LM340/LM78XXC Electrical Characteristics (Note 4) (Continued)
0˚C ≤ TJ≤ +125˚C unless otherwise specified
Output Voltage 5V 12V 15V
Symbol Input Voltage (unless otherwise noted) 10V 19V 23V Units
Parameter Conditions Min Typ Max Min Typ Max Min Typ Max
V
MIN
≤ VIN≤ V
MAX
(7.5 ≤ VIN≤ 20) (14.8 ≤ VIN≤
27)
(17.9 ≤ VIN≤ 30) V
I
O
≤ 500 mA, 0˚C ≤ TJ≤ +125˚C 1.0 1.0 1.0 mA
V
MIN
≤ VIN≤ V
MAX
(7 ≤ VIN≤ 25) (14.5 ≤ VIN≤
30)
(17.5 ≤ VIN≤ 30) V
V
N
Output Noise
Voltage
TA= 25˚C, 10 Hz ≤ f ≤ 100 kHz 40 75 90 µV
Ripple Rejection IO≤ 1A, TJ=
25˚C
62 80 55 72 54 70 dB
f = 120 Hz or I
O
≤ 500 mA, 62 55 54 dB
0˚C ≤ T
J
≤ +125˚C
V
MIN
≤ VIN≤ V
MAX
(8 ≤ VIN≤ 18) (15 ≤ VIN≤ 25) (18.5 ≤ VIN≤
28.5)
V
R
O
Dropout Voltage TJ= 25˚C, IO= 1A 2.0 2.0 2.0 V
Output Resistance f = 1 kHz 8 18 19 mΩ
Short-Circuit Current T
J
= 25˚C 2.1 1.5 1.2 A
Peak Output
Current
T
J
= 25˚C 2.4 2.4 2.4 A
Average TC of V
OUT
0˚C ≤ TJ≤ +125˚C, IO= 5 mA −0.6 −1.5 −1.8 mV/˚C
V
IN
Input Voltage TJ= 25˚C, IO≤ 1A
Required to
Maintain
7.5 14.6 17.7 V
Line Regulation
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions
but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2: The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (T
JMAX
= 125˚C
or 150˚C), the junction-to-ambient thermal resistance (θ
JA
), and the ambient temperature (TA). P
DMAX
=(T
JMAX−TA
)/θJA. If this dissipation is exceeded, the die
temperature will rise above T
JMAX
and the electrical specifications do not apply. If the die temperature rises above 150˚C, the device will go into thermal shutdown.
For the TO-3 package (K, KC), the junction-to-ambient thermal resistance (θ
JA
) is 39˚C/W. When using a heatsink, θJAis the sum of the 4˚C/W junction-to-case
thermal resistance (θ
JC
) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (T), θJAis 54˚C/W and θJCis
4˚C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174˚C/W and can be reduced by a heatsink (see Applications Hints on heatsinking).
If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package: Using 0.5 square
inches of copper area, θ
JA
is 50˚C/W; with 1 square inch of copper area, θJAis 37˚C/W; and with 1.6 or more inches of copper area, θJAis 32˚C/W.
Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Note 4: All characteristics are measured with a 0.22 µF capacitor from input to ground and a 0.1 µF capacitor from output to ground. All characteristics except noise
voltage and ripple rejection ratio are measured using pulse techniques (t
w
≤ 10 ms, duty cycle ≤ 5%). Output voltage changes due to changes in internal temperature
must be taken into account separately.
Note 5: A military RETS specification is available on request. At the time of printing, the military RETS specifications for the LM140AK-5.0/883, LM140AK-12/883,
and LM140AK-15/883 complied with the min and max limits for the respective versions of the LM140A. At the time of printing, the military RETS specifications for
the LM140K-5.0/883, LM140K-12/883, and LM140K-15/883 complied with the min and max limits for the respective versions of the LM140. The LM140H/883,
LM140K/883, and LM140AK/883 may also be procured as a Standard Military Drawing.
LM340/LM78XX
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