Nokia RH-37 Service Manual

Nokia Customer Care

RH-37 Series Transceivers

7 - System Module

Issue 1 07/04 © 2004 Nokia Corporation Page 1

Company Confidential

RH-37

System Module Nokia Customer Care

[This page left intentionally blank]

Page 2 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Table of Contents

Page No

Glossary of Terms..................................................................................................................................... 7

Baseband................................................................................................................................................. 10

Block diagram ......................................................................................................................................11

Environmental Specifications............................................................................................................ 13

Absolute maximum ratings ..............................................................................................................13

Temperature conditions ....................................................................................................................13

Humidity and water resistance ......................................................................................................13

Frequencies in baseband ..................................................................................................................14

PWB ........................................................................................................................................................14

Characteristics of the PWB.......................................................................................................... 14

Key components.............................................................................................................................. 14

Technical Specifications ..................................................................................................................... 16

Baseband core .....................................................................................................................................16

UPP...................................................................................................................................................... 16

UEMEK ............................................................................................................................................... 16

External SRAM and Flash ............................................................................................................. 17

Energy management ..........................................................................................................................17

Modes of operation........................................................................................................................ 17

No Supply.......................................................................................................................................... 18

Backup ............................................................................................................................................... 18

Acting Dead...................................................................................................................................... 18

Active ................................................................................................................................................. 18

Sleep Mode....................................................................................................................................... 19

Charging............................................................................................................................................ 19

Power distribution ..............................................................................................................................19

DC characteristics ..............................................................................................................................20

Supply voltage ranges ................................................................................................................... 20

Baseband regulators ...................................................................................................................... 21

Function Groups................................................................................................................

Battery ...................................................................................................................................................22

Audio ......................................................................................................................................................22

Internal microphone ...................................................................................................................... 22

Internal speaker............................................................................................................................... 23

IHF speaker ....................................................................................................................................... 23

External audio.................................................................................................................................. 24

External microphone connection ............................................................................................... 24

Headset connections...................................................................................................................... 24

Test possibilities .............................................................................................................................. 24

Camera ..................................................................................................................................................24

Key features...................................................................................................................................... 25

Specifications................................................................................................................................... 26

CCP bus.............................................................................................................................................. 26

CCI bus............................................................................................................................................... 26

UIF bus ............................................................................................................................................... 27

Clocks ................................................................................................................................................. 27

Test possibility ................................................................................................................................. 27

Vibra .......................................................................................................................................................27

.................... 22

Issue 1 07/04 ©Nokia Corporation Page 3

RH-37

System Module Nokia Customer Care

Test possibility ................................................................................................................................. 27

FCI ...........................................................................................................................................................27

Function............................................................................................................................................. 28

Test possibility ................................................................................................................................. 29

LCD module ..........................................................................................................................................29

Characteristics................................................................................................................................. 30

LCD connector ................................................................................................................................. 31

Test possibility ................................................................................................................................. 32

Keypad ...................................................................................................................................................32

Test possibility ................................................................................................................................. 32

Illumination ..........................................................................................................................................33

Test possibility ................................................................................................................................. 34

XPress on grip LEDs ............................................................................................................................34

Test possibility ................................................................................................................................. 34

SIM .........................................................................................................................................................35

Test possibility ................................................................................................................................. 35

Interfaces ................................................................................................................................................ 36

BB-RF interface ...................................................................................................................................36

System connector interface .............................................................................................................36

System connector ........................................................................................................................... 36

ACI....................................................................................................................................................... 38

FBUS ................................................................................................................................................... 38

VOUT................................................................................................................................................... 39

DC plug .............................................................................................................................................. 39

Component Placement Hints............................................................................................................. 40

Power switch (S2419) .......................................................................................................................40

Helgo RF-chip (N7500) .....................................................................................................................41

Camera socket (X1470) .....................................................................................................................42

Hardware accelerator (D1470) .......................................................................................................42

UEM (D2800) .......................................................................................................................................43

Flash (D3000) .......................................................................................................................................43

SIM card reader (X2700) ..................................................................................................................43

System connector (X2002) ...............................................................................................................43

UEM (D2200) .......................................................................................................................................44

Battery connector (X2000) ..............................................................................................................45

X-press on grip LED’s (V2402, V2403, V2404, V2405, V2406, V2407) ...............................45

Label placement ..................................................................................................................................46

RF Module Description........................................................................................................................ 47

General specifications of the transceiver ....................................................................................48

Frequency concept .............................................................................................................................48

RF power supply configuration .......................................................................................................49

RF block diagram ................................................................................................................................50

Antenna switch (TX/RX switch) ......................................................................................................51

Receiver ............................................................................................................................................. 52

Transmitter ....................................................................................................................................... 52

Frequency synthesizer ................................................................................................................... 52

Signal paths .........................................................................................................................................53

Receiver signal paths..................................................................................................................... 53

Page 4 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Transmitter signal paths............................................................................................................... 55

Frequency synthesizer signals..................................................................................................... 56

Printed Wired Board ............................................................................................................................ 57

RF key component placement .........................................................................................................58

Appendix 7A: Differentiation between RH-37 and RH-49 ............................................. 61

Differentiation between 900 MHz and 850 MHz (US) version (RH-37 vs. RH-49)........... 62

Antenna radiator (I039) and deco foil (I041) .............................................................................62

RF components ....................................................................................................................................62

MCU-SW ................................................................................................................................................. 65

Tuning ....................................................................................................................................................65

Flash exchange...................................................................................................................................... 66

Tuning and testing.......................................................................................................................... 67

Power Amplifier / Antenna Switch Exchange............................................................................... 69

Issue 1 07/04 ©Nokia Corporation Page 5

RH-37

System Module Nokia Customer Care

[This page left intentionally blank]

Page 6 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Glossary of Terms

ACI Accessory Control Interface

ADC Analogue to Digital Converter

AFC Automatic Frequency Control

ASIC Application Specific Integrated Circuit

ASM Antenna switch module

BB Baseband

BSI Battery Size Indicator

DCT4 Digital Core Technology, generation 4

DSP Digital Signal Processor

DUT Device under test

EDGE Enhanced Data Rates for Global Evolution

EGPRS Enhanced General Packed Radio Service

EMC Electro Magnetic Compatibility

ESD Electro Static Discharge

FC Functional Cover

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPRS General Packed Radio Service

GSM Global System for Mobile Communication

GSM900 GSM900 (channels 1 - 124)+extended GSM900 (channels 975 - 1023, 0)

HSCSD High Speed Circuit Switched Data

HW Hardware

IF Interface

IHF Integrated Hands Free

Issue 1 07/04 ©Nokia Corporation Page 7

RH-37

System Module Nokia Customer Care

IMEI International Mobile Equipment Identity

I/O Input/Output

IR Infrared

IrDA Infrared Data Association

LCD Liquid Crystal Display

LED Light Emitting Diode

LDO Low Drop Out

LNA Low Noise Amplifier

LO Local Oscillator

MCU Micro Controller Unit

PA Power Amplifier

Phoenix SW tool of DCT4

PLL Phase Locked Loop

PWB Printed Wired Board

RF Radio Frequency

RTC Real Time Clock

RX Receiver

SA Spectrum analyzer

SIM Subscriber Identification Module

SW Software

TP Test point

TX Transmitter

UEMEK Universal Energy Management ASIC enhanced version

UI User Interface

Page 8 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

UPP Universal Phone Processor

USB Universal Serial Bus

VBU

<COFF>

Back-up Battery Cut Off voltage (typical: 2.0 V)

VCO Voltage controlled oscillator

VCTCXO Voltage controlled temperature compensated oscillator

V

<MSTR+>

Master Reset Threshold (typical: 2.1 V)

8-PSK Phase Shift Keying with 8 states (Modulation scheme for EDGE/EGPRS)

Issue 1 07/04 ©Nokia Corporation Page 9

RH-37

System Module Nokia Customer Care

Baseband

The RH-37 product is a DCT4.5 Expression segment phone. There are two variants: An
EGSM900/GSM1800/GSM1900 phone and a US variant, RH 49, with GSM850/1800/

1900.

The HW has the following features:

• GPRS and HSCSD with EDGE in up to (2RX + 2TX) (MCS5), without EDGE also in
(3RX + 1TX) (MCS6)

• DCT4 with AMR and 16 MIDI tones

• 128/16 Mbit Combo memory

• Amazon Active display with 64k colours

•Battery BL-5B

• Illuminated XPress on grips

• PopPortTM interface

• 5-way navigation key with select

• FCI rear side (C-cover)

•VGA Camera

•Vibra

•IHF

TM

The RH-37 BB is based on the DCT4/4.5 engine and is compatible to the PopPort
accessories. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Universal
Energy Management IC including voltage regulators, charge control and audio circuits,
audio IFH amplifier from DCT4.5) and the UPP (Universal Phone Processor including MCU,
DSP and RAM from DCT4).

Page 10 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Block diagram

Figure 1: Baseband block diagram

UEMEK supplies both baseband and RF with power via built in voltage regulators, which
are connected to the battery. The RF parts use mainly 2.78 V and the baseband parts 1.8V
I/O voltage. The UPP core is supplied with programmable core voltage of 1.0V, 1.3V or

1.5V. UEMEK includes 7 linear LDO (Low Drop-Out) regulators for baseband and 7 regula­tors for RF. It also includes 4 current sources for biasing purposes and internal usage. The
UEMEK is furthermore supplying the SIM interface with a programmable voltage of 1.8V
or 3V.

Note: 5V SIM cards are no longer supported by DCT-4 generation Baseband.

UPP operates from a 26 MHz clock coming from the RF ASIC Helgo. The clock signal is
divided by two down to the nominal system clock frequency of 13 MHz. The DSP and
MCU contain PLLs, which can multiply the system clock to a higher frequency.

A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz
clock supply as the sleep clock.

The communication between UEMEK and UPP is implemented using two bi-directional
serial busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a

Issue 1 07/04 ©Nokia Corporation Page 11

RH-37

System Module Nokia Customer Care

speed of 1 MHz. The DBUS is controlled by the MCU and operates at a speed of 13 MHz.
Both processors are located in the UPP.

The UEMEK ASIC handles the analog interface between the Baseband and the RF section.
UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and
transmit signal paths and also A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEMEK supplies the analog TXC and
AFC signals to the RF section according to UPP signal control. There are also separate
signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP
ASIC.

UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply

1.8V and the analog parts are running from the analog supply 2.78V. Also VBAT is
directly used (Vibra, LED-driver, Camera Regulator, FCI).

The Baseband supports both internal and external microphone inputs and speaker out­puts. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP
and transmitted to the UEMEK for decoding. An external vibra alert control signals are
generated by the UEMEK with separate PWM outputs.

EMC shielding is implemented using a soldered shielding, RF cans and PWB grounding.

Page 12 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Environmental Specifications

Absolute maximum ratings

Table 1: Absolute maximum ratings

Signal Note

Battery Voltage (Idle) -0.3…5.5V

Battery Voltage (Call) Max 4.8V

Charger Input Voltage -0.3V …16V

Temperature conditions

Table 2: Temperature conditions

Condition Min Max

Normal operating temperature -10°C+55°C

Reduced functionality -25°C+75°C

Storage -40°C+85°C

Humidity and water resistance

Table 3: Humidity conditions

Condition Min Max

Relative Humidity 5%

C

The module is not protected against water.

95%

Issue 1 07/04 ©Nokia Corporation Page 13

RH-37

System Module Nokia Customer Care

Frequencies in baseband

Table 4: Frequencies in baseband

Frequency Context UPP UEMEK Flash SIM Comment

100 kHz FCI X X

32 kHz SleepClk X

1 MHz CBUS X X

Up to 1 MHz RFConvClk X X Estimation

6,5 MHz Display IF X

3,25 MHz SIMIF X X Min

13 MHz DBUS, RFBUClik X X

26 MHz RF Clk X

52 MHz Memory Clock X X

PWB

Characteristics of the PWB

• Single PWB

• 8 layer board

• Double side assembled

Key components

Figure 2: Key components

D1470 HW Accelerator

D2800 UPP

D2200 UEMEK

D3000 Combo

Page 14 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Table 5: Key components

Position Component Name Code

D1470 HW Accelerator 4377033

D2800 UPP8M v 3.5 4371105

D2200 UEMEKv2.0 4376371

D3000 Combo Memory (128M NOR + 16M UTRAM) 4347043

Issue 1 07/04 ©Nokia Corporation Page 15

RH-37

System Module Nokia Customer Care

Technical Specifications

Baseband core

UPP

Main characteristics of the used UPP are:

• DSP, LEAD3 16 bit DSP core 32 bit IF max. 200 MHz

• MCU based on ARM7 RISC MCU core max 50 MHz

• Internal 8 Mbit SRAM (PDRAM)

• General purpose UARTS

• SIM card interface

UEMEK

• Accessory interface (ACI)

• Interface control for Keypad, LCD, Audio and UEM control

• Handling of BB-RF Interface

Main characteristics of the used UEMEK are:

• ACI support

• Audio codec

• 11 Channel A/D converter

• Auxiliary A/D converter

• 32 KHz crystal oscillator

• SIM interface and drivers

• Security logic

• Storage of IMEI code

• Buzzer and vibra motor drivers

•PWM

• 2 LED drivers, keyboard and display backlight drivers

Page 16 ©Nokia Corporation Issue 1 07/04

RH-37

e

Nokia Customer Care System Module

• Voltage reference for analogue blocks

• Charging function

• Baseband regulators

• RF regulators

• RF interface converters

External SRAM and Flash

The Combo-Memory is a multi chip package memory which combines 128 Mbit (8Mx16)
muxed burst multibank flash and 16 Mbit muxed CMOS PSRAM (Pseudo SRAM: DRAM
with SRAM interface).

The combo is supplied by single 1,8 V for read, write and erase operations. For acceler­ated flash programming, Vpp = 9.0 V has to be applied to VPP input of the combo device.

The combo memory is housed in a 44-ball FBGA.

Energy management

The energy management of RH-37 is based on BB 4.0 architecture. A so-called semi fixed
battery (BL-5B) supplies power primarily to UEMEK ASIC and the RF PA. The UEMEK
includes several regulators to supply RF and Baseband. It provides energy management
including power up/down procedure.

2nd

1st Chip

Figure 3: Combo memory

PI

Modes of operation

The baseband engine has six different functional modes: Since the UEMEK controls the
regulated power distribution; each of these states affects the general functionality of the
phone.

1 No supply

Issue 1 07/04 ©Nokia Corporation Page 17

RH-37

System Module Nokia Customer Care

2 Backup

3Acting Dead

4Active

5 Sleep

6 Charging

No Supply

In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the discon­nection of the main battery and backup battery or low battery voltage level in both of
the batteries.

The phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is
detected. The battery voltage can rise either by connecting a new battery with VBAT >

V

or by connecting charger and charging the battery above V

MSTR+

MSTR+

.

Backup

In BACKUP mode the backup battery has sufficient charge but the main battery can be
disconnected or empty (VBAT < V

The VRTC regulator is disabled in BACKUP mode. VRTC output is supplied without regula­tion from the backup battery (VBACK). All the other regulators are disabled.

BACKUP mode is not used in RH-37 since the product has no backup battery.

Acting Dead

If the phone is off when the charger is connected, the phone is powered on but enters a
state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A bat­tery-charging alert is given and/or a battery charging indication on the display is shown
to acknowledge the user that the battery is being charged.

Active

In the Active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. There are several sub-states in
the active mode depending on if the phone is in burst reception, burst transmission, if
DSP is working etc.

and VBACK > VBU

MSTR

COFF

).

In Active mode the RF regulators are controlled by SW writing into UEMEK´s registers
wanted settings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and
its output voltage can be programmed to be 2.78V or 3.3V. VR4-VR7 can be enabled, dis­abled, or forced into the low quiescent current mode. VR3 is always enabled in Active
mode.

Page 18 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Sleep Mode

Sleep mode is entered when both MCU and DSP are in stand–by mode. Both processors
control the sleep mode. When SLEEPX signal (low) is detected UEMEK enters SLEEP
mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All
the RF regulators are off in SLEEP. When SLEEPX=1 detected UEMEK enters ACTIVE mode
and all functions are activated.

The sleep mode is exited either by the expiration of a sleep clock counter in the UEMEK
or by some external interrupt, generated by a charger connection, key press, headset
connection etc.

In the sleep mode, VCTCXO is shut down and 32 kHz sleep clock oscillator is used as ref­erence clock for the Baseband.

Charging

In RH-37, the battery type/size is indicated by a BSI-resistor. The resistor value corre­sponds to a specific battery capacity. Also BTEMP, NTC resistor, is located on an engine
board.

The battery voltage, temperature, size and current are measured by the UEMEK con­trolled by the charging software running in the UPP.

The charging control circuitry (CHACON) inside the UEMEK controls the charging current
delivered from the charger to the battery. The battery voltage rise is limited by turning
the UEMEK switch off when the battery voltage has reached 4.2 V. Charging current is
monitored by measuring the voltage drop across a 220 mΩ resistor.

Power distribution

Under normal conditions, the battery powers the baseband module. Individual regulators
located within the UEMEK regulate the battery voltage VBAT. These regulators supply the
different parts of the phone. 7 regulators are dedicated to the RF module and 7 to the
baseband module.

The VSIM regulator is able to deliver both 1,8V and 3,0 V DC and thus supporting two
different SIM technologies.

The regulator VCORE is likewise adjustable by the MCU. VCORE supplies the core logic of
the UPP.

The system connector provides a voltage to supply accessories.

The white LEDs need a higher voltage supply than the battery can supply and are fed by a
separate external voltage regulator.

VBAT is directly distributed to the RF power amplifier, FCI and external baseband regula­tors.

Issue 1 07/04 ©Nokia Corporation Page 19

RH-37

y

System Module Nokia Customer Care

Figure 4: Power Distribution Diagram

CAMERA

LCD

LEDs

White LED
Driver

Battery

Baseband

UEME

RF Regulators

VFLASH1
VAUX3

VLED+

Baseband

RTC

VBAT

PA Supply

Regulators

VAUX2

CHACON

Vout

System Connector

VR1A
VR1B

VR2-7

VSIM

VCORE

VANA

VIO

VFLASH1

VBAT

To RF Part s

6

FCI

SIM

UPP

Combo

Memor

DC characteristics

Supply voltage ranges

Table 6: Battery voltage ranges

Signal Min Nom Max Note

VBAT 3.1V 3.7V 4.2V 3.2V SW cut off

2.95V HW power off

Page 20 ©Nokia Corporation Issue 1 07/04

RH-37

Nokia Customer Care System Module

Baseband regulators

Table 7: Regulator specification

Regulator Load current (mA) Limit (V) Min/Max (Typ)

VCORE 200 1.476 / 1.65 (1.57)

VIO 150 1.72 / 1.88 (1.8)

VSIM1 25 1.745 / 1.855 (1.8)

VANA 80 2.70 / 2.86 (2.78)

VFLASH1 70 2.70 / 2.86 (2.78)

VAUX2 70 2.70 / 2.86 (2.78)

VAUX3 10 2.70 / 2.86 (2.78)

VR2 100 2.70 / 2.86 (2.78)

VR3 20 2.70 / 2.86 (2.78)

VR4 50 2.70 / 2.86 (2.78)

VR5 50 2.70 / 2.86 (2.78)

VR6 50 2.70 / 2.86 (2.78)

VR7 45 2.70 / 2.86 (2.78)

VR1A 5* 4.6 / 4.9 (4.75)

VR1B 5* 4.6 / 4.9 (4.75)

* When both enabled. Load current is 10 mA if other is disabled.

Note: This list shows the band regulators only. Please see other descriptions in the Glossary of Terms
and in the dedicated sections.

Issue 1 07/04 ©Nokia Corporation Page 21