NSC LMC555CN, LMC555CMX, LMC555CMMX, LMC555CM, LMC555CBPX Datasheet

LMC555
CMOS Timer

General Description

The LMC555 is a CMOS version of the industry standard
555 series general purpose timers. In addition to the stan­dard package(SOIC, MSOP, and MDIP) the LMC555 is also
available in achip sized package(8 Bump micro SMD) using
National’s micro SMD package technology. The LMC555 of­fers the same capability of generating accurate time delays
and frequencies as the LM555 but with much lower power
dissipation and supply current spikes. When operated as a
one-shot, the time delay is precisely controlled by a single
external resistor and capacitor. In the stable mode the oscil­lation frequency and duty cycle are accurately set by two ex­ternal resistors and one capacitor. The use of National Semi­conductor’s LMCMOS

™

process extends boththe frequency

range and low supply capability.

Features

n Less than 1 mW typical power dissipation at 5V supply
n 3 MHz astable frequency capability
n 1.5V supply operating voltage guaranteed
n Output fully compatible with TTL and CMOS logic at 5V

supply

n Tested to −10 mA, +50 mA output current levels
n Reduced supply current spikes during output transitions
n Extremely low reset, trigger, and threshold currents
n Excellent temperature stability
n Pin-for-pin compatible with 555 series of timers
n Available in 8 pin MSOP Package and 8-Bump micro

SMD package

Block and Connection Diagrams

LMCMOS™is a trademark of National Semiconductor Corp.

8-Pin SOIC, MSOP,

and MDIP Packages

DS008669-1

Top View

8-Bump micro SMD

DS008669-9

Top View

(bump side down)

February 2000

LMC555 CMOS Timer

© 2000 National Semiconductor Corporation DS008669 www.national.com

Ordering Information

Package Temperature Range Package Marking Transport Media NSC

Drawing

Industrial

−40˚C to +85˚C

8-LeadSmall Outline
(SO)

LMC555CM LMC555CM Rails

M08A

LMC555CMX LMC555CM 2.5k Units Tape and Reel

8-Lead Mini Small
Outline (MSOP)

LMC555CMM ZC5 1k Units Tape and Reel

MUA08A

LMC555CMMX ZC5 3.5k Units Tape and Reel

8-Lead Molded Dip
(MDIP)

LMC555CN LMC555CN Rails

N08E

8-Bump micro SMD LMC555CBP F1 250 Units Tape and Reel

BPA08EFB

LMC555CBPX F1 3k Units Tape and Reel

Metronome Circuit LMC555CBPEVAL N/A N/A N/A

micro SMD Marking Orientation

Top View

DS008669-23

Bumps are numbered counter-clockwise

LMC555

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Absolute Maximum Ratings (Notes 2, 3)

If Military/Aerospace specified devices are required,
please contact theNational Semiconductor SalesOffice/
Distributors for availability and specifications.

Supply Voltage, V

+

15V

Input Voltages, V

TRIG,VRES,VCTRL

,

V

THRESH

−0.3V to VS+ 0.3V

Output Voltages, V

O,VDIS

15V

Output Current I

O,IDIS

100 mA
Storage Temperature Range −65˚C to +150˚C
Soldering Information

MDIP Soldering (10 seconds) 260˚C
SOIC, MSOP Vapor Phase (60

sec) 215˚C

SOIC, MSOP Infrared (15 sec) 220˚C

Note: See AN-450 “Surface Mounting Methods and Their Effect on Product

Reliability” for other methods of soldering surface mount devices.

Operating Ratings(Notes 2, 3)

Termperature Range −40˚C to +85˚C

Thermal Resistance (θ

JA

) (Note 2)
SO, 8-lead Small Outline 169˚C/W
MSOP, 8-lead Mini Small

Outline 225˚C/W
MDIP, 8-lead Molded Dip 111˚C/W
8-Bump micro SMD 220˚C/W

Maximum Allowable Power
Dissipation

@

25˚C
MDIP-8 1126mW
SO-8 740mW
MSOP-8 555mW
8 Bump micro SMD 568mW

Electrical Characteristics (Notes 1, 2)

Test Circuit, T=25˚C, all switches open, RESET to V

S

unless otherwise noted

Symbol Parameter Conditions Min Typ Max Units

(Limits)

I

S

Supply Current V

S

=

1.5V

V

S

=

5V

V

S

=

12V

50
100
150

150
250
400

µA

V

CTRL

Control Voltage V

S

=

1.5V

V

S

=

5V

V

S

=

12V

0.8

2.9

7.4

1.0

3.3

8.0

1.2

3.8

8.6

V

V

DIS

Discharge Saturation
Voltage

V

S

=

1.5V, I

DIS

=

1mA

V

S

=

5V, I

DIS

=

10 mA

75
150

150
300

mV

V

OL

Output Voltage (Low) V

S

=

1.5V, I

O

=

1mA

V

S

=

5V, I

O

=

8mA

V

S

=

12V, I

O

=

50 mA

0.2

0.3

1.0

0.4

0.6

2.0

V

V

OH

Output Voltage
(High)

V

S

=

1.5V, I

O

=

−0.25 mA

V

S

=

5V, I

O

=

−2 mA

V

S

=

12V, I

O

=

−10 mA

1.0

4.4

10.5

1.25

4.7

11.3

V

V

TRIG

Trigger Voltage V

S

=

1.5V

V

S

=

12V

0.4

3.7

0.5

4.0

0.6

4.3

V

I

TRIG

Trigger Current V

S

=

5V 10 pA

V

RES

Reset Voltage V

S

=

1.5V (Note 4)

V

S

=

12V

0.4

0.4

0.7

0.75

1.0

1.1

V

I

RES

Reset Current V

S

=

5V 10 pA

I

THRESH

Threshold Current V

S

=

5V 10 pA

I

DIS

Discharge Leakage V

S

=

12V 1.0 100 nA

t Timing Accuracy SW 2, 4 Closed

V

S

=

1.5V

V

S

=

5V

V

S

=

12V

0.9

1.0

1.0

1.1

1.1

1.1

1.25

1.20

1.25

ms

∆t/∆V

S

Timing Shift with Supply V

S

=

5V

±

1V 0.3

%

/V

∆t/∆T Timing Shift with

Temperature

V

S

=

5V

−40˚C ≤ T ≤ +85˚C

75 ppm/˚C

f

A

Astable Frequency SW 1, 3 Closed, V

S

=

12V 4.0 4.8 5.6 kHz

f

MAX

Maximum Frequency Max. Freq. Test Circuit, V

S

=

5V 3.0 MHz

t

R,tF

Output Rise and
Fall Times

Max. Freq. Test Circuit
V

S

=

5V, C

L

=

10 pF

15 ns

LMC555

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Electrical Characteristics (Notes 1, 2)

Test Circuit, T=25˚C, all switches open, RESET to V

S

unless otherwise noted (Continued)

Symbol Parameter Conditions Min Typ Max Units

(Limits)

t

PD

Trigger Propagation Delay V

S

=

5V, Measure Delay

from Trigger to Output

100 ns

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damagetothedevicemayoccur. Operating Ratings indicate conditions for whichthedeviceisfunc-

tional, but donotguaranteespecificperformancelimits.Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar­antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.

Note 3: See AN-450 for other methods of soldering surface mount devices, and also AN-1112 for micro SMD considerations.
Note 4: If the RESET pin is to be used at temperatures of −20˚C and below V

S

is required to be 2.0V or greater.

Note 5: For device pinout please refer to table 1

TABLE 1. Package Pinout Names vs. Pin Function

Pin Function Package Pin numbers

8-Pin SO,MSOP, and MDIP 8-Bump micro SMD
GND 1 7
Trigger

26
Output 3 5
Reset

44
Control Voltage 5 3
Threshold 6 2
Discharge 7 1
V

+

88

Test Circuit (Note 5)

DS008669-2

Maximum Frequency Test Circuit (Note 5)

DS008669-3

LMC555

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