Nokia CardPhone2 System Module 03
PAMS Technical Documentation
RPM-1 Series Transceivers
System Module
Issue 1 12/99 Nokia Mobile Phones Ltd.
RPM-1
System Module
PAMS Technical Documentation
AMENDMENT RECORD SHEET
Amendment
Number
Date Inserted By Comments
12/99 OJuntune Issue 1
Page 2
Nokia Mobile Phones Ltd.
Issue 1 12/99
PAMS Technical Documentation
CONTENTS
List of Schematic Diagrams 5. . . . . . . . . . . . . . . . . . . . . . . . . .
Glossary of Terms 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Assembly 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF/System Module GX9 8. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bottom Cover Subassembly 8. . . . . . . . . . . . . . . . . . . . . . . . .
Extension Box Subassembly 8. . . . . . . . . . . . . . . . . . . . . . . . .
Top Cover Subassembly 8. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interconnection Diagram 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Description 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Diagram 9. . . . . . . . . . . . . . . . . . . . . . . . . .
PCMCIA Interface 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCMCIA Connector 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Interface 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Connector 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna or RF Connector 17. . . . . . . . . . . . . . . . . . . . . . . . . . .
Headset or Analog Audio Interface 17. . . . . . . . . . . . . . . . . . .
Headset Connector 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of Operation 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Standard PCMCIA mode 20. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Vertical (i.e. non–PCMCIA) mode 20. . . . . . . . . . . . . . . . . . . .
Maximum Ratings 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RPM-1
System Module
Page No
Introduction to baseband 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power up 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power–Up in PCMCIA mode 25. . . . . . . . . . . . . . . . . . . . . . . . .
Power–Up in non–PCMCIA mode 26. . . . . . . . . . . . . . . . . . . .
Power down 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Card Temperature Measurement 29. . . . . . . . . . . . . . . . . . . . . . .
Audio Control 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog audio 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Control 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memories 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Memory 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SRAM Memory 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Nokia Mobile Phones Ltd.
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RPM-1
System Module
Sleep Mode 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction to RF Section 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagrams 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF frequency plan 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF characteristics 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GSM part 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GSM transmitter characteristics 35. . . . . . . . . . . . . . . . . . . . . .
GSM receiver characteristics 35. . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 part 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 Transmitter characteristics 36. . . . . . . . . . . . . . . . .
DCS1800 receiver characteristics 36. . . . . . . . . . . . . . . . . . . .
Functional descriptions 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF block diagram 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency synthesizers 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizer block diagram 40. . . . . . . . . . . . . . . . . . . . . . . .
Receivers 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GSM frontend 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 frontend 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Common receiver parts for GSM and DCS 1800 41. . . . . . .
RX interstage filter 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GSM UHF–mixer in CRFU3 42. . . . . . . . . . . . . . . . . . . . . . .
DCS1800 receiver frontend 43. . . . . . . . . . . . . . . . . . . . . . . . . .
Pre LNA filter 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 LNA in CRFU3 44. . . . . . . . . . . . . . . . . . . . . . . . .
RX interstage filter 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 UHF mixer 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
193 MHz filter for DCS1800 1st IF 45. . . . . . . . . . . . . . . . . .
DCS1800 VHF mixer 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Common parts of the receiver 46. . . . . . . . . . . . . . . . . . . . . . . . . .
73 MHz IF–filter 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AGC–stage and 13 MHz mixer in SUMMA 46. . . . . . . . . .
13MHz IF–filter 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13 MHz buffer in SUMMA 47. . . . . . . . . . . . . . . . . . . . . . . . .
Transmitters 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GSM transmitter 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 transmitter 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter power control for GSM and DCS1800 49. . . . . .
TX blocks for GSM and DCS1800 in SUMMA 50. . . . . . . . . .
Transmitter section in SUMMA 50. . . . . . . . . . . . . . . . . . . .
GSM TX part 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
120 MHz LC TX IF–filter 51. . . . . . . . . . . . . . . . . . . . . . . . . .
GSM upconversion mixer in CRFU3 51. . . . . . . . . . . . . . . .
GSM TX interstage filter 52. . . . . . . . . . . . . . . . . . . . . . . . . .
Power amplifier module for GSM 52. . . . . . . . . . . . . . . . . . .
PAMS Technical Documentation
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Issue 1 12/99
PAMS Technical Documentation
DCS 1800 TX part 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
240 MHz SAW TX IF–filter 53. . . . . . . . . . . . . . . . . . . . . . . .
DCS1800 upconversion mixer in CRFU3 53. . . . . . . . . . . .
1’st DCS 1800 TX interstage filter 54. . . . . . . . . . . . . . . . . .
Tx buffer amplifier for DCS 1800 55. . . . . . . . . . . . . . . . . . .
2’nd DCS 1800 TX interstage filter 55. . . . . . . . . . . . . . . . .
Power amplifier for DCS 1800 56. . . . . . . . . . . . . . . . . . . . .
Power control parts 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Directional coupler for GSM and DCS 1800 56. . . . . . . . .
Power detector for GSM and DCS1800 56. . . . . . . . . . . . .
Power control section in SUMMA 56. . . . . . . . . . . . . . . . . .
Synthesizer blocks 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCTCXO, reference oscillator 57. . . . . . . . . . . . . . . . . . . . . . . .
VHF PLL 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VHF VCO 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHF PLL section 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHF VCO module 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHF local signal input and divider in CRFU3 60. . . . . . . . . . .
UHF LO signal input for GSM 60. . . . . . . . . . . . . . . . . . . . . . . .
Antenna 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna Connector 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF–Baseband interface 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RPM-1
System Module
Timings 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizer control timings 66. . . . . . . . . . . . . . . . . . . . . . . . . .
Startup timing 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Band change / monitoring on different band 67. . . . . . . . . . . .
Frequency hop between RX and TX 67. . . . . . . . . . . . . . . .
Transmitter power switching timing diagrams 68. . . . . . . . . . . . .
TX power switching for normal burst 68. . . . . . . . . . . . . . . . . .
Transmitter power switching for dual slot mode 68. . . . . . . . .
DCS1800 Rx/Tx switch timing 69. . . . . . . . . . . . . . . . . . . . . . . . . .
Unconnected Pins of BB ASICs 70. . . . . . . . . . . . . . . . . . . . . . . .
Parts Lists 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF/System Module GX9 (0201215) 72. . . . . . . . . . . . . . . . . . . . .
List of Schematic Diagrams
Block Diagram of Baseband GX9 v.09 ed 31 A–1. . . . . . . . . . . . . . . .
Block Diagram of RF block GX9 v.09 ed.71 A–2. . . . . . . . . . . . . . . . .
Page No
Circuit Diagram of Audio (Version 0.0 Edit 67)
for layout version 09 A–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of CPU Block (Version 0.0 Edit 73)
for layout version 09 A–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Nokia Mobile Phones Ltd.
Page 5
RPM-1
System Module
Circuit Diagram of CRFU (Version 0.0 Edit 121)
for layout version 09 A–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of Synthesizer (Version 0.0 Edit 129)
for layout version 09 A–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of Power Supply (Version 0.0 Edit 85)
for layout version 09 A–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of PCMCIA Connector (Version 0.0 Edit 54)
for layout version 09 A–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of RF–BB Connection (Version 0.0 Edit 89)
for layout version 09 A–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of PA (Version 0.0 Edit 102)
for layout version 09 A–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of SUMMA (Version 0.0 Edit 149)
for layout version 09 A–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAMS Technical Documentation
Layout Diagram of GX9 – Top (Version 09) A–12. . . . . . . . . . . . . . . . .
Layout Diagram of GX9 – Bottom (Version 09) A–12. . . . . . . . . . . . . .
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Issue 1 12/99
PAMS Technical Documentation
Glossary of Terms
ACCIf Accessory Interface block of MAD2WD1
ASIC Application Specific Integrated Circuit
BB Baseband
CCONT Power management IC for digital phones
CIS PCMCIA Card Information Structure
COBBA_GJP DCT3 RF–interface and audio codec ASIC
COR Configuration Option Register of PCMCIA
CSP Chip Scale Package
DB Dualband
DCS1800 Digital Cellular system at 1800 MHz
DCT3 Digital Core Technology, 3rd generation
DSP Digital Signal Processor
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
FBUS Asynchronous Full Duplex Serial Bus
GSM Global System for Mobile communications
HSCSD High Speed Circuit Switched Data
MBUS 1–wire half duplex serial bus
MCU MicroController Unit
MDI MCU–DSP Interface
MAD MCU+ASIC+DSP asic, common name for whole
MAD2PR1 Modified MAD2 asic, pin count 144 instead of 176
MAD2WD1 MCU+ASIC+DSP with HSCSD specific changes
non–PCMCIA Nokia specific operating mode
PA Transmit Power Amplifier
PC Personal Computer
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
PCMCIA PC Memory Card International Association
Powder First generation GSM Nokia Cellular Card Phone
RF Radio Frequency
SIM Subscriber Identity Module
SMART PCMCIA interface ASIC for Powder
Sulo PCMCIA interface ASIC for RPM–1
UI User Interface
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated
RPM-1
System Module
with serial MAD interface
family
(=vertical mode, =Nokia mode)
Crystal Oscillator.
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Nokia Mobile Phones Ltd.
Page 7
RPM-1
System Module
Assembly
RF/System Module GX9
The RF/System module (M1) is a 6–layer two–sided (components) PCB
with antenna clip, grounding clip, SIM–reader, PCMCIA–connector, and
RF shields. RF shields are metal cans with removable lids. Shield frames
are soldered to the PCB.
Bottom Cover Subassembly
Bottom cover subassembly consists of bottom cover (8) and saddle
adapter (7). Bottom cover is made of sheet metal. Saddle adapter is
made of plastic.
Extension Box Subassembly
PAMS Technical Documentation
Extension box subassembly consists of extension box (5), antenna insert
(4), and audio headset connector (6). Extension box is made of plastic
and the metallic antenna insert is thermally installed to the box. There is a
separate housing in the extension box for the headset connector. Headset
connector has spring contacts to the PCB pads.
Top Cover Subassembly
Top cover subassembly consists of top cover (1) and insulation foil (2).
Top cover is made of sheet metal. Insulation foil is glued inside the cover.
Antenna
The antenna (3) is removable. The actual antenna element is of PCB
type. The outer antenna mechanics (visible part) is made of plastic. The
connection to the RF module is made with the antenna clips.
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Issue 1 12/99
PAMS Technical Documentation
Interconnection Diagram
System/RF
Module
RPM-1
System Module
GX9
connectors for external signals
PCMCIA
Connector
68
Host computer
Functional Description
Circuit Description
The RPM–1 transceiver electronics consist of the Radio Module i.e. RF +
System blocks.
RF SIM
2
External
antenna
1
SIM card
Antenna
Headset
Audio
2
6
Mic
RPM–1
3 (common ground)
2
Speaker
The System blocks provide the MCU, DSP and Logic control functions in
MAD2WD1 ASIC, external memories, audio processing and RF control
hardware in COBBA_GJP ASIC. Power supply circuitry CCONT ASIC de-
livers operating voltages both for the System and the RF blocks.
The RF block is designed for a handportable phone which operates in the
GSM and DCS1800 systems. The purpose of the RF block is to receive
and demodulate the radio frequency signal from the base station and to
transmit a modulated RF signal to the base station. The SUMMA ASIC
together with an external PLL circuit is used for VHF and PLL functions.
The CRFU3 ASIC is used at the front end.
Power Distribution Diagram
The RF powering is described in the following picture. The baseband
powering concept is included in the baseband block diagram.
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Nokia Mobile Phones Ltd.
Page 9
Page 10
F
4.75 V ... 5.25 V FET switch
PCMCIA slot
RPM-1
System Module
VPAVcc
4*680uF+3*470uF tantalum capacitors
Nokia Mobile Phones Ltd.
CCONT
2 mA
VCTCXO
+Buffer
Issue 1 12/99
VXO
VR
1
VR
2
40 mA
SUMMA RX
VRX_2
VR
3
10 mA
Synthesizer
SUMMA:
VP1, VP2, VDD
VSYN_2
Pow.det.
VCOs
CRFU3:
Prescaler
UHF buffers
VR
4
40 mA
VSYN_1
VR
5
30 mA
CRFU3 &
SUMMA
RX
VRX_1
VR
6
12 mA
COBBA
ANAL.
VCOBBA
PAs
DCS: 1 A @ class 1 (50 Ohm Load)
GSM: 1.8 A @ class 4 (50 Ohm Load)
VR
VREF
7
< 10 uA
SUMMA
VREF
140mA
SUMMA & CHARGE
power detector OF PLL–IC
VTX
TXP
VXOENA
SYNPWR
RXPWR
TXPWR
V5V
PAMS Technical Documentation
0.2 mA (PLL locked)
PUMPsCRFU3 TX
VCP
PAMS Technical Documentation
Connector Name Code
PCMCIA connector 5469079
SIM connector 5409063
Headset connector 5400083
Extension box subassembly (includes antenna insert and headset connector) 9477002
System Module
PCMCIA Interface
Supply voltages and all digital activity to external hosts go through the
PCMCIA interface. This interface is handled by SULO asic. In SULO asic
the PCMCIA interface section Vccs is PCMCIA connector Vcc. It is inde-
pendent from SULO core Vcc which is regulated to 2.8V from PCMCIA
connector Vcc.
The interface has two operating modes: one for PCMCIA compliant com-
puter hosts and one for non–PCMCIA (or vertical or Nokia mode) hosts.
The PCMCIA interface has two different pinouts. First is the normal
PCMCIA pinout which conforms to the PC Card’97 standard . Second
mode is the non–PCMCIA mode in which MBUS, FBUS and PCM SIO
buses are brought to the PCMCIA connector. Also flow control signals
and RESET are routed to the connector. The PCMCIA connector pinouts
and electrical characteristics are shown in the tables on the following
pages.
RPM-1
PCMCIA Connector
The 68–pin PCMCIA connector complies with the PC Card Standard
NO TAG which specifies the pinout and the functionality and electrical
characteristics of the pins. In the non–PCMCIA mode the functionality of
the pins is changed (see the following table).
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RPM-1
System Module
PAMS Technical Documentation
The pins of the PCMCIA connector are listed below:
PCMCIA mode Non–PCMCIA mode
Pin
Signal
name
1 GND Ground. Ground
2 D3 I/O Data bit 3. DSP Sleepnote OUT
3 D4 /IO Data bit 4. RIX OUT
4 D5 I/O Data bit 5. DCDX OUT
5 D6 I/O Data bit 6. CTSX OUT
6 D7 I/O Data bit 7. PCMTxDATA OUT
7 CE1X IN Card enable 1, pulled up Pulled up
8 A10 IN nc nc
9 OEX IN Output enable, pulled up pulled up.
Dir Function
Signal
name
Function Dir
10 A11 IN nc nc
11 A9 IN nc nc
12 A8 IN Address bit 8 Not used OUT
13 A13 IN nc nc
14 A14 IN nc nc
15 WEX IN Write enable, pulled up Pulled up.
READY/
16
IREQ
17 VCC Card power. Card power.
18 VPP1 nc nc
19 A16 IN nc nc
20 A15 IN nc nc
21 A12 IN nc nc
22 A7 IN Address bit 7 FBUSTxD OUT
23 A6 IN Address bit 6 FBUSRxD IN
24 A5 IN Address bit 5 DTRX IN
25 A4 IN Address bit 4 RTSX IN
26 A3 IN Address bit 3 PCM frame sync clk IN
OUT
Ready/busy, interrupt request.
Fixed 0. OUT
27 A2 IN Address bit 2 PCM data transmit clk IN
28 A1 IN Address bit 1 PCMRxDAT A IN
29 A0 IN Address bit 0
30 D0 I/O Data bit 0.
31 D1 I/O Data bit 1 DSRX OUT
32 D2 I/O Data bit 2. MCUSleepNote OUT
WP/
33
IOIS16X
Page 12
OUT
Write protect, I/O port is 16
bits wide, connected to VCC
Nokia Mobile Phones Ltd.
MBUS (Max. 2.8V),
Pulled up.
Connected to VCC
Issue 1 12/99
IN/
OUT
PAMS Technical Documentation
Non–PCMCIA modePCMCIA mode
Pin
Pin
34 GND Ground. Ground.
35 GND Ground. Ground.
Signal
name
FunctionDir
Signal
name
RPM-1
System Module
DirFunction
36 CD1X OUT
37 D11 I/O nc nc
38 D12 I/O nc nc
39 D13 I/O nc nc
40 D14 I/O nc nc
41 D15 I/O nc nc
42 CE2X IN Card enable 2, pulled up Pulled up
43 VS1X OUT nc nc
RFU/
44
IORDX
RFU/
45
IOWRX
46 A17 IN nc nc
47 A18 IN nc nc
48 A19 IN nc nc
49 A20 IN nc nc
50 A21 IN nc nc
Card detect 1, connected to
Ground
IN I/O read strobe, pulled up Pulled up
IN I/O write strobe, pulled up Pulled up
Connected to Ground
51 VCC Card power. Card power.
52 VPP2 nc nc
53 A22 IN nc nc
54 A23 IN nc nc
55 A24 IN nc nc
56 A25 IN nc nc
57 VS2X OUT nc nc
58 RESET IN Card RESET, pulled up Card RESET, pulled up IN
59 WAITX OUT nc nc
RFU/IN-
60
PACKX
61 REGX IN
BVD2/SP
62
KRX
BVD1/STS
63
CHGX
64 D8 I/O nc nc
OUT Input port acknowledge. Fixed ’0’ OUT
Register and I/O select enable, pulled up
OUT Pulled up.
OUT
Status changed indication to
host device
Pulled up. IN
Select non–PCMCIA mode by
connecting to ground.
(pulled up)
Fixed ’1’ OUT
IN
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Page 13
RPM-1
System Module
Pin
Pin
65 D9 I/O nc nc
66 D10 I/O nc nc
67 CD2X OUT Connected to ground. Connected to ground.
68 GND Ground Ground.
Signal
name
FunctionDir
PAMS Technical Documentation
Non–PCMCIA modePCMCIA mode
Signal
name
PCMCIA connector electrical specifications:
DirFunction
Pin Line
Symbol
PCMCIA-
signals
PCMCIA
signals
29 A0 Bidirectional MBUS 0V
Parameter Minimum Typical /
PCMCIA input signals, 0.0V
PCMCIA output signals 0.0V
SIM Interface
System asic MAD2WD1 controls the SIM card. All signals go through the
CCONT asic, where the level shifting of logical signals between
MAD2WD1 and SIM card are done . The CCONT contains also switched
mode supply for SIM–interface, called VSIM. MAD2WD1 controls the
VSIM voltage level (3V/5V) through control bus VSIM level is SIM car dependent..
To protect the SIM card from damage (when card is removed from
PCMCIA slot in power on state) there is a control signal, SIMCardDetx in
MAD2WD1.
2.4V
2.8V
2.1V
Nominal
LOW
HIGH
LOW
HIGH
LOW
HIGH
Maximum Notes
0.8V
VCC
+0.25V
0.5V
VCC
0.6V
2.8V
TTL or CMOS logic levels,
VCC=5V
TTL or CMOS logic levels,
VCC=5V
NOTE 2.8V is maximum in-
put voltage level. (This ap-
plies to NON–PCMCIA
only)
Active signal in that pin starts automatically the power down sequence.
The information from the removing is taken from PCMCIA RESET signal.
As power supply pins are longer, PCMCIA RESET pin is disconnected before power supply pins and internal pull up resistor activates the PCMCIA
RESET signal which activates the MAD2WD1 reset signal, MADPURX.
The MADPURX is delayed so, that there is enough time to drive SIM card
down before MAD goes to reset state.
All SIM reader signals withstand short circuit to ground without damage.
SIM Connector
SIM connector provides 6 contact pads for the SIM card according to the
GSM 11.11 standard.
Page 14
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Issue 1 12/99
PAMS Technical Documentation
1
6
34
System Module
The pins of the SIM connector are listed below:
Pin Line Symbol Min Typ. Max. Unit Notes
RPM-1
1 SIMCLK Frequency
Trise/Tfall
2 SIMRST
5V SIM Card
3V SIM Card
Trise/Tfall
6 SIMDATA
5V SIM Card, logical
”1”
logical
”0”
3V SIM Card, logical
”1”
logical
”0”
Trise/Tfall
3,5 VSIM
5V level
Operating voltage, 3V
level
Output current
4.0
2.8
4.0
0.0
2.8
0.0
4.8
2.8
3.25
25
HIGH VSIM
100
HIGH
LOW
HIGH
LOW
5.0
3.0
VSIM
0.5
VSIM
0.5
1
5.2
3.2
MHz
ns
V
V
ns
V
V
V
V
us
V
V
SIM clock
SIM reset
SIM data
Supply voltage
Fullfill the GSM11.10
current spike requ.
30
4 GND Signal ground
Issue 1 12/99
Nokia Mobile Phones Ltd.
mA
Page 15
RPM-1
Explanation
Explanation
System Module
PAMS Technical Documentation
The signals of the SIM interface are listed below:
SIM card CCONT
Pin name Direction Pin name Direction
VSIM VSIM SIM card operating voltage.
GND GND
SIMRST IN SIMRST_O OUT SIM RESET.
SIMCLK IN SIMCLK_O OUT SIM clock.
SIMDATA I/O DA TA_O I/O SIM data.
CCONT MAD2WD1
Pin name Direction Pin name Direction
SIMRST_A IN SIMCardRstX OUT SIM RESET from MAD2WD1
SIMCLK_A IN SIMCardClk OUT SIM clock from MAD2WD1
DATA_A I/O SIMCardData I/O SIM data to/from MAD2WD1
SIM I/O_C IN SIMCardIOC OUT
SIM_PWR IN SIMCardPwr OUT SIM power control (on/off)
SIM ground. Connected to common
ground of the phone.
SIM data direction control from
MAD2WD1. When LOW, data flow from
MAD2WD1 to CCONT.
SIM connector electrical specifications:
Conn./Pin. Name/Line Symbol Min T yp. Max. Unit Comments
X700/1
SIMCLK
X700/2
SIMRST
X700/6
SIMDATA
X700/5
VSIM
SIMCLK Frequency
Trise/Tfall
5V SIM Card
3V SIM Card
Trise/Tfall
5V SIM Card, logical ”1”
logical ”0”
3V SIM Card, logical ”1”
logical ”0”
Trise/Tfall
Operating voltage, 5V level
Operating voltage, 3V level
Output current
4.0
2.8
4.0
0.0
2.8
0.0
4.8
2.8
3.25
25
HIGH VSIM
100
HIGH
LOW
HIGH
LOW
5.0
3.0
VSIM
0.5
VSIM
0.5
1
5.2
3.2
30
MHz
ns
V
V
ns
V
V
V
V
us
V
V
mA
SIM clock
SIM reset
SIM data
Supply voltage
Fullfill the
GSM11.10 cur-
rent spike requ.
Page 16
Note that the SIM card reader (X700) pin numbers are NOT the same as
pin numbers of the SIM card.
Nokia Mobile Phones Ltd.
Issue 1 12/99
PAMS Technical Documentation
Im edance
50ohm
tor
Antenna or RF Connector
Antenna or RF connector contacts are listed below:
RPM-1
System Module
Con-
tact
1 EXT_ANT
2 GND
Line
Symbol
Parameter Mini-
mum
p
Loss in GSM
band
Loss in PCN
band
Headset or Analog Audio Interface
The Headset or Analog audio signals to the headset connector are coming from COBBA_GJP audio codec. Audio signals from COBBA_GJP to
headset connector goes through RF block in the PCB layout, and connector is near the antenna. Because of that there must be EMI protection circuit near the headset connector and also in COBBA_GJP side.
Typical
/ Nomi-
nal
Maxi-
mum
External antenna connec0 V DC
0.6 dB
1.0 dB
Unit / Notes
,
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Page 17
RPM-1
System Module
PAMS Technical Documentation
Baseband
HookDet
MAD
HeadDet
CCON
T
AUXOUT
EA
D
EAR
N
EAR
P
HFC
M
VCOBBA
RF
Headset
connector
MIC
EAR
COM
EMI protection
(low impedance
in audio freq.)
VCOBBA
SGN
D
H
F
XEAR
HSGND
HSEAR
COBBA_GJP
MIC1
N
MIC1
P
MIC3
N
MIC3
P
Headset Connector
XMI
C
HSMIC
Page 18
The headset connector is used to connect the HDC–6D headset to
RPM–1. HDC–6D has a 2.5 mm stereo plug connector.
Nokia Mobile Phones Ltd.
Issue 1 12/99
PAMS Technical Documentation
HookD
ead e s g a
HeadDet signal
1
3
24
Electrical specifications for the Headset interface
Pin Name Function Min Typ Max Unit Description
3 HSEAR Analog audio output
Accessory detection with
et signal.
2 HSMIC Headset microphone input
Headset detection with
HeadDet signal.
Micbias on
22 Output AC impedance (ref. GND)
10 F Series output capacitance
16 150 300 Load AC impedance to GND: Headset
1.0 V
0.56 V DC Voltage (level in MAD–ASIC, ”0”<0.2*VBB).
0 0.2 V DC Voltage (ref. HSGND). Headset with closed
16 250 1500 Load DC resistance to HSGND. Headset with closed
1.96 V DC Voltage (ref. HSGND). Headset with open switch
47 k Pull–up resistor to VBB in RPM–1
2.0 2.2 k Input AC impedance (Micbias on)
2.5 k Headset source impedance
100 300 500 A Bias current (Note! Micbias 2.1 V)
200 mV
47 k Pull–up resistor to VBB in phone
1.2 1.7 V Headset connected.
2.1 V Headset not connected.
Max. output level. No load
p–p
switch
switch
Maximum signal level
p–p
RPM-1
System Module
Headset detection with
Micbias off
Micbias 2.1 V Switched on when call is on and headset is in.
1 HSGND Audio signal ground
(=AGND).
4 GND Ground 0 Ground
Issue 1 12/99
.
Nokia Mobile Phones Ltd.
0 0.1 V Headset connected.
2.5 2.9 V Headset not connected.
0 Is the same than GND in the phone, they have been
connected together by a 0 ohm resistor.
Page 19
RPM-1
System Module
Modes of Operation
Standard PCMCIA mode
This is the standard operating mode of the RPM–1. The card is used as a
standard 8–bit PCMCIA I/O device. In this mode the card can be used in
two different sub–modes: Nokia–mode and generic mode. In generic
mode the card functions just as a normal modem card and no RPM–1–
specific SW drivers are needed in the PC. In Nokia–mode an improved
power management is offered (deep sleep), but this requires the use of
RPM–1–specific SW drivers in the PC.
The host PC automatically configures its internal memory and interrupt
mapping based on so called CIS data structure (Configuration Information
Structure, specified by the PC card standard) which is stored in the serial
EEPROM in the card and loaded into Sulo ASIC at startup. The PCMCIA
ASIC (Sulo) also contains the following standard PC card registers: Configuration Option Register (COR), Configuration and Status Register
(CSR), and Extended Status Register (ESR). See document NO TAG for
details.
PAMS Technical Documentation
PCMCIA connector signals are listed in NO TAG.
Vertical (i.e. non–PCMCIA) mode
For host devices not having a PCMCIA slot the RPM–1 has been designed to support also simple direct serial bus operation. In this mode the
PCMCIA connector signals have been redefined to support new logical
interfaces. PCMCIA connector signals in non–PCMCIA mode are listed in
NO TAG.
Typical RPM–1 host interface is RS232C. The application specific socket
for the RPM–1 is assumed to contain all 5V to RS232C buffering circuitry.
The vertical operating mode is activated by grounding pin 62
(SPKR#/BVD2) in the PCMCIA connector before card RESET is released.
Pin 62 (SPKR#/BVD2) must be kept grounded all the time when operating
in non–PCMCIA mode. The SPKR#/BVD2 pin has an internal pull–up resistor ensuring standard PCMCIA mode operation if the pin is left unconnected.
Maximum Ratings
Sym-
bol
Vcc Supply voltage –0.5 to 5.5 V
Parameter Ratings Unit Comments
VI Input voltage range –0.5 to Vcc+0.5 V
Vo Output voltage range –0.5 to Vcc+0.5 V
Page 20
Nokia Mobile Phones Ltd.
Issue 1 12/99
PAMS Technical Documentation
bol
IIK Input clamp current
±20
RPM-1
System Module
CommentsUnitRatingsParameterSym-
mA
IOK Output clamp current
Max. operating temperature
range
±20
–10 to +55 _C
mA
DC Characteristics
Supply voltages and Power consumption
Conn./Pin. Name/Line Symbol Min T yp. Max. Unit Comments
PCMCIA/
17,51
PCMCIA/
17,51
PCMCIA/
17,51
PCMCIA/
17,51
PCMCIA connector supply
voltage Vcc
PCMCIA supply current (Vcc)
during CIS reading
PCMCIA supply current
(Vcc=5.0V)
in IDLE state
PCMCIA supply current
(Vcc=5.0V) in CALL state
(2+2, 0.8W)
4.75 5.0 5.25 V Operating voltage range
32 40 mA Absolute max.
supply current
during CIS read-
ing is 70mA.
30 40 mA 1A is absolute
max. current
from PCMCIA
connector.
480 mA Average current
when using
max. transmit
power (GSM)
and multislot
transmission
Issue 1 12/99
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Page 21
Page 22
RPM-1
Introduction to baseband
System Module
Vcc 4.75...5.25 Vdc
Nokia Mobile Phones Ltd.
PCMCIA bus
Vcc
Lin. Reg.
2.8 Vdc
N400
PCMCIA Connector X400
Vcc
10k
BVD2/SPKR#
Vsulo
CIS
EEPROM
(Serial)
D401
Issue 1 12/99
A0
256*8
SIM
reader
X700
NTC
N701
SULO
PCMCIA
interface
ASIC
D400
V5V_2
SIM
Vref
100k
BTEMP
CCONT
Regulator
ASIC
VBAT
N700
PURx
MADPURx
Trace Bus
FBUS
PCM
Flow control
MCUSleepNote
DSPSleepNote
WakeUpInt
COBBA AudioSel
ModeStatus
FLASH Clk
MBUS SW
D402
COBBA PCM
13MHz
VBB
SleepCLK
SIMif
CNTVR
MBUS
VBB
VPA
V5V VCP
VR1
VR2
VR3
VR4
VR5
VR7
VXO
VRX_2
VSYN_2
VSYN_1
VRX_1
VTX
VR6
Vref
V2V
2.425 V
Core
MAD2WD1
VBB
IOs
VBB
COBBA_GJP
COBBA bus TX/RX signals
13MHz
RFI+
CODEC
N600 X601
Vref
Headset
HeadDet, HookDet
MCU
System logic
DSP
SRAM, ROM
Sdata/Sclk/Sena1/Sena2
13MHz
PDATA0
Band Sel
TXP
RFC
D500
VPPEN
Memory bus
VBB
FLASH SRAM
VPP SW
V703
VPP
D501 D502
128k*161M*16
RF
This section of the document specifies the BB section of the GX9 RF/sys-
tem module for RPM–1.
The baseband block diagram is below:
PAMS Technical Documentation
PAMS Technical Documentation
Functional Description
Power Distribution
The supply voltage (VCC) from PCMCIA slot goes to the CCONT VBAT
pins, Sulo ASIC and Sulo core voltage regulator. Also transmit power amplifier (PA) is connected to VCC via FET switch and MBUS switch is powered from VCC rail.
The voltage to power amplifier is connected via delayed FET switch,
which is turned on slowly after the card is powered by host computer, and
CIS information has been read. The VPA line has capacitor array, and to
avoid the inrush current the FET switch is delayed so, that current spike is
under 300mA in the beginning.
Because the SULO ASIC must be powered all the time when the RPM–1
is in PCMCIA slot of the host computer, it needs own regulator for core
voltage. The SULO ASIC draws the core voltage supply from low dropout
regulator, which regulates PCMCIA voltage (Vcc) to 2.8V. The CIS EEPROM takes supply voltage from the same regulator. Secondary supply
voltage (Vcca) to SULO is taken directly from PCMCIA supply voltage
(Vcc). This voltage set the logic levels for PCMCIA interface (5V).
RPM-1
System Module
The CCONT includes all the voltage regulators and feeds the power to
the whole RF and BB system (except SULO, CIS EEPROM and TX power
amplifiers). The MAD2WD1 IOs, COBBA_GJP digital parts and memories
are powered from the same regulator which provides 2.8V baseband supply VBB. The baseband regulator is active always when the CCONT supply voltage is higher than 3.1 V. There is also a separate regulator for SIM
card. The VSIM regulator output is selectable between 3V and 5V, controlled by MAD via serial control bus. COBBA_GJP analog parts are powered from dedicated 2.8V supply, VCOBBA, by the CCONT. CCONT includes also voltage reference regulator for COBBA_GJP analog parts,
temperature measurement and RF block.
The CCONT has six additional 2.8V regulators providing power to the RF
section. These regulators can be controlled either by direct control signals
from MAD or by RF regulator control register in CCONT which MAD can
update.
The switched mode regulator, V5V, is used for SUMMA and Integral PLL
charge pump supply VCP. This voltage can be controlled on and off with
serial IO bus.
The CCONT programmable regulator, V2V, is used as a power source for
MAD2WD1 core. The V2V level in startup is set to 1.975V. The right voltage level for the MAD2WD1 C07 core is 1.75 V (1.65 ... 1.95 V). This level is set by MCU SW before DSP release and normal operation. Detailed
information about V2V setting can be found in ”CCONT V2V User’s
Manual” NO TAG.
The VPP voltage is used for FLASH memory programming, when MCU
code is downloaded to the FLASH memory and when EEPROM emula-
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Page 23
RPM-1
System Module
tion blocks of FLASH memory are updated. The VPP voltage is taken
from VBB power net through a voltage switch. VPP is enabled with
MAD2WD1 general I/O pin, MCUGenIO4.
DC Characteristics of the CCONT voltage regulators are listed below:
PAMS Technical Documentation
Reg. on/off-
Control
line in
CCONT
VR1 SLEEPX Supply voltage
VR2 CNTVR2 Supply voltage
VR3 CNTVR3 Supply voltage
VR4 CNTVR4 Supply voltage
VR5 CNTVR5 Supply voltage
VR6 SLEEPX Supply voltage
VR7 TXPWR Supply voltage
VBB Supply voltage
VSIM SIMPWR Supply voltage
V5V Supply voltage
V2V Programmable,
VRef Supply voltage
Parameter Min. Typ. Max. Unit Comments
Supply current
Supply current
Supply current
Supply current
Supply current
Supply current
Supply current
Supply current (on)
(sleep)
Supply Voltage
Supply current
Supply current
Supply voltage
Supply current
Supply current
2.7 2.8 2.85
80
2.7 2.8 2.85
80
2.7 2.8 2.85
50
2.7 2.8 2.85
80
2.7 2.8 2.85
80
2.7 2.8 2.85
80
2.7 2.8 2.85
150VmA
2.7 2.8 2.85
125
1
2.8
4.8
4.8 5.0 5.2
1.3 2.65
1.478 1.5 1.523
3.0
5.0
3.2
5.2
330
30
50
200
V
VCTCXO voltage,
mA
mA
mA
mA
mAmACurrent limit 250mA
uA
mA
mA
controlled by MAD
(VCXOPwr)
VmARx part voltage, con-
trolled by MAD
(RxPwr)
V
V
VmARx part voltage, con-
V
V
V
V
V
V
VuAReference voltage to
VSYN_2 voltage,
controlled by MAD
(SynthPwr)
VSYN_1 voltage,
controlled by MAD
(SynthPwr)
trolled by MAD
(RxPwr)
VCOBBA voltage,
controlled by MAD
(VCXOPwr)
Tx voltage, con-
trolled by MAD
(TxPwr)
Current limit 5mA
Voltage (3V/5V) is
selected by MAD via
control bus
SUMMA/FPLL
charge pump volt-
age.
Initilal state 1.975V,
Is set to 1.75 V
after startup
COBBA_GJP and
SUMMA
Power up
The only way to power up RPM–1 is to insert it in to a 68 pin PCMCIA
connector. The connector may be either in a PCMCIA compliant slot, or a
Page 24
Nokia Mobile Phones Ltd.
Issue 1 12/99
PAMS Technical Documentation
NOKIA proprietary non–PCMCIA slot. The host computer or controller
connects power to the card after it has detected the card in it’s slot.
Power–Up in PCMCIA mode
RPM-1
System Module
VPA
1
SLEEPX
0
1
CCONTPURx
0
1
62ms
MADPURx
0
1
PCMCIA slot IREQx/READY
0
1
100ms
0
10us
CIS information from EEPROM to Sulo RAM
PCMCIA slot RESET
20ms
1.975V
1.75 V
2.8V
Vcc
0
Max. 500ms
V2V, MAD core voltage (C07)
Power aplifier voltage, VPA
0
Baseband voltage VBB
0
PCMCIA Vcc
3.0V
3
1
2
4
CIS READING
5
6
Power up in PCMCIA mode takes place in following steps:
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Nokia Mobile Phones Ltd.
Page 25
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