Nokia Thf12, 650 Chapter 4.0

PAMS Technical Documentation

Chapter 4.0

TRANSCEIVER THF-12

Issue 2 05/99

THF-12

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 05/99 OJuntune Variation module update

Page 1 – 2

Issue 2 05/99

PAMS

THF-12

Technical Documentation

CONTENTS

Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1B SMD VARIATION MODULE 0201270 1 – 7. . . . .

Variant

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Page 1 – 3

THF-12

PAMS

Variant

Introduction

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Modules

Transceiver THF–12 0502069

• system module NH1 0201270

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12 0261827

Technical Documentation

Swap package 0068939

RF Characteristics

Characteristic Value / Comments

RX Frequency range 462.500...467.475 MHz
TX Frequency range 452.500...457.475 MHz
Channel spacing 25 kHz
Number of channels 200 (181...200 / 1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-

nal)

FFSK deviation

• 1200 Hz (”1” frequency) ± 2800 Hz

• 1800 Hz (”0” frequency) ± 4200 Hz

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THF-12

Technical Documentation

Exploded View of THF–12

Variant

Issue 2 05/99

Figure 1.

Page 1 – 5

THF-12

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

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THF-12

Technical Documentation

Variant

Parts list of NH1B SMD VARIATION MODULE

(EDMS Issue1.6 ) Code: 0201270

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C690 2320536 Ceramic cap. 10 p 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L310 3643003 Chip coil 12 n 5 % Q=30/250 MHz
0805
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
0805

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L652 3645179 Chip coil 2 n Q=8/100M 0603
L690 3645009 Chip coil 33 n 5 % Q=12/100 MHz
0603
G420 4350169 Vco 416–425mhz 2.8v 12ma NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma NMT450
Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512089 Dupl 453–457.5/463–467.5mhz 35x25

Technical Documentation

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PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12B

(For Bulgaria)

Issue 2 05/99

 Nokia Mobile Phones Ltd.

THF–12B

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 05/99 OJuntune Variation module update

Page 1 – 2

Issue 2 05/99

PAMS

THF–12B

Technical Documentation

CONTENTS

Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12B 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12B 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1B VARIATION MODULE 0201275 1 – 7. . . . . . . . . .

Variant

Page No

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Page 1 – 3

THF–12B

PAMS

Variant

Introduction

The appendix comprises an exploded view of the THF–12B variant for
Bulgaria (including a list of assembly parts) plus component parts lists
covering the system module and the display module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12B 0502078

• system module NH1B 0201265

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12B 0261841

Swap package 0068942

RF Characteristics

Characteristic Value / Comments

RX Frequency range 462.500...467.475 MHz
TX Frequency range 452.500...457.475 MHz
Channel spacing 25 kHz
Number of channels 200 (181...200 / 1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-

nal)

FFSK deviation

• 1200 Hz (”1” frequency) ± 2800 Hz

• 1800 Hz (”0” frequency) ± 4200 Hz

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PAMS

THF–12B

Technical Documentation

Exploded View of THF–12B

Variant

Issue 2 05/99

Figure 1.

Page 1 – 5

THF–12B

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12B

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

Page 1 – 6

Issue 2 05/99

PAMS

THF–12B

Technical Documentation

Variant

Parts list of NH1B VARIATION MODULE 0201275 v1.7

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
R690 1430690 Chip jumper 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L310 3641536 Chip coil 33 n 5 % Q=40/250 MHz
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L652 3645179 Chip coil 2 n Q=8/100M 0603
G420 4350169 Vco 416–425mhz 2.8v 12ma nmt450 NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma nmt450 NMT450
Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512109 Duplex filter 452.5–457.5/462.5–467.5MHz

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THF–12B

PAMS

Variant

Technical Documentation

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PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12C

(For Czech Republic and Slovakia)

Issue 2 04/99

 Nokia Mobile Phones Ltd.

THF–12C

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 04/99 OJuntune Variation module update

Page 1 – 2

Issue 2 04/99

PAMS

THF–12C

Technical Documentation

CONTENTS

Introduction to Version 12P 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12P 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12P 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1P variation module 0201268 1 – 7. . . . . . . . . . . . . .

Variant

Page No

Issue 2 04/99

Page 1 – 3

THF–12C

PAMS

Variant

Introduction

The appendix comprises an exploded view of the THF–12C variant for
Czech Republic and Slovakia (including a list of assembly parts) plus
component parts lists covering the system module and the display
module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12C 0502071

• system module NH1C 0201260

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12C 0261836

Swap package 0068943

RF Characteristics

Characteristic Value / Comments

RX Frequency range 461.310...465.730 MHz
TX Frequency range 451.310...455.730 MHz
Channel spacing 20 kHz
Number of channels 222 (222...1)
TX Frequency deviation ≤± 3.75 kHz (± 4.05 kHz with 4 kHz supervisory signal)
FFSK deviation

• 1200 Hz (”1” frequency) ± 2240 Hz

• 1800 Hz (”0” frequency) ± 3360 Hz

Page 1 – 4

Issue 2 04/99

PAMS

THF–12C

Technical Documentation

Exploded View of THF–12C

Variant

Issue 2 04/99

Figure 1.

Page 1 – 5

THF–12C

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12C

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

Page 1 – 6

Issue 2 04/99

PAMS

THF–12C

Technical Documentation

Variant

Parts list of NH1C VARIATION MODULE 0201269 v1.7

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
R690 1430690 Chip jumper 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C690 2320536 Ceramic cap. 10 p 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L310 3643003 Chip coil 27 n 5 % Q=40/250 MHz
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
L652 3645179 Chip coil 2 n Q=8/100M 0603
L690 3645009 Chip coil 33 n 5 % Q=12/100 MHz
G420 4350169 Vco 416–425mhz 2.8v 12ma nmt450 NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma nmt450 NMT450

Issue 2 04/99

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THF–12C

PAMS

Variant

Technical Documentation

Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512107 Dupl 451.3–455.8/461.3–465.8mhz

[]

1

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Issue 2 04/99

PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12H

(For Hungary)

Issue 2 05/99

 Nokia Mobile Phones Ltd.

THF–12H

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 05/99 OJuntune Variation module update

Page 1 – 2

Issue 2 05/99

PAMS

THF–12H

Technical Documentation

CONTENTS

Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12H 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12H 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1H VARIATION MODULE 0201273 1 – 7. . . . . . . . . .

Variant

Page No

Issue 2 05/99

Page 1 – 3

THF–12H

PAMS

Variant

Introduction

The appendix comprises an exploded view of the THF–12H variant for
Hungary (including a list of assembly parts) plus component parts lists
covering the system module and the display module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12H 0502076

• system module NH1H 0201263

• SMD Variation module NH1H 0201273

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12H 0261839

Swap package 0068944

RF Characteristics

Characteristic Value / Comments

RX Frequency range 465.230...467.370 / 468.570...469.990 MHz
TX Frequency range 455.230...457.370 / 458.570...459.990 MHz
Channel spacing 20 kHz
Number of channels 239 (239...132 / 72...1)
TX Frequency deviation ≤± 3.75 kHz (± 4.05 kHz with 4 kHz supervisory signal)
FFSK deviation

• 1200 Hz (”1” frequency) ± 2240 Hz

• 1800 Hz (”0” frequency) ± 3360 Hz

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THF–12H

Technical Documentation

Exploded View of THF–12H

Variant

Issue 2 05/99

Figure 1.

Page 1 – 5

THF–12H

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12H

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590
9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201263 NH1 system module THF–12H
M2 0201258 NH1 UIF THF–12H

Page 1 – 6

Issue 2 05/99

PAMS

THF–12H

Technical Documentation

Variant

Parts list of NH1H VARIATION MODULE 0201273 v1.6

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C666 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C690 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L310 3643003 Chip coil 12 n 5 % Q=30/250 MHz
0805
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
0805
L652 3645179 Chip coil 2 n Q=8/100M 0603

Issue 2 05/99

Page 1 – 7

THF–12H

PAMS

Variant

G420 4350169 Vco 416–425mhz 2.8v 12ma nmt450 NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma nmt450 NMT450
Z330 4511009 Saw filter 467.6+–2.4 M 5.2x5.2
Z640 4512119 Dupl 455.2–460/465.2–470mhz 35x25

Technical Documentation

Page 1 – 8

Issue 2 05/99

PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12K

(For Turkey)

Issue 2 04/99

 Nokia Mobile Phones Ltd.

THF–12K

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 05/99 OJuntune Variation module update

Page 1 – 2

Issue 2 04/99

PAMS

THF–12K

Technical Documentation

CONTENTS

Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12K 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12K 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1K SMD VARIATION MODULE (EDMS Issue 1.6)

Code: 0201272 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Variant

Page No

Issue 2 04/99

Page 1 – 3

THF–12K

PAMS

Variant

Introduction

The appendix comprises an exploded view of the THF–12K variant
(including a list of assembly parts) plus component parts lists covering the
system module and the display module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12K 0502075

• system module NH1K 0201261

• software module 0240660

• display module NU1 0201258

• mechanics MTHF12K 0261838

Swap package 0068945

RF Characteristics

Characteristic Value / Comments

RX Frequency range 415.500...419.975 MHz
TX Frequency range 425.500...429.975 MHz
Channel spacing 25 kHz
Number of channels 180 (1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-

nal)

FFSK deviation

• 1200 Hz (”1” frequency) ± 2800 Hz

• 1800 Hz (”0” frequency) ± 4200 Hz

Page 1 – 4

Issue 2 04/99

PAMS

THF–12K

Technical Documentation

Exploded View of THF–12K

Variant

Issue 2 04/99

Figure 1.

Page 1 – 5

THF–12K

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12K

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

Page 1 – 6

Issue 2 04/99

PAMS

THF–12K

Technical Documentation

Variant

Parts list of NH1K VARIATION MODULE 0201272 v1.6

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
R690 1430690 Chip jumper 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C663 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C664 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C666 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C690 2320536 Ceramic cap. 10 p 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L310 3641536 Chip coil 33 n 5 % Q=40/250 MHz
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
L652 3645179 Chip coil 2 n Q=8/100M 0603
L690 3645009 Chip coil 33 n 5 % Q=12/100 MHz 0
G420 4350191 Vco 375–385mhz 2.8v 12ma rx nmt
G430 4350193 Vco 410–420mhz 2.8v 15ma tx nmt

Issue 2 04/99

Page 1 – 7

THF–12K

PAMS

Variant

Z330 4511003 Saw filter 427.75+–2.25 M 5.2x5.2
Z640 4512115 Duplex filter 415.5–420/425.5–430 MHz 35x25

Technical Documentation

Page 1 – 8

Issue 2 04/99

PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12L

(For Slovenia)

Issue 2 05/99

 Nokia Mobile Phones Ltd.

THF–12L

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 05/99 OJuntune Variation module update

Page 1 – 2

Issue 2 05/99

PAMS

THF–12L

Technical Documentation

CONTENTS

Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12L 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12L 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1L VARIATION MODULE 0201274 1 – 7. . . . . . . . . .

Variant

Page No

Issue 2 05/99

Page 1 – 3

THF–12L

PAMS

Variant

Introduction

The appendix comprises an exploded view of the THF–12L variant for
Slovenia and Croatia (including a list of assembly parts) plus component
parts lists covering the system module and the display module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12L 0502077

• system module NH1L 0201264

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12L 0261840

Swap package 0068946

RF Characteristics

Characteristic Value / Comments

RX Frequency range 411.675...415.850 MHz
TX Frequency range 421.675...425.850 MHz
Channel spacing 25 kHz
Number of channels 168 (1...168)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-

nal)

FFSK deviation

• 1200 Hz (”1” frequency) ± 2800 Hz

• 1800 Hz (”0” frequency) ± 4200 Hz

Page 1 – 4

Issue 2 05/99

PAMS

THF–12L

Technical Documentation

Exploded View of THF–12L

Variant

Issue 2 05/99

Figure 1.

Page 1 – 5

THF–12L

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12L

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

Page 1 – 6

Issue 2 05/99

PAMS

THF–12L

Technical Documentation

Variant

Parts list of NH1L VARIATION MODULE 0201274 v1.6

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C663 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C690 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L310 3643003 Chip coil 12 n 5 % Q=30/250 MHz
0805
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
0805
L652 3645165 Chip coil 3 n 10 % Q=10/100 MHz

Issue 2 05/99

Page 1 – 7

THF–12L

PAMS

Variant

0603
G420 4350191 Vco 375–385mhz 2.8v 12ma rx nmt
G430 4350193 Vco 410–420mhz 2.8v 15ma tx nmt
Z330 4511007 Saw filter 423.8+–2.1 M 5.2x5.2
Z640 4512111 Dupl 411.7–415.9/421.7–425.9mhz

Technical Documentation

Page 1 – 8

Issue 2 05/99

PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12M

(For Malaysia)

Issue 2 05/99

THF–12M

PAMS

Foreword

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 05/99 OJuntune Variation module update

Page 1 – 2

Issue 2 05/99

PAMS

THF–12M

Technical Documentation

CONTENTS

Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1B SMD VARIATION MODULE (EDMS Issue1.4)

Code: 0201271 1 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Foreword

Page No

Issue 2 05/99

Page 1 – 3

THF–12M

PAMS

Foreword

Introduction

The appendix comprises an exploded view of the THF–12M variant
(including a list of assembly parts) plus component parts lists covering the
system module and the display module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12M 0502072

• system module NH1M 0201262

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12M 0261837

Swap package 0068947

RF Characteristics

Characteristic Value / Comments

RX Frequency range 462.000...466.475 MHz
TX Frequency range 452.000...456.475 MHz
Channel spacing 25 kHz
Number of channels 180 (1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-

nal)

FFSK deviation

• 1200 Hz (”1” frequency) ± 2800 Hz

• 1800 Hz (”0” frequency) ± 4200 Hz

Page 1 – 4

Issue 2 05/99

PAMS

THF–12M

Technical Documentation

Exploded View of THF–12M

Foreword

Issue 2 05/99

Figure 1.

Page 1 – 5

THF–12M

PAMS

Foreword

Technical Documentation

Assembly Parts of THF–12M

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

Page 1 – 6

Issue 2 05/99

PAMS

THF–12M

Technical Documentation

Foreword

Parts list of NH1M variation module 0201271 v.1.6

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C690 2320536 Ceramic cap. 10 p 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L310 3643003 Chip coil 12 n 5 % Q=30/250 MHz
0805
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
0805
L652 3645179 Chip coil 2 n Q=8/100M 0603

Issue 2 05/99

Page 1 – 7

THF–12M

PAMS

Foreword

L690 3645009 Chip coil 33 n 5 % Q=12/100 MHz
0603
G420 4350169 Vco 416–425mhz 2.8v 12ma nmt450 NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma nmt450 NMT450
Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512117 Dupl 452–456.5/462–466.5mhz 35x25

Technical Documentation

Page 1 – 8

Issue 2 05/99

PAMS Technical Documentation

Chapter 4

TRANSCEIVER THF–12P

(For Poland)

Issue 2 04/99

 Nokia Mobile Phones Ltd.

THF–12P

PAMS

Variant

Technical Documentation

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

Issue 2 04/99 OJuntune Variation module update

Page 1 – 2

Issue 2 04/99

PAMS

THF–12P

Technical Documentation

CONTENTS

Introduction to Version 12P 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exploded View of THF–12P 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Parts of THF–12P 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts list of NH1P variation module 0201268 1 – 7. . . . . . . . . . . . . .

Variant

Page No

Issue 2 04/99

Page 1 – 3

THF–12P

PAMS

Variant

Introduction to Version 12P

The appendix comprises an exploded view of the THF–12P variant for
Poland (including a list of assembly parts) plus component parts lists
covering the system module and the display module.

Functional Description

The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.

RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio fre­quency signal from the base station and to transmit a modulated RF signal
to the base station.

Technical Documentation

Modules

Transceiver THF–12P 0502070

• system module NH1P 0201259

• software module 0240623

• display module NU1 0201258

• mechanics MTHF12P 0261835

Swap package 0068940

RF Characteristics

Characteristic Value / Comments

RX Frequency range 462.500...467.475 MHz
TX Frequency range 452.500...457.475 MHz
Channel spacing 25 kHz
Number of channels 200 (181...200 / 1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-

nal)

FFSK deviation

• 1200 Hz (”1” frequency) ± 2800 Hz

• 1800 Hz (”0” frequency) ± 4200 Hz

Page 1 – 4

Issue 2 04/99

PAMS

THF–12P

Technical Documentation

Exploded View of THF–12P

Variant

Issue 2 04/99

Figure 1.

Page 1 – 5

THF–12P

PAMS

Variant

Technical Documentation

Assembly Parts of THF–12P

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

1 9456462 A–cover DMC01943
2 9456436 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955

9480327 Support tape DMD02590

9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12

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Issue 2 04/99

PAMS

THF–12P

Technical Documentation

Variant

Parts list of NH1P variation module 0201268 v.1.7

ITEM CODE DESCRIPTION VALUE TYPE

R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
R690 1430690 Chip jumper 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L310 3641536 Chip coil 33 n 5 % Q=40/250 MHz
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L652 3645179 Chip coil 2 n Q=8/100M 0603
G420 4350169 Vco 416–425mhz 2.8v 12ma nmt450 NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma nmt450 NMT450
Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512109 Duplex filter 452.5–457.5/462.5–467.5 MHz

Issue 2 04/99

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THF–12P

PAMS

Variant

Technical Documentation

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Issue 2 04/99