NSC DS3883AV, DS3883AVX, DS3883AVF, DS3883AVB Datasheet

DS3883A BTL 9-Bit Data Transceiver
General Description
The DS3883A is one in a series of transceivers designed specifically for the implementation of high performance Fu­turebus+ and proprietary bus interfaces. The DS3883A, is a BTL 9-bit Transceiver designed to conform to IEEE 1194.1 (Backplane Transceiver Logic—BTL) as specified in the IEEE 896.2 Futurebus+ specification. Utilization of the DS3883A simplifies the implementation of byte wide address/data with parity lines and also may be used for the Futurebus+ status, tag and command lines.
The DS3883A driver output configuration is an NPN open collector which allows Wired-OR connection on the bus. Each driver output incorporates a Schottky diode in series with its collector to isolate the transistor output capacitance from the bus thus reducing the bus loading in the inactive state. The combined output capacitance of the driver and re­ceiver input is less than 5 pF. The driver also has high sink current capability to comply with the bus loading require­ments defined within IEEE 1194.1 BTL specification.
Backplane Transceiver Logic (BTL) is a signaling standard that was invented and first introduced by National Semicon­ductor, then developed by the IEEE to enhance the perfor­mance of backplane buses. BTL compatible transceivers feature low output capacitance drivers to minimize bus load­ing, a 1V nominal signal swing for reduced power consump­tion and receivers with precision thresholds for maximum noise immunity. BTL eliminates settling time delays that se­verely limit TTL bus performance, and thus provide signifi­cantly higher bus transfer rates. The backplane bus is in­tended to be operated with termination resistors (selected to match the bus impedance) connected to 2.1V at both ends. The low voltage is typically 1V.
Separate ground pins are provided for each BTL output to minimize induced ground noise during simultaneous switch­ing.The unique driver circuitry meets the maximum slew rate of 0.5 V/ns which allows controlled rise and fall times to re­duce noise coupling to adjacent lines.The transceiver’s con­trol and driver inputs are designed with high impedance PNP input structures and are fully TTL compatible.
CC
and QGND pins are provided to minimize the effects
of high current switching noise. The output is TRI-STATE
®
and fully TTL compatible. The DS3883A supports live insertion as defined in 896.2
through the LI (Live Insertion) pin. To implement live inser­tion the LI pin should be connected to the live insertion power connector. If this function is not supported the LI pin must be tied to the V
CC
pin. The DS3883A also provides glitch free power up/down protection during power sequenc­ing.
The DS3883A has two types of power connections in addi­tion to the LI pin. They are the Logic V
CC(VCC
) and the Quiet
V
CC
(QVCC). There are two logic VCCpins on the DS3883 that provide the supply voltage for the logic and control cir­cuitry. Multiple power pins reduce the effects of package in­ductance and thereby minimize switching noise. As these pins are common to the V
CC
bus internal to the device, a voltage delta should never exist between these pins and the voltage difference between V
CC
and QVCCshould never ex-
ceed
±
0.5V because of ESD circuitry.
Additionally, the ESD circuitry between the V
CC
pins and all other pins except for BTL I/O’s and LI pins requires that any voltage on these pins should not exceed the voltage on V
CC
+ 0.5V. There are three different types of ground pins on the
DS3883A. They are the logic ground (GND), BTL grounds (B0GND–B8GND) and the Bandgap reference ground (QGND). All of these ground reference pins are isolated within the chip to minimize the effects of high current switch­ing transients. For optimum performance the QGND should be returned to the connector through a quiet channel that does not carry transient switching current. The GND and B0GND–B8GND should be connected to the nearest back­plane ground pin with the shortest possible path.
Since many different grounding schemes could be imple­mented and ESD circuitry exists on the DS3883, it is impor­tant to note that any voltage difference between ground pins, QGND, GND or B0GND–B8GND should not exceed
±
0.5V
including power-up/down sequencing. When CD (Chip Disable) is high, An and Bn are in a high im-
pedance state. To transmit data (An to Bn) the T/R signal is high. To receive data (Bn to An) the T/R signal is low.
Features
n 9-bit Inverting BTL transceiver meets IEEE 1194.1
standard on Backplane Transceiver Logic (BTL)
n Supports live insertion n Glitch free power-up/down protection n Typically less than 5 pF bus-port capacitance n Low bus-port voltage swing (typically 1V) at 80 mA n Open collector bus-port output allows Wired-OR n Controlled rise and fall time to reduce noise coupling n TTL compatible driver and control inputs n Built in bandgap reference with separate QV
CC
and
QGND pins for precise receiver thresholds
n Exceeds 2 kV ESD (Human Body Model) n Individual bus-port ground pins minimize ground bounce n Tight skew (1 ns typical)
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
July 1998
DS3883A BTL 9-Bit Data Transceiver
© 1999 National Semiconductor Corporation DS010719 www.national.com
Connection Diagram
DS010719-17
Order Number DS3883AVF
See NS Package Number VF44B
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage 6.5V Control Input Voltage 6.5V Driver Input and Receiver Output 5.5V Receiver Input Current
±
15 mA
Bus Termination Voltage 2.4V
Power Dissipation at 25˚C
PQFP (VF44B) 1.3W Derate PQFP Package (VF44B) 11.1 mW/˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature
(Soldering, 4 seconds) 260˚C
Recommended Operating Conditions
Min Max Units
Supply Voltage, V
CC
4.5 5.5 V
Bus Termination Voltage (V
T
) 2.06 2.14 V
Operating Free Air Temperature 0 70 ˚C
DC Electrical Characteristics (Notes 2, 3)
T
A
=
0˚C to +70˚C, V
CC
=
5V
±
10
%
Symbol Parameter Conditions Min Typ Max Units
DRIVER AND CONTROL INPUT (CD, T/R , An)
V
IH
Minimum Input High Voltage 2.0 V
V
IL
Maximum Input Low Voltage 0.8 V
I
I
Input Leakage Current V
IN
=
V
CC
=
5.5V 250 µA
I
IH
Input High Current V
IN
=
2.4V, AN=CD=0.5V, T/R=2.4V
40 µA
I
IL
Input Low Current V
IN
=
0.5V, AN=CD=0.5V, T/R=2.4V
−100 µA
V
CL
Input Diode Clamp Voltage I
CLAMP
=
−12 mA −1.2 V DRIVER OUTPUT/RECEIVER INPUT (Bn) V
OLB
Output Low Bus Voltage An=T/R=2.4V, CD=0.5V 0.75 1.0 1.1 V (Note 5) I
OL
=
80 mA
I
OFF
Output Off Low Current An=0.5V, T/R=2.4V, Bn=0.75V, CD=0.5V −200 µA Output Off High Current An=0.5V, T/R=2.4V, Bn=2.1V, CD=0.5V
200 µA
Output Off Low Current — An=0.5V, T/R=CD=2.4V, Bn=0.75V
−50 µA Chip Disabled Output Off Low Current — An=0.5V, T/R=CD=2.4V, Bn=2.1V
50 µA
Chip Disabled
V
TH
Receiver Input Threshold T/R=CD=0.5V 1.47 1.55 1.62 V
V
CLP
Positive Clamp Voltage V
CC
=
Max or 0V, I
Bn
=
1 mA, CD=T/R=0V
2.4 3.4 4.5 V An=0V V
CC
=
Max or 0V, I
Bn
=
10 mA, CD=T/R=0V
2.9 3.9 5.0 V An=0V
V
CLN
Negative Clamp Voltage I
CLAMP
=
−12 mA, CD=T/R=0.5V
−1.2 V RECEIVER OUTPUT (An) V
OH
Voltage Output High Bn=1.1V, T/R=CD=0.5V, I
OH
=
−2 mA
2.4 3.2 V
V
OL
Voltage Output Low T/R=CD=0.5V, Bn=2.1V, I
OL
=
24 mA
0.35 0.5 V
T/R=CD=0.5V, Bn=2.1V, I
OL
=
8mA
0.35 0.4 V
I
OZ
TRI-STATE Leakage Current An=2.4V, CD=2.4V, T/R=0.5V 10 µA
An=0.5V, CD=2.4V, T/R=0.5V
−10 µA
I
OS
Output Short Circuit Current Bn=1.1V, T/R=CD=0.5V (Note 4) −40 −70 −100 mA
SUPPLY CURRENT
I
CC
Supply Current: Includes T/R=All An Inputs=2.4V, CD=0.5V 62 mA V
CC
,QVCCand LI CD=T/R=0.5V, All Bn Inputs=2.1V 53 mA
I
LI
Live Insertion Current T/R=CD=An=0.5V, Bn=Open, 2.2 mA
V
CC
=
QV
CC
=
5.5V
T/R=All An=2.4V, CD=0.5V, Bn=Open
4.5 mA
V
CC
=
QV
CC
=
5.5V
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