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RF front end wideband applications in the GHz range,
such as analog and digital cellular telephones, cordless
telephones (CT2, CT3, PCN, DECT, etc.), radar detectors,
pagers, satellite television tuners (SATV) and repeater
amplifiers in fibre-optic systems.
DESCRIPTION
NPN silicon planar epitaxial transistor in a 4-pin
dual-emitter SOT343N plastic package.
collector-base voltageopen emitter−−20V
collector-emitter voltage RBE=0−−15V
collector current (DC)−−70mA
total power dissipationTs≤ 85 °C−−500mW
DC current gainIC= 20 mA; VCE= 6 V60120250
feedback capacitanceIC= 0; VCB= 6 V; f = 1 MHz−0.35−pF
transition frequencyIC= 20 mA; VCE= 6 V; f = 1 GHz; T
maximum unilateral
IC= 20 mA; VCE= 6 V; f = 900 MHz; T
=25°C−9−GHz
amb
=25°C −17−dB
amb
power gain
2
|
|S
21
Fnoise figureΓ
insertion power gainIC= 20 mA; VCE= 6 V; f = 900 MHz; T
; IC= 5 mA; VCE= 6 V; f = 900 MHz−1.11.6dB
s=Γopt
=25°C1617−dB
amb
NXP SemiconductorsProduct specification
Rev. 04 - 21 November 2007
3 of 15
NPN 9 GHz wideband transistorsBFG520W; BFG520W/X
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
s
THERMAL CHARACTERISTICS
collector-base voltageopen emitter−20V
collector-emitter voltageRBE=0−15V
emitter-base voltageopen collector−2.5V
collector current (DC)−70mA
total power dissipationTs≤ 85 °C; see Fig.2; note 1−500mW
storage temperature−65+150°C
junction temperature−175°C
is the temperature at the soldering point of the collector pin.
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th j-s
thermal resistance from junction to soldering pointTs≤ 85 °C; note 1180K/W
Note
1. T
is the temperature at the soldering point of the collector pin.
s
150
MBG248
o
T ( C)
s
600
handbook, halfpage
P
tot
(mW)
400
200
0
050100200
Fig.2 Power derating curve.
NXP SemiconductorsProduct specification
Rev. 04 - 21 November 2007
4 of 15
NPN 9 GHz wideband transistorsBFG520W; BFG520W/X
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
(BR)CBO
V
(BR)CES
V
(BR)EBO
I
CBO
h
FE
C
re
f
T
G
UM
2
|S
|
21
Fnoise figureΓ
P
L1
ITOthird order intercept pointnote 2−26−dBm
V
o
d
2
collector-base breakdown voltageIC=10 µA; IE=020−−V
collector-emitter breakdown voltage IC=10µA; RBE=015−−V
emitter-base breakdown voltageIE=10µA; IC= 02.5−−V
collector leakage currentVCB=6V; IE=0−−50nA
DC current gainIC= 20 mA; VCE= 6 V; see Fig.360120250
feedback capacitanceIC= 0; VCB= 6 V; f = 1 MHz;
1. These parameters have not been extracted, the
default values are shown.
(f)=QL
B,E
C
cb
E'
L
E
L3
E
√(f/fc)
B,E
C
MBC964
handbook, halfpage
L1L2
B
C
bece
QLB= 50; QLE= 50; QL
= scaling frequency = 1 GHz.
f
c
L
B
Fig.22 Package equivalent circuit SOT343N.
List of components (see Fig.22)
DESIGNATIONVALUEUNIT
C
be
C
cb
C
ce
70fF
50fF
115fF
L10.34nH
L20.10nH
L30.25nH
L
B
L
E
0.40nH
0.40nH
CB'C'
NXP SemiconductorsProduct specification
Rev. 04 - 21 November 2007
13 of 15
NPN 9 GHz wideband transistorsBFG520W; BFG520W/X
PACKAGE OUTLINE
Plastic surface mounted package; 4 leadsSOT343N
D
y
e
34
A
12
b
1
e
b
p
1
w M
B
E
H
E
A
1
detail X
AB
Q
L
p
X
v M
A
c
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT343N
1.1
0.8
012 mm
scale
A
1
A
max
0.1
b
p
0.4
0.3
IEC JEDEC EIAJ
b
1
0.7
0.5
cD
0.25
2.2
0.10
1.8
E
1.35
1.3
1.15
REFERENCES
e
H
L
e
E
1
2.2
0.45
2.0
0.15
Qwv
p
0.23
0.13
0.2y0.10.21.15
EUROPEAN
PROJECTION
ISSUE DATE
97-05-21
NXP Semiconductors
Rev. 04 - 21 November 2007
14 of 15
Legal information
Data sheet status
BFG520W; BFG520W/X
NPN 9 GHz wideband transistors
Document status
Objective [short] data sheetDevelopmentThis document contains data from the objective specification for product development.
Preliminary [short] data sheet QualificationThis document contains data from the preliminary specification.
Product [short] data sheetProductionThis document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document mayhave changed since this document was published and may differ in case of multipledevices. The latest product status
information is available on the Internet at URL
[1][2]
Product status
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shallhaveno liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product typenumber(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give anyrepresentations or
warranties, expressed or implied, as to the accuracyor completeness of such
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authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
[3]
http://www.nxp.com.
Definition
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device.Limiting valuesare stress ratings only and operationof
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
http://www.nxp.com/profile/terms, including those pertaining to warranty,
at
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No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
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Notice: All referenced brands, product names, service names and trademarks
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Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
BFG520W_N_420071121Product data sheet-BFG520W_X_3
Modifications:
BFG520W_X_319981002Product specification-BFG520W_2
BFG520W_219950824Product specification-BFG520W_1
BFG520W_119940829---
• Page 2; text in Pinning table changed
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