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RF front end applications in the GHz range, such as
analog and digital cellular telephones, cordless telephones
(CT1, CT2, DECT, etc.), radar detectors, pagers and
satellite TV tuners (SATV).
DESCRIPTION
NPN silicon planar epitaxial transistor in a 4-pin
dual-emitter SOT143B plastic package.
collector-base voltageopen emitter−−20V
collector-emitter voltage RBE=0−−15V
collector current (DC)−−18mA
total power dissipationTs≤ 130 °C−−150mW
DC current gainVCE=6V; IC= 5 mA60120250
feedback capacitanceVCB=6V; IC=ic= 0; f = 1 MHz−0.2−pF
transition frequencyVCE=6V; IC= 5 mA; f = 1 GHz−9−GHz
maximum unilateral
power gain
insertion power gainVCE=6V; Ic= 5 mA;
VCE=6V; IC= 5 mA;
T
=25°C; f = 900 MHz
amb
V
=6V; IC= 5 mA;
CE
T
=25°C; f = 2 GHz
amb
T
=25°C; f = 900 MHz
amb
= Γ
s
opt;VCE
T
=25°C; f = 900 MHz
amb
Γ
= Γ
s
opt;VCE
T
=25°C; f = 900 MHz
amb
Γ
= Γ
s
opt
T
=25°C; f = 2 GHz
amb
=6V; Ic= 1.25 mA;
=6V; Ic= 5 mA;
; VCE=6V; Ic= 1.25 mA;
−20−dB
−13−dB
1617−dB
−1.21.7dB
−1.62.1dB
−1.9−dB
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
3 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
is the temperature at the soldering point of the collector pin.
s
THERMAL CHARACTERISTICS
collector-base voltageopen emitter−20V
collector-emitter voltageRBE=0−15V
emitter-base voltageopen collector−2.5V
collector current (DC)−18mA
total power dissipationTs≤ 130 °C; see Fig.2; note 1−150mW
storage temperature range−65150°C
junction temperature−175°C
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th j-s
thermal resistance from junction to soldering pointnote 1290K/W
Note
is the temperature at the soldering point of the collector pin.
1. T
s
200
handbook, halfpage
P
tot
(mW)
150
100
50
MRA638-1
0
050100200
150
Ts (°C)
Fig.2 Power derating curve.
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
4 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
CHARACTERISTICS
T
= 25 °C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
I
CBO
h
FE
C
e
C
c
C
re
f
T
G
UM
S
21
Fnoise figureΓ
P
L1
ITOthird order intercept pointnote 2−10−dBm
collector cut-off currentVCB=6V; IE=0−− 50nA
DC current gainIC= 5 mA; VCE= 6 V; see Fig.360120250
emitter capacitanceIC=ic=0 VEB= 0.5 V; f = 1 MHz−0.4−pF
collector capacitanceVCB=6V; IE=ie= 0; f = 1 MHz−0.3−pF
feedback capacitanceIC= 0; VCB= 6 V; f = 1 MHz; see Fig.4−0.2−pF
transition frequencyIC= 5 mA; VCE= 6 V; f = 1 GHz;
−9−GHz
see Fig.5
maximum unilateral
power gain; note 1
2
insertion power gainIc= 5 mA; VCE=6V;
output power at 1 dB gain
compression
IC= 5 mA; VCE=6V;
T
=25°C; f = 900 MHz
amb
I
= 5 mA; VCE=6V;
c
T
=25°C; f = 2 GHz
amb
T
=25°C; f = 900 MHz
amb
= Γ
; IC= 1.25 mA; VCE=6V;
s
opt
T
=25°C; f = 900 MHz
amb
= Γ
Γ
T
Γ
T
; IC= 5 mA; VCE=6V;
s
opt
=25°C; f = 900 MHz
amb
= Γ
; IC= 1.25 mA; VCE=6V;
s
opt
=25°C; f = 2 GHz
amb
IC= 5 mA; VCE=6V; RL=50Ω;
T
=25°C; f = 900 MHz
amb
−20−dB
−13−dB
1617−dB
−1.21.7dB
−1.62.1dB
−1.9−dB
−4−dBm
Notes
1. G
2. VCE= 6 V; IC= 5 mA; RL=50Ω; T
is the maximum unilateral power gain, assuming S12is zero and
UM
=25°C;
amb
fp= 900 MHz; fq= 902 MHz;
measured at 2fp− fq= 898 MHz and 2fq− fp= 904 MHz.
VCE= 6 V; f = 900 MHz.
GUM= maximum unilateral power gain;
MSG = maximum stable gain;
= maximum available gain.
G
max
G
UM
MSG
812
Fig.6 Gain as a function of collector current.
MRA642
I
(mA)
C
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
6 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
25
handbook, halfpage
gain
(dB)
20
15
10
5
0
04
VCE= 6 V; f = 2 GHz.
GUM= maximum unilateral power gain;
MSG = maximum stable gain;
= maximum available gain.
G
max
MSG
G
UM
G
max
812
Fig.7 Gain as a function of collector current.
MRA643
I
(mA)
C
50
handbook, halfpage
gain
G
(dB)
VCE= 6 V; IC= 1.25 mA.
GUM= maximum unilateral power gain;
MSG = maximum stable gain;
G
max
UM
40
30
MSG
20
10
0
10
= maximum available gain.
2
10
Fig.8 Gain as a function of frequency.
MRA644
3
10
f (MHz)
4
10
50
handbook, halfpage
gain
(dB)
VCE= 6 V; IC= 5 mA.
GUM= maximum unilateral power gain;
MSG = maximum stable gain;
G
max
G
UM
40
MSG
30
20
10
0
10
= maximum available gain.
2
10
Fig.9 Gain as a function of frequency.
MRA645
G
max
3
10
f (MHz)
4
10
handbook, halfpage
5
F
min
(dB)
4
3
2
1
0
10
VCE=6V.
−1
2000 MHz
1000 MHz
900 MHz
500 MHz
G
ass
F
min
1
IC (mA)
MRA650
f = 900 MHz
1000 MHz
2000 MHz
20
G
ass
(dB)
15
10
5
0
−5
10
Fig.10 Minimum noise figure and associated
available gain as functions of collector
current.
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
7 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
MRA651
5
ndbook, halfpage
F
min
(dB)
4
IC = 1.25 mA
5 mA
G
ass
20
G
15
ass
(dB)
3
2
5 mA
1
1.25 mA
0
2
10
VCE=6V.
F
min
3
10
f (MHz)
Fig.11 Minimum noise figure and associated
available gain as functions of frequency.
handbook, full pagewidth
135°
10
pot. unst.
region
0.5
10
5
0
−5
4
90°
1
45°
2
1.0
0.8
0.6
stability
circle
180°
Zo=50Ω.
VCE= 6 V; Ic= 1.25 mA; f = 900 MHz.
0
−135°
0.2
0.2
0.2
0.515
F = 3 dB
0.5
1
−90°
Fig.12 Noise circle figure.
F
min
F = 1.5 dB
2
F = 2 dB
= 1. 2 dB
Γ
OPT
2
−45°
5
5
MRA652
0.4
0.2
0°
0
1.0
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
8 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
handbook, full pagewidth
Zo=50Ω.
VCE= 6 V; Ic= 1.25 mA; f = 2000 MHz.
stability
circle
180°
pot. unst.
region
135°
0
−135°
0.5
0.2
0.20.525
0.2
0.5
90°
F = 3 dB
F = 4 dB
−90°
1
F = 2.5 dB
1
1
Fig.13 Noise circle figure.
F
min
Γ
OPT
= 1. 9 dB
1.0
45°
2
5
5
2
−45°
MRA653
0.8
0.6
0.4
0.2
0°
0
1.0
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
9 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
handbook, full pagewidth
VCE= 6 V; IC= 5 mA.
Zo=50Ω.
90°
1
180°
135°
0
−135°
0.5
0.2
3 GHz
0.20.5125
0.2
0.5
1
−90°
2
2
45°
40 MHz
−45°
Fig.14 Common emitter input reflection coefficient (S11).
5
5
MRA646
1.0
0.8
0.6
0.4
0.2
0°
0
1.0
handbook, full pagewidth
VCE= 6 V; IC= 5 mA.
90°
135°
180°
1512963
40 MHz
−135°
3 GHz
−90°
45°
0°
−45°
MRA647
Fig.15 Common emitter forward transmission coefficient (S21).
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
10 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
handbook, full pagewidth
VCE= 6 V; IC= 5 mA.
90°
135°
180°
0.25 0.20 0.15 0.10 0.05
−135°
3 GHz
40 MHz
−90°
45°
0°
−45°
MRA648
Fig.16 Common emitter reverse transmission coefficient (S12).
handbook, full pagewidth
VCE= 6 V; IC= 5 mA.
Zo=50Ω.
90°
1
180°
135°
0
−135°
0.5
0.2
0.20.5125
0.2
0.5
1
−90°
3 GHz
45°
2
5
40 MHz
5
2
−45°
MRA649
Fig.17 Common emitter output reflection coefficient (S22).
1.0
0.8
0.6
0.4
0.2
0°
0
1.0
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
11 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
PACKAGE OUTLINE
Plastic surface mounted package; 4 leadsSOT143B
D
y
e
b
p
B
w M
E
v M
A
B
H
E
A
X
34
Q
A
A
1
21
b
1
e
1
detail X
L
c
p
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT143B
1.1
0.9
012 mm
scale
A
A
1
max
0.1
b
c
D
b
0.48
0.38
1
p
0.88
0.15
0.78
0.09
IEC JEDEC EIAJ
E
3.0
1.4
2.8
1.2
REFERENCES
1.9
e
1.7
H
L
E
1
2.5
2.1
0.45
0.15
p
0.55
0.45
EUROPEAN
PROJECTION
e
ywvQ
0.10.10.2
ISSUE DATE
97-02-28
NXP Semiconductors
Rev. 04 - 22 November 2007
12 of 13
Legal information
Data sheet status
BFG505; BFG505/X
NPN 9 GHz wideband transistors
Document status
Objective [short] data sheetDevelopmentThis document contains data from the objective specification for product development.
Preliminary [short] data sheet QualificationThis document contains data from the preliminary specification.
Product [short] data sheetProductionThis document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document mayhave changed since this document was published and may differ in case of multipledevices.Thelatestproductstatus
information is available on the Internet at URL
[1][2]
Product status
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shallhaveno liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product typenumber(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give anyrepresentations or
warranties, expressed or implied, as to the accuracyor completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
[3]
http://www.nxp.com.
Definition
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device.Limitingvalues are stress ratingsonly and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
http://www.nxp.com/profile/terms, including those pertaining to warranty,
at
intellectual property rights infringement and limitation of liability, unless
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No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
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Notice: All referenced brands, product names, service names and trademarks
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For additional information, please visit: http://www.nxp.com
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Please be aware that important notices concerning this document and the product(s)
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