PNP general purpose transistorsBC856; BC857; BC858
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
V
V
I
I
I
P
T
T
T
CBO
CEO
EBO
C
CM
BM
tot
stg
j
amb
collector-base voltageopen emitter
BC856−−80V
BC857−−50V
BC858−−30V
collector-emitter voltageopen base
BC856−−65V
BC857−−45V
BC858−−30V
emitter-base voltageopen collector−−5V
collector current (DC)−−100mA
peak collector current−−200mA
peak base current−−200mA
total power dissipationT
PNP general purpose transistorsBC856; BC857; BC858
500
handbook, halfpage
h
FE
MGT711
400
(1)
300
200
100
0
−10−2−10
−1
(2)
(3)
−1−10−102−10
IC (mA)
BC857A; VCE = −5 V.
(1) T
= 150 °C.
amb
(2) T
= 25 °C.
amb
(3) T
= −55 °C.
amb
Fig.2DC current gain as a function of collector
current; typical values.
−1200
handbook, halfpage
V
BE
(mV)
MGT712
−1000
−800
(1)
(2)
−600
−400
(3)
−200
3
0
−10−2−10
−1
−1−10−102−10
3
IC (mA)
BC857A; VCE = −5 V.
(1) T
= −55 °C.
amb
(2) T
= 25 °C.
amb
(3) T
= 150 °C.
amb
Fig.3Base-emitter voltage as a function of
collector current; typical values.
4
−10
handbook, halfpage
V
CEsat
(mV)
3
−10
2
−10
−10
−1
−10
(1)
(2)(3)
−1−10−10
MGT713
2
IC (mA)
BC857A; IC/IB = 20.
= 150 °C.
(1) T
amb
(2) T
= 25 °C.
amb
(3) T
= −55 °C.
amb
Fig.4Collector-emitter saturation voltage as a
function of collector current; typical values.
−10
−1200
handbook, halfpage
V
BEsat
(mV)
−1000
−800
−600
(1)
(2)
(3)
MGT714
−400
−200
0
3
−10
−1
−1−10−10
2
−10
3
IC (mA)
BC857A; IC/IB = 20.
= −55 °C.
(1) T
amb
(2) T
= 25 °C.
amb
(3) T
= 150 °C.
amb
Fig.5Base-emitter saturation voltage as a
function of collector current; typical values.
2004 Jan 165
NXP SemiconductorsProduct data sheet
PNP general purpose transistorsBC856; BC857; BC858
1000
handbook, halfpage
h
FE
MGT715
800
600
(1)
400
(2)
200
0
−10−2−10
−1
(3)
−1−10−102−10
IC (mA)
BC857B; VCE = −5 V.
(1) T
= 150 °C.
amb
(2) T
= 25 °C.
amb
(3) T
= −55 °C.
amb
Fig.6DC current gain as a function of collector
current; typical values.
−1200
handbook, halfpage
V
BE
(mV)
MGT716
−1000
−800
(1)
(2)
−600
−400
(3)
−200
3
0
−10−2−10
−1
−1−10−102−10
3
IC (mA)
BC857B; VCE = −5 V.
(1) T
= −55 °C.
amb
(2) T
= 25 °C.
amb
(3) T
= 150 °C.
amb
Fig.7Base-emitter voltage as a function of
collector current; typical values.
4
−10
handbook, halfpage
V
CEsat
(mV)
3
−10
2
−10
−10
−1
−10
(1)
(3)
(2)
−1−10−10
MGT717
2
IC (mA)
BC857B; IC/IB = 20.
= 150 °C.
(1) T
amb
(2) T
= 25 °C.
amb
(3) T
= −55 °C.
amb
Fig.8Collector-emitter saturation voltage as a
function of collector current; typical values.
−10
−1200
handbook, halfpage
V
BEsat
(mV)
MGT718
−1000
−800
(1)
(2)
−600
(3)
−400
−200
0
3
−10
−1
−1−10−10
2
−10
3
IC (mA)
BC857B; IC/IB = 20.
= −55 °C.
(1) T
amb
(2) T
= 25 °C.
amb
(3) T
= 150 °C.
amb
Fig.9Base-emitter saturation voltage as a
function of collector current; typical values.
2004 Jan 166
NXP SemiconductorsProduct data sheet
PNP general purpose transistorsBC856; BC857; BC858
1000
handbook, halfpage
h
FE
(1)
MGT719
800
600
(2)
400
(3)
200
0
−10−2−10
−1
−1−10−102−10
IC (mA)
BC857C; VCE = −5 V.
(1) T
= 150 °C.
amb
(2) T
= 25 °C.
amb
(3) T
= −55 °C.
amb
Fig.10 DC curre nt gain as a function of collector
current; typical values.
−1200
handbook, halfpage
V
BE
(mV)
MGT720
−1000
−800
(1)
(2)
−600
−400
(3)
−200
0
3
−10
−1
−1−10−10
2
−10
3
IC (mA)
BC857C; VCE = −5 V.
(1) T
= −55 °C.
amb
(2) T
= 25 °C.
amb
(3) T
= 150 °C.
amb
Fig.11 Base-emitter voltage as a function of
collector current; typical values.
4
−10
handbook, halfpage
V
CEsat
(mV)
3
−10
2
−10
−10
−1
−10
(1)
(2)
(3)
−1−10−10
MGT721
2
IC (mA)
BC857C; IC/IB = 20.
= 150 °C.
(1) T
amb
(2) T
= 25 °C.
amb
(3) T
= −55 °C.
amb
Fig.12 Collector-emitter saturation voltage as a
function of collector current; typical values.
−10
−1200
handbook, halfpage
V
BEsat
(mV)
MGT722
−1000
−800
(1)
(2)
−600
(3)
−400
−200
0
3
−10
−1
−1−10−10
2
−10
3
IC (mA)
BC857C; IC/IB = 20.
= −55 °C.
(1) T
amb
(2) T
= 25 °C.
amb
(3) T
= 150 °C.
amb
Fig.13 Base-emitter satur ation v oltag e as a
function of collector current; typical values.
2004 Jan 167
NXP SemiconductorsProduct data sheet
3
PNP general purpose transistorsBC856; BC857; BC858
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leadsSOT2
D
3
A
A
1
12
e
1
b
p
e
w
M
B
E
H
E
detail X
AB
Q
L
p
X
v
M
A
c
012 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
1.1
mm
0.9
OUTLINE
VERSION
SOT23TO-236AB
max.
0.1
b
cD
p
0.48
0.15
0.38
0.09
IEC JEDEC JEITA
3.0
2.8
E
1.4
1.2
REFERENCES
1.9
e
e
0.95
H
L
Qwv
1
2.5
2.1
p
E
0.55
0.45
0.15
0.45
0.2
0.1
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
2004 Jan 168
NXP SemiconductorsProduct data sheet
PNP general purpose transistorsBC856; BC857; BC858
DATA SHEET STATUS
DOCUMENT
STATUS
Objective data sheetDevelopmentThis document contains data from the objective specification for product
Preliminary data sheetQualificationThis document contains data from the preliminary specification.
Product data sheetProductionThis document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be su itable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveya nce or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .
Limiting values⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
2004 Jan 169
60134) may cause permanent damage to
Quick reference data⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
The information presented in this documen t d oes not form part of any quotation or contract, is b elieve d t o b e a ccur ate a nd re li a ble and may be change d
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industri al or intellectual property righ ts.
Printed in The Netherlands R75/06/pp10 Date of release: 2004 Jan 16 Document order number: 9397 750 12397
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