NXP 1PS70SB40, 1PS70SB44, 1PS70SB45, 1PS70SB46, 1PS75SB45 Schematic [ru]

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BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Rev. 08 — 13 January 2010 Product data sheet

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number Package Configuration

1PS70SB40 SOT323 SC-70 single diode 1PS76SB40 SOD323 SC-76 single diode 1PS79SB40 SOD523 SC-79 single diode BAS40 SOT23 - single diode BAS40H SOD123F - single diode BAS40L SOD882 - single diode BAS40W SOT323 SC-70 single diode 1PS70SB44 SOT323 SC-70 dual series BAS40-04 SOT23 - dual series BAS40-04W SOT323 SC-70 dual series 1PS70SB45 SOT323 SC-70 dual common cathode 1PS75SB45 SOT416 SC-75 dual common cathode BAS40-05 SOT23 - dual common cathode BAS40-05W SOT323 SC-70 dual common cathode 1PS70SB46 SOT323 SC-70 dual common anode BAS40-06 SOT23 - dual common anode BAS40-06W SOT323 SC-70 dual common anode BAS40-07 SOT143B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/

1PS88SB48 SOT363 SC-88 quadruple common cathode/

BAS40XY SOT363 SC-88 quadruple; 2 series

NXP JEITA

common cathode

NXP Semiconductors

1.2 Features

 High switching speed  Low leakage current  High breakdown voltage  Low capacitance

1.3 Applications

 Ultra high-speed switching  Voltage clamping

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp≤ 300 μs; δ≤0.02.

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

forward current - - 120 mA

[1]

forward voltage IF=1mA reverse voltage - - 40 V

--380mV

2. Pinning information

Table 3. Pinning

Pin Description Simplified outline Symbol

BAS40H; 1PS76SB40; 1PS79SB40

1 cathode 2 anode

BAS40L

1 cathode 2 anode

BAS40; BAS40W; 1PS70SB40

1 anode 2 not connected 3 cathode

[1]

001aab540

[1]

Transparent

top view

006aaa14

sym00

n.c.

006aaa436

Product data sheet Rev. 08 — 13 January 2010 2 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Table 3. Pinning

…continued

Pin Description Simplified outline Symbol

BAS40-04; BAS40-04W; 1PS70SB44

1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),

anode (diode 2)

006aaa14

BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45

1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1),

cathode (diode 2)

006aaa14

BAS40-06; BAS40-06W; 1PS70SB46

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1),

anode (diode 2)

006aaa14

006aaa43

BAS40-07

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1)

BAS40-07V

1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1)

456

123

006aaa4

654

123

006aaa44

Product data sheet Rev. 08 — 13 January 2010 3 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Table 3. Pinning

…continued

Pin Description Simplified outline Symbol

BAS40-05V; 1PS88SB48

1 anode (diode 1) 2 anode (diode 2)

6 45

654

3 cathode (diode 3),

cathode (diode 4) 4 anode (diode 3) 5 anode (diode 4)

1 32

001aab55

123

6 cathode (diode 1),

cathode (diode 2)

BAS40XY

1 anode (diode 1)

2 cathode (diode 2)

3 anode (diode 3),

cathode (diode 4) 4 anode (diode 4)

132

5 cathode (diode 3) 6 cathode (diode 1),

anode (diode 2)

[1] The marking bar indicates the cathode.

006aaa44

654

123

006aaa25

Product data sheet Rev. 08 — 13 January 2010 4 of 21

NXP Semiconductors

3. Ordering information

Table 4. Ordering information

Type number Package

1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS40 - plastic surface-mounted package; 3 leads SOT23 BAS40H - plastic surface-mounted package; 2 leads SOD123F BAS40L - leadless ultra small plastic package; 2 terminals;

BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-04 - plastic surface-mounted package; 3 leads SOT23 BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416 BAS40-05 - plastic surface-mounted package; 3 leads SOT23 BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-06 - plastic surface-mounted package; 3 leads SOT23 BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-07 - plastic surface-mounted package; 4 leads SOT143B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Name Description Version

SOD882

body 1.0 × 0.6 × 0.5 mm

Product data sheet Rev. 08 — 13 January 2010 5 of 21

NXP Semiconductors

4. Marking

Table 5. Marking codes

Type number Marking code

1PS70SB40 6*3 1PS75SB45 45 1PS76SB40 S4 BAS40-05 45* 1PS79SB40 T BAS40-05W 65* BAS40 43* 1PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 63* BAS40-07 47* 1PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* 1PS88SB48 8*5 1PS70SB45 6*5 BAS40XY 40*

[1] * = -: made in Hong Kong

BAS40 series; 1PSxxSB4x series

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

[1]

General-purpose Schottky di od e s

Type number Marking code

[1]

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

FRM

FSM

amb

stg

[1] Tj=25°C prior to surge.

reverse voltage - 40 V forward current - 120 mA repetitive peak forward

tp≤ 1s; δ≤0.5 - 120 mA

current non-repetitive peak forward

tp≤ 10 ms

[1]

-200mA

current junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C

Product data sheet Rev. 08 — 13 January 2010 6 of 21

NXP Semiconductors

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device

th(j-a)

th(j-sp)

thermal resistance from junction to ambient

SOT23 - - 500 K/W

SOT143B - - 500 K/W

SOT363 (1PS88SB48) - - 416 K/W

SOT416 - - 833 K/W

SOT666 (BAS40-05V)

SOT666 (BAS40-07V)

SOD123F

SOD323 - - 450 K/W

SOD523

SOD882

SOT323 - - 625 K/W

thermal resistance from junction to solder point

SOT363 (BAS40XY)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

in free air

[1]

[2]

--225K/W

[2]

--416K/W

[2]

--330K/W

[2]

--450K/W

[2]

--500K/W

[3]

--260K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 8. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp≤ 300 μs; δ≤0.02.

=25

C unless otherwise specified.

forward voltage

[1]

IF= 1 mA - - 380 mV

= 10 mA - - 500 mV

=40mA - - 1 V

reverse current VR=30V - - 1 μA

=40V - - 10 μA

diode capacitance VR=0V; f=1MHz - - 5 pF

Product data sheet Rev. 08 — 13 January 2010 7 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

(mA)

(1) T (2) T (3) T (4) T

amb amb amb amb

(1) (2) (3) (4)

0.6 0.80.40.2 1

= 125 °C =85°C =25°C = −40 °C

−1

−2

mlc361

(V)

Fig 1. Forward current as a function of forward

voltage; typical values

(µA)

(1) T (2) T (3) T

−1

−2

= 125 °C

amb

=85°C

amb

=25°C

amb

(1)

(2)

(3)

2010 4030

mlc362

VR (V)

Fig 2. Reverse current as a function of reverse

voltage; typical values

IF (mA)

mlc364

(Ω)

dif

−1

110

f=10kHz T

Fig 3. Differential resistance as a function of forward

current; typical values

(pF)

01020 4030

=25°C; f = 1 MHz

amb

mlc363

VR (V)

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

Product data sheet Rev. 08 — 13 January 2010 8 of 21

NXP Semiconductors

8. Package outline

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

0.85

0.75

0.34

0.26

2.7

2.3

1.8

1.6

1.35

1.15

1.1

0.8

0.40

0.25

0.45

0.15

0.25

0.10

1.65

1.25

1.55

1.15

03-12-17Dimensions in mm

Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79)

1.7

1.5

0.55

0.35

2.5

2.1

1.4

1.2

3.0

2.8

1.1

0.9

0.45

0.15

3.6

2.7

3.4

2.5

0.65

0.58

1.2

1.0

0.17

0.11

02-12-13Dimensions in mm

1.9

0.48

0.38

0.15

0.09

04-11-04Dimensions in mm

0.70

0.55

0.25

0.10

04-11-29Dimensions in mm

Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Packag e outline SOD123F

0.30

0.22

0.30

0.22

0.62

0.55

0.47

0.65

cathode marking on top side

0.50

0.46

1.02

0.95

2.2

1.8

0.4

0.3

0.45

0.15

2.2

1.35

2.0

1.15

1.3

03-04-17Dimensions in mm

1.1

0.8

0.25

0.10

04-11-04Dimensions in mm

Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70)

Product data sheet Rev. 08 — 13 January 2010 9 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

2.5

2.1

1.4

1.2

0.88

0.78

3.0

2.8

1.9

1.7

1.1

0.9

0.45

0.15

0.48

0.38

0.15

0.09

04-11-16Dimensions in mm

2.2

2.0

1.35

1.15

2.2

1.8

pin 1 index

132

0.65

1.3

0.45

465

0.15

0.3

0.2

Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)

1.7

1.5

456

0.3

0.1

1.75

1.45

0.9

0.7

1.8

1.4

0.95

0.60

0.45

0.15

1.7

1.5

1.3

1.1 pin 1 index

1.1

0.8

0.25

0.10

0.6

0.5

06-03-16Dimensions in mm

0.30

0.15

0.25

0.10

04-11-04Dimensions in mm

Dimensions in mm

123

0.5 1

Fig 13. Package outline SOT416 (SC-75) Fig 14. Package outline SOT666

0.27

0.17

0.18

0.08

04-11-08

Product data sheet Rev. 08 — 13 January 2010 10 of 21

NXP Semiconductors

9. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

1PS70SB40 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS76SB40 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB40 SOD523 2 mm pitch, 8 m m tape and reel - - -315 -

BAS40 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -2 35 BAS40H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS40W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB44 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB45 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS75SB45 SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB46 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

BAS40-05V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

1PS88SB48 SOT363 4 mm pitch, 8 mm tape and reel; T1

BAS40XY SOT363 4 mm pitch, 8 mm tape and reel; T1

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

[1]

3000 4000 8000 10000

4 mm pitch, 8 mm tape and reel -115 - - -135

4 mm pitch, 8 mm tape and reel - -115 - -

[2]

-115 - - -135

4 mm pitch, 8 mm tape and reel; T2

[3]

-125 - - -165

[2]

-115 - - -135

[3]

-125 - - -165

[1] For further information and the availability of packing methods, see Section 13. [2] T1: normal taping [3] T2: reverse taping

Product data sheet Rev. 08 — 13 January 2010 11 of 21

NXP Semiconductors

10. Soldering

1.65

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

3.05

2.80

2.10

1.60

0.60

0.500.95

solder lands

solder resist

occupied area

0.50 (2×)

msa433

Dimensions in mm

Fig 15. Reflow soldering footprint SOD323 (SC-76)

5.00

4.40

1.40

1.202.75

preferred transport direction during soldering

Dimensions in mm

Fig 16. Wave soldering footprint SOD323 (SC-76)

solder paste

solder lands

solder resist

occupied area

msa415

2.15

0.60

0.50

mgs34

solder lands

solder paste

solder resist

occupied area

1.20

0.30

0.40

1.80

1.90

Reflow soldering is the only recommended soldering method. Dimensions in mm

Fig 17. Reflow soldering footprint SOD523 (SC-79)

Product data sheet Rev. 08 — 13 January 2010 12 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

2.90

2.50

solder lands

0.50 (3x)

0.60 (3x)

MSA439

3.00

0.85

1.30

0.85

1.00

3.30

Dimensions in mm

Fig 18. Reflow soldering footprint SOT23 (TO-236AB)

3.40

1.20 (2x)

4.00

1.20

4.60

2.70

solder resist

occupied area

solder paste

solder lands

solder resist

occupied area

preferred transport direction during soldering

2.80

4.50

MSA427

Dimensions in mm

Fig 19. Wave soldering footprint SOT23 (TO-236AB)

Product data sheet Rev. 08 — 13 January 2010 13 of 21

NXP Semiconductors

Fig 20. Reflow soldering footprint SOD123F

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

4.4

2.9

1.6

1.1

(2×)

Reflow soldering is the only recommended soldering method. Dimensions in mm

1.1 1.22.1

1.30

0.30R = 0.05 (8×) R = 0.05 (8×)

solder lands

solder resist

solder paste

occupied area

0.90

solder lands

solder paste

solder resist

occupied area

0.30 (2×)

0.40 (2×)

0.50 (2×)

Reflow soldering is the only recommended soldering method. Dimensions in mm

Fig 21. Reflow soldering footprint SOD882

0.60 (2×)

0.70 (2×)

0.80 (2×)

mbl87

Product data sheet Rev. 08 — 13 January 2010 14 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

2.65

1.3250.75

1.30

0.60

0.852.35 (3×)

0.55 (3×)

2.40

msa429

Fig 22. Reflow soldering footprint SOT323 (SC-70)

4.60

4.00

1.15

2.103.65

preferred transport direction during soldering

0.50 (3×)

1.90

2.70

0.90 (2×)

solder lands

solder paste

solder resist

occupied area

Dimensions in mm

solder lands

solder resist

occupied area

Dimensions in mm

msa41

Fig 23. Wave soldering footprint SOT323 (SC-70)

Product data sheet Rev. 08 — 13 January 2010 15 of 21

NXP Semiconductors

Fig 24. Reflow soldering footprint SOT143B

BAS40 series; 1PSxxSB4x series

0.60 (4x)

2.70

Dimensions in mm

3.25

0.60 (3x)

0.50 (3x)

3.00

1.30

0.90

1.00

2.50

General-purpose Schottky di od e s

solder lands

solder resist

occupied area

solder paste

msa441

4.45

1.20 (3×)

1.00

3.40

Fig 25. Wave soldering footprint SOT143B

4.60

4.00

1.15

solder lands

solder resist

occupied area

Dimensions in mm

preferred transport direction during soldering

msa422

Product data sheet Rev. 08 — 13 January 2010 16 of 21

NXP Semiconductors

2.35

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

2.65

solder lands

1.5

0.6

(4×)

0.5

(4×)

0.4 (2×) solder resist

solder paste

0.5

(4×)

0.6

(4×)

0.6

(2×)

1.8

Fig 26. Reflow soldering footprint SOT363 (SC-88)

1.5

4.5

1.5

1.3 1.3

2.45

5.3

Fig 27. Wave soldering footprint SOT363 (SC-88)

0.3

occupied area

Dimensions in mm

sot363_

solder lands

2.5 solder resist

occupied area

Dimensions in mm

preferred transport

direction during soldering

sot363_

Product data sheet Rev. 08 — 13 January 2010 17 of 21

NXP Semiconductors

Fig 28. Reflow soldering footprint SOT416

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

2.2

0.6

1.1

0.7

0.6

(3x)

1.9

solder lands solder resist

1.5

0.5

(3x)

msa438

solder paste

occupied area

2.0

0.85

Dimensions in mm

2.75

2.45

2.1

1.6

0.538

1.075

1.72

0.55 (2×)

1.7

0.45 (4×)

0.5

(4×)

Reflow soldering is the only recommended soldering method.

Fig 29. Reflow soldering footprint SOT666

0.6

(2×)

0.65 (2×)

0.4

(6×)

0.25 (2×)

0.325 (4×)

0.3

(2×)

0.375 (4×)

solder lands

placement area

solder paste

occupied area

Dimensions in mm

sot666_

Product data sheet Rev. 08 — 13 January 2010 18 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS40_1PSXXSB4X_SER_8 20100113 Product data sheet - BAS40_1PSXXSB4X_SER_7 Modifications: • This data sheet was changed to reflect the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technical content.

• Figure 12 “Package outline SOT363 (SC-88)”: updated

Figure 16 “Wave soldering footprint SOD323 (SC-76)”: updated

•

Figure 17 “Reflow soldering footprint SOD523 (SC-79)”: updated Figure 21 “Reflow soldering footprint SOD882”: updated

•

Figure 22 “Reflow soldering footprint SOT323 (SC-70)”: updated

•

Figure 23 “Wave soldering footprint SOT323 (SC-70)”: updated Figure 25 “Wave soldering footprint SOT143B”: updated

•

Figure 26 “Reflow soldering footprint SOT363 (SC-88)”: updated

•

Figure 27 “Wave soldering footprint SOT363 (SC-88)”: updated Figure 28 “Reflow soldering footprint SOT416”: updated

•

Figure 29 “Reflow soldering footprint SOT666”: updated

•

BAS40_1PSXXSB4X_SER_7 20060512 Product data sheet - BAS40_1PSXXSB4X_SER_6 BAS40_1PSXXSB4X_SER_6 20050809 Product data sheet - 1PS70SB40_3

1PS75SB45_2 1PS76SB40_3 1PS79SB40_2 1PS88SB48_3 BAS40H_1 BAS40L_1 BAS40-05V_1 BAS40-07V_1 BAS40W_3

BAS40_SERIES_5 1PS70SB40_3 19990426 Product specification - 1PS70SB40_2 1PS75SB45_2 19990426 Product specification - 1PS75SB45_1 1PS76SB40_3 20040126 Product specification - 1PS76SB40_2 1PS79SB40_2 19990426 Product specification - 1PS79SB40_1 1PS88SB48_3 20021107 Product specification - 1PS88SB48_2 BAS40H_1 20050425 Product data sheet - BAS40L_1 20030520 Product specification - BAS40-05V_1 20021121 Product specification - BAS40-07V_1 20020327 Product specification - BAS40W_3 19990426 Product specification - BAS40W_2 BAS40_SERIES_5 20011010 Product specification - BAS40_4

Product data sheet Rev. 08 — 13 January 2010 19 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

12. Legal information

12.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have changed si nce this docum ent was pub lished and may dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

http://www.nxp.com.

[3]

Definition

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconduct ors does not give any repr esentatio ns or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published

http://www.nxp.com/profile/terms, including those pertaining to warranty,

at intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is ope n for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteri stics sections of this document, and as such is not complete, exhaustive or legally binding.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 08 — 13 January 2010 20 of 21

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 5

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Packing information . . . . . . . . . . . . . . . . . . . . 11

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

13 Contact information. . . . . . . . . . . . . . . . . . . . . 20

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

General-purpose Schottky di od e s

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Document identifier: BAS40_1PSXXSB4X_SER_8

Date of release: 13 January 2010

NXP 1PS70SB40, 1PS70SB44, 1PS70SB45, 1PS70SB46, 1PS75SB45 Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Package outline

9. Packing information

10. Soldering

11. Revision history

12. Legal information

12.1 Data sheet status

12.2 Definitions

12.3 Disclaimers

12.4 Trademarks

13. Contact information

14. Contents