Electrical Characteristics (Serial Interface)
Unless otherwise specified, all limits guaranteed for TA = 25°C, V+ - V− ≥ 2.7V, VD = V+ - DGND ≥ 2.5V.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
V
IL
Logic Low Threshold
0.3 × V
D
V
V
IH
Logic High Threshold
0.7 × V
D
V
I
SDO
Output Source Current, SDO VD = 3.3V or 5.0V,
CS = 0V, VOH = V+ – 0.7V
−7
mA
Output Sink Current, SDO VD = 3.3V or 5.0V,
CS = 0V, VOL = 1.0V
10
I
OZ
Output Tri-state Leakage Current,
SDO
VD = 3.3V or 5.0V,
CS = VD = 3.3V or 5V
±1 µA
t
1
High Period, SCK (Note 9) 100
ns
t
2
Low Period, SCK (Note 9) 100
ns
t
3
Set Up Time, CS to SCK (Note 9) 50
ns
t
4
Set Up Time, SDI to SCK (Note 9) 30
ns
t
5
Hold Time, SCK to SDI (Note 9) 10
ns
t
6
Prop. Delay, SCK to SDO (Note 9)
60 ns
t
7
Hold Time, SCK Transition to CS
Rising Edge
(Note 9) 50
ns
t
8
CS Inactive (Note 9) 50
ns
t
9
Prop. Delay, CS to SDO Active (Note 9)
50 ns
t
10
Prop. Delay, CS to SDO Inactive (Note 9)
50 ns
t
11
Hold Time, SCK Transition to CS
Falling Edge
(Note 9) 10
ns
tR/t
F
Signal Rise and Fall Times (Note 9) 1.5
5 ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but for which specific performance is not guaranteed. For guaranteed specifications and the test conditions, see Electrical Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22–A115–A (ESD MM std. of JEDEC). FieldInduced Charge-Device Model, applicable std. JESD22–C101–C (ESD FICDM std. of JEDEC).
Note 3: The short circuit test is a momentary test which applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated
ambient temperature can exceed the maximum allowable junction temperature of 150°C.
Note 4: The maximum power dissipation is a function of T
J(MAX)
, θJA. The maximum allowable power dissipation at any ambient temperature is PD = (T
J(MAX)
–
TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
Note 5: Typical Values indicate the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Slew rate is the average of the rising and falling slew rates.
Note 8: The offset voltage average drift is determined by dividing the value of VOS at the temperature extremes by the total temperature change.
Note 9: Load for these tests is shown in the Timing Diagram Test Circuit.
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LMP8100