Nokia RM-704, C2-00 Service Manual

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Page 1

Nokia Customer Care

Service Manual

RM-704 (Nokia C2-00)

Mobile Terminal

Part No: (Issue 1)

COMPANY CONFIDENTIAL

Page 2

Amendment Record Sheet

Amendment No Date Inserted By Comments

Original issue 05/2011 Jeff Zhao

RM-704

Amendment Record Sheet

Page ii COMPANY CONFIDENTIAL Issue 1

Page 3

RM-704 Copyright

Copyright

without the prior written permission of Nokia is prohibited. Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of their respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental, consequential or indirect damages howsoever caused.

The contents of this document are provided "as is". Except as required by applicable law, no warranties of any kind, either express or implied, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

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RM-704

Warnings and cautions

Warnings

•

IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/ MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

•

THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES, FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

•

OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.

•

BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

•

Servicing and alignment must be undertaken by qualified personnel only.

•

Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

•

Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

•

Use only approved components as specified in the parts list.

•

Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and alignment.

•

Ensure all cables and wires are repositioned correctly.

•

Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

•

During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise GSM or WCDMA PA may be damaged.

Page iv COMPANY CONFIDENTIAL Issue 1

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RM-704 For your safety

For your safety

QUALIFIED SERVICE

Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES

Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES

When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect incompatible products.

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RM-704

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below will help you to fulfil any warranty obligations and to enjoy this product for many years.

•

Keep the phone and all its parts and accessories out of the reach of small children.

•

Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that will corrode electronic circuits.

•

Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

•

Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage batteries, and warp or melt certain plastics.

•

Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form inside, which may damage electronic circuit boards.

•

Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

•

Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

•

Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

•

Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

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RM-704 ESD protection

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing the phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be replaced without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied. All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge. All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside

any ESD Protected Area (EPA). Every repair action involving opening the product or handling the product components must be done under

ESD protection. ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area. For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

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RM-704

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged battery will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge. For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the

product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose. Never use any charger or battery which is damaged. Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or

pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery or the connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77° F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged. Batteries' performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire! Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

Page viii COMPANY CONFIDENTIAL Issue 1

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RM-704 Company policy

Company policy

Our policy is of continuous development; details of all technical modifications will be included with service bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/email.

Please state:

•

Title of the Document + Issue Number/Date of publication

•

Latest Amendment Number (if applicable)

•

Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION Nokia Mobile Phones Business Group Nokia Customer Care PO Box 86 FIN-24101 SALO Finland E-mail: Service.Manuals@nokia.com

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RM-704

Company policy

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RM-704 Nokia C2-00 Service Manual Structure

Nokia C2-00 Service Manual Structure

1 General Information 2 Service Tools and Service Concepts 3 BB Troubleshooting and Manual Tuning Guide 4 RF Troubleshooting 5 System Module Glossary

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RM-704

Nokia C2-00 Service Manual Structure

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Nokia Customer Care

1 — General Information

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RM-704

General Information

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RM-704 General Information

Table of Contents

Product selection................................................................................................................................................... 1–5

Phone features ...................................................................................................................................................... 1–5

Accessories............................................................................................................................................................. 1–6

Technical specifications........................................................................................................................................ 1–7

Transceiver general specifications ................................................................................................................. 1–7

Battery endurance............................................................................................................................................ 1–7

List of Figures

Figure 1 RM-704 (Nokia C2-00) product picture................................................................................................. 1–5

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RM-704

General Information

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RM-704 General Information

Product selection

RM-704 (Nokia C2–00) is a GSM Quad-band phone, supporting EGSM 900/1800 bands.

Figure 1 RM-704 (Nokia C2-00) product picture

Phone features

Hardware features

•

One internal SIM slot under battery

•

One external SIM slot, hot-swap enabled

•

HW16, Dual-band variants: EGSM 900/1800 & GSM900/1800 – Edge down link only

•

Combo 32 MB Flash, 16 MB SDRAM

•

Codecs supported: FR, EFR, HR, AMR

•

SIM support: 3volt, 1.8volt

•

128x160 TFT display (ACF)

•

microSD card slot, hot-swap supported

•

VGA Camera

•

Long battery life time (BL-5C; 1020mAh)

•

Nokia AV connector

•

Stereo FM Radio & Radio recording, RDS

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•

Bluetooth

•

BTHCost4.0

•

3in1 speaker

•

Clapton microphone

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Speaker loudness: 103db

•

3.5mm audio jack

•

Micro USB

SW features (S40 SPR10.4)

•

Smart Dual SIM, swap external SIM without rebooting

•

UI: D5, Entry S40 UI, connect UI, 3soft keys, 5way Navi™ key

•

Full MP3 player

•

Bluetooth connectivity

•

Stereo FM radio and recording

•

MP3 ringing tones

•

Java MIDP 2.1

•

OMA DRM 2.0

•

WAP 2.0

•

MMS 1.3

•

SyncML 1.2

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Native Email Client

•

Nokia Xpress Audio messaging

•

Theme 3.0

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Organizer with local calendar

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Expense manager

•

Advanced calculator

•

Converter II

•

FOTA/NSU

RM-704

General Information

Applications

•

Nokia Cherry 2.5

•

Ovi Life Tool 1.7

•

Nokia Messaging service 2.0

Accessories

In-box:

•

Phone: Nokia C2–00

•

Battery: BL-5C

•

Chargers: AC-3 (China use AC-8C and CA-100C)

•

Headset: WH-102

For out-box accessories, please refer to enhancement list document.

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RM-704 General Information

Technical specifications

Transceiver general specifications

Unit Dimensions (L x W x T)

Transceiver with BL-5C 1020 mAh Li Lion battery pack

(mm)

108 x 45 x 14.65 74.1 67.9

Weight (g)

Battery endurance

Battery Talk time Stand-by time

BL-5C with 1020 mAh Li Lion standard battery

Note: Variation in operation time will occur depending on SIM card, network settings and usage.

Talk time is increased by up to 30% if half rate is active and reduced by 5% if enhanced full rate is active.

Best Talk Time ECTEL Talk Time Best Stand-by Time ECTEL Stand-by Time

11.5 hours 5.7 hours 570 hours 460 hours

Volume (cm3)

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RM-704

General Information

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Nokia Customer Care

2 — Service Tools and Service

Concepts

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RM-704

Service Tools and Service Concepts

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RM-704 Service Tools and Service Concepts

Table of Contents

Service tools........................................................................................................................................................... 2–5

Product specific tools....................................................................................................................................... 2–5

SS-255........................................................................................................................................................... 2–5

SS-256........................................................................................................................................................... 2–5

SS-257........................................................................................................................................................... 2–5

General tools..................................................................................................................................................... 2–5

CU-4............................................................................................................................................................... 2–6

FPS-21........................................................................................................................................................... 2–7

MJ-300 .......................................................................................................................................................... 2–8

PK-1............................................................................................................................................................... 2–8

RJ-230 ........................................................................................................................................................... 2–8

SRT-6............................................................................................................................................................. 2–8

SS-227........................................................................................................................................................... 2–9

SS-93............................................................................................................................................................. 2–9

SX-4............................................................................................................................................................... 2–9

Cables................................................................................................................................................................. 2–9

CA-101 .......................................................................................................................................................... 2–9

CA-128RS ................................................................................................................................................... 2–10

CA-31D ....................................................................................................................................................... 2–10

CA-89DS ..................................................................................................................................................... 2–10

CA-99PS...................................................................................................................................................... 2–10

PCS-1.......................................................................................................................................................... 2–11

XRS-6.......................................................................................................................................................... 2–11

Service concepts ................................................................................................................................................. 2–12

POS (Point of Sale) flash concept ................................................................................................................. 2–12

Flashing, certificate restore and product code change............................................................................. 2–13

Flashing, certificate restore, product code change and EM calibration................................................... 2–14

BB and RF tuning........................................................................................................................................... 2–15

List of Figures

Figure 2 POS flash concept ................................................................................................................................ 2–12

Figure 3 Flashing, certificate restore and product code change................................................................... 2–13

Figure 4 Flashing, certificate restore, product code change and EM calibration......................................... 2–14

Figure 5 BB and RF tuning ................................................................................................................................. 2–15

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RM-704

Service Tools and Service Concepts

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RM-704 Service Tools and Service Concepts

Service tools

Product specific tools

The table below gives a short overview of service devices that can be used for testing, error analysis, and repair of product RM-704. For the correct use of the service devices, and the best effort of workbench setup, please refer to various concepts.

SS-255 Protection plate SS-255 is designed as protection plate working with SS-256 for OKI

soldering machine.

SS-256 Blowing nozzle SS-256 is a blowing nozzle which can be used with protection plates

for different soldering machines.

SS-257 Protection plate SS-257 is designed as protection plate working with SS-256 for Martin

soldering machine.

General tools

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RM-704

Service Tools and Service Concepts

CU-4 Control unit CU-4 is a general service tool used with a module jig and/or a flash

adapter. It requires an external 12 V power supply. The unit has the following features:

•

Software controlled via USB

•

EM calibration function

•

Forwards FBUS/Flashbus traffic to/from terminal

•

Forwards USB traffic to/from terminal

•

Software controlled BSI values

•

Regulated VBATT voltage

•

2 x USB2.0 connector (Hub)

•

FBUS and USB connections supported

When using CU-4, note the special order of connecting cables and other service equipment:

Instructions

1 Connect a service tool (jig, flash adapter) to CU-4. 2 Connect CU-4 to your PC with a USB cable. 3 Connect supply voltage (12 V) 4 Connect an FBUS cable (if necessary). 5 Start service software.

Note: Service software enables CU-4 regulators via USB when

it is started. Reconnecting the power supply requires a service software

restart.

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RM-704 Service Tools and Service Concepts

FPS-21 Flash prommer

FPS-21 sales package:

•

FPS-21 prommer

•

AC-35 power supply

•

CA-31D USB cable

FPS-21 interfaces:

Front

•

Service cable connector Provides Flashbus, USB and VBAT connections to a mobile device.

•

SmartCard socket A SmartCard is needed to allow DCT-4 generation mobile device

programming.

Rear

•

DC power input For connecting the external power supply (AC-35).

•

Two USB A type ports (USB1/USB3) Can be used, for example, for connecting external storage memory

devices or mobile devices

•

One USB B type device connector (USB2) For connecting a PC.

•

Phone connector Service cable connection for connecting Flashbus/FLA.

•

Ethernet RJ45 type socket (LAN) For connecting the FPS-21 to LAN.

Inside

•

Four SD card memory slots For internal storage memory.

Note: In order to access the SD memory card slots inside

FPS-21, the prommer needs to be opened by removing the front panel, rear panel and heatsink from the prommer body.

Issue 1 COMPANY CONFIDENTIAL Page 2 – 7

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RM-704

Service Tools and Service Concepts

MJ-300 Module jig Module jig MJ-300 can be used for flashing via USB and RF, battery and

system testing. The main functions are:

•

Powering with external power

•

CU-4 interface adapter to phone (requires SS-227)

•

WLAN/BT/GPS RF-interfaces with probes

•

GSM/WCDMA RF-interfaces with probes

•

BSI mode selector (Tabby and Lynx interface, selected with battery cable)

•

VBATT interface (Tabby and Lynx interface, selected with battery cable)

•

CA-128RS cable is used together with this jig for RF testing

PK-1 Software protection

key

PK-1 is a hardware protection key with a USB interface. It has the same functionality as the PKD-1 series dongle.

PK-1 is meant for use with a PC that does not have a series interface. To use this USB dongle for security service functions please register

the dongle in the same way as the PKD-1 series dongle. RJ-230 Soldering jig

RJ-230 is a soldering jig used for soldering and as a rework jig for the engine module.

SRT-6 Opening tool SRT-6 is used to open phone covers.

Note: The SRT-6 is included in the Nokia Standard Toolkit.

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RM-704 Service Tools and Service Concepts

SS-227 Interface for CU-4

control unit

SS-227 is designed for regional Central Services to be able to use CU-4 with MJ-300 module jig. With SS-227, CU-4 can be used for battery testing.

The main functions of SS-227 are:

•

CU-4 interface adapter to MJ-300

•

BSI mode selector (Lynx and Tabby mode selection)

•

VBATT interface

All functions are performed in the CU-4. Calibration voltages and currents e.g. are protected and monitored by the CU-4 interface software (protection for over-current, overvoltage and reverse voltage).

SS-93 Opening tool SS-93 is used for opening JAE connectors.

Note: The SS-93 is included in Nokia Standard Toolkit.

SX-4 Smart card SX-4 is a BB5 security device used to protect critical features in tuning

and testing. SX-4 is also needed together with FPS-21 when DCT-4 phones are

flashed.

Cables

CA-101 Micro USB cable The CA-101 is a USB-to-microUSB data cable that allows connections

between the PC and the phone.

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RM-704

Service Tools and Service Concepts

CA-128RS RF tuning cable Product-specific adapter cable for RF tuning.

CA-31D USB cable The CA-31D USB cable is used to connect FPS-21 to a PC. It is included

in the FPS-21 sales package.

CA-89DS Cable Provides VBAT and Flashbus connections to mobile device

programming adapters.

CA-99PS Adapter CA-99PS adapter, 3.5 jack to 5.5 plug.

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RM-704 Service Tools and Service Concepts

PCS-1 Power cable The PCS-1 power cable (DC) is used with a docking station, a module

jig or a control unit to supply a controlled voltage.

XRS-6 RF cable The RF cable is used to connect, for example, a module repair jig to

the RF measurement equipment. SMA to N-Connector approximately 610 mm. Attenuation for:

•

GSM850/900: 0.3+-0.1 dB

•

GSM1800/1900: 0.5+-0.1 dB

•

WCDMA/WLAN: 0.6+-0.1dB

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Service concepts

POS (Point of Sale) flash concept

RM-704

Service Tools and Service Concepts

Figure 2 POS flash concept

Type Description

Product specific tools

BL-5C Battery

Other tools

PC with Care Suite

Cables

CA-101 Micro USB cable

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RM-704 Service Tools and Service Concepts

Flashing, certificate restore and product code change

Figure 3 Flashing, certificate restore and product code change

Type Description

Product specific devices

BL–5C Battery

Other devices

FPS-21 Flash prommer box AC-35 Power supply PK-1 SW security device SX-4 Smart card

PC with service software (Phoenix)

Cables

CA-101 Micro USB cable

USB cable

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Service Tools and Service Concepts

Flashing, certificate restore, product code change and EM calibration

RM-704

Figure 4 Flashing, certificate restore, product code change and EM calibration

Type Description

Product specific tools

MJ-300 Module jig

Other tools

CU-4 Control unit FPS-21 Flash prommer box PK-1 SW security device SX-4 Smart card

PC with service software (Phoenix)

Cables

CA-101 Micro USB cable CA-89DS Service cable CA-99PS Adapter PCS-1 Power cable

USB cable

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RM-704 Service Tools and Service Concepts

BB and RF tuning

Figure 5 BB and RF tuning

Type Description

Phone specific devices

MJ–300 Module jig

Other devices

CU-4 Control unit SS-227 CU-4 interface part FPS-21 Flash prommer box PK-1 SW security device SX-4 Smart card

PC with service software (Care Suite) Measurement equipment

Cables

CA-101 Micro USB cable PCS-1 DC power cable XRS-6 RF cable

USB cable GPIB control cable

CA-128RS Product specific RF adapter cable

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RM-704

Service Tools and Service Concepts

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Nokia Customer Care

3 — BB Troubleshooting and

Manual Tuning Guide

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RM-704

BB Troubleshooting and Manual Tuning Guide

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RM-704 BB Troubleshooting and Manual Tuning Guide

Table of Contents

Baseband Troubleshooting .................................................................................................................................. 3–5

Introduction to BB Troubleshooting ................................................................................................................... 3–5

Non re-workable Baseband Components ........................................................................................................... 3–5

Baseband main troubleshooting......................................................................................................................... 3–5

........................................................................................................................................................................... 3–5

Phone does not power on............................................................................................................................... 3–6

Power supply troubleshooting ....................................................................................................................... 3–6

Clocking system troubleshooting ................................................................................................................... 3–9

Flash programming troubleshootin............................................................................................................ 3–11

Main memory troubleshooting.................................................................................................................... 3–12

Charging troubleshooting ............................................................................................................................ 3–13

SIM card troubleshooting ............................................................................................................................. 3–15

Dual SIM troubleshooting............................................................................................................................. 3–17

USB troubleshooting..................................................................................................................................... 3–18

User interface troubleshooting......................................................................................................................... 3–20

Keyboard troubleshooting ........................................................................................................................... 3–20

Display troubleshooting ............................................................................................................................... 3–21

Backlight troubleshooting............................................................................................................................ 3–22

Camera interface troubleshooting ................................................................................................................... 3–23

Camera troubleshooting instructions ......................................................................................................... 3–23

No valid data from Camera interface IC ..................................................................................................... 3–25

Audio troubleshooting....................................................................................................................................... 3–26

Audio troubleshooting test instructions..................................................................................................... 3–26

Internal microphone troubleshooting........................................................................................................ 3–27

Internal earpiece troubleshooting .............................................................................................................. 3–29

IHF speaker troubleshooting........................................................................................................................ 3–30

External microphone troubleshooting........................................................................................................ 3–31

Headset speaker troubleshooting ............................................................................................................... 3–32

FM radio troubleshooting.................................................................................................................................. 3–33

FM radio troubleshooting............................................................................................................................. 3–33

Memory card troubleshooting .......................................................................................................................... 3–35

Cannot detect memory card......................................................................................................................... 3–35

Baseband manual tuning guide........................................................................................................................ 3–35

Certificate restoring BB5............................................................................................................................... 3–35

Energy management calibration................................................................................................................. 3–39

List of Figures

Figure 6 Baseband test point locations .............................................................................................................. 3–5

Listing 1: High current when battery is inserted, I>500mA; ............................................................................ 3–7

Figure 8 High current when battery inserted..................................................................................................... 3–7

Figure 9 IR picture showing component overheat ............................................................................................ 3–7

Listing 2: High current after pressing power-on key, 100mA<I<500mA......................................................... 3–8

Figure 11 High current after pressing power-on key ........................................................................................ 3–8

Figure 12 No current when pressing power on key .......................................................................................... 3–9

Figure 13 26 MHz Clock does not work ............................................................................................................ 3–10

Figure 14 32 KHz RTC clock does not work ...................................................................................................... 3–11

Figure 15 Cannot identify charger.................................................................................................................... 3–14

Figure 16 No charging current.......................................................................................................................... 3–15

Figure 17 Cannot identify SIM card................................................................................................................... 3–15

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RM-704

BB Troubleshooting and Manual Tuning Guide

Figure 18 SIM voltages, no ATR......................................................................................................................... 3–16

Figure 19 SIM voltages, normal startup at 3V ................................................................................................. 3–16

Figure 20 SIM 1 troubleshooting flow.............................................................................................................. 3–17

Figure 21 SIM 2 troubleshooting flow.............................................................................................................. 3–18

Figure 22 Pin 3 of V2202.................................................................................................................................... 3–20

Figure 23 Blank display troubleshooting flow ................................................................................................ 3–22

Figure 24 No backlight troubleshooting flow ................................................................................................. 3–23

Figure 25 Interface signals between D3100 and N3000 ................................................................................ 3–24

Figure 26 Camera interface IC troubleshooting guide ................................................................................... 3–25

Figure 27 Phoenix audio test window............................................................................................................. 3–26

Figure 28 PWB audio test point........................................................................................................................ 3–27

Figure 29 Test arrangement for microphone.................................................................................................. 3–28

Figure 30 Internal microphone troubleshooting flow ................................................................................... 3–28

Figure 31 Test arrangement for earpiece........................................................................................................ 3–29

Figure 32 Internal earpiece troubleshooting flow ......................................................................................... 3–30

Figure 33 Test arrangement for IHF speaker................................................................................................... 3–31

Figure 34 IHF speaker troubleshooting flow................................................................................................... 3–31

Figure 35 Test arrangement for external microphone................................................................................... 3–32

Figure 36 external microphone troubleshooting flow................................................................................... 3–32

Figure 37 Test arrangement for headset speaker........................................................................................... 3–33

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RM-704 BB Troubleshooting and Manual Tuning Guide

Baseband Troubleshooting

The following sections contains guidelines how to identify and correct basic baseband related faults. Access to normal LAB equipment (power-supply, digital multi-meter and oscilloscope) is a prerequisite for following the guidelines. Due to the small size of the components and test-points, access to a microscope or magnifying glass is recommended.

Introduction to BB Troubleshooting

Initial baseband troubleshooting normally involves the measurements of various power supply voltages and control signals. The location on the most important test-points is indicated in the following figure:

Figure 6 Baseband test point locations

Non re-workable Baseband Components

The XGold 213 V2.1S GSM controller IC D3100 is non-reworkable. This means that if failure diagnostics leads to the conclusion of defective D3100, the PWB has to be swapped with a working unit.

Baseband main troubleshooting

The following sections will contain in-depth trouble-shooting guides for various areas of the baseband circuit. It is assumed that a battery simulator containing a valid BSI resistance is used to supply the phone, or a valid battery is used.

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Phone does not power on

Troubleshooting flow

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Power supply troubleshooting

High current

If the phone draws excessively high current upon power on or insertion of battery, it means that VBAT or a LDO output is shorted.

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Listing 1: High current when battery is inserted, I>500mA;

Refer to the following picture:

Figure 8 High current when battery inserted

Figure 9 IR picture showing component overheat

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Listing 2: High current after pressing power-on key, 100mA<I<500mA.

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Figure 11 High current after pressing power-on key

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No current when pressing power on key

Figure 12 No current when pressing power on key

Clocking system troubleshooting

26 MHz clock does not work

If the 26 MHz crystal does not work, it may be due to B7100 malfunction or a soldering defect.

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Figure 13 26 MHz Clock does not work

32 KHz RTC clock does not work

If the 32 KHz crystal does not work, it may be due to B3000 malfunction, matching capacitor or B3000 soldering defect.

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Figure 14 32 KHz RTC clock does not work

Flash programming troubleshootin

Context

Flash programming can be done via the USB test points or the USB connector. If there is a connectivity issue (open/short circuit) under BGA chip, it may also cause programming failure. It is assumed that the integrity of the USB connection is verified prior to flashing troubleshooting.

The Phoenix tool can give some useful information about the failure as indicated in the following programming troubleshooting flow.

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Troubleshooting flow

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Main memory troubleshooting

Context

Possible issues happen on the main memory could be: image corruption, soldering issue or flash chip damaged.

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Troubleshooting flow

Charging troubleshooting

Can not identify charger

When inserting the wall adaptor into the phone, the phone will detect a valid voltage if charger output voltage is 4.6 – 9.3V. But if something is wrong with the voltage detect/measurement circuit, then the phone cannot correctly identify the charger.

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Figure 15 Cannot identify charger

No charging current (cannot charge battery fully in expected time)

When the phone is in constant current or constant voltage charge state, the average charging current is controlled by phone SW. The current is feed into battery though the V2204 transistor, the phone measures charging current by sampling the voltage over resistor R2208. If there is something wrong at this path, the charging current may be out of specification. It is assumed that phone can detect the presence of the charger, otherwise please refer to the above section.

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Figure 16 No charging current

SIM card troubleshooting

Cannot identify SIM card

The hardware of the SIM interface from XGOLD213 (D3100) to the SIM connector (X2750) can be tested without a SIM card. When the phone is switched on, the phone first checks for a 1.8V SIM card, and then for a 3V SIM card. The phone will try this several times, where after it will display “Insert SIM card”.

Figure 17 Cannot identify SIM card

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Figure 18 SIM voltages, no ATR

SIM card rejected

The error “SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data signal levels are wrong. The first data is always ATR and it is sent from card to phone. For reference a picture with normal SIM power-up is shown below.

Figure 19 SIM voltages, normal startup at 3V

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Dual SIM troubleshooting

Troubleshooting SIM problems on a dual SIM product is very similar to the procedures outlined in the above section. The presence of the dual SIM IC is detected by the self-test routine, and as such it can be assumed that presence and interface towards the BB IC is verified if the self-test passes. The troubleshooting guides will as a consequence focus on dual SIM IC <-> SIM card related problems. It also assumed that troubleshooting on SIM1 is done using only one SIM card, which is inserted either in slot 1, and troubleshooting on SIM2 is done using 2 SIM cards, so both slots needs to be occupied.

SIM 1 not recognized

Figure 20 SIM 1 troubleshooting flow

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SIM 2 not recognized

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Figure 21 SIM 2 troubleshooting flow

USB troubleshooting

Context

If the phone cannot be detected by PC when the USB cable is inserted, this means that communication between phone and PC can not be setup. This may be due to soldering issue or a malfunction in the ESD protection device.

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Troubleshooting flow

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User interface troubleshooting

Keyboard troubleshooting

Context

One or more keys don’t function at all.

Figure 22 Pin 3 of V2202

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Troubleshooting flow

Display troubleshooting

Blank display

The display doesn’t show any information at all when phone is powered on. XGOLD connects the LCD via the serial port. If the communication between XGOLD and LCD has problems, the XGOLD may be not be able to initialize LCD correctly. The XGOLD also feeds 2 power supplies to the LCD: VAUX and 1V8, if these 2 power supply work abnormally, the LCD also doesn’t work.

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Figure 23 Blank display troubleshooting flow

Display is corrupt

The display contains missing or fading segments or color presentation is incorrect. Since ACF assembling is used, it cannot be repaired.

Backlight troubleshooting

No backlight

The backlight is driven by a DC-DC converter. The LCD backlight LED’s and the keypad LED’s are in connected in serial path. If any component on this serial path is open circuit, there is no backlight.

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Figure 24 No backlight troubleshooting flow

Camera interface troubleshooting

Camera troubleshooting instructions

Camera troubleshooting involves debugging on two interfaces; the interface between the camera module itself and the camera interface IC N3000, and debugging on the interface between N3000 and the baseband IC D3100. Troubleshooting on interface between camera and N3000 is outside the scope of this specification. In the following troubleshooting guide it is assumed that the integrity of this interface is already verified and valid signal are present on the inputs of N3000.

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Figure 25 Interface signals between D3100 and N3000

The above figure shows the interface signals between N3000 and D3100 when the camera is active: Yellow: Pixel Clock signal J3002 Red: Data bit 0 J3003 Green: Hsync J3005 Blue: Vsync J3006 Actual pixel clock frequency, Vsync and Hsync frequency and data content will depend on the camera used

(resolution, frame-rate) and operating mode (still picture capture, video recording, viewfinder mode).

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No valid data from Camera interface IC

Figure 26 Camera interface IC troubleshooting guide

Configuration of the camera interface chip IC: CCP_CLASS_SEL = GND: SMIA Class 0, Strobe pins functions as Clock inputs (ACME VGA module) CCP_CLASS_SEL = 1.8V: SMIA Class 1, Strobe and Data. (2MP Gandalf module)

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Audio troubleshooting

Audio troubleshooting test instructions

Audio troubleshooting using phoenix:

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Figure 27 Phoenix audio test window

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Figure 28 PWB audio test point

Internal microphone troubleshooting

Steps:

1 Connect phone with Phoenix. 2 Open “audio test” window from “Testing –> Audio test”, as shown in Figure Phoenix audio test window

above.

3 Select “Hp microphone in Ext speaker out”.

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4 Select “Loop” as “On”. 5 Input sound at microphone port, for example 94dB SPL 1kHz. 6 Check if signal is detected at HS_EAR_L/R pads, as shown in Figure “PWB audio test points” above.

Figure 29 Test arrangement for microphone

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Figure 30 Internal microphone troubleshooting flow

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Internal earpiece troubleshooting

Steps:

1 Connect phone with Phoenix. 2 Open “audio test” window from “Testing –> Audio test”, as shown in Figure Phoenix audio test window

above.

3 Select “Ext microphone in Hp speaker out”. 4 Select “Loop” as “On”. 5 Input signal to HS_MIC/GND pads, as shown in Figure PWB audio test point above, for example 100mVpp,

1kHz.

6 Check if sound is heard in earpiece.

Figure 31 Test arrangement for earpiece

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Figure 32 Internal earpiece troubleshooting flow

IHF speaker troubleshooting

Steps:

1 Connect phone with Phoenix. 2 Open “audio test” window from “Testing –> Audio test”, as shown in Figure Phoenix audio test window

above. 3 Select “Ext microphone in IHF speaker out”. 4 Select “Loop” as “On”. 5 Input signal to HS_MIC/GND pads, as shown in Figure PWB audio test point above, for example 100mVpp,

1kHz. 6 6) Check if sound is heard in IHF.

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Figure 33 Test arrangement for IHF speaker

Figure 34 IHF speaker troubleshooting flow

External microphone troubleshooting

Steps:

1 Connect phone with Phoenix.

2 Open “audio test” window from “Testing –> Audio test”, as shown in Figure Phoenix audio test window

above. 3 Select “Ext microphone in Ext speaker out”. 4 Select “Loop” as “On”. 5 Input sound at microphone port, for example 94dB SPL 1kHz. 6 Check if signal is detected at HS_EAR_L/R pads, shown in Figure PWB audio test points above.

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Figure 35 Test arrangement for external microphone

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Figure 36 external microphone troubleshooting flow

Headset speaker troubleshooting

Steps:

1 Connect phone with Phoenix. 2 Open “audio test” window from “Testing –> Audio test”, as shown in Figure Phoenix audio test window

above.

3 Select “Ext microphone in Ext speaker out”. 4 Select “Loop” as “On”. 5 Input signal to HS_MIC/GND pads, as shown in Figure PWB audio test point above, for example 100mVpp,

1kHz.

6 Check if sound is heard in headset.

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Figure 37 Test arrangement for headset speaker

FM radio troubleshooting

Context

FM radio problems can fall into two categories; not possible to tune into a station when headset cable is inserted, or it can tune in on a station (Station ID and valid signal strength indicated in display) but there is no audio. In the latter case please refer to “IHF speaker troubleshooting” or “Headset speaker troubleshooting” for trouble shooting the downlink audio path and headset detection function. It is assumed that live FM stations with sufficient signal strength are available on the point of service, and that a dedicated FM signal generator is not used during troubleshooting.

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Troubleshooting flow

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Memory card troubleshooting

Cannot detect memory card

Context

Quantum support SD/MMC card.

Troubleshooting flow

Baseband manual tuning guide

Certificate restoring BB5

Context

This procedure is performed when the Combo Memory is replaced.

Hardware and Software Setup:

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•

Latest Phoenix Service Software supporting phone model

•

Latest phone model specific Data Package

•

FPS--10 or 21 Flash prommer

•

SX-4 Smart Card with Enabled Certificate Restore feature

•

Phone model specific Module Jig or Generic Module Jig

Refer to the setup in Service Concept.

Steps

1. Connect phone and scan product, read phone information to check communication with phone. Select Tools –> Certificate Restore BB5 in the menu.

2. Provide Tucson Password and PIN code. Please note that characters are case sensitive.

3. Select OK, Phoenix will read product information from phone.

4. Product code shown on the UI does not matter, because during restoring it will be replaced by the product code which is the latest one stored in Nokia system.

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5. It is recommended to perform “Restore” function without selecting “Flash Product” –– option to avoid

possible SW downgrade which causes the phone to die.

6. Information from phone and Smart Card are read and connection to Tucson server is established.

7. Information from Nokia system is retrieved and programmed in the phone.

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8. After programming confirmation about successful event is sent to Nokia system.

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Next actions

After a successful rewrite, you must retune the phone completely. (RF and BB)

Energy management calibration

Context

Energy Management calibration is performed to calibrate the settings of the AD converters in several channels to get an accurate AD conversion result.

Hardware and Software Setup:

•

Latest Phoenix Service Software supporting phone model

•

Latest phone model specific Data Package

•

FPS--10 or 21 Flash prommer

•

Supply 12V DC from an external power supply to CU-4 to power up the phone

•

The phone must be connected to a CU-4 unit with a product-specific Module Jig or generic module jig.

Refer to the setup in Service Concept.

Steps

1. Connect CU-4 with Module Jig, and place the phone module to the Module Jig -> Mode Switch on Flashing

+ EM CALIB.

2. Start Phoenix service software.

3. Choose File -> Scan Product.

4. Choose Tuning -> Energy Management.

5. To show the current values in the phone memory, click Read.

6. Click Tune & Calculate.

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7. The new calibration values are shown in the calculated column. If the new calibration values seem to be acceptable click Write to store the new calibration values to the phone permanent memory.

8. Click Read, and confirm that the new calibration values are stored in the phone memory correctly.

9. End the procedure and close the Energy Management window.

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Nokia Customer Care

4 — RF Troubleshooting

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Table of Contents

Introduction to RF Troubleshooting.................................................................................................................... 4–5

Non re-workable RF Components........................................................................................................................ 4–5

Maintenance Overview.......................................................................................................................................... 4–5

........................................................................................................................................................................... 4–5

Maintenance step 1.......................................................................................................................................... 4–6

Maintenance step 2.......................................................................................................................................... 4–6

Maintenance step 3.......................................................................................................................................... 4–6

Maintenance step 4.......................................................................................................................................... 4–7

Maintenance working flow................................................................................................................................... 4–7

Overview ........................................................................................................................................................... 4–7

Case 1: All Self Tests Passed ............................................................................................................................ 4–7

Case 2: X-Tal, Antenna detection and FEM ID Self-Test Failed...................................................................... 4–7

Case 3: RF Internal Loopback failure .............................................................................................................. 4–8

Maintenance step 1—Self test ............................................................................................................................. 4–8

Maintenance step 1 — Self test ...................................................................................................................... 4–8

Maintenance step 2 –Debugging and troubleshooting..................................................................................... 4–9

Maintenance step 2 –Debugging and troubleshooting................................................................................ 4–9

Visual inspection check flow........................................................................................................................... 4–9

RF Troubleshooting: X-Tal debug check flow............................................................................................. 4–10

RF Troubleshooting: Antenna detection check flow.................................................................................. 4–11

RF Troubleshooting: AFC troubleshooting.................................................................................................. 4–12

Receiver troubleshooting............................................................................................................................. 4–13

Receiver troubleshooting overview ....................................................................................................... 4–13

RX LB troubleshooting ............................................................................................................................. 4–14

RX HB troubleshooting............................................................................................................................. 4–18

Transmitter troubleshooting ....................................................................................................................... 4–19

Transmitter troubleshooting overview ................................................................................................. 4–19

TX LB troubleshooting ............................................................................................................................. 4–21

TX HB troubleshooting............................................................................................................................. 4–24

Maintenance step 3- Local mode verification and calibration ...................................................................... 4–26

Maintenance step 3- local mode verification and calibration .................................................................. 4–26

Maintenance step 4 –Signalling mode test...................................................................................................... 4–27

Maintenance step 4 –Signalling mode test................................................................................................. 4–27

NOKIA CARE SUITE Testing and Tuning Tool..................................................................................................... 4–27

General ........................................................................................................................................................... 4–27

General ...................................................................................................................................................... 4–27

Preparation.................................................................................................................................................... 4–28

Preparation............................................................................................................................................... 4–28

Installation..................................................................................................................................................... 4–29

Installation................................................................................................................................................ 4–29

Install testing and tuning tool................................................................................................................ 4–29

Launching Care Suite Testing and tuning Tool .......................................................................................... 4–35

You can launch Care Suite in the following ways: ................................................................................ 4–35

Layout........................................................................................................................................................ 4–36

Configuration of testing and tuning tools.................................................................................................. 4–40

Configure connections between phone and PC .................................................................................... 4–40

Preferences ............................................................................................................................................... 4–41

RF tuning........................................................................................................................................................ 4–45

................................................................................................................................................................... 4–45

RF testing ....................................................................................................................................................... 4–48

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................................................................................................................................................................... 4–48

EM calibration ................................................................................................................................................ 4–49

................................................................................................................................................................... 4–49

Notes............................................................................................................................................................... 4–49

................................................................................................................................................................... 4–49

Bluetooth Troubleshooting............................................................................................................................... 4–49

Bluetooth functional description................................................................................................................. 4–49

Block diagram................................................................................................................................................ 4–50

Interface signals............................................................................................................................................ 4–51

Component placement ................................................................................................................................. 4–52

Symptom, Problem and Repair Solution..................................................................................................... 4–53

Test Coverage ................................................................................................................................................ 4–54

Test Procedure............................................................................................................................................... 4–54

Bluetooth troubleshootin............................................................................................................................. 4–56

List of Tables

Table 1 Power supply voltages for the X-GOLD213 IC RF sub-system ........................................................... 4–16

Table 2 Bluetooth Signal List............................................................................................................................. 4–51

List of Figures

Figure 38 D3100 is the non-reworkable components on PWB......................................................................... 4–5

Figure 39 RX checkpoints and component overview (measurement point marked with blue) ................ 4–14

Figure 40 X-Gold RX pin volts @ L7100(LB) / L7101(HB) ................................................................................ 4–15

Figure 41 RX LB FEM logic waveform (C1:VC1; C2:VC2; C3:VC3) ...................................................................... 4–16

Figure 42 X-Gold RX pin volts @ L7100(LB) / L7101(HB) ................................................................................ 4–18

Figure 43 TX checkpoints and component overview (measurement point marked with blue) ................ 4–20

Figure 44 X-Gold TX pin volts @ C7108(LB) /C7109 (HB)................................................................................. 4–21

Figure 45 RX LB FEM logic waveform (C1:VC1; C2:VC2; C3:VC3) ...................................................................... 4–22

Figure 46 TX LB VPC logic waveform-PCL5 (C1: VPC; C2: PAEN) ...................................................................... 4–23

Figure 47 TX HB FEM logic waveform (C1:VC1; C2:VC2; C3:VC3)...................................................................... 4–24

Figure 48 TX HB VPC logic waveform-PCL0 (C1: VPC; C2: PAEN)...................................................................... 4–25

Figure 49 Bluetooth block diagram.................................................................................................................. 4–51

Figure 50 Test points in Archie Bluetooth ASIC circuit – BTHCost4.0D (CSR8810)........................................ 4–53

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Introduction to RF Troubleshooting

For the RF troubleshooting, generally 2 types of measurements are used: RF measurements and LF measurements.

RF measurements are done with a spectrum analyzer (or spectrum analyzer alike?) and a high-frequency probe, e.g. Agilent E4440A. Note that the test jig has some losses, which must be taken into consideration when calibrating the test system.

LF (low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe used in the following is a 10mW/10pF probe. For the other types of probes the voltages displayed may be slightly different. Always make sure the measurement setup is calibrated when measuring RF parameters on the antenna pad. When re-aligning the phone, the loss in the module repair jig should be included.

Most RF semiconductors are static discharge sensitive, i.e. ESD protection must be added during repair (ground straps and ESD soldering irons). The FEM and the X-GOLD213 are also sensitive to moisture, i.e. these parts must be pre-baked prior to soldering.

Key components are described in this document but there are also a lot of discrete components (resistors, inductors and capacitors) where the troubleshooting is done by checking if soldering of the component is done properly and checking if the component is missing from PWB. Capacitors can be checked for shortcircuiting and resistors for value by means of an Ohm meter. However it should be noted that in-circuit measurements should be evaluated carefully.

Non re-workable RF Components

The non-reworkable component for the Quantum is the X-GOLD213 (D3100). All other components are reworkable.

Figure 38 D3100 is the non-reworkable components on PWB

Maintenance Overview

When the phone is received at the service centre, it is fully assembled, and it is the objective to identify the failure area in the phone by doing fast troubleshooting and then locate the failed component(s). Since the X-Gold213 IC is a non-replaceable component, it should be the primary task to identify whether the failure is related to this component or not. In case of failure of the X-GOLD213 the current PCB will be replaced by a new fully mounted PCB. The intention of the troubleshooting procedure is to find the failing component(s). After this a re-tuning + verification of the phone is needed in order to secure passes of all RF parameters and no more failures will be present.

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Before sending the phone back to the customers a short verification step in normal mode + live network call will be performed.

The Maintenance steps can be seen in the figure below:

Maintenance step 1

Step 1 is where the phone (MS) is fully assembled, i.e. the RF production connector cannot be used. The purpose is to perform a quick identification of the failure mode using MS self test. The self-test feature will not be able to detect the failed component, but in best case it can detect the failure area/functionality. Note that the self test might not catch all failures.

Purpose of step 1:

•

Fast identification of any failures when phone is assembled;

•

To identify the area of the failures in order to give the operator (Service maintenance operator) further information where to debug. (Note: Self-test will not be able to specify which component(s) is failing only which functionality is failing.)

Maintenance step 2

Step 2 is where the phone (MS) is disassembled and the RF production connector can be used, i.e. the antenna is not mounted. The purpose of this step is to identify the failing component(s) and replace it. In this step the troubleshooting will be made.

Purpose of step 2:

•

Identify the failure when phone is disassembled;

•

Troubleshooting in order to find the specific failing component(s) and replace it/them.

Maintenance step 3

The Maintenance Step 3 is the local mode verification step. Note that this can be used for both troubleshooting and verification.

Purpose of step 3:

•

In case of the MS self-test performed in Maintenance Step 1 didn’t show any errors the verification should identify where the error is located (on functional level);

•

In case a component(s) has been replaced after troubleshooting, this step should verify that the phone can pass all RF test after recalibration or:

a Identify if the replaced components was the component(s) causing the failure. a Detect if other failures are present after replacing.

•

To make a final calibration and verification (local mode) to make sure that the phone passes all RF limits and requirements.

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Maintenance step 4

In Maintenance step 4 the phone will be assembled and a short test in signalling mode in order to verify that the assembled phone with full mechanic and antenna can pass finial UI requirements in Normal Mode, i.e. Signalling Mode and if the phone is able to do a voice call.

Purpose of step 4:

•

Finial verification step using normal mode of the full assembled phone before sending it back to the customer;

•

To verify the phone is working in live network.

Maintenance working flow

Overview

The Maintenance step 1 is the maintenance step where all self-tests are performed on the fully assembled MS. In some case the Self-tests will detect failure i.e. tell the maintenance operator where to debug. However in other cases the Self-test will not detect any failure however this doesn’t mean that a failure is present. In order to locate the area of the failure it’s recommended to run verification test (Maintenance step 3) in order to give the Maintenance operator better hint where to trouble shoot.

Below is the different working flow described depending on outcome of the different Self-tests.

Case 1: All Self Tests Passed

Below is the working flow for the case where all Self-test passed illustrated.

The phone passes all the Self-tests meaning that the Self-Test was not able to detect any failure – however it must be assumed that a failure is present.

In order to locate the area of the failure, the RF verification in Maintenance step 3 need to be executed. The verification step will highlight in which area the failure is present and where to start to troubleshoot. Debugging and troubleshooting are described in the Maintenance Step 2.

After the troubleshooting i.e. finding and replacing the failing components(s) the next step is to re-tune (calibrate) and do RF verification (Maintenance step 3). This is done in order to secure that all failures have been removed and no further failures are present. The MS passes needs to pass all RF related test. Finally the MS is assembled in Maintenance step 4 and verified in normal mode.

Case 2: X-Tal, Antenna detection and FEM ID Self-Test Failed

Below is the working flow illustrated for the case where all Self-test fails the X-Tal, Antenna detection or FEM ID Self-test in the Maintenance step.

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Debug and troubleshooting should be performed in the area of the Self-test failure i.e. if it is the X-tal selftest that fails then do the X-Tal troubleshooting etc. After the troubleshooting i.e. finding and replacing the failing components(s) the next step is to re-tune (calibrate) and do RF verification (Maintenance step 3). This is done in order to secure that all failures have been removed and no further failures are present. The MS passes needs to pass all RF related test. Finally the MS is assembled in Maintenance step 4 and verified in normal mode.

Case 3: RF Internal Loopback failure

Below is the working flow described in the case where the phone fails at RF internal loop back self-test in the Maintenance step 1.

The Internal Loop Back Self-test is a special test mode where the TX part of the X-GOLD213 is configured to transmit on a RX frequency. This signal is weak amplified in the PA of the FEM and by the antenna switch of the FEM directed to the RX port (not the antenna port as normal operation!) and then looped back to the RX input of the X-GOLD213. The receiver of the X-GOLD213 is then able to measure how much of the transmitted output power is looped back.

Since a fail in the RF loopback test can be a failure in the TX or RX (LB or HB) and the RF internal loopback selftest is not able to highlight this, it is recommended to do a verification step in the maintenance step 3 – with the only purpose to get the info if the failure is in the TX or RX path.

After troubleshooting i.e. finding and replacing the failing components(s) the next step is to re-tune (calibrate) and do RF verification (Maintenance step 3). This is done in order to secure that all failures have been removed and no further failures are present. The MS passes needs to pass all RF related test. Finally the MS is assembled in Maintenance step 4 and verified in normal mode.

Maintenance step 1—Self test

Maintenance step 1 — Self test

Run all self-tests in order to clarify if the Self-Test can detect any failures.

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Maintenance step 2 –Debugging and troubleshooting

In this stage the phone is disassembled. The goal of this step is to identify the failed component(s) either by visual inspection or by troubleshooting.

Visual inspection check flow

The purpose of the visual inspection is to try by visual to identify the area or component of root cause i.e. locate burned components (mal colure), destroyed components, misplaced components and other visual abnormalities.

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RF Troubleshooting: X-Tal debug check flow

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RF Troubleshooting: Antenna detection check flow

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RF Troubleshooting: AFC troubleshooting

Receiver troubleshooting

Receiver troubleshooting overview

If the phone failure identified at maintenance step1&3 is indicating failure at the receiver, RX troubleshooting must be executed.

Abbreviation and terms:

Specific abbreviations used in RX troubleshooting workflow are described here: Abbreviation Definition RXLB_MN C7115, L7100, C7126 RXHB_MN C7114, L7101, C7129 FEM_RxCtl VC1, VC2, VC3, FEM_RxCtrlRes R7106, R7110, R7113 FEM_RxCtrlCap C7107, C7110, C7132 FEM_BatComp L7707, C7135, C7125, C7117, C7111

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Figure 39 RX checkpoints and component overview (measurement point marked with blue)

RX LB troubleshooting

The test signal from GSM tester must be a continuous signal, as the phone has no means of synchronizing to a GSM burst signal in local mode. To excite the RSSI detector in the same way a modulated GSM signal does, the test signal must either be GMSK modulated (Pseudo-random bit sequence (PRBS)) or an un-modulated CW-signal with 67.7kHz offset from center frequency.

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Figure 40 X-Gold RX pin volts @ L7100(LB) / L7101(HB)

Figure 41 RX LB FEM logic waveform (C1:VC1; C2:VC2; C3:VC3)

Table 1 Power supply voltages for the X-GOLD213 IC RF sub-system

Name Ball No. Test point Function

VBAT G14 C7134 3.6V typ. Battery voltage, supply

voltage of D2B LDO

VDDRF2 G13 C7106 2.5V D2B output voltage, part of RF

supply

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Name Ball No. Test point Function

VRF1 H10 C7121 1.8V DCDC output voltage, supply of

1.3V LDOs VDDTRX B14 C7124 1.4V Transceiver supply VDDTDC B12 C7131 1.3V VDD for Time to Digital

Converter of DPLL VDDMS H13 C7123 1.3V Mixed signal supply VDDXO E11 C7130 1.3V DCXO supply VDDMMD A12 NONE 1.3V VDD for Multi Modulus Divider of

DPLL

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RX HB troubleshooting

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Figure 42 X-Gold RX pin volts @ L7100(LB) / L7101(HB)

Transmitter troubleshooting

Transmitter troubleshooting overview

If the phone failure identified at maintenance step1&3 is transmitter fail, and then the phone should be set to the TX check mode, and then follow the corresponding workflow below for troubleshooting.

Abbreviation and terms:

Specific abbreviations used in TX troubleshooting workflow are described here: Abbreviation Definition TXLB_PI_ATT R7107, R7112, R7105 TXHB_PI_ATT R7104, R7108, R7103 TXLB_H4FILTER C7108, C7120, L7504 TXHB_H2FILTER C7109, C7101, L7106 FEM_TxCtl VC1,VC2, VC3, PAEN FEM_TxCtrlRes R7106, R7110, R7113,R7100 FEM_TxCtrlCap C7105, C7107, C7110,C7132 FEM_BatComp L7707, C7135, C7125, C7117, C7111

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Figure 43 TX checkpoints and component overview (measurement point marked with blue)

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TX LB troubleshooting

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Figure 44 X-Gold TX pin volts @ C7108(LB) /C7109 (HB)

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Figure 45 RX LB FEM logic waveform (C1:VC1; C2:VC2; C3:VC3)

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Figure 46 TX LB VPC logic waveform-PCL5 (C1: VPC; C2: PAEN)

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TX HB troubleshooting

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Nokia RM-704, C2-00 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Amendment Record Sheet

Copyright

Warnings and cautions

For your safety

Care and maintenance

ESD protection

Battery information

Company policy

Nokia C2-00 Service Manual Structure

Product selection

Phone features

Accessories

Technical specifications

Transceiver general specifications

Battery endurance

Service tools

Product specific tools

SS-255 Protection plate SS-255 is designed as protection plate working with SS-256 for OKI

SS-256 Blowing nozzle SS-256 is a blowing nozzle which can be used with protection plates

SS-257 Protection plate SS-257 is designed as protection plate working with SS-256 for Martin

General tools

CU-4 Control unit CU-4 is a general service tool used with a module jig and/or a flash

FPS-21 Flash prommer

MJ-300 Module jig Module jig MJ-300 can be used for flashing via USB and RF, battery and

PK-1 Software protection

SRT-6 Opening tool SRT-6 is used to open phone covers.

SS-227 Interface for CU-4

SS-93 Opening tool SS-93 is used for opening JAE connectors.

SX-4 Smart card SX-4 is a BB5 security device used to protect critical features in tuning

Cables

CA-101 Micro USB cable The CA-101 is a USB-to-microUSB data cable that allows connections

CA-128RS RF tuning cable Product-specific adapter cable for RF tuning.

CA-31D USB cable The CA-31D USB cable is used to connect FPS-21 to a PC. It is included

CA-89DS Cable Provides VBAT and Flashbus connections to mobile device

CA-99PS Adapter CA-99PS adapter, 3.5 jack to 5.5 plug.

PCS-1 Power cable The PCS-1 power cable (DC) is used with a docking station, a module

XRS-6 RF cable The RF cable is used to connect, for example, a module repair jig to

Service concepts

POS (Point of Sale) flash concept

Flashing, certificate restore and product code change

Flashing, certificate restore, product code change and EM calibration

BB and RF tuning

Baseband Troubleshooting

Introduction to BB Troubleshooting

Non re-workable Baseband Components

Baseband main troubleshooting

Phone does not power on

Power supply troubleshooting

Clocking system troubleshooting

Flash programming troubleshootin

Main memory troubleshooting

Charging troubleshooting

SIM card troubleshooting

Dual SIM troubleshooting

USB troubleshooting

User interface troubleshooting

Keyboard troubleshooting

Display troubleshooting

Backlight troubleshooting

Camera interface troubleshooting

Camera troubleshooting instructions

No valid data from Camera interface IC

Audio troubleshooting

Audio troubleshooting test instructions

Internal microphone troubleshooting

Internal earpiece troubleshooting

IHF speaker troubleshooting

External microphone troubleshooting

Headset speaker troubleshooting

FM radio troubleshooting

FM radio troubleshooting

Memory card troubleshooting

Cannot detect memory card

Baseband manual tuning guide

Certificate restoring BB5

Energy management calibration