Nokia Thf13, 640 System Module 02

PAMS Technical Documentation

THF-13 Series Transceivers

System Module NH2

Issue 1 08/99  Nokia Mobile Phones Ltd.

THF-13

System Module NH2

PAMS Technical Documentation

AMENDMENT RECORD SHEET

Amendment Number

Date Inserted By Comments

08/99 OJuntune Issue 1

Page 2

 Nokia Mobile Phones Ltd.

Issue 1 08/99

PAMS Technical Documentation

CONTENTS

Transceiver THF–13 System Module NH2 7. . . . . . . . . . . . . . . . . .

Introduction 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Module 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Baseband Sub-module 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical summary 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modes of Operation 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Specifications 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum Ratings 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC Characteristics 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery connector 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UIF–connector 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU Circuit 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Block Description 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – CONNECTORU 13. . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – PWRU 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – AUDIO 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – UIF 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – RX 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – SYNT 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CTRLU – TX 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Main Components 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Controller Ports 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PWRU 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery charging 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Startup charging 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery overvoltage protection 20. . . . . . . . . . . . . . . . . . . . .

Battery removal during charging 21. . . . . . . . . . . . . . . . . . .

Different PWM frequencies ( 1Hz and 32 Hz) 22. . . . . . . .

Supply voltage regulators and controlling 24. . . . . . . . . . .

Operation modes 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power–Off Mode 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Entering Power–Off Mode 28. . . . . . . . . . . . . . . . . . . . . . . . .

Charging in Power–Off 28. . . . . . . . . . . . . . . . . . . . . . . . . . .

Reset Mode 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power–On Mode 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AUDIO BLOCK 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Main features 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FFSK modem features 30. . . . . . . . . . . . . . . . . . . . . . . . . . .

Audio features 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Other features 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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System Module NH2

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THF-13

System Module NH2

Receive (RX) Audio Signal Path 33. . . . . . . . . . . . . . . . . . . . . . . .

Receiving Data Path 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiving Audio Path 34. . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX Trimmer 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mux and de–emphasis 35. . . . . . . . . . . . . . . . . . . . . . . . . . .

Expander 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX filter 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

De–scrambler 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX automatic gain control 35. . . . . . . . . . . . . . . . . . . . . . . . .

Ear sensitive filter 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Volume control 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Earphone and accessory buffers 36. . . . . . . . . . . . . . . . . . .

Transmitting paths 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitting data path 36. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitting audio path 36. . . . . . . . . . . . . . . . . . . . . . . . . . .

Mic amplifier and mux 37. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mic trimmer and bandpass filter 37. . . . . . . . . . . . . . . . . . . .

Scrambler 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Compressor 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pre–emphasis 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Automatic Gain Control 37. . . . . . . . . . . . . . . . . . . . . . . . . . .

Tx hard limiter 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tx lowpass filter 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tx audio level control 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tx trimmer 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Summing unit and trimmer 38. . . . . . . . . . . . . . . . . . . . . . . .

FII path 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fii filtering and gain control 38. . . . . . . . . . . . . . . . . . . . . . . .

Hands free system 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hands free controller 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hands free attenuators 39. . . . . . . . . . . . . . . . . . . . . . . . . . .

Buzzer driver 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Clock divider 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Call continue sensor 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Module 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Specifications 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum ratings 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SYNT 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current Consumption 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connections 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connections to Baseband sub–module 45. . . . . . . . . . . . . . . .

Antenna 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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PAMS Technical Documentation

RX Synthesizer 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX loop filter 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX Synthesizer 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX Loop Filter 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ambient temperature 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Duplexer 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX submodule 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Preamplifier 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX–filter 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1st mixer 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1st IF–filter 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IF–amplifier 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2nd IF–filter 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IF–circuit 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX submodule 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power amplifier 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power control 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Coupler lines 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Synthesizer submodule 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PLL 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX VCO 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX VCO 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Isolation amplifier (TX buffer) 58. . . . . . . . . . . . . . . . . . . . . .

VCTCXO 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH2 Basic (EDMS Issue 2.0) Code: 0201469 59. . . .

THF-13

System Module NH2

Schematic Diagrams

Block Diagram of System/RF Blocks (Version 15 Edit 164)

for layout version 15 3A–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of Connectors (Version 15 Edit 249)

for layout version 15 3A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of CTRLU Block (Version 15 Edit 236 )

for layout version 15 3A–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of PWRU (Version 15 Edit 220 )

for layout version 15 3A–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of Audio (Version 15 Edit 326)

for layout version 15 3A–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of Receiver (Version 15 Edit 172)

for layout version 15 3A–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of Synthesiser Block (Version 15 Edit 101)

for layout version 15 3A–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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THF-13

System Module NH2

Circuit Diagram of Transmitter (Version 15 Edit 175)

for layout version 15 3A–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Layout Diagram of NH2 (Version 15) 3A–9. . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of UIF Module (Version 03 Edit 63)

for layout version 03 4A–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Layout Diagram of NU1 (Version 03) 4A–2. . . . . . . . . . . . . . . . . . . . . .

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PAMS Technical Documentation

Transceiver THF–13 System Module NH2

Introduction

This document specifices the System module NH1 of the THF–13

NMT–450 cellular phone.

The NH2 System Module comprises the baseband and the RF functions

of the phone.

System Module

List of submodules below:

Name of submodule Notes

THF-13

System Module NH2

CTRLU CONNU

PWRU AUDIO RX TX SYNT

Control Unit for the phone Connector Unit

Power supply Audio Receiver Transmitter Synthesizer

These blocks are only functional blocks and therefore have no type nor

material codes.

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THF-13

System Module NH2

Baseband Sub-module

The Baseband submodule controls the internal operation of the phone. It

controls the user interface, i.e. LCD driver, keyboard and audio interface

functions. The module performs all signalling towards the system and car-

ries out audio–frequency signal processing. In addition, it controls the op-

eration of the transceiver and stores tuning data for the phone.

The baseband architecture is basically similar to the previous generation.

However, the system specified logical voltage level used is 2.82V and

new features include a improved charging circuit CHAPS, a new power

supply circuit PSA and signalling ASIC MASI.

The nominal battery voltage in THF–13 is 3.6V. The actual battery volt-

age varies between 3.2 to 4.2V/5.3V depending on the cell type used (Li-

Ion or NiMH) and whether the phone is connected to a charger (limit on

5.3V with NiMH battery in idle).

PAMS Technical Documentation

Battery charging is controlled by a PWM signal from the MCU. The PWM

duty cycle is determined by a charging software. The PWM signal is fed

to the CHAPS charging switch and through the charging pins to an exter-

nal charger. There can be two types of chargers connected to the phone.

Standard chargers (two wires) provide coarse supply power, which is

switched by the CHAPS for suitable charging voltage and current.

Advanced chargers (three wires) are equipped with a control input,

through which the phone gives PWM charging control signal to the char-

ger.

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PAMS Technical Documentation

THF-13

System Module NH2

Mod/IF

Audio

RF control

VRX, VTX

BUZZER

MASI

Audio/

Signalling

ASIC

XT AL

14..7456M

ADDRESS CONTROL

DATA

SIS

VL VA

FLASH SRAM

512Kx16 64kx8

MCU

H8 2322

8k RAM

ROMless

8ADC ports

I/O ports

UI CONNECTOR

Serial ports

LCD

Keyboard

XMIC,XEAR,MIC

MBUS,FBUS

BOTTOM CONNECTOR

CHARGER

PSA

Power

Supply

ASIC

PWM outputs

CHAPS

0R22

Charger

ASIC

BATTERY CONNECTOR

Figure 1.

I2C

EEPROM

RTC

Back–up

Battery

XTAL

32.768k

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THF-13

System Module NH2

Technical summary

The baseband module consists of Hitachi H8S processor 2322, four ASIC

circuits, PSA, CHAPS, MASI and SIS, and some standard circuits,

FLASH, SRAM, EEPROM and a RTC.

The MCU includes 8 kbytes RAM. It controls all transceiver functions.

FLASH size is 1Mbytes and SRAM 64kBytes

The EEPROM type is 16 kbytes with 32 bytes and it’s a serial I

type, RTC is connected to the same bus and SDAT line is also used to

control LCD.

The baseband is running from a 2.8 V power rail, which is supplied by a

power controlling asic. In the PSA asic there are two separate power sup-

plies for BaseBand ( VA,VL ) and two externally controllable power sup-

plies for RF (VRX, VTX).

PAMS Technical Documentation

C–bus

The CHAPS is a charging control ASIC. It is essentially

power switch for controlling charging current, in a mobile phone. CHAPS

is designed for 3 cell Nickel or 1 cell Lithium battery packs.

The MASI circuit integrates the Audio and Modem operations. It includes

audio power amplifier for EAR and XEAR lines. MASI includes also driver

for buzzer.

All functional blocks of the baseband are mounted on a single multi layer

printed circuit board. All components of the baseband are surface mount-

able. This board contains also the RF–parts. The B–cover side ( battery

side ) EMC shielding is implemented by using a metallized inside of

B–cover as a shield on the RF–blocks. On the other side the engine is

shielded with a aluminium frame, which makes a contact to a ground ring

of the engine board.

The connections from BaseBand to UI board are fed through a 28–way

2–row board to board spring connector.

Modes of Operation

Power off, Standby, Listening and Conversation modes.

– In Power off mode only the circuits needed for power up are supplied.

an integrated

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– In Standby mode the MCU and needed blocks of the MASI are active,

in SLEEP mode MASI cuts off system clock.

– In Listening mode the receiver and some blocks of the MASI are ac-

tive.

– In Conversation mode all ICs are active.

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Technical Specifications

Maximum Ratings

Parameter Rating

Battery voltage, idle mode 3.2... 5.3 V (5.0V in call mode)

Charger input voltage –5.0 ... 16V

Operating temperature range –25C to +55C

Storage temperature range –40C to +85 C

Charging of the batteries is possible only in the temperature range +5 ...

+45 °C.

DC Characteristics

THF-13

System Module NH2

The supply voltages and power consumption are listed below:

Line Symbol Minimum Typical /

Nominal

Supply battery voltage 3.2 3.6 4.5 (5.3 in

Battery cut off voltage (HW) 2.7 2.8 2.9 V (3.2V min SW

Regulated logic supply voltage (VL) 2.72 2.82 2.9 V Regulated logic supply current 0 40 mA Regulated audio supply voltage (VA) 2.7 2.8 2.85 V Regulated audio supply current 0 100 mA Regulated RX supply voltage (VRX) 2.7 2.8 2.85 V Regulated RX supply current 0.05 50 mA Regulated TX supply voltage (VTX) 2.7 2.8 2.85 V Regulated TX supply current 0.02 60 mA Current consumption standby mode 65 mA Current consumption sleep mode 11 mA Current consumption conv. low power 650 mA

Maximum Unit / Notes

idle mode)

cutoff)

Current consumption conv. high power 1100 mA

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THF-13

System Module NH2

PAMS Technical Documentation

Battery connector

The electrical specifications for the battery connector:.

Pin Name Min Typ Max Unit Notes

1 BVOLT 3.2 3.6 4.5 V Battery voltage

5.3 Maximum voltage in idle state with charger

2 BSI

3 BTEMP

0 2.85 V Battery size indication

Phone has 100kohm pull up resistor.

2.2 18 kohm Battery indication resistor (Ni battery) 20 22 24 kohm Battery indication resistor (service battery) 27 51 kohm Battery indication resistor (4.1V Lithium

battery)

68 91 kohm Battery indication resistor (4.2V Lithium bat-

tery)

0 1.4 V Battery temperature indication

Phone has a 100k (+–5%) pullup resistor,

Battery package has a NTC pulldown resis-

tor:

47k+–5%@+25C , B=4050+–3%

20 22 25 kHz PWM control to VIBRA BATTERY

4 BGND 0 0 V Battery ground

UIF–connector

The electrical specifications for the User Interface connector:

Signal Name Pin Notes

VL 1–2 Logic supply voltage 2.8V ROW0,1,2 4–6 Lines for keyboard write BACKLIGHT 22,23 Backlights supply COL0–6 7–11,15,16 Lines for keyboard read LCD_CLK 17 External LCD clock LCD_SCLK 18 LCD Driver serialclock LCD_SDAT 19 LCD Driver serialdata LCD_CS 20 LCD Driver chipselect LCD_DC 21 LCD Driver data/control select LCD_RESET 22 LCD Driver reset GND 25–28 Ground

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PAMS Technical Documentation

CTRLU Circuit

Block Description

CTRLU – CONNECTORU

Between MCU and system connector all data lines are protected for ESD.

HEAD_DET, Headset detection

Headset is detected by voltage level in XMIC line, it goes to MCU A/D converter. When headset is not connected HEAD_DET DC level is same as VL because of pull up resistor. When headset is connected DC level drops so that if can be detected. In talk mode mic bias current is fed to headset with HEAD_BIAS control it also increases the voltage level in XMIC line which must be noticed.

HOOK_DET, Hook detection

Hook in headset is detected with MCU input port. HOOK_DET line goes low when button is pushed in headset.

THF-13

System Module NH2

CTRLU – PWRU

The MCU controls the watchdog timer in the PSA. It sends a positive pulse at approximately 1 s interval to XPWROFF pin of the PSA to keep the power on. If CTRLU fails to deliver this pulse, the PSA will remove power from the system. CTRLU controls also the charger on/off switching in the PWRU block. When power off is requested CTRLU leaves PSA watchdog without reset. After the watchdog has elapsed PSA cuts off the supply voltages from the phone. Battery charging is controlled by CSW line.

VBATSW, Battery voltage measurement

Battery voltage can be measured up–to 6.2V with 2.8 V reference voltage. The absolute accuracy is low because of the reference 3 % accuracy and A/D–converter +/– 8 LSB accuracy . This battery voltage measurement must be calibrated with input voltage 4.1 V. The A/D conversion result can be calculated from this equation:

A/D readout = 1024 * (VBAT* ( 0.45)) / VREF VREF=2.8 V For example:

4.1 V results =674

ICHARG, Charger current measurement

Charger current is calculated from the voltage difference of the ends of the shunt resistor that the charging current goes thru. The difference of these voltages are first amplified by factor of 6.8 with op–amp to get more accuracy to the measurement measured from different ends of charging current shunt resistor. The absolute accuracy is low because there is very small change in voltages with different currents . The measurement error is minimized with calibration of the A/D–converter with 0 A and 0.5 A charging currents.

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VCHARG , Charger voltage measurement

Charger voltage can be measured up to 16.8 V nominal. The A/D–conversion result can be calculated from equation :

A/D readout = 1024 * (VCHARG*(10/60)) / VREF

VREF=2.8 V

For example:

7.5 V gives 457

BSI, Battery size indication

The battery type can be defined with the BSI resistor value. Batteries with different capacities and with different cell types can be defined individually, BSI is calibrated with service battery.

BTEMP, Battery temperature measurement

The battery temperature measurement is implemented with 47 kohm NTC with N value of 4050 and 47 kohm pullup resistor. BTEMP is calibrated with service battery.

PAMS Technical Documentation

CTRLU – AUDIO

The interface between the MCU and the MASI circuit is a bidirectional 8–bit data bus with 5 address lines. MASI is connected to the same address bus as Flash and SRAM memories, MASI has own address space. MASI has one separate control line XINT for interrupt output to MCU.

CTRLU – UIF

The keyboard is connected directly to the controller. Data lines 0–7 are input lines and ROW0–2 are output lines. Normally all ROW lines are set to ’0’ and if any key is pressed the KBINT line indicates it to MASI and MASI gives an interrupt to MCU which the starts scanning the keys. The scanning is done by driving one ROW line to 0 V at the time, then the corresponding data line goes to 0V and phone knows which key is pressed. ROW(0:2) lines must be in 0 V state when phone is in sleep mode so that key pressing can be indicated.

Data to LCD Driver is written through a serial port which is used to control RTC and EEPROM too.

Keyboards and LCD lights are controlled by LIGHTS signal.

CTRLU – RX

The RX circuit power is connected on/off by the RXE signal. Received signal strength is measured over the RSSI and intermediate fre-

quency is measured over the IF.

CTRLU – SYNT

RF temperature is measured over the RFTEMP. Frequency is controlled by AFC signal. Synthesizer is controlled via synchronous serial bus

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SDAT/SCLK. The data is latched to the synthesizer by the positive edge of SLE line. TX synthesizer power on/off (TXS/port P3) line is controlled via PLL circuit.

CTRLU – TX

Transmitter output power level is measured over the TXI. TXE line activates power module. The power is controlled via TXC line which is PWM– controlled output port.

Main Components MCU

MCU H8/2322 is a CMOS microcontroller. The CPU is ROMless so all memory needed is located outside the chip.

MCU operating clock (=14.7456 MHz) is generated in the MASI.

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Controller Ports

Pin no Symbol Description Pin type

1 Vcc 2–23 A0–A19 FLASH,MASI and RAM Address bus address 24 Ass 25 A20 NC I 26 PA5 NC I 27 PA6 NC I 28 PA7 NC I 29 P67 NC I 30 P66 HOOK_DET Handset HOOK signal I 31 P65 HEAD_BIAS Headset microphone bias control I/O 32 P64 XINT interrupt signal from MASI I/O 33 Vcc 34–37,

39–46, 48–51

D0–D15 Data bus Data

38,47 Vss 52 Vcc 53 P30/TxD0 MBUSTX I/O 54 P31/TxD1 LCD_SDAT, RTC_SDAT, EEPROM_SDAT I/O 55 P32/RxD0 MBUSRX I/O 56 P33/RxD1 VPPCON I/O 57 P34/SCK0 ROW1 I/O

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58 P35/SCk1 LCD_SCLK I/O 59 Vss

PAMS Technical Documentation

60 P60/CS4/

_DREQ0

61 P61/CS5/

_TEND0

62 P62/_DREQ1ECLK serial clock (EEPROM, RTC) I/O

63 P63/_TEND1LIGHTS I/O

64 P27 SLE I/O 65 P26 ROW0 I/O 66 P25 MBUSRX timer I/O 67 P24 SCLK serial clock for SYNT I/O 68 P23 SIS_SDAT I/O 69 P22 TXE I/O 70 P21 SIS RESET I/O 71 P20 RXE I/O 72 _WDTOVF–

NC I

73 _RES XRES reset for MCU, FLASH, MASI from PSA 74 NMI – 75 _STBY – 76 Vcc 77 XTAL – 78 EXTAL CLKMCU from MASI 79 Vss 80 PF7 PWRON I 81 Vcc 82 _AS – 83 _RD FLASH,MASI,RAM Read 84 _HWR MASI, RAM Write 85 _LWR FLASH Write 86 PF2 LCD_CS I/O 87 PF1 LCD_DC I/O 88 PF0 LCD_RESET I/O 89 P50/TxD2 FBUSTX / BOOST0 I/O 90 P51/RxD2 FBUSRX / BOOST1 I/O

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91 * P52/SCK2 MBUS RX used for FBUS CLK I/O 92 P53 SIS SCLK I/O 93 AVcc 94 Vref 95 AN0 VBATSW Analog 96 AN1 VCHARG Analog 97 AN2 RSSI Analog 98 AN3 ICHARG Analog 99 AN4 BTEMP Analog 100 AN5 BSI Analog 101 AN6 RFTEMP Analog 102 AN7 HEAD_DET Analog 103 AVss

System Module NH2

104 Vss 105 P17 LIM I/O 106 P16 TXC I/O 107 P15 CDET I/O 108 P14 CSW I/O 109 P13 XPWROFF I/O 110 P12 111 P11 SYNTH SDAT I/O 112 P10 VIBRA I/O 113 MD0 0 114 MD1 0 115 MD2 1 116 PG0 ROW2 I 117 PG1 NC I 118 PG2 RAMCS I 119 PG2 MASICS I 120 PG2 FLASHCS I

– FLASH memory 1Mx16 with 16 bit databus – SRAM memory 16kx8 with 8 bit databus

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SIS

AT90S2343 is the SIS (subscriber identification) circuit connected to the controller over serial bus IIC. The signals are listed below:

Pin Description

EXTAL Clock input from MASI RESET Reset input PD0 IIC bus data PD1 IIC bus clock

EEPROM

There is one 16k EEPROMs in phone. EEPROM is a nonvolatile memory into which is stored the tuning data for the phone. In addition, it contains the short code memory locations to retain user selectable phone numbers. SDAT line is used for control LCD and RTC too.

PAMS Technical Documentation

Pin Description

SDA IIC bus data SCL IIC bus clock

RTC

The real time clock is connected to the same IIC bus as the EEPROM. RTC alarm interrupt is connected to the XPRWON line, so it works even if phone is powered off. Backup power supply to the RTC is done with a separate battery which is charged through the CHAPS.

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PWRU

Power Distribution

The main components of the Power Unit are the PSA ( Power Supply Asic) and the CHAPS ( Charger Power Switch ).

In normal operation the baseband is powered from the phone‘s battery. The battery consists of three Nickel Metal Hydride cells. There is also a possibility to use batteries consisting of one Lithium–Ion cell. An external charger is used for recharging the battery and supplying power to the phone. The charger can be either a standard charger that can deliver around 400 mA or a so called performance charger, which can deliver supply current up to 850 mA.

The baseband contains components that control the power distribution to the whole phone excluding those parts that use continuous battery supply. The battery feeds power directly to three parts of the system: PSA, RF–power amplifier, and UI (buzzer and display and keyboard lights).

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The power management circuit CHAPS provides protection against overvoltages, charger failures and pirate chargers etc. that could otherwise cause damage to the phone.

Battery charging

Acceptable chargers are detected by the software. The absolute maximum input voltage is 30V due to the transient suppressor that is protecting the charger input. At the phone end there is no difference between a plug–in charger or a desktop charger. The DC–jack pins and bottom connector charging pads are connected together inside the phone. The charging block diagram is below.

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PAMS Technical Documentation

LIM

CSW

MCU

0R22

VBAT

VBATSW

VCHARGSW

PSA

GND

VCHAR

LIM

VOUT RSENSE PWM

10k

22p

CHAPS

VCH

GND

TRANSCEIVER

50.3k

10k

Figure 2. Charging block diagram

30V

VIN

CHRG_CTRL

L_GND

CHARGER

NOT IN ACP–7

Startup charging

When a charger is connected, the CHAPS is supplying a startup current minimum of 130mA to the phone. The startup current provides initial charging to a phone with an empty battery. The startup circuit charges the battery until the battery voltage level reaches 3.0V (+/– 0.1V) and the PSA releases the PURX reset signal and program execution starts. Charging mode is changed from startup charging to PWM charging that is controlled by the MCU software. If the battery voltage reaches 3.55V (3.75V maximum) before the program has taken control over the charging, the startup current is switched off. The startup current is switched on again when the battery voltage has decreased to 100mV (nominal).

Startup characteristics are listed below:

Parameter Symbol Min Typ Max Unit

VOUT Start– up mode cutoff limit Vstart 3.45 3.55 3.75 V

VOUT Start– up mode hysteresis

NOTE: Cout = 4.7 uF

Start–up regulator output current

VOUT = 0V ... Vstart

Vstarthys 80 100 200 mV

Istart 130 165 200 mA

Battery overvoltage protection

Output overvoltage protection is used to protect phone from damage. This function is also used to define the protection cutoff voltage for differ-

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ent battery types (Li or Ni). The power switch is immediately turned OFF if the voltage in VOUT rises above the selected limit VLIM1 or VLIM2.

VLIM characteristics are listed below:

Parameter Symbol LIM input Min Typ Max Unit

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Output voltage cutoff limit (during transmission or Li–battery)

Output voltage cutoff limit (no

transmission or Ni–battery)

The voltage limit (VLIM1 or VLIM2) is selected by logic LOW or logic HIGH on the CHAPS (N101) LIM– input pin. Default value is lower limit VLIM1.

When the switch in output overvoltage situation has once turned OFF, it stays OFF until the the battery voltage falls below VLIM1 (or VLIM2) and PWM = LOW is detected. The switch can be turned on again by setting PWM = HIGH.

VCH

VCH<VOUT

VOUT

VLIM1 or VLIM2

VLIM1 LOW 4.4 4.6 4.8 V

VLIM2 HIGH 4.8 5.0 5.2 V

SWITCH

PWM (32Hz)

ON OFF

Figure above: Battery overvoltage protection

Battery removal during charging

Output overvoltage protection is also needed in case the main battery is removed when a charger connected or a charger is connected before the battery is connected to the phone.

With a charger connected, if VOUT exceeds VLIM1 (or VLIM2), the CHAPS turns switch OFF until the charger input has decreased below

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