NXP BC848B, BC848W Schematic [ru]

Download

BC848 series

30 V, 100 mA NPN general-purpose transistors

Rev. 07 — 17 November 2009 Product data sheet

1. Product profile

1.1 General description

NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number Package PNP

BC848B SOT23 - TO-236AB BC858B BC848W SOT323 SC-70 - BC858W

1.2 Features

NXP JEITA JEDEC

complement

 General-purpose transistors  SMD plastic packages

1.3 Applications

 General-purpose switching and amplification

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V I h

CEO

collector-emitter voltage open base - - 30 V collector current - - 100 mA DC current gain VCE=5V;

=2mA

BC848B 200 290 450 BC848W 110 - 800

NXP Semiconductors

2. Pinning information

Table 3. Pinning

Pin Description Simplified outline Symbol

1base 2emitter 3 collector

BC848 series

30 V, 100 mA NPN general-purpose transist ors

3. Ordering information

Table 4. Ordering information

Type number Package

BC848B - plastic surface mounted package; 3 leads SOT23 BC848W SC-70 plastic surface mounted package; 3 leads SOT323

4. Marking

Table 5. Marking codes

Type number Marking code

BC848B 1K* BC848W 1M*

[1] * = -: made in Hong Kong

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

006aaa14

sym02

Name Description Version

[1]

Product data sheet Rev. 07 — 17 November 2009 2 of 12

NXP Semiconductors

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

CBO

CEO

EBO

tot

amb

stg

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

BC848 series

30 V, 100 mA NPN general-purpose transist ors

collector-base voltage open emitter - 30 V collector-emitter voltage open base - 30 V emitter-base voltage open collector - 5 V collector current - 100 mA peak collector current single pulse;

≤ 1ms

peak base current single pulse;

≤ 1ms

total power dissipation T

amb

≤ 25 °C SOT23 - 250 mW SOT323 - 200 mW

junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C

-200mA

[1]

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

thermal resistance from junction to ambient

SOT23 - - 500 K/W SOT323 - - 625 K/W

in free air

[1]

Product data sheet Rev. 07 — 17 November 2009 3 of 12

NXP Semiconductors

7. Characteristics

Table 8. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

CBO

EBO

CEsat

BEsat

NF noise figure V

BC848 series

30 V, 100 mA NPN general-purpose transist ors

=25°C unless otherwise specified.

collector-base cut-off current

emitter-base cut-off current

DC current gain VCE=5V; IC=10μA-150-

collector-emitter saturation voltage

base-emitter saturation voltage

base-emitter voltage IC=2mA; VCE=5V

transition frequency VCE=5V; IC=10mA;

collector capacitance VCB=10V; IE=ie=0A;

VCB=30V; IE=0A - - 15 nA

=30V; IE=0A;

= 150 °C

--5μA

VEB=5V; IE= 0 A - - 100 nA

=5V; IC=2mA

BC848B 200 290 450 BC848W 11 0 - 800

IC=10mA; IB= 0.5 mA - 90 250 mV

= 100 mA; IB=5mA

IC=10mA; IB=0.5mA

= 100 mA; IB=5mA

=10mA; VCE=5V

[1]

- 200 600 mV

[2]

-700-mV

[2]

-900-mV

[3]

580 660 700 mV

[3]

- - 770 mV 100 - - MHz

f = 100 MHz

-2.53pF

f=1MHz

=5V; IC=200μA;

- 2 10 dB RS=2kΩ; f = 1 kHz; B=200Hz

[1] Pulse test: tp≤ 300 μs; δ≤0.02. [2] V [3] V

Product data sheet Rev. 07 — 17 November 2009 4 of 12

decreases by approximately 1.7 mV/K with increasing temperature.

BEsat

decreases by approximately 2 mV/K with increasing temperature.

NXP Semiconductors

BC848 series

30 V, 100 mA NPN general-purpose transist ors

600

500

400

300

200

100

−1

11010210

(1)

(2)

(3)

mgt727

IC (mA)

VCE=5V

amb amb amb

= 150 °C =25°C = −55 °C

(1) T (2) T (3) T

Fig 1. BC848B: DC current gain as a function of

collector current; typical values

mgt728

(mA)

(mV)

1200

1000

800

600

400

200

(1) T (2) T (3) T

−2

CE amb amb amb

−1

=5V

= −55 °C =25°C = 150 °C

(1)

(2)

(3)

11010210

Fig 2. BC848B: Base-emitter voltage as a function of

collector current; typical values

mgt729

IC (mA)

(mV)

CEsat

−1

(1)

(2)

(3)

11010210

IC/IB=20

amb amb amb

= 150 °C =25°C = −55 °C

(1) T (2) T (3) T

Fig 3. BC848B: Collector-emitter saturation voltage

as a function of collector current; typical values

mgt730

IC (mA)

(mV)

BEsat

1200

1000

800

600

400

200

0 10

(1) T (2) T (3) T

−1

C/IB

amb amb amb

(1)

(2)

(3)

11010210

=10

= −55 °C =25°C = 150 °C

Fig 4. BC848B: Base-emitter saturation voltage as a

function of collector current; typical values

Product data sheet Rev. 07 — 17 November 2009 5 of 12

NXP Semiconductors

8. Package outline

BC848 series

30 V, 100 mA NPN general-purpose transist ors

2.5

2.1

3.0

2.8

0.45

0.15

1.4

1.2

0.48

1.9

0.38

1.1

0.9

0.15

0.09

2.2

1.8

0.4

0.3

0.45

0.15

2.2

1.35

2.0

1.15

1.3

04-11-04Dimensions in mm

Fig 5. Package outline SOT23 (TO-236AB) Fig 6. Package outline SOT323 (SC-70)

9. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

BC848B SOT23 4 mm pitch, 8 mm tape and reel -215 -235 BC848W SOT323 4 mm pitch, 8 mm tape and reel -115 -135

[1]

3000 10000

1.1

0.8

0.25

0.10

04-11-04Dimensions in mm

[1] For further information and the availability of packing methods, see Section 14.

Product data sheet Rev. 07 — 17 November 2009 6 of 12

NXP Semiconductors

10. Soldering

BC848 series

30 V, 100 mA NPN general-purpose transist ors

2.90

2.50

solder lands

0.50 (3x)

0.60 (3x)

MSA439

3.00

0.85

1.30

0.85

1.00

3.30

Dimensions in mm

Fig 7. Reflow soldering footprint SOT23 (TO-236AB)

3.40

1.20 (2x)

4.00

1.20

4.60

2.70

solder resist

occupied area

solder paste

solder lands

solder resist

occupied area

preferred transport direction during soldering

2.80

4.50

MSA427

Dimensions in mm

Fig 8. Wave soldering footprint SOT23 (TO-236AB)

Product data sheet Rev. 07 — 17 November 2009 7 of 12

NXP Semiconductors

BC848 series

30 V, 100 mA NPN general-purpose transist ors

2.65

1.3250.75

1.30

0.60

0.852.35 (3×)

0.55 (3×)

2.40

msa429

Fig 9. Reflow soldering footprint SOT323 (SC-70)

4.60

4.00

1.15

2.103.65

preferred transport direction during soldering

0.50 (3×)

1.90

2.70

0.90 (2×)

solder lands

solder paste

solder resist

occupied area

Dimensions in mm

solder lands

solder resist

occupied area

Dimensions in mm

msa41

Fig 10. Wave soldering footprint SOT323 (SC-70)

Product data sheet Rev. 07 — 17 November 2009 8 of 12

NXP Semiconductors

11. Mounting

BC848 series

30 V, 100 mA NPN general-purpose transist ors

43.4

0.7

0.6

0.7

Dimensions in mm

0.6

0.5

006aaa52

PCB thickness: FR4 PCB = 1.6 mm

Fig 11. FR4 PCB, standard footprint

SOT23 (TO-236AB)

43.4

0.6

0.55

Dimensions in mm

PCB thickness: FR4 PCB = 1.6mm

Fig 12. FR4 PCB, standard footprint

SOT323 (SC-70)

0.5

006aaa67

Product data sheet Rev. 07 — 17 November 2009 9 of 12

NXP Semiconductors

BC848 series

30 V, 100 mA NPN general-purpose transist ors

12. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BC848_SER_7 20091117 Product data sheet - BC848_SER_6 Modifications:

BC848_SER_6 20060203 Product data sheet - BC846_BC847_

BC846_BC847_BC848_5 20040206 Product specification - BC846_BC847_

BC846W_BC847W_ BC848W_4

• This data sheet was changed to reflect the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technical content.

• Figure 9 “Reflow soldering footprint SOT323 (SC-70)”: updated

• Figure 10 “Wave soldering footprint SOT323 (SC-70)”: updated

BC848_5 BC846W_BC847W_ BC848W_4

BC848_4

20020204 Product specification - BC846W_847W_3

Product data sheet Rev. 07 — 17 November 2009 10 of 12

NXP Semiconductors

BC848 series

30 V, 100 mA NPN general-purpose transist ors

13. Legal information

13.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have changed si nce this docum ent was pub lished and may dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconduct ors does not give any repr esentatio ns or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is ope n for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteri stics sections of this document, and as such is not complete, exhaustive or legally binding.

, including those pertaining to warranty,

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 07 — 17 November 2009 11 of 12

NXP Semiconductors

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Packing information . . . . . . . . . . . . . . . . . . . . . 6

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

BC848 series

30 V, 100 mA NPN general-purpose transist ors

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 November 2009

Document identifier: BC848_SER_ 7

NXP BC848B, BC848W Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Package outline

9. Packing information

10. Soldering

11. Mounting

12. Revision history

13. Legal information

13.1 Data sheet status

13.2 Definitions

13.3 Disclaimers

13.4 Trademarks

14. Contact information

15. Contents