NSC JD54F374SRA Datasheet

TL/F/9524
54F/74F374 Octal D-Type Flip-Flop with TRI-STATE Outputs
May 1995
54F/74F374 Octal D-Type Flip-Flop with TRI-STATE
É
Outputs
General Description
) are common to all
flip-flops.
Features
Y
Edge-triggered D-type inputs
Y
Buffered positive edge-triggered clock
Y
TRI-STATE outputs for bus-oriented applications
Y
Guaranteed 4000V minimum ESD protection
Commercial Military
Package
Package Description
Number
74F374PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line
54F374DM (QB) J20A 20-Lead Ceramic Dual-In-Line
74F374SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC
74F374SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ
74F374MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II
54F374FM (QB) W20A 20-Lead Cerpack
54F374LM (QB) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13×reel. Use suffixeSCX, SJX, and MSAX.
Logic Symbols Connection Diagrams
TL/F/9524– 1
IEEE/IEC
TL/F/9524– 4
Pin Assignment for DIP, SOIC, SSOP and Flatpak
TL/F/9524– 2
Pin Assignment
for LCC
TL/F/9524– 3
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Unit Loading/Fan Out
Pin
54F/74F
Names
Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
D0–D7Data Inputs 1.0/1.0 20 mA/b0.6 mA CP Clock Pulse Input (Active Rising Edge) 1.0/1.0 20 m A/
b
0.6 mA
OE
TRI-STATE Output Enable Input (Active LOW) 1.0/1.0 20 m A/b0.6 mA
O0–O7TRI-STATE Outputs 150/40 (33.3)b3 mA/24 mA (20 mA)
Functional Description
The ’F374 consists of eight edge-triggered flip-flops with in­dividual D-type inputs and TRI-STATE true outputs. The buffered clock and buffered Output Enable are common to all flip-flops. The eight flip-flops will store the state of their individual D inputs that meet the setup and hold time re­quirements on the LOW-to-HIGH Clock (CP) transition. With the Output Enable (OE
) LOW, the contents of the eight flip-
flops are available at the outputs. When the OE
is HIGH, the outputs go to the high impedance state. Operation of the OE
input does not affected the state of the flip-flops.
Truth Table
Inputs Internal Output
D
n
CP OE
Register
O
n
H L LH H LLLL L XXH X Z
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
Z
e
High Impedance
L
e
LOW-to-HIGH Clock Transition
Logic Diagram
TL/F/9524– 5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Storage Temperature
b
65§Ctoa150§C
Ambient Temperature under Bias
b
55§Ctoa125§C
Junction Temperature under Bias
b
55§Ctoa175§C
Plastic
b
55§Ctoa150§C
V
CC
Pin Potential to
Ground Pin
b
0.5V toa7.0V
Input Voltage (Note 2)
b
0.5V toa7.0V
Input Current (Note 2)
b
30 mA toa5.0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0.5V to V
CC
TRI-STATE Output
b
0.5V toa5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
ESD Last Passing Voltage (Min) 4000V
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating Conditions
Free Air Ambient Temperature
Military
b
55§Ctoa125§C
Commercial 0
§
Ctoa70§C
Supply Voltage
Military
a
4.5V toa5.5V
Commercial
a
4.5V toa5.5V
DC Electrical Characteristics
Symbol Parameter
54F/74F
Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1.2 V Min I
IN
eb
18 mA
V
OH
Output HIGH 54F 10% V
CC
2.5 I
OH
eb
1mA
Voltage 54F 10% V
CC
2.4 I
OH
eb
3mA
74F 10% V
CC
2.5 V Min
I
OH
eb
1mA
74F 10% V
CC
2.4 I
OH
eb
3mA
74F 5% V
CC
2.7 I
OH
eb
1mA
74F 5% V
CC
2.7 I
OH
eb
3mA
V
OL
Output LOW 54F 10% V
CC
0.5 V Min
I
OL
e
20 mA
Voltage 74F 10% V
CC
0.5 I
OL
e
24 mA
I
IH
Input HIGH 54F 20.0
mA Max
V
IN
e
2.7V
Current 74F 5.0
I
BVI
Input HIGH Current 54F 100
mA Max
V
IN
e
7.0V
Breakdown Test 74F 7.0
I
CEX
Output HIGH 54F 250
mA Max
V
OUT
e
V
CC
Leakage Current 74F 50
V
ID
Input Leakage
74F 4.75 V 0.0
I
ID
e
1.9 mA
Test All Other Pins Grounded
I
OD
Output Leakage
74F 3.75 mA 0.0
V
IOD
e
150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current
b
0.6 mA Max V
IN
e
0.5V
I
OZH
Output Leakage Current 50 mA Max V
OUT
e
2.7V
I
OZL
Output Leakage Current
b
50 mA Max V
OUT
e
0.5V
I
OS
Output Short-Circuit Current
b
60
b
150 mA Max V
OUT
e
0V
I
ZZ
Bus Drainage Test 500 mA 0.0V V
OUT
e
5.25V
I
CCZ
Power Supply Current 55 86 mA Max V
O
e
HIGH Z
3
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