Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
Input Voltage (R
IN
+, RIN−) −0.3V to +3.9V
Output Voltage (R
OUT
) −0.3V to (VCC+ 0.3V)
Maximum Package Power Dissipation +25˚C
M Package 1025 mW
Derate M Package 8.2 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature Range Soldering
(4 sec.) +260˚C
Maximum Junction Temperature +150˚C
ESD Rating (Note 4)
(HBM 1.5 kΩ, 100 pF) ≥ 7kV
(EIAJ 0Ω, 200 pF) ≥ 500 V
Recommended Operating
Conditions
Min Typ Max Units
Supply Voltage (V
CC
) +3.0 +3.3 +3.6 V
Receiver Input Voltage GND 3.0 V
Operating Free Air
Temperature (T
A
) −40 25 +85 ˚C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3)
Symbol Parameter Conditions Pin Min Typ Max Units
V
TH
Differential Input High Threshold VCM= +1.2V, 0V, 3V (Note 11) RIN+, +100 mV
V
TL
Differential Input Low Threshold RIN− −100 mV
I
IN
Input Current VIN= +2.8V VCC= 3.6V or 0V −10
±
1 +10 µA
V
IN
= 0V −10
±
1 +10 µA
V
IN
= +3.6V VCC= 0V -20 +20 µA
V
OH
Output High Voltage IOH= −0.4 mA, VID= +200 mV R
OUT
2.7 3.1 V
I
OH
= −0.4 mA, Inputs terminated 2.7 3.1 V
I
OH
= −0.4 mA, Inputs shorted 2.7 3.1 V
V
OL
Output Low Voltage IOL= 2 mA, VID= −200 mV 0.3 0.5 V
I
OS
Output Short Circuit Current V
OUT
= 0V (Note 5) −15 −50 −100 mA
V
CL
Input Clamp Voltage ICL= −18 mA −1.5 −0.8 V
I
CC
No Load Supply Current Inputs Open V
CC
5.4 9 mA
Switching Characteristics
VCC= +3.3V±10%,TA= −40˚C to +85˚C (Notes 6, 7)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low CL= 15 pF 1.0 1.6 2.5 ns
t
PLHD
Differential Propagation Delay Low to High VID= 200 mV 1.0 1.7 2.5 ns
t
SKD1
Differential Pulse Skew |t
PHLD−tPLHD
| (Note 8) (
Figure 1
and
Figure 2
) 0 50 400 ps
t
SKD3
Differential Part to Part Skew (Note 9) 0 1.0 ns
t
SKD4
Differential Part to Part Skew (Note 10) 0 1.5 ns
t
TLH
Rise Time 325 800 ps
t
THL
Fall Time 225 800 ps
f
MAX
Maximum Operating Frequency (Note 12) 200 250 MHz
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Currentout of device pins is definedas negative.All voltages are referenced to groundunless otherwise specified (such as V
ID
).
Note 3: All typicals are given for: V
CC
= +3.3V and TA= +25˚C.
Note 4: ESD Rating: HBM (1.5 kΩ, 100 pF) ≥ 7kV
EIAJ (0Ω, 200 pF) ≥ 500V
Note 5: Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not ex-
ceed maximum junction temperature specification.
Note 6: C
L
includes probe and jig capacitance.
Note 7: Generator waveform for all tests unless otherwise specified:f=1MHz, Z
O
=50Ω,trand tf(0%to 100%) ≤ 3 ns for RIN.
Note 8: t
SKD1
is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of the same channel.
Note 9: t
SKD3
, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same V
CC
and within 5˚C of each other within the operating temperature range.
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