NSC ADC12C170HFEB, ADC12C170 Datasheet

February 2007
ADC12C170 12-Bit, 170 MSPS, 1.1 GHz Bandwidth A/D Converter with CMOS outputs
General Description
The ADC12C170 is a high-performance CMOS analog-to­digital converter capable of converting analog input signals into 12-Bit digital words at rates up to 170 Mega Samples Per Second (MSPS). This converter uses a differential, pipelined architecture with digital error correction and an on-chip sam­ple-and-hold circuit to minimize power consumption and the external component count, while providing excellent dynamic performance. A unique sample-and-hold stage yields a full­power bandwidth of 1.1 GHz. The ADC12C170 operates from dual +3.3V and +1.8V power supplies and consumes 715 mW of power at 170 MSPS.
The separate +1.8V supply for the digital output interface al­lows lower power operation with reduced noise. A power­down feature reduces the power consumption to 5 mW while still allowing fast wake-up time to full operation. In addition there is a sleep feature which consumes 50 mW of power and has a faster wake-up time.
The differential inputs provide a full scale differential input swing equal to 2 times the reference voltage. A stable 1.0V internal voltage reference is provided, or the ADC12C170 can be operated with an external reference.
Clock mode (differential versus single-ended) and output data format (offset binary versus 2's complement) are pin-se­lectable. A duty cycle stabilizer maintains performance over a wide range of input clock duty cycles.
The ADC12C170 is pin compatible with the ADC14155. It is available in a 48-lead LLP package and operates over the
industrial temperature range of −40°C to +85°C.
Features
1.1 GHz Full Power Bandwidth
Internal sample-and-hold circuit
Low power consumption
Internal precision 1.0V reference
Single-ended or Differential clock modes
Clock Duty Cycle Stabilizer
Dual +3.3V and +1.8V supply operation (+/- 10%)
Power-down and Sleep modes
Offset binary or 2's complement output data format
Pin-compatible with: ADC14155
48-pin LLP package, (7x7x0.8mm, 0.5mm pin-pitch)
Key Specifications
Resolution 12 Bits
Conversion Rate 170 MSPS
SNR (fIN = 70 MHz) 67.2 dBFS (typ)
SFDR (fIN = 70 MHz) 85.4 dBFS (typ)
ENOB (fIN = 70 MHz) 10.8 bits (typ)
Full Power Bandwidth 1.1 GHz (typ)
Power Consumption 715 mW (typ)
Applications
High IF Sampling Receivers
Wireless Base Station Receivers
Power Amplifier Linearization
Multi-carrier, Multi-mode Receivers
Test and Measurement Equipment
Communications Instrumentation
Radar Systems
Block Diagram
20209202
© 2007 National Semiconductor Corporation 202092 www.national.com
ADC12C170 12-Bit, 170 MSPS, 1.1 GHz Bandwidth A/D Converter
Connection Diagram
20209201
Ordering Information
Industrial (−40°C TA +85°C)
Package
ADC12C170CISQ 48 Pin LLP
ADC12C170LFEB Evaluation Board
ADC12C170HFEB Evaluation Board
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ADC12C170
Pin Descriptions and Equivalent Circuits
Pin No. Symbol Equivalent Circuit Description
ANALOG I/O
3
VIN− Differential analog input pins. The differential full-scale input signal
level is two times the reference voltage with each input pin signal centered on a common mode voltage, VCM.
4
VIN+
43
V
RP
These pins should each be bypassed to AGND with a low ESL (equivalent series inductance) 0.1 µF capacitor placed very close to the pin to minimize stray inductance. A 0.1 µF capacitor should be placed between VRP and VRN as close to the pins as possible, and a 10 µF capacitor should be placed in parallel. VRP and VRN should not be loaded. VRM may be loaded to 1mA for use as a temperature stable 1.5V reference. It is recommended to use VRM to provide the common mode voltage, VCM, for the differential analog inputs, VIN+ and VIN−.
45
V
RM
44
V
RN
46
V
REF
This pin can be used as either the +1.0V internal reference voltage output (internal reference operation) or as the external reference voltage input (external reference operation). To use the internal reference, V
REF
should be decoupled to AGND with a 0.1 µF, low equivalent series inductance (ESL) capacitor. In this mode, V
REF
defaults as the output for the internal 1.0V reference. To use an external reference, overdrive this pin with a low noise external reference voltage. The input impedance looking into this pin is 9k. Therefore, to overdrive this pin, the output impedance of the external reference source should be << 9kΩ. This pin should not be used to source or sink current. The full scale differential input voltage range is 2 * V
REF
.
8 CLK_SEL/DF
This is a four-state pin controlling the input clock mode and output data format. CLK_SEL/DF = VA, CLK+ and CLK− are configured as a differential clock input. The output data format is 2's complement. CLK_SEL/DF = (2/3)*VA, CLK+ and CLK− are configured as a differential clock input. The output data format is offset binary. CLK_SEL/DF = (1/3)*VA, CLK+ is configured as a single-ended clock input and CLK− should be tied to AGND. The output data format is 2's complement. CLK_SEL/DF = AGND, CLK+ is configured as a single-ended clock input and CLK− should be tied to AGND. The output data format is offset binary.
7 PD/Sleep
This is a three-state input controlling Power Down and Sleep modes. PD = VA, Power Down is enabled. In the Power Down state only the reference voltage circuitry remains active and power dissipation is reduced. PD = VA/2, Sleep mode is enabled. Sleep mode is similar to Power Down mode - it consumes more power but has a faster recovery time. PD = AGND, Normal operation.
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ADC12C170
Pin No. Symbol Equivalent Circuit Description
11 CLK+ The clock input pins can be configured to accept either a single-
ended or a differential clock input signal. When the single-ended clock mode is selected through CLK_SEL/ DF (pin 8), connect the clock input signal to the CLK+ pin and connect the CLK− pin to AGND. When the differential clock mode is selected through CLK_SEL/DF (pin 8), connect the positive and negative clock inputs to the CLK + and CLK− pins, respectively. The analog input is sampled on the falling edge of the clock input.
12 CLK−
DIGITAL I/O
19-24,
27-32
D0–D11
Digital data output pins that make up the 12-Bit conversion result. D0 (pin 19) is the LSB, while D11 (pin 32) is the MSB of the output word. Output levels are CMOS compatible.
33 OVR
Over-Range Indicator. This output is set HIGH when the input amplitude exceeds the 12-Bit conversion range (0 to 4095).
34 DRDY
Data Ready Strobe. This pin is used to clock the output data. It has the same frequency as the sampling clock. One word of data is output in each cycle of this signal. The rising edge of this signal should be used to capture the output data.
17-18 OGND
Output GND, internally tied to GND through 5k ohm resistor to provide pin compatibility with 14 bit ADCs.
ANALOG POWER
1, 6, 9, 37, 40,
41, 48
V
A
Positive analog supply pins. These pins should be connected to a quiet +3.3V source and be bypassed to AGND with 0.01 µF and
0.1 µF capacitors located close to the power pins.
2, 5, 10, 38,
39, 42, 47
AGND The ground return for the analog supply.
DIGITAL POWER
13
V
D
Positive digital supply pin. This pin should be connected to a quiet +3.3V source and be bypassed to DGND with a 0.01 µF and 0.1 µF capacitor located close to the power pin.
14 DGND The ground return for the digital supply.
15, 25, 36
V
DR
Positive driver supply pin for the output drivers. This pin should be connected to a quiet voltage source of +1.8V and be bypassed to DRGND with 0.01 µF and 0.1 µF capacitors located close to the power pins.
16, 26, 35 DRGND
The ground return for the digital output driver supply. These pins should be connected to the system digital ground, but not be connected in close proximity to the ADC's DGND or AGND pins. See Section 6.0 (Layout and Grounding) for more details.
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ADC12C170
Absolute Maximum Ratings
(Notes 1, 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (VA, VD) −0.3V to 4.2V
Supply Voltage (VDR) −0.3V to 2.35V
|VA–VD|
100 mV
Voltage on Any Input Pin (Not to exceed 4.2V)
−0.3V to (VA +0.3V)
Voltage on Any Output Pin (Not to exceed 2.35V)
-0.3V to (VDR +0.2V)
Input Current at Any Pin other than Supply Pins (Note 3)
±5 mA
Package Input Current (Note 3) ±50 mA Max Junction Temp (TJ) +150°C
Thermal Resistance (θJA)
24°C/W
Package Dissipation at TA = 25° C (Note 4)
5.2W
ESD Rating Human Body Model (Note 5) 2000 V Machine Model (Note 5) 200 V Charge Device Model 1000 V Storage Temperature −65°C to +150°C
Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging.
(Note 6)
Operating Ratings (Notes 1, 2)
Operating Temperature
−40°C TA +85°C
Supply Voltage (VA, VD) +3.0V to +3.6V
Output Driver Supply (VDR)
+1.6V to +2.0V CLK −0.05V to (VA + 0.05V)
Clock Duty Cycle 30/70 % Analog Input Pins 0V to 2.6V V
CM
1.4V to 1.6V
|AGND-DGND|
100mV
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ADC12C170
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD = +3.3V, VDR = +1.8V, Internal V
REF
= +1.0V, f
CLK
= 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset Binary Format.
Typical values are for TA = 25°C. Boldface limits apply for T
MIN
TA T
MAX
. All other limits apply for TA = 25°C (Notes 7, 8, 9)
Symbol Parameter Conditions
Typical
(Note 10)
Limits
Units
(Limits)
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes 12 Bits (min)
INL Integral Non Linearity (Note 11)
±0.85
2.95 LSB (max)
-3.29 LSB (min)
DNL Differential Non Linearity
±0.54
1.3 LSB (max)
-0.92 LSB (min)
PGE Positive Gain Error +0.85
3.38 %FS (max)
-2.10 %FS (min)
NGE Negative Gain Error -0.31
3.00 %FS (max)
-3.57 %FS (min)
TC GE Gain Error Tempco
−40°C TA +85°C
+8.0 ppm/°C
V
OFF
Offset Error (VIN+ = VIN−)
−0.13
0.89 %FS (max)
-1.14 %FS (min)
TC V
OFF
Offset Error Tempco
−40°C TA +85°C
+0.5 ppm/°C
Under Range Output Code 0 0
Over Range Output Code 4095 4095
REFERENCE AND ANALOG INPUT CHARACTERISTICS
V
CM
Common Mode Input Voltage 1.5 V
V
RM
Reference Ladder Midpoint Output Voltage
Output load = 1 mA 1.5 V
C
IN
VIN Input Capacitance (each pin to GND) (Note 12)
VIN = 1.5 Vdc ± 0.5 V
(CLK LOW) 9 pF
(CLK HIGH) 6 pF
V
REF
Reference Voltage (Note 13) 1.00 V
Reference Input Resistance 9
kΩ
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ADC12C170
Dynamic Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD = +3.3V, VDR = +1.8V, Internal V
REF
= +1.0V, f
CLK
= 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset Binary Format.
Typical values are for TA = 25°C. Boldface limits apply for T
MIN
TA T
MAX
. All other limits apply for TA = 25°C (Notes 7, 8, 9)
Symbol Parameter Conditions
Typical
(Note
10)
Limits
Units
(Limits)
DYNAMIC CONVERTER CHARACTERISTICS, AIN = -1dBFS
FPBW Full Power Bandwidth -1 dBFS Input, −3 dB Corner 1.1 GHz
SNR Signal-to-Noise Ratio
fIN = 10 MHz
67.5 dBFS
fIN = 70 MHz
67.2 66.0 dBFS
fIN = 150 MHz
67.1 dBFS
fIN = 250 MHz
66.8 dBFS
fIN = 400 MHz
66.0 dBFS
SFDR Spurious Free Dynamic Range
fIN = 10 MHz
86.6 dBFS
fIN = 70 MHz
85.4 74.0 dBFS
fIN = 150 MHz
83.4 dBFS
fIN = 250 MHz
84.1 dBFS
fIN = 400 MHz
72.9 dBFS
ENOB Effective Number of Bits
fIN = 10 MHz
10.9 Bits
fIN = 70 MHz
10.8 10.5 Bits
fIN = 150 MHz
10.8 Bits
fIN = 250 MHz
10.8 Bits
fIN = 400 MHz
10.5 Bits
THD Total Harmonic Disortion
fIN = 10 MHz
-82.6 dBFS
fIN = 70 MHz
−82.6 -72.0 dBFS
fIN = 150 MHz
-81.1 dBFS
fIN = 250 MHz
-80.3 dBFS
fIN = 400 MHz
-70.7 dBFS
H2 Second Harmonic Distortion
fIN = 10 MHz
-89.7 dBFS
fIN = 70 MHz
−88.4 -77.0 dBFS
fIN = 150 MHz
-93.5 dBFS
fIN = 250 MHz
-91.0 dBFS
fIN = 400 MHz
-72.9 dBFS
H3 Third Harmonic Distortion
fIN = 10 MHz
-86.7 dBFS
fIN = 70 MHz
−85.4 -74 dBFS
fIN = 150 MHz
-84.6 dBFS
fIN = 250 MHz
-84.1 dBFS
fIN = 400 MHz
-77.6 dBFS
SINAD Signal-to-Noise and Distortion Ratio
fIN = 10 MHz
67.3 dBFS
fIN = 70 MHz
67.1 65.2 dBFS
fIN = 150 MHz
67.0 dBFS
fIN = 250 MHz
66.6 dBFS
fIN = 400 MHz
64.7 dBFS
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ADC12C170
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