Pin Descriptions
Pin
Name
Pin
Number
I/O, Type Description
DIFFERENTIAL INPUTS COMMON TO ALL MUXES
IN1+
IN1−
16
15
I, LVDS Inverting and non-inverting differential inputs.
IN2+
IN2−
14
13
I, LVDS Inverting and non-inverting differential inputs.
IN3+
IN3−
12
11
I, LVDS Inverting and non-inverting differential inputs.
IN4+
IN4−
10
9
I, LVDS Inverting and non-inverting differential inputs.
SWITCHED DIFFERENTIAL OUTPUTS
OUT1+
OUT1−
25
26
O, LVDS Inverting and non-inverting differential outputs. OUT1
±
can be connected to any
one pair IN1
±
, IN2±, IN3±,orIN4
±
OUT2+
OUT2−
27
28
O, LVDS Inverting and non-inverting differential outputs. OUT2±can be connected to any
one pair IN1
±
, IN2±, IN3±,orIN4
±
OUT3+
OUT3−
29
30
O, LVDS Inverting and non-inverting differential outputs. OUT3±can be connected to any
one pair IN1
±
, IN2±, IN3±,orIN4
OUT4+
OUT4−
31
32
O, LVDS Inverting and non-inverting differential outputs. OUT4
±
can be connected to any
one pair IN1
±
, IN2±, IN3±,orIN4
±
DIGITAL CONTROL INTERFACE
SCLK 6 I, LVCMOS Control clock to latch in programming data at SI. SCLK can be 0 MHz to
100 MHz. SCLK should be burst of clock pulses active only while accessing the
device. After completion of programming, SCLK should be kept at logic low to
minimize potential noise injection into the high-speed differential data paths.
SI / SEL1 7 I, LVCMOS Programming data to select the switch configuration. Data is latched into the input
buffer register at the rising edge of SCLK.
SEL0 5 I, LVCMOS Programming data to select the switch configuration.
CSO
RSO
18
2
O, LVCMOS With MODE low, control data is shifted out at CSO (RSO) for cascading to the
next device in the serial chain. The control data at CSO (RSO) is identical to that
shifted in at SI with the exception of the device column (row) address being
decremented by one internally before propagating to the next device in the chain.
CSO (RSO) is clocked out at the rising edge of SCLK.
CSCLK
RSCLK
19
3
O, LVCMOS With MODE low, these pins function as a buffered control clock from SCLK.
CSCLK (RSCLK) is used for cascading the serial control bus to the next device in
the serial chain.
LOAD 22 I, LVCMOS When LOAD is high and SCLK makes a LH transition, the device transfers the
programming data in the load register into the configuration registers. The new
switch configuration for all outputs takes effect. LOAD needs to remain high for
only one SCLK cycle to complete the process, holding LOAD high longer repeats
the transfer to the configuration register.
MODE 23 I, LVCMOS When MODE is low, the SCLK is active and a buffered SCLK signal is present at
the CLKOUT output. When MODE is high, the SCLK signal is uncoupled from
register and state machine internals. Internal registers will see an active low signal
until MODE is brought Low again.
POWER
V
DD
1, 8, 17,
24
I, Power VDD= 2.5V±5%. At least 4 low ESR 0.01 µF bypass capacitors should be
connected from V
DD
to GND plane.
GND 4, 20, 21,
DAP
I, Power Ground reference to LVDS and CMOS circuitry.
DAP is the exposed metal contact at the bottom of the LPP-32 package. The DAP
is used as the primary GND connection to the device. It should be connected to
the ground plane with at least 4 vias for optimal AC and thermal performance.
DS90CP04
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