NSC DS90LV031ATMX, DS90LV031ATM Datasheet

DS90LV031A 3V LVDS Quad CMOS Differential Line Driver
General Description
The DS90LV031Ais a quad CMOS differential line driver de­signed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
The DS90LV031Aaccepts low voltage TTL/CMOS input lev­els and translates them to low voltage (350 mV) differential output signals. In addition the driver supports aTRI-STATE
®
function that may be used to disable the output stage, dis­abling the load current, and thus dropping the device to an ultra low idle power state of 13 mW typical.
Features
n
>
400 Mbps (200 MHz) switching rates
n 0.1 ns typical differential skew n 0.4 ns maximum differential skew n 2.0 ns maximum propagation delay n 3.3V power supply design
n
±
350 mV differential signaling
n Low power dissipation (13mW at 3.3V static) n Interoperable with existing 5V LVDS devices n Compatible with IEEE 1596.3 SCI LVDS standard n Compatible with TIA/EIA-644 LVDS standard n Industrial and Military operating temperature range n Available in SOIC, TSSOP and Cerpack surface mount
packaging
n Standard Microcircuit Drawing (SMD) 5962-9865201
Connection Diagram Functional Diagram
Truth Table
DRIVER
Enables Input Outputs
EN EN
*
D
IN
D
OUT+DOUT−
LHXZZ
All other combinations of ENABLE inputs
LLH
HHL
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Dual-In-Line
DS100095-1
Order Number DS90LV031ATM
or DS90LV031ATMTC
or DS90LV031AW
See NS Package Number M16A or MTC16 or W16A
DS100095-2
July 1999
DS90LV031A 3V LVDS Quad CMOS Differential Line Driver
© 1999 National Semiconductor Corporation DS100095 www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
Input Voltage (D
IN
) −0.3V to (VCC+ 0.3V)
Enable Input Voltage (EN, EN
*
) −0.3V to (VCC+ 0.3V)
Output Voltage (D
OUT+,DOUT−
) −0.3V to +3.9V
Short Circuit Duration
(D
OUT+,DOUT−
) Continuous
Maximum Package Power Dissipation
@
+25˚C M Package 1088 mW MTC Package 866 mW W Package 845 mW
Derate M Package 8.5 mW/˚C above +25˚C Derate MTC Package 6.9 mW/˚C above +25˚C Derate W Package 6.8 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C Lead Temperature Range
Soldering (4 sec.) +260˚C Maximum Junction Temperature +150˚C ESD Rating (Note 10)
(HBM, 1.5 k, 100 pF) 6kV
Recommended Operating Conditions
Min Typ Max Units
Supply Voltage (V
CC
) +3.0 +3.3 +3.6 V
Operating Free Air Temperature (T
A
)
Industrial −40 +25 +85 ˚C
Military -55 +25 +125 ˚C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3, 4)
Symbol Parameter Conditions Pin Min Typ Max Units
V
OD1
Differential Output Voltage R
L
=
100(
Figure 1
)D
OUT−
D
OUT+
250 350 450 mV
V
OD1
Change in Magnitude of V
OD1
for Complementary Output States
4 35 |mV|
V
OS
Offset Voltage 1.125 1.25 1.375 V
V
OS
Change in Magnitude of VOSfor Complementary Output States
5 25 |mV|
V
OH
Output Voltage High 1.38 1.6 V
V
OL
Output Voltage Low 0.90 1.03 V
V
IH
Input Voltage High DIN,
EN, EN*
2.0 V
CC
V
V
IL
Input Voltage Low GND 0.8 V
I
IH
Input Current V
IN
=
V
CC
or 2.5V −10
±
1 +10 µA
I
IL
Input Current V
IN
=
GND or 0.4V −10
±
1 +10 µA
V
CL
Input Clamp Voltage I
CL
=
−18 mA −1.5 −0.8 V
I
OS
Output Short Circuit Current ENABLED, (Note 11)
D
IN=VCC,DOUT+
=0Vor
D
IN
= GND, D
OUT−
=0V
D
OUT−
D
OUT+
−6.0 −9.0 mA
I
OSD
Differential Output Short Circuit Current
ENABLED, VOD=0V (Note 11)
−6.0 −9.0 mA
I
OFF
Power-off Leakage V
OUT
=
0V or 3.6V,
V
CC
=
0V or Open
−20
±
1 +20 µA
I
OZ
Output TRI-STATE Current EN = 0.8V and EN* = 2.0V
V
OUT
=
0V or V
CC
−10
±
1 +10 µA
I
CC
No Load Supply Current Drivers Enabled
DIN=VCCor GND V
CC
5.0 8.0 mA
I
CCL
Loaded Supply Current Drivers Enabled
RL= 100All Channels, DIN= V
CC
or GND (all inputs)
23 30 mA
I
CCZ
No Load Supply Current Drivers Disabled
DIN=VCCor GND, EN = GND, EN* = V
CC
2.6 6.0 mA
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Switching Characteristics - Industrial
V
CC
=
+3.3V
±
10%,T
A
=
−40˚C to +85˚C (Notes 3, 9, 12)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low RL= 100,CL=10pF
(
Figure 2
and
Figure 3
)
0.8 1.18 2.0 ns
t
PLHD
Differential Propagation Delay Low to High 0.8 1.25 2.0 ns
t
SKD1
Differential Pulse Skew |t
PHLD−tPLHD
|
(Note 5)
0 0.07 0.4 ns
t
SKD2
Channel-to-Channel Skew (Note 6) 0 0.1 0.5 ns
t
SKD3
Differential Part to Part Skew (Note 7) 0 1.0 ns
t
SKD4
Differential Part to Part Skew (Note 8) 0 1.2 ns
t
TLH
Rise Time 0.38 1.5 ns
t
THL
Fall Time 0.40 1.5 ns
t
PHZ
Disable Time High to Z RL= 100,CL=10pF
(
Figure 4
and
Figure 5
)
5ns
t
PLZ
Disable Time Low to Z 5ns
t
PZH
Enable Time Z to High 7ns
t
PZL
Enable Time Z to Low 7ns
f
MAX
Maximum Operating Frequency (Note 14) 200 250 MHz
Switching Characteristics - Military
V
CC
=
+3.3V
±
10%,T
A
=
−55˚C to +125˚C (Notes 9, 12)
Symbol Parameter Conditions Min Max Units
t
PHLD
Differential Propagation Delay High to Low RL= 100,CL=10pF
(
Figure 2
and
Figure 3
)
0.8 2.0 ns
t
PLHD
Differential Propagation Delay Low to High 0.8 2.0 ns
t
SKD1
Differential Pulse Skew |t
PHLD−tPLHD
|
(Note 5)
0 0.4 ns
t
SKD2
Channel-to-Channel Skew (Note 6) 0 0.5 ns
t
SKD3
Differential Part to Part Skew (Note 7) 0 1.0 ns
t
SKD4
Differential Part to Part Skew (Note 8) 0 1.2 ns
t
TLH
Rise Time 1.5 ns
t
THL
Fall Time 1.5 ns
t
PHZ
Disable Time High to Z RL= 100,CL=10pF
(
Figure 4
and
Figure 5
)
5ns
t
PLZ
Disable Time Low to Z 5ns
t
PZH
Enable Time Z to High 7ns
t
PZL
Enable Time Z to Low 7ns
f
MAX
Maximum Operating Frequency (Note 14) 200 MHz
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: V
OD1
and
V
OD1
.
Note 3: All typicals are given for: V
CC
=
+3.3V, T
A
=
+25˚C.
Note 4: The DS90LV031Ais a current mode device and only functions within datasheet specifications when a resistive load is applied to the driver outputs typical range is (90to 110)
Note 5: t
SKD1
,|t
PHLD−tPLHD
| is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the
same channel. Note 6: t
SKD2
is the Differential Channel-to-Channel Skew of any event on the same device.
Note 7: t
SKD3
, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This speci-
fication applies to devices at the same V
CC
and within 5˚C of each other within the operating temperature range.
Note 8: t
SKD4
, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended
operating temperature and voltage ranges, and across process distribution. t
SKD4
is defined as |Max − Min| differential propagation delay.
Note 9: Generator waveform for all tests unless otherwise specified: f=1 MHz, Z
O
=
50,t
r
1 ns, and tf≤ 1 ns.
Note 10: ESD Ratings:
HBM (1.5 k, 100 pF) 6kV
Note 11: Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only.
Note 12: C
L
includes probe and jig capacitance.
Note 13: All input voltages are for one channel unless otherwise specified. Other inputs are set to GND. Note 14: f
MAX
generator input conditions: t
r
=
t
f
<
1ns, (0%to 100%), 50%duty cycle, 0V to 3V.Output Criteria: duty cycle=45%/55%, VOD>250mV,all channels
switching.
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Parameter Measurement Information
DS100095-3
FIGURE 1. Driver VODand VOSTest Circuit
DS100095-4
FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit
DS100095-5
FIGURE 3. Driver Propagation Delay and Transition Time Waveforms
DS100095-6
FIGURE 4. Driver TRI-STATE Delay Test Circuit
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Parameter Measurement Information (Continued)
Typical Application
Applications Information
General application guidelines and hints for LVDS drivers and receivers may be found in the following application notes: LVDS Owner’s Manual (lit #550062-001), AN808, AN1035, AN977, AN971, AN916, AN805, AN903.
LVDSdrivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in
Figure 6
. This configuration provides a clean signaling en­vironment for the quick edge rates of the drivers. The re­ceiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic dif­ferential impedance of the media is in the range of 100.A termination resistor of 100should be selected to match the media, and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced bythe driver into a voltagethat is detected by the re­ceiver. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance disconti­nuities as well as ground shifting, noise margin limits, and to­tal termination loading must be taken into account.
The DS90LV031A differential line driver is a balanced cur­rent source design. A current mode driver, generally speak­ing has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in one direction to pro-
duce a logic state and in the other direction to produce the other logic state. The output current is typically 3.5 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode requires (as discussed above) that a resistive termi­nation be employed to terminate the signal and to complete the loop as shown in
Figure 6
. AC or unterminated configu­rations are not allowed. The 3.5 mA loop currentwill develop a differential voltage of 350 mV across the 100termination resistor which the receiver detects with a 250 mV minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold (350 mV – 100 mV
= 250 mV)). The signal is centered around +1.2V (Driver Off­set, V
OS
) with respect to ground as shown in
Figure 7
. Note
that the steady-state voltage (V
SS
) peak-to-peak swing is
twice the differential voltage (V
OD
) and is typically 700 mV.
The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its quies­cent current remains relatively flat versus switching fre­quency.Whereas the RS-422 voltage mode driverincreases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows between the rails of the device when the internal gates switch. Whereas the cur­rent mode driver switches a fixed current between its output without any substantial overlap current. This is similar to some ECL and PECL devices, but without the heavy static I
CC
requirements of the ECL/PECL designs. LVDS requires
>
80%less current than similar PECL devices. AC specifica­tions for the driver are a tenfold improvement over other ex­isting RS-422 drivers.
DS100095-7
FIGURE 5. Driver TRI-STATE Delay Waveform
DS100095-8
FIGURE 6. Point-to-Point Application
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Applications Information (Continued)
The TRI-STATE function allows the driver outputs to be dis­abled, thus obtaining an even lower power state when the transmission of data is not required.
The footprint of the DS90LV031Ais the same as the industry standard 26LS31 Quad Differential (RS-422) Driver and is a step down replacement for the 5V DS90C031 Quad Driver.
Power Decoupling Recommendations:
Bypass capacitors must be used on power pins. High fre­quency ceramic (surface mount is recommended) 0.1µF in parallel with 0.01µF, in parallel with 0.001µF at the power supply pin as well as scattered capacitors over the printed circuit board. Multiple vias should be used to connect the de­coupling capacitors to the power planes. A 10µF (35V) or greater solid tantalum capacitor should be connected at the power entry point on the printed circuit board.
PC Board considerations:
Use at least 4 PCB layers (top to bottom); LVDS signals, ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put TTL and LVDS signals on different layers which are isolated by a power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
Differential Traces:
Use controlled impedance traces which match the differen­tial impedance of your transmission medium (ie. cable) and termination resistor. Run the differential pair trace lines as close together as possible as soon as they leave the IC (stubs should be
<
10mm long). This will help eliminate re­flections and ensure noise is coupled as common-mode. In fact, we have seen that differential signals which are 1mm apart radiate far less noise than traces 3mm apart since magnetic field cancellation is much better with the closer traces. Plus, noise induced on the differential lines is much more likely to appear as common-mode which is rejected by the receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase differ­ence between signals which destroys the magnetic field can­cellation benefits of differential signals and EMI will result. (Note the velocity of propagation, v = c/Er where c (the speed of light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely solely on the autoroute function for differential traces. Care­fully review dimensions to match differential impedance and provide isolation for the differential lines. Minimize the num­ber or vias and other discontinuities on the line.
Avoid 90˚ turns (these cause impedance discontinuities). Use arcs or 45˚ bevels.
Within a pair of traces, the distance between the two traces should be minimized to maintain common-mode rejection of the receivers. On the printed circuit board, this distance should remain constant to avoid discontinuities in differential impedance. Minor violations at connection points are allow­able.
Termination:
Use aresistor which best matches the differential impedance or your transmission line. The resistor should be between 90and 130. Remember that the current mode outputs need the termination resistor to generate the differential volt­age. LVDS will not work without resistor termination. Typi­cally,connect a single resistor across the pair atthe receiver end.
Surface mount 1%to 2%resistors are best. PCB stubs, component lead, and the distance from the termination to the receiver inputs should be minimized. The distance between the termination resistor and the receiver should be
<
10mm
(12mm MAX).
Probing LVDS Transmission Lines:
Always use high impedance (
>
100k), low capacitance
(
<
2pF) scope probes with a wide bandwidth (1GHz) scope.
Improper probing will give deceiving results.
Cables and Connectors, General Comments:
When choosing cable and connectors for LVDS it is impor­tant to remember:
Use controlled impedance media. The cables and connec­tors you use should have a matched differential impedance of about 100. They should not introduce major impedance discontinuities.
Balanced cables (e.g. twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax.) for noise re­duction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also tend to pick up electromagnetic radiation a common-mode (not differen­tial mode) noise which is rejected by the receiver. For cable distances
<
0.5M, most cables can be made to work effec­tively. For distances 0.5M d 10M, CAT 3 (category 3) twisted pair cable works well, is readily available and rela­tively inexpensive.
Fail-safe Feature:
The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic levels. Due to the high gain and tight threshold of the re­ceiver,care should be taken to prevent noise from appearing as a valid signal.
The receiver’s internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs.
1. Open Input Pins. The DS90LV032A is a quad receiver
device, and if an application requires only 1, 2 or 3 re­ceivers, the unused channel(s) inputs should be left OPEN. Do not tie unused receiver inputs to ground or any other voltages. The input is biased by internal high value pull up and pull down resistors to set the output to a HIGH state. This internal circuitry will guarantee a HIGH, stable output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable
unplugged), or if the driver is in a TRI-STATE or power­off condition, the receiver output will again be in a HIGH state, even with the end of cable 100termination resis­tor across the input pins. The unplugged cable can be­come a floating antenna which can pick up noise. If the cable picks up more than 10mV of differential noise, the receiver may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not differential, a balanced interconnect should be used. Twisted pair cable will offer better balance than flat rib­bon cable.
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Applications Information (Continued)
3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V differ­ential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (GND to
2.4V). It is only supported with inputs shorted and no ex­ternal common-mode voltage applied.
External lower value pull up and pull down resistors (for a stronger bias) may be used to boost fail-safe in the presence of higher noise levels. The pull up and pull down resistors should be in the 5kto 15krange to minimize loading and waveform distortion to the driver. The common-mode bias point should be set to approximately 1.2V (less than 1.75V) to be compatible with the internal circuitry.
Pin Descriptions
Pin No. Name Description
1, 7, 9, 15 D
IN
Driver input pin, TTL/CMOS compatible
2, 6, 10,14D
OUT+
Non-inverting driver output pin, LVDS levels
3, 5, 11,13D
OUT−
Inverting driver output pin, LVDS levels
4 EN Active high enable pin, OR-ed
with EN
*
12 EN*Active low enable pin, OR-ed
with EN
16 V
CC
Power supply pin, +3.3V±0.3V
8 GND Ground pin
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40˚C to +85˚C SOP/M16A DS90LV031ATM
−40˚C to +85˚C TSSOP/MTC16 DS90LV031ATMTC
Operating Package Type/ Order Number
Temperature Number
-55˚C to +125˚C Cerpack/W16A DS90LV031AW-QML
DS100095-9
FIGURE 7. Driver Output Levels
DS100095-10
FIGURE 8. Typical DS90LV031A, D
OUT
(single ended)
vs R
L,TA
= 25˚C
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Applications Information (Continued)
DS100095-11
FIGURE 9. Typical DS90LV031A, D
OUT
vs RL,
V
CC
= 3.3V, TA= 25˚C
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Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90LV031ATM
NS Package Number M16A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead (0.100" Wide) Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90LV031ATMTC
NS Package Number MTC16
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
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2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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www.national.com
16-Lead Cerpack
Order Number DS90LV031AW-QML
NS Package Number W16A
DS90LV031A 3V LVDS Quad CMOS Differential Line Driver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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