NXP BCV29, BCV49 Schematic [ru]
DATA SH EET
ook, halfpage
DISCRETE SEMICONDUCTORS
M3D109
BCV29; BCV49
NPN Darlington transistors
Product data sheet
Supersedes data of 1999 Apr 08
2004 Dec 06
NXP Semiconductors Product data sheet
7
NPN Darlington transistors BCV29; BCV49
FEATURES
• High current (max. 500 mA)
• Low voltage (max. 60 V)
• High DC current gain (min. 20 000).
APPLICATIONS
• Preamplifier input applications.
DESCRIPTION
NPN small-signal Darlington transistor in a surface mount
SOT89 plastic package. PNP complements: BCV28 and
BCV48.
MARKING
T YPE NUMBER MARKING CODE
BCV29 EF
BCV49 EG
ORDERING INFORMATION
PINNING
PIN DESCRIPTION
1 emitter
2 collector
3 base
TR1
321
Fig.1 Simplified outline (SOT89) and symbol.
23
TR2
1
sym08
T YPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
BCV29 SC-62 plastic surface mounted package; collector pad for good heat
BCV49
transfer; 3 leads
SOT89
2004 Dec 06 2
NXP Semiconductors Product data sheet
NPN Darlington transistors BCV29; BCV49
LIMITING VALUES
In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
V
I
I
I
P
T
T
T
CBO
CES
EBO
C
CM
BM
tot
stg
j
amb
collector-base voltage open emitter
BCV29 − 40 V
BCV49 − 80 V
collector-emitter voltage VBE = 0 V
BCV29 − 30 V
BCV49 − 60 V
emitter-base voltage open collector − 10 V
collector current (DC) − 500 mA
peak collector current − 1 A
peak base current − 200 mA
total power dissipation T
≤ 25 °C; note 1 − 1.3 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
ambient temperature −65 +150 °C
Note
1. Device mounted on a printed-circuit board, single-sided copp er, tin-plated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th(j-a)
th(j-s)
thermal resistance from junction to ambient note 1 96 K/W
thermal resistance from junction to soldering point 16 K/W
Note
1. Device mounted on a printed-circuit board, single-sided copp er, tin-plated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.
2004 Dec 06 3
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