Dear customer,
As from October 1st, 2006 Philips Semiconductors has a new trade name
- NXP Semiconductors, which will be used in future data sheets together with new contact
details.
In data sheets where the previous Philips references remain, please use the new links as
shown below.
http://www.philips.semiconductors.com use http://www.nxp.com
http://www.semiconductors.philips.com use http://www.nxp.com (Internet)
sales.addresses@www.semiconductors.philips.com use salesaddresses@nxp.com
(email)
The copyright notice at the bottom of each page (or elsewhere in the document,
RF front end applications in the GHz range, such as
analog and digital cellular telephones, cordless telephones
(CT1, CT2, DECT, etc.), radar detectors, pagers and
satellite TV tuners (SATV).
DESCRIPTION
NPN silicon planar epitaxial transistor in a 4-pin
dual-emitter SOT143B plastic package.
collector-base voltageopen emitter−−20V
collector-emitter voltage RBE=0−−15V
collector current (DC)−−18mA
total power dissipationTs≤ 130 °C−−150mW
DC current gainVCE=6V; IC= 5 mA60120250
feedback capacitanceVCB=6V; IC=ic= 0; f = 1 MHz−0.2−pF
transition frequencyVCE=6V; IC= 5 mA; f = 1 GHz−9−GHz
maximum unilateral
power gain
insertion power gainVCE=6V; Ic= 5 mA;
VCE=6V; IC= 5 mA;
T
=25°C; f = 900 MHz
amb
V
=6V; IC= 5 mA;
CE
T
=25°C; f = 2 GHz
amb
T
=25°C; f = 900 MHz
amb
= Γ
s
opt;VCE
T
=25°C; f = 900 MHz
amb
Γ
= Γ
s
opt;VCE
T
=25°C; f = 900 MHz
amb
Γ
= Γ
s
opt
T
=25°C; f = 2 GHz
amb
=6V; Ic= 1.25 mA;
=6V; Ic= 5 mA;
; VCE=6V; Ic= 1.25 mA;
−20−dB
−13−dB
1617−dB
−1.21.7dB
−1.62.1dB
−1.9−dB
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
3 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
is the temperature at the soldering point of the collector pin.
s
THERMAL CHARACTERISTICS
collector-base voltageopen emitter−20V
collector-emitter voltageRBE=0−15V
emitter-base voltageopen collector−2.5V
collector current (DC)−18mA
total power dissipationTs≤ 130 °C; see Fig.2; note 1−150mW
storage temperature range−65150°C
junction temperature−175°C
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th j-s
thermal resistance from junction to soldering pointnote 1290K/W
Note
is the temperature at the soldering point of the collector pin.
1. T
s
200
handbook, halfpage
P
tot
(mW)
150
100
50
MRA638-1
0
050100200
150
Ts (°C)
Fig.2 Power derating curve.
NXP SemiconductorsProduct specification
Rev. 04 - 22 November 2007
4 of 13
NPN 9 GHz wideband transistorsBFG505; BFG505/X
CHARACTERISTICS
T
= 25 °C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
I
CBO
h
FE
C
e
C
c
C
re
f
T
G
UM
S
21
Fnoise figureΓ
P
L1
ITOthird order intercept pointnote 2−10−dBm
collector cut-off currentVCB=6V; IE=0−− 50nA
DC current gainIC= 5 mA; VCE= 6 V; see Fig.360120250
emitter capacitanceIC=ic=0 VEB= 0.5 V; f = 1 MHz−0.4−pF
collector capacitanceVCB=6V; IE=ie= 0; f = 1 MHz−0.3−pF
feedback capacitanceIC= 0; VCB= 6 V; f = 1 MHz; see Fig.4−0.2−pF
transition frequencyIC= 5 mA; VCE= 6 V; f = 1 GHz;
−9−GHz
see Fig.5
maximum unilateral
power gain; note 1
2
insertion power gainIc= 5 mA; VCE=6V;
output power at 1 dB gain
compression
IC= 5 mA; VCE=6V;
T
=25°C; f = 900 MHz
amb
I
= 5 mA; VCE=6V;
c
T
=25°C; f = 2 GHz
amb
T
=25°C; f = 900 MHz
amb
= Γ
; IC= 1.25 mA; VCE=6V;
s
opt
T
=25°C; f = 900 MHz
amb
= Γ
Γ
T
Γ
T
; IC= 5 mA; VCE=6V;
s
opt
=25°C; f = 900 MHz
amb
= Γ
; IC= 1.25 mA; VCE=6V;
s
opt
=25°C; f = 2 GHz
amb
IC= 5 mA; VCE=6V; RL=50Ω;
T
=25°C; f = 900 MHz
amb
−20−dB
−13−dB
1617−dB
−1.21.7dB
−1.62.1dB
−1.9−dB
−4−dBm
Notes
1. G
2. VCE= 6 V; IC= 5 mA; RL=50Ω; T
is the maximum unilateral power gain, assuming S12is zero and
UM
=25°C;
amb
fp= 900 MHz; fq= 902 MHz;
measured at 2fp− fq= 898 MHz and 2fq− fp= 904 MHz.