Nokia 7360, RM-127 RF Description and Troubleshooting

Nokia Customer Care

7 - System Module

Issue 1 11/2005 COMPANY CONFIDENTIAL
Copyright © 2005 Nokia. All Rights Reserved.
RM-127
Nokia Customer Care 7 - System Module
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RM-127 7 - System Module Nokia Customer Care
Table of Contents
Page No
Glossary of Terms............................................................................................... 7
Baseband...........................................................................................................10
Block diagram .................................................................................................. 11
Environmental Specifications.......................................................................... 13
Absolute maximum ratings............................................................................... 13
Temperature conditions................................................................................... 13
Humidity and water resistance......................................................................... 13
Frequencies in baseband................................................................................. 14
PWB................................................................................................................. 14
Characteristics of the PWB ............................................................................14
Key components ............................................................................................14
Technical Specifications .................................................................................. 16
Baseband core................................................................................................. 16
UPP ................................................................................................................16
UEMEK ..........................................................................................................16
External SRAM and flash ...............................................................................16
Energy management........................................................................................ 17
Modes of operation ........................................................................................17
No Supply ......................................................................................................17
Backup ...........................................................................................................17
Acting Dead ...................................................................................................17
Active .............................................................................................................17
Sleep Mode ....................................................................................................18
Charging ........................................................................................................18
Power distribution ............................................................................................ 18
DC characteristics............................................................................................ 19
Supply voltage ranges ...................................................................................19
Baseband regulators ......................................................................................20
Function Groups ............................................................................................... 21
Battery.............................................................................................................. 21
Audio................................................................................................................ 21
Internal microphone ....................................................................................... 21
Internal speaker ............................................................................................. 22
IHF speaker ...................................................................................................23
External audio ................................................................................................23
External microphone connection ....................................................................23
Headset connections .....................................................................................23
Test possibilities .............................................................................................23
Camera............................................................................................................ 23
Key features ...................................................................................................24
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Specifications .................................................................................................25
CCP bus .........................................................................................................25
CCI bus ..........................................................................................................25
UIF bus ..........................................................................................................26
Clocks ............................................................................................................26
Test possibility ...............................................................................................26
Vibra................................................................................................................. 26
Test possibility ...............................................................................................26
LCD module..................................................................................................... 26
Characteristics ...............................................................................................27
LCD connector ............................................................................................... 28
Test possibility ...............................................................................................29
Keypad............................................................................................................. 29
Test possibility ...............................................................................................29
Illumination....................................................................................................... 30
Test possibility ...............................................................................................30
SIM................................................................................................................... 30
Test possibility ...............................................................................................31
FM radio........................................................................................................... 31
Function .........................................................................................................32
Test Possibility ............................................................................................... 32
IR Module......................................................................................................... 32
Interfaces ...........................................................................................................34
BB-RF interface ............................................................................................... 34
System connector interface ............................................................................. 34
System connector ..........................................................................................34
ACI .................................................................................................................35
FBUS .............................................................................................................35
VOUT .............................................................................................................35
DC plug .......................................................................................................... 36
Component Placement Hints ...........................................................................37
Power switch (S2419)...................................................................................... 38
Helgo RF-chip (N7500).................................................................................... 38
Camera socket (X1470)................................................................................... 39
Hardware accelerator (D1470)......................................................................... 39
UEM (D2800)................................................................................................... 40
Flash (D3000) .................................................................................................. 40
SIM card reader (X2700) ................................................................................. 40
System connector (X2002) .............................................................................. 40
UEM (D2200)................................................................................................... 41
Battery connector (X2000)............................................................................... 41
Label placement............................................................................................... 42
RF Module Description.....................................................................................43
General specifications of the transceiver......................................................... 44
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RM-127 7 - System Module Nokia Customer Care
Frequency concept .......................................................................................... 45
RF power supply configuration ........................................................................ 45
RF block diagram............................................................................................. 46
Antenna switch (TX/RX switch)........................................................................ 47
Receiver .........................................................................................................48
Transmitter .....................................................................................................48
Frequency synthesizer ...................................................................................48
Signal paths..................................................................................................... 49
Receiver signal paths .....................................................................................49
Transmitter signal paths .................................................................................51
Frequency synthesizer signals .......................................................................52
Printed Wiring Board ........................................................................................ 53
RF key component placement ......................................................................... 54
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Nokia Customer Care 7 - System Module
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RM-127 7 - System Module Nokia Customer Care

Glossary of Terms

ACI Accessory Control Interface ADC Analogue to Digital Converter AFC Automatic Frequency Control ASIC Application Specific Integrated Circuit ASM Antenna switch module BB Baseband BSI Battery Size Indicator DCT4 Digital Core Technology, generation 4 DSP Digital Signal Processor DUT Device under test EDGE Enhanced Data Rates for Global Evolution EGPRS Enhanced General Packed Radio Service EMC Electro Magnetic Compatibility ESD Electro Static Discharge FC Functional Cover FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packed Radio Service GSM Global System for Mobile Communication GSM900 GSM900 (channels 1 - 124)+extended GSM900
(channels 975 - 1023, 0) HSCSD High Speed Circuit Switched Data HW Hardware IF Interface IHF Integrated Hands Free
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Nokia Customer Care 7 - System Module
IMEI International Mobile Equipment Identity I/O Input/Output IR Infrared IrDA Infrared Data Association LCD Liquid Crystal Display LED Light Emitting Diode LDO Low Drop Out LNA Low Noise Amplifier LO Local Oscillator MCU Micro Controller Unit PA Power Amplifier Phoenix SW tool of DCT4 PLL Phase Locked Loop PWB Printed Wired Board RF Radio Frequency RTC Real Time Clock RX Receiver SA Spectrum analyzer SIM Subscriber Identification Module SW Software TP Test point TX Transmitter UEMEK Universal Energy Management ASIC enhanced version UI User Interface UPP Universal Phone Processor USB Universal Serial Bus
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RM-127 7 - System Module Nokia Customer Care
VBU
<COFF>
Back-up Battery Cut Off voltage (typical: 2.0 V)
VCO Voltage controlled oscillator VCTCXO Voltage controlled temperature compensated oscillator V
<MSTR+>
Master Reset Threshold (typical: 2.1 V)
8-PSK Phase Shift Keying with 8 states (Modulation scheme for EDGE/
EGPRS)
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Baseband

The RM-127 product is a DCT4.5 Fashion segment phone. It is a triple band EGSM900/ GSM1800/GSM1900 phone.
The HW has the following features:
GPRS and HSCSD with EDGE in up to (2RX + 2TX) (MCS5), without EDGE also in (3RX + 1TX) (MCS6)
DCT4 with AMR and 16 MIDI tones
128/16 Mbit combo memory
Active display with 64k colours
Battery BL-5B
PopPort
5-way navigation key with select
TM
interface
•VGA camera
•Vibra
•IHF
FM radio
IR module
Back-up battery
The RM-127 BB is based on the DCT4/4.5 engine and is compatible to the PopPort sories. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Universal Energy Management IC including voltage regulators, charge control and audio circuit s, audio IHF am­plifier from DCT4.5) and the UPP (Universal Phone Processor including MCU, DSP and RAM from DCT4).
TM
acces-
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Block diagram

Figure 1: Baseband block diagram
VV
Camera
LCD
ctive TFD colour
LED drivers
Battery
BL-5B
Backup bat
SIM
RF Interface
FLASH
128 Mbit
SRAM
16 Mbit
UEMEK
UPP8M
Keyboard
Keyboard
Illumination
VIBRA
IR Int
IHF
Charger
DC ack
System connector
Pop-Port
FM-Radio
UEMEK supplies both baseband and RF with power via built in voltage regulators, which are connected to the battery . The RF pa rts use mainly 2.78 V and the baseband p arts 1.8V I/O volt­age. The UPP core is supplied with programmable core voltage of 1.0V, 1.3V or 1.5V . UEMEK includes 7 linear LDO (Low Drop-Out) regulators for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. The UEMEK is furthermore supplying the SIM interface with a programmable voltage of 1.8V or 3V.
Note: 5V SIM cards are no longer supported by DCT-4 generation baseband.
UPP operates from a 26 MHz clock coming from the RF ASIC Helgo. The clock signal is divided by two down to the nominal system clock frequency of 13 MHz. The DSP and MCU contain PLLs, which can multiply the system clock to a higher frequency.
A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz clock supply as the sleep clock.
The communication between UEMEK and UPP is implemented using two bi-directional serial busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of 1 MHz. The DBUS is controlled by the MCU and operates at a speed of 13 MHz. Both processors are located in the UPP.
Issue 1 11/2005 COMPANY CONFIDENTIAL 11
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Nokia Customer Care 7 - System Module
The UEMEK ASIC handles the analog interface between the Baseband and the RF section. UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEMEK supplies the analog TXC and AFC sign als to the RF section according to UPP signal control. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC.
UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and the analog parts are ru nning from t he analo g supply 2.78V. Also VBAT is directly used (vi­bra, LED-driver, camera regulator, FCI).
The baseband supports both internal and external microphone inputs and speaker outputs. Keypad tones, DTMF , and other audio tones are generated and encoded by the UPP and trans­mitted to the UEMEK for decoding. An external vibra alert control signals are generated by the UEMEK with separate PWM outputs.
EMC shielding is implemented using a soldered shielding, RF cans and PWB grounding.
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Environmental Specifications

Absolute maximum ratings

Table 1: Absolute maximum ratings
Signal Note
Battery Voltage (Idle) -0.3…5.5V Battery Voltage (Call) Max 4.8V Charger Input Voltage -0.3V …16V

Temperature conditions

Table 2: Temperature conditions
Condition Min Max
Normal operating temperature -10°C+55°C Reduced functionality -25°C+75°C Storage -40°C+85°C

Humidity and water resistance

Table 3: Humidity conditions
Condition Min Max
Relative Humidity 5% 95%
The module is not protected against water.
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Frequencies in baseband

Table 4: Frequencies in baseband
Frequency Context UPP UEMEK Flash SIM Comment
32 kHz SleepClk X 1 MHz CBUS X X Up to 1 MHz RFConvClk X X Estimation 6,5 MHz Display IF X 3,25 MHz SIMIF X X Min 13 MHz DBUS, RFBUClk X X 26 MHz RF Clk X 52 MHz Memory Clock X X
PWB

Characteristics of the PWB

•Single PWB
8 layer board
Double side assembled

Key components

Figure 2: Key components
HW Accelerator D2800 UPP D2200 UEMEK D3000 Combo
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6158 FM radio
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RM-127 7 - System Module Nokia Customer Care
Table 5: Key components
Position Component Name
D1470 HW Accelerator D2800 UPP8M v4.2E D2200 UEMEKv2.0 D3000 Combo Memory (128M NOR + 16M UTRAM) N6158 FM radio
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Nokia Customer Care 7 - System Module

Technical Specifications

Baseband core

UPP
Main characteristics of the used UPP are:
DSP, LEAD3 16 bit DSP core 32 bit IF max. 200 MHz
MCU based on ARM7 RISC MCU core max 50 MHz
Internal 8 Mbit SRAM (PDRAM)
General purpose UARTS
SIM card interface
Accessory interface (ACI)
Interface control for Keypad, LCD, Audio and UEM control
Handling of BB-RF Interface

UEMEK

Main characteristics of the used UEMEK are:
ACI support
Audio codec
11 channel A/D converter
Auxiliary A/D converter
32 KHz crystal oscillator
SIM interface and drivers
Security logic
Storage of IMEI code
Buzzer and vibra motor PWM drivers
2 LED drivers, keyboard and display backlight drivers
Voltage reference for analogue blocks
Charging function
Baseband regulators
RF regulators
RF interface converters

External SRAM and flash

The combo memory is a multi chip package memory which combines 128 Mbit (8Mx16) muxed burst multibank flash and 16 Mbit muxed CMOS PSRAM (Pseudo SRAM: DRAM with SRAM interface).
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The combo is supplied by single 1,8 V for read, write and erase operations. For accelerated flash programming, Vpp = 9.0 V has to be applied to VPP input of the combo device.
The combo memory is housed in a 44-ball FBGA.

Energy management

The energy management of RM-127 is based on BB 4.0 architecture. A so-called semi fixed battery (BL-5B) supplies power primarily to UEMEK ASIC and the RF P A. The UEMEK includes several regulators to supply RF and baseband. It provides energy management inclu ding pow­er up/down procedure. (If the main battery is not present, a cell capacitor maintains backup power supply for the RTC part of UEMEK.)

Modes of operation

The baseband engine has six different functional modes: Since the UEMEK controls the regu­lated power distribution; each of these states affects the general functionality of the phone.
1. No supply
2. Backup
3. Acting Dead
4. Active
5. Sleep
6. Charging

No Supply

In NO_SUPPLY mode, the phone has no supply volt age. This mode is due to the disconnection of the main battery and backup battery or low battery voltage level in both of the batteries.
The phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. The battery voltage can rise either by connecting a new battery with VBA T > V necting charger and charging the battery above V
MSTR+
.
MSTR+
or by con-

Backup

In BACKUP mode the backup battery has suf ficient charge but the main battery can be discon- nected or empty (VBAT < V
and VBACK > VBU
MSTR
COFF
).
The VRTC regulator is disabled in BACKUP mode. VRTC output is supp lied without regulation from the backup battery (VBACK). All the other regulators are disabled.

Acting Dead

If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery-charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.

Active

In Active mode, the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.
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