Nokia Thf12, 650 Chapter 4.0
PAMS Technical Documentation
Chapter 4.0
TRANSCEIVER THF-12
Issue 2 05/99
THF-12
PAMS
Variant
Technical Documentation
AMENDMENT RECORD SHEET
Amendment
Number
Date Inserted By Comments
Issue 2 05/99 OJuntune Variation module update
Page 1 – 2
Issue 2 05/99
PAMS
THF-12
Technical Documentation
CONTENTS
Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Exploded View of THF–12 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Assembly Parts of THF–12 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts list of NH1B SMD VARIATION MODULE 0201270 1 – 7. . . . .
Variant
Page No
Issue 2 05/99
Page 1 – 3
THF-12
PAMS
Variant
Introduction
Functional Description
The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.
RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio frequency signal from the base station and to transmit a modulated RF signal
to the base station.
Modules
Transceiver THF–12 0502069
• system module NH1 0201270
• software module 0240623
• display module NU1 0201258
• mechanics MTHF12 0261827
Technical Documentation
Swap package 0068939
RF Characteristics
Characteristic Value / Comments
RX Frequency range 462.500...467.475 MHz
TX Frequency range 452.500...457.475 MHz
Channel spacing 25 kHz
Number of channels 200 (181...200 / 1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-
nal)
FFSK deviation
• 1200 Hz (”1” frequency) ± 2800 Hz
• 1800 Hz (”0” frequency) ± 4200 Hz
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Issue 2 05/99
PAMS
THF-12
Technical Documentation
Exploded View of THF–12
Variant
Issue 2 05/99
Figure 1.
Page 1 – 5
THF-12
PAMS
Variant
Technical Documentation
Assembly Parts of THF–12
ITEM Q’TY CODE DESCRIPTION VALUE, TYPE
1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955
9480327 Support tape DMD02590
9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12
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PAMS
THF-12
Technical Documentation
Variant
Parts list of NH1B SMD VARIATION MODULE
(EDMS Issue1.6 ) Code: 0201270
ITEM CODE DESCRIPTION VALUE TYPE
R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C690 2320536 Ceramic cap. 10 p 5 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L310 3643003 Chip coil 12 n 5 % Q=30/250 MHz
0805
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
0805
L441 3641522 Chip coil 6 n 20 % Q=50/250 MHz
0805
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THF-12
PAMS
Variant
L652 3645179 Chip coil 2 n Q=8/100M 0603
L690 3645009 Chip coil 33 n 5 % Q=12/100 MHz
0603
G420 4350169 Vco 416–425mhz 2.8v 12ma NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma NMT450
Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512089 Dupl 453–457.5/463–467.5mhz 35x25
Technical Documentation
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Issue 2 05/99
PAMS Technical Documentation
Chapter 4
TRANSCEIVER THF–12B
(For Bulgaria)
Issue 2 05/99
Nokia Mobile Phones Ltd.
THF–12B
PAMS
Variant
Technical Documentation
AMENDMENT RECORD SHEET
Amendment
Number
Date Inserted By Comments
Issue 2 05/99 OJuntune Variation module update
Page 1 – 2
Issue 2 05/99
PAMS
THF–12B
Technical Documentation
CONTENTS
Introduction 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Exploded View of THF–12B 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Assembly Parts of THF–12B 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts list of NH1B VARIATION MODULE 0201275 1 – 7. . . . . . . . . .
Variant
Page No
Issue 2 05/99
Page 1 – 3
THF–12B
PAMS
Variant
Introduction
The appendix comprises an exploded view of the THF–12B variant for
Bulgaria (including a list of assembly parts) plus component parts lists
covering the system module and the display module.
Functional Description
The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.
RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio frequency signal from the base station and to transmit a modulated RF signal
to the base station.
Technical Documentation
Modules
Transceiver THF–12B 0502078
• system module NH1B 0201265
• software module 0240623
• display module NU1 0201258
• mechanics MTHF12B 0261841
Swap package 0068942
RF Characteristics
Characteristic Value / Comments
RX Frequency range 462.500...467.475 MHz
TX Frequency range 452.500...457.475 MHz
Channel spacing 25 kHz
Number of channels 200 (181...200 / 1...180)
TX Frequency deviation ≤± 4.7 kHz (± 5 kHz with 4 kHz supervisory sig-
nal)
FFSK deviation
• 1200 Hz (”1” frequency) ± 2800 Hz
• 1800 Hz (”0” frequency) ± 4200 Hz
Page 1 – 4
Issue 2 05/99
PAMS
THF–12B
Technical Documentation
Exploded View of THF–12B
Variant
Issue 2 05/99
Figure 1.
Page 1 – 5
THF–12B
PAMS
Variant
Technical Documentation
Assembly Parts of THF–12B
ITEM Q’TY CODE DESCRIPTION VALUE, TYPE
1 9456462 A–cover DMC01943
2 9456434 Window assembly DMC01982
3 9794013 Keymat module DMC01940
4 5140580 Speaker
5 0200921 LCD module GD40
6 9470079 Insulation plate DMD04330
7 9450031 Chassis DMD04337
8 5140101 Microphone + mic.boot DMC00955
9480327 Support tape DMD02590
9 9790366 Side key assembly DMC01978
10 9456396 B–cover DMC01944
11 0660185 Antenna DMD04396
12 9380529 Type label 4D25502
13 1 6190023 Screw M1.6x4 T6 FeZn cl DMD02852
14 5 6190013 Screw M1.6x7 T6 FeZn cl DMD01749
M1 0201257 NH1 system module THF–12
M2 0201258 NH1 UIF THF–12
Page 1 – 6
Issue 2 05/99
PAMS
THF–12B
Technical Documentation
Variant
Parts list of NH1B VARIATION MODULE 0201275 v1.7
ITEM CODE DESCRIPTION VALUE TYPE
R356 1430690 Chip jumper 0402
R420 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R421 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R422 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R423 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R433 1430788 Chip resistor 22 k 5 % 0.063 W 0402
R434 1430774 Chip resistor 6.8 k 5 % 0.063 W 0402
R435 1430792 Chip resistor 33 k 5 % 0.063 W 0402
R436 1430804 Chip resistor 100 k 5 % 0.063 W 0402
R442 1430710 Chip resistor 22 5 % 0.063 W 0402
R443 1430722 Chip resistor 68 5 % 0.063 W 0402
R444 1430710 Chip resistor 22 5 % 0.063 W 0402
R690 1430690 Chip jumper 0402
C301 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C302 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C312 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C351 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C420 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C421 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C422 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C423 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C424 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C435 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C436 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C437 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C438 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C439 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C441 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C444 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C445 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C662 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C663 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C664 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C666 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
L301 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L310 3641536 Chip coil 33 n 5 % Q=40/250 MHz
L311 3643013 Chip coil 27 n 5 % Q=40/250 MHz
L652 3645179 Chip coil 2 n Q=8/100M 0603
G420 4350169 Vco 416–425mhz 2.8v 12ma nmt450 NMT450
G430 4350167 Vco 450–460mhz 2.8v 15ma nmt450 NMT450
Z330 4510135 Saw filter 464.5+–3 M /4DB 5.2x5.2
Z640 4512109 Duplex filter 452.5–457.5/462.5–467.5MHz
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Page 1 – 7
THF–12B
PAMS
Variant
Technical Documentation
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Issue 2 05/99
PAMS Technical Documentation
Chapter 4
TRANSCEIVER THF–12C
(For Czech Republic and Slovakia)
Issue 2 04/99
Nokia Mobile Phones Ltd.
THF–12C
PAMS
Variant
Technical Documentation
AMENDMENT RECORD SHEET
Amendment
Number
Date Inserted By Comments
Issue 2 04/99 OJuntune Variation module update
Page 1 – 2
Issue 2 04/99
PAMS
THF–12C
Technical Documentation
CONTENTS
Introduction to Version 12P 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modules 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Characteristics 1 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Exploded View of THF–12P 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Assembly Parts of THF–12P 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts list of NH1P variation module 0201268 1 – 7. . . . . . . . . . . . . .
Variant
Page No
Issue 2 04/99
Page 1 – 3
THF–12C
PAMS
Variant
Introduction
The appendix comprises an exploded view of the THF–12C variant for
Czech Republic and Slovakia (including a list of assembly parts) plus
component parts lists covering the system module and the display
module.
Functional Description
The transceiver electronics consist of UI module PCB and RF/system PCB.
UI module is connected to system module with a connector. System and rf
submodules are interconnected with PCB wiring. Unit can be connected to
accessories with a bottom system connector, which includes charging and
accessory control.
RF block is designed for a hand portable phone, which operates in NMT450
systems. Purpose of the RF module is to receive and demodulate radio frequency signal from the base station and to transmit a modulated RF signal
to the base station.
Technical Documentation
Modules
Transceiver THF–12C 0502071
• system module NH1C 0201260
• software module 0240623
• display module NU1 0201258
• mechanics MTHF12C 0261836
Swap package 0068943
RF Characteristics
Characteristic Value / Comments
RX Frequency range 461.310...465.730 MHz
TX Frequency range 451.310...455.730 MHz
Channel spacing 20 kHz
Number of channels 222 (222...1)
TX Frequency deviation ≤± 3.75 kHz (± 4.05 kHz with 4 kHz supervisory signal)
FFSK deviation
• 1200 Hz (”1” frequency) ± 2240 Hz
• 1800 Hz (”0” frequency) ± 3360 Hz
Page 1 – 4
Issue 2 04/99
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