Ts≤ 85 °C; note 1 180 K/W
Note
1. T
is the temperature at the soldering point of the collector pin.
s
150
MBG248
o
T ( C)
s
600
handbook, halfpage
P
tot
(mW)
400
200
0
0 50 100 200
Fig.2 Power derating curve.
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
4 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X

CHARACTERISTICS

T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CES
V
(BR)EBO
I
CBO
h
FE
C
re
f
T
G
UM
2
|S
|
21
F noise figure Γ
P
L1
ITO third order intercept point note 2 26 dBm V
o
d
2
collector-base breakdown voltage IC=10 µA; IE=0 20 −−V collector-emitter breakdown voltage IC=10µA; RBE=0 15 −−V emitter-base breakdown voltage IE=10µA; IC= 0 2.5 −−V collector leakage current VCB=6V; IE=0 −−50 nA DC current gain IC= 20 mA; VCE= 6 V; see Fig.3 60 120 250 feedback capacitance IC= 0; VCB= 6 V; f = 1 MHz;
0.35 pF
see Fig.4
transition frequency IC= 20 mA; VCE= 6 V; f = 1 GHz;
T
=25°C; see Fig.5
amb
maximum unilateral power gain; note 1
IC= 20 mA; VCE= 6 V; f = 900 MHz; T
=25°C
amb
I
= 20 mA; VCE= 6 V; f = 2 GHz;
C
T
=25°C
amb
insertion power gain IC= 20 mA; VCE= 6 V; f = 900 MHz;
T
=25°C
amb
; IC= 5 mA; VCE=6V;
s=Γopt
9 GHz
17 dB
11 dB
16 17 dB
1.1 1.6 dB
f = 900 MHz
Γ
; IC= 20 mA; VCE=6V;
s=Γopt
1.6 2.1 dB
f = 900 MHz
Γ
; IC= 5 mA; VCE=6V;
s=Γopt
1.85 dB
f = 2 GHz
output power at 1 dB gain compression
IC= 20 mA; VCE= 6 V; f = 900 MHz; RL=50Ω; T
amb
=25°C
17 dBm
output voltage note 3 275 mV second order intermodulation
note 4 −−50 dB
distortion
Notes
1. G
is the maximum unilateral power gain, assuming S12 is zero.
UM
2. IC= 20 mA; VCE=6V; RL=50Ω; T fp= 900 MHz; fq= 902 MHz; measured at 2fp− fq= 898 MHz and 2fq− fp= 904 MHz.
3. dim= 60 dB (DIN45004B); IC= 20 mA; VCE=6V; Vp=Vo; Vq=Vo−6 dB; Vr=Vo−6 dB; RL=75Ω; fp= 795.25 MHz; fq= 803.25 MHz; fr= 805.25 MHz; measured at fp+fq−fr= 793.25 MHz.
4. IC= 20 mA; VCE=6V; Vo=75mV; RL=75Ω; T fp= 250 MHz; fq= 560 MHz; measured at fp+fq= 810 MHz.
amb
=25°C;
amb
=25°C;
2
S
G
UM
10
-------------------------------------------------------------­1S
()1S
21
2
11
()
dB.log=
2
22
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
5 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
150
handbook, halfpage
h
FE
100
50
0
1
10
VCE=6V.
11010
I (mA)
C
Fig.3 DC current gain as a function of collector
current; typical values.
MLB807
2
0.6
handbook, halfpage
C
re
(pF)
0.4
0.2
0
0
IC= 0; f= 1 MHz.
2.5 5 7.5 10
Fig.4 Feedback capacitance as a function of
collector-base voltage; typical values.
MLB808
V (V)
CB
12
handbook, halfpage
f
T
(GHz)
8
4
0
f = 1 GHz; T
amb
=25°C.
101
I (mA)
C
Fig.5 Transition frequency as a function of
collector current; typical values.
MLB809
V =
CE
6 V
3 V
2
10
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
6 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
30
handbook, halfpage
gain (dB)
20
MSG
10
0
0
f = 900 MHz; VCE=6V.
10 20 40
30
Fig.6 Gain as a function of collector current;
typical values.
G
max
G
UM
I (mA)
C
MLB810
30
handbook, halfpage
gain (dB)
20
MSG
10
0
0
f = 2 GHz; VCE=6V.
10 20 40
30
Fig.7 Gain as a function of collector current;
typical values.
G
max
G
UM
I (mA)
C
MLB811
50
handbook, halfpage
gain (dB)
IC= 5 mA; VCE=6V.
G
40
MSG
30
20
10
0
10
Fig.8 Gain as a function of frequency;
UM
2
10
typical values.
MLB812
G
max
3
10
f (MHz)
4
10
50
handbook, halfpage
gain
(dB)
IC= 20 mA; VCE=6V.
G
40
MSG
30
20
10
0
10
UM
2
10
10
3
G
max
f (MHz)
MLB813
4
10
Fig.9 Gain as a function of frequency;
typical values.
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
7 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
30
handbook, halfpage
d
im
(dB)
40
50
60
70
01020 40
Vo= 275 mV; fp+fq−fr= 793.25 MHz; VCE=6V;
=75Ω; T
R
L
amb
=25°C.
30
Fig.10 Intermodulation distortion as a function
of collector current; typical values.
MLB818
I (mA)
C
30
MLB819
I (mA)
C
30
handbook, halfpage
d
2
(dB)
40
50
60
70
01020 40
Vo= 75 mV; fp+fq= 810 MHz; VCE=6V;
=75Ω T
R
L
amb
=25°C.
Fig.11 Second order intermodulation distortion as a
function of collector current; typical values.
4
handbook, halfpage
F
(dB)
3
2
1
0
VCE=6V.
Fig.12 Minimum noise figure as a function
of collector current; typical values.
MLB820
f = 2000 MHz
1000 MHz
900 MHz 500 MHz
I (mA)
C
f = 900 MHz
1000 MHz
2000 MHz
C
MLB821
2
10101
20
handbook, halfpage
G
ass
(dB)
15
10
5
2
10101
0
I (mA)
VCE=6V.
Fig.13 Associated available gain as a function
of collector current; typical values.
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
8 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
4
handbook, halfpage
F
(dB)
3
2
I =
C
20 mA
1
5 mA
0
10
VCE=6V.
2
3
10
Fig.14 Minimum noise figure as a function of
frequency; typical values.
f (MHz)
MLB822
f (MHz)
MLB823
4
10
20
handbook, halfpage
G
ass
(dB)
15
10
5
4
10
0
10
VCE=6V.
C
2
20 mAI = 5 mA
3
10
Fig.15 Associated available gain as a function
of frequency; typical values.
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
9 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
o
90
1
o
45
2
1.0
0.8
0.6
handbook, full pagewidth
unstable region
o
135
0.5
180
stability circle
f = 900 MHz; VCE= 6 V; IC= 5 mA; Zo=50Ω.
Fig.16 Common emitter noise figure circles; typical values.
handbook, full pagewidth
0.2
o
0.2
0
0.5
Γ
opt
F = 1.1 dB
min
1 2 5
F = 1.5 dB
5
0.4
0.2
o
00
F = 2 dB
5
o
45
MLB824
1.0
1.0
o
45
0.8
135
0.2
135
F = 3 dB
0.5
o
2
1
o
90
o
90
1
o
0.5
2
0.6
(1) Γ
; F
opt
(2) F = 2 dB. (3) F = 2.5 dB. (4) F = 3 dB. (5) Γms;G (6) G = 11 dB. (7) G = 10 dB. (8) G = 9 dB. f = 2 GHz; VCE= 6 V; IC= 5 mA; Zo=50Ω.
= 1.85 dB.
min
= 11.8 dB.
max
(4)
(3)
1
5
52
5
2
1
o
90
o
45
MLB825
180
0.2
o
0.2
0
(5)
(2)
0.5
(1)
0.2
(6)
135
(7)
0.5
o
(8)
Fig.17 Common emitter noise figure circles; typical values.
0.4
0.2
o
00
1.0
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
10 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
o
90
handbook, full pagewidth
135
1
o
0.5
o
45
2
1.0
0.8
0.6
VCE= 6 V; IC= 20 mA; Zo=50Ω.
handbook, full pagewidth
0.2 3 GHz
5
0.4
0.2
180
o
0.2
0
0.5
1
52
o
00
40 MHz
0.2
135
0.5
o
2
1
o
90
5
o
45
MLB814
1.0
Fig.18 Common emitter input reflection coefficient (S11); typical values.
o
90
135
o
o
45
VCE= 6 V; IC= 20 mA.
40 MHz
o
180
50 40 30 20 10
o
135
90
3 GHz
o
o
45
MLB815
o
0
Fig.19 Common emitter forward transmission coefficient (S21); typical values.
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
11 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
o
handbook, full pagewidth
90
VCE= 6 V; IC= 20 mA.
handbook, full pagewidth
o
135
o
180
0.25 0.20 0.15 0.10 0.05
o
135
90
3 GHz
40 MHz
o
o
45
o
0
o
45
MLB816
Fig.20 Common emitter reverse transmission coefficient (S12); typical values.
o
90
1.0
0.8
0.6
135
1
o
0.5
o
45
2
VCE= 6 V; IC= 20 mA; Zo=50Ω.
0.2
5
0.4
0.2
180
o
0.2
0
0.5
1
52
o
00
40 MHz
0.2
135
3 GHz
0.5
o
2
1
o
90
5
o
45
MLB817
1.0
Fig.21 Common emitter output reflection coefficient (S22); typical values.
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
12 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X
SPICE parameters for the BFG520W die
SEQUENCE No. PARAMETER VALUE UNIT
1 IS 1.016 fA 2 BF 220.1 3 NF 1.000 4 VAF 48.06 V 5 IKF 510 mA 6 ISE 283 fA 7 NE 2.035 8 BR 100.7 9 NR 0.988 10 VAR 1.692 V 11 IKR 2.352 mA 12 ISC 24.48 aA 13 NC 1.022 14 RB 10.00 15 IRB 1.000 µA 16 RBM 10.00 17 RE 775.3 m 18 RC 2.210
(1)
19 20 21
(1) (1)
XTB 0.000 EG 1.110 eV
XTI 3.000 22 CJE 1.245 pF 23 VJE 600.0 mV 24 MJE 0.258 25 TF 8.616 ps 26 XTF 6.788 27 VTF 1.414 V 28 ITF 110.3 mA 29 PTF 45.01 deg 30 CJC 447.6 fF 31 VJC 189.2 mV 32 MJC 0.070 33 XCJC 0.130 34 TR 543.7 ps
(1)
35
CJS 0.000 F
SEQUENCE No. PARAMETER VALUE UNIT
(1)
36 37
(1)
VJS 750.0 mV MJS 0.000
38 FC 0.780
Note
1. These parameters have not been extracted, the default values are shown.
(f)=QL
B,E
C
cb
E'
L
E
L3
E
(f/fc)
B,E
C
MBC964
handbook, halfpage
L1 L2
B
C
be ce
QLB= 50; QLE= 50; QL
= scaling frequency = 1 GHz.
f
c
L
B
Fig.22 Package equivalent circuit SOT343N.
List of components (see Fig.22)
DESIGNATION VALUE UNIT
C
be
C
cb
C
ce
70 fF 50 fF
115 fF L1 0.34 nH L2 0.10 nH L3 0.25 nH L
B
L
E
0.40 nH
0.40 nH
CB' C'
NXP Semiconductors Product specification
Rev. 04 - 21 November 2007
13 of 15
NPN 9 GHz wideband transistors BFG520W; BFG520W/X

PACKAGE OUTLINE

Plastic surface mounted package; 4 leads SOT343N
D
y
e
34
A
12
b
1
e
b
p
1
w M
B
E
H
E
A
1
detail X
AB
Q
L
p
X
v M
A
c
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE VERSION
SOT343N
1.1
0.8
0 1 2 mm
scale
A
1
A
max
0.1
b
p
0.4
0.3
IEC JEDEC EIAJ
b
1
0.7
0.5
cD
0.25
2.2
0.10
1.8
E
1.35
1.3
1.15
REFERENCES
e
H
L
e
E
1
2.2
0.45
2.0
0.15
Qwv
p
0.23
0.13
0.2y0.10.21.15
EUROPEAN
PROJECTION
ISSUE DATE
97-05-21
NXP Semiconductors
Rev. 04 - 21 November 2007
14 of 15

Legal information

Data sheet status

BFG520W; BFG520W/X
NPN 9 GHz wideband transistors
Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document mayhave changed since this document was published and may differ in case of multipledevices. The latest product status
information is available on the Internet at URL
[1][2]
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Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shallhaveno liability for the consequences of use of such information.
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[3]
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Definition
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device.Limiting valuesare stress ratings only and operationof the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
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Contact information

For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
NXP Semiconductors
BFG520W; BFG520W/X
NPN 9 GHz wideband transistors
Revision history
Revision history
Document ID Release date Data sheet status Change notice Supersedes
BFG520W_N_4 20071121 Product data sheet - BFG520W_X_3 Modifications: BFG520W_X_3 19981002 Product specification - BFG520W_2 BFG520W_2 19950824 Product specification - BFG520W_1 BFG520W_1 19940829 - - -
Page 2; text in Pinning table changed
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 November 2007
Document identifier: BFG520W_X_N_4
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