NSB-5 Series Core Transceiver comprising
General Information
System Module
Mechanical Assembly
Service Software Instructions
Service Tools
Disassembly
Troubleshooting Instructions
Nonserviceable Accessories
Installation Instructions CARK 64/91
Issue 1
Programmes After Market Services
This document is intended for use by qualified service personnel only.
Company Policy
Our policy is of continuous development; details of all technical modifications will be
included with service bulletins.
While every endeavour has been m ade to ensure the accuracy of this do cument, some
errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Ltd
should be notified in writing.
Please state:
Technical Documentation
IMPORTANT
Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error
Please send to: Nokia Mobile Phones Ltd
PAMS Technical Documentation
PO Box 86
FIN-24101 SAL O
Finland
Issue 1
Programmes After Market Services
Technical Documentation
Warnings and Cautions
Please refer to the phone's user guide for instructions relating to operation, care and
maintenance including important safety information. Note also the following:
Warnings:
1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC
SYSTEMS TO RF ENERGY.
2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS LIKELY
TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.
3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLU-
Cautions:
1. Servicing and alignment must be undertaken by qualified personnel only.
2. Ensure all work is carried out at an anti-static workstation and that an anti-
3. Ensure solder, wire, or foreign matter does not enter the telephone as dam-
4. Use only approved components as specified in the parts list.
5. Ensure all components, modules screws and insulators are correctly re-fit-
LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS.
OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
static wrist strap is worn.
age may result.
ted after servicing and alignment. Ensure all c ables and wires are repositioned correctly.
Fig 1 A Side Cross Sectional View .....................................................................................4
Fig 2 B Side Cross Sectional View......................................................................................5
Page 2Nokia Mobile Phones Ltd.Issue 1 03/01
NSB-5
PAMS Technical DocumentationG eneral Information
Introduction
This chapter contains details of the technical specifications for the Transceiver, general
technical information and a list of products/modules together with their associated order
codes.
NSB–5 is a handheld cellular phone for the US GSM network. It has a GSM 1900 transceiver, providing16 power levels with a maximum output power of 1W (Power class 4).
The basic handportable package offers the user a standard battery pack and travel
charger for charging from mains. Accessories and other options are also listed in this
chapter.
Issue 1 03/01Nokia Mobile Phones Ltd.Page 3
NSB-5
General InformationPAMS Technical Documentation
Antenna
LCD Module connector
RF Shield can
RF Shield can
Keypad + LED’s
RF connector
Batt connector
Sim
8 layer pcb
Figure 1: A Side Cross Sectional View
Page 4Nokia Mobile Phones Ltd.Issue 1 03/01
NSB-5
PAMS Technical DocumentationG eneral Information
Antenna
IR Module pads
RF Shield can
RF connector
Battery
contacts
sim card
contacts
RF circuits
Baseband
circuits
Buzzer
pads
Back up battery pads
System connector
Figure 2: B Side Cross Sectional View
Issue 1 03/01Nokia Mobile Phones Ltd.Page 5
NSB-5
General InformationPAMS Technical Documentation
Modules and Accessories
Modules
Unit/Type:Product Code:Module Code:
Transceive r NSB-5050168 9
System Module UG80201192
UIF Module9480401
MNSE5 Mechanical Assembly0261713
Accessories
All accessories are deemed non-serviceable unle ss stated.
Slim Battery BLS-2 900mAh0670206
Standard Battery BMS-2 900 mAh0671323
Vibrator Battery BMS-2V 900 mAh0670204
Extended Battery BLS-4 1500 mAh0670207
AC Travel Charger ACP-7E (EUR) 207-253 Vac0675144
AC Travel Charger ACP-7U (US) 108-132 Vac0675143
AC Travel Charger ACP-7P (US) 207-253 Vac0675147
AC Travel Charger ACP-7C (US) 198-242 Vac0675158
AC Travel Charger ACP-7X (UK) 207-253 Vac0675145
AC Travel Charger ACP -7H (UK) 180-220 Vac067514 6
AC Travel Charger ACP-7A (AUS) 216-264 Vac0675148
Cigarette Lighter Charger LCH-90675120
Desktop Stand DCH-90700049
Mobile Holder MBC-10700060
Mobile Holder MCC-10620043
Handsfree Unit HFU-20694049
Power Cable PCH-4J0730055
HF Microphone HFM-80690016
HF Speaker HFS-120692008
Mounting Plate MKU-10620036
Swivel Mount HHS-90620037
Headset HDC-9P0694069
Page 6Nokia Mobile Phones Ltd.Issue 1 03/01
NSB-5
PAMS Technical DocumentationG eneral Information
Belt Clip BCH-120720098
External Antenna Cable XRC-10730103
Data Adapter Cable DAC-20730106
DLR-3P0730183
Mobile Accessories
Mobile Holder MBT-50620030
Handsfree Unit PHF-30694030
Figure 23: Marking specification for the light guide ............................................. 89
Page 6Nokia Mobile Phones Ltd.Issue 1 03/01
NSB-5
PAMS Technical DocumentationSystem Module
System Connector
This section describes the elect rical connection and interface levels b etween the baseband, RF and UI parts. The electrical interface specifications are collected into tables that
cover a connector or a defined int erface.
The system connector includes the following parts:
– DC connector for external plug–in charger and a desktop charger
– System connector for accessories and intelligent battery packs
The System connector is used to connect the transceiver to accessories.
System connector pins can be used to connect intelligent battery packs to the trans-
ceiver.
Contact 1
DC–jack
2,3,4
Contact 5
2
3
Slide Detect
4
Contacts
8...13
6
7
8
13
Contact 14
Figure 1: System connector module
Solderable element,
14
Cable/Cradle connector
guiding/fixing hole, 2 pcs
2 pcs
Issue 1 03/01Nokia Mobile Phones Ltd.Page 7
NSB-5
System ModulePAMS Technical Documentation
IBI connector
(6 pads)
B side view
14
8
Fixing pads (2 pcs)
1
7
PCB
DC Jack
Microphone
acoustic ports BB
Bottom
connector (6 pads)
A
B
Charger pads (3 pcs)
A side view
Cable locking holes (3 pcs)
Figure 2: System Connector - detailed
Table 1: System connector signals
PinNameFunctionDescription
1V_INBottom charger contactsCharging voltage
2L_GNDDC JackLogic and charging ground
3V_INDC JackCharging voltage
4CHRG_CTRLDC JackCharger control
9SGNDBottom & IBI connectorsAudio signal ground
10XEARBottom & IBI connectorsAnalog audio output
11MBUSBottom & IBI connectorsBidirectional serial bus
12FBUS_RXBottom & IBI connectorsSerial data in
13FBUS_TXBottom & IBI connectorsSerial data out
14L_GNDBottom charger contactsLogic and charging ground
Page 8Nokia Mobile Phones Ltd.Issue 1 03/01
NSB-5
PAMS Technical DocumentationSystem Module
DC Connector
The electrical specifications in Table 3 shows the idle voltage produced by the acceptable
chargers at the DC connector input. The absolute maximum input voltage is 18V due to
the transient suppressor that is protecting the charger input.
Slide Microphone
The microphone is connected to the slide by means of springs it has a microphone input
level specified in Table 2. The microphone requires bias current to operate which is generated by the COBBA_GJP ASIC.
Slide Connector
An Interrupt signal to MAD2WD1 determines whether the slide is in an open or closed
position.
Roller Interface
A mechanical solution is implemented and thre e interrupts are fed to the MAD2WD1.
Keys and Keymatrix
0–9, *, #, send, end, soft_1, soft_2, power_on_off, rolle r_push,
Headset Connector
The external headset device is connected to the system connector, from which the signals are routed to COBBA_GJP microphone inputs and earphone outputs.
NAMICN mounted in
slide
NAMICP mounted in
slide
Table 2: Mic signals of the system connector
0212.5mVConnected to COBBA_GJP MIC2N input. The
maximum value corresponds to 1 kHz, 0 dBmO
network level with input amplifier gain set to
32 dB, typical value is maximum value - 16 dB.
0212.5mVConnected to COBBA_GJP MIC2P input. The
maximum value corresponds to 1 kHz, 0 dBmO
network level with input amplifier gain set to
32 dB, typical value is maximum value - 16 dB.
Issue 1 03/01Nokia Mobile Phones Ltd.Page 9
NSB-5
System ModulePAMS Technical Documentation
Table 3: System/IBI connector
IB-
Pin
NAMEFunctionMinTypMaxUnitDescription
pin
10YesXEARAnalog
audio output (from
phone to
accessory)
Accessory
detection
(from
accessory
to phone)
16
4.7
47
10
300
10
1.0
100
0.5
6.8
0
0.2
V
Ω
Output AC impedance (ref GND)
resistor tol. is 5%
uF
Series output capacitance
Load AC impedance to GND: Head-
Ω
set
Load AC impedance to SGND:
kΩ
External accessory
Max. output level. No load
p-p
Resistance to accessory ground (in
kΩ
accessory)
V
DC voltage (ref. SNGD). External
accessory
Load DC resistance to SGND. Exter-
kΩ
nal accessory
DC voltage (ref SGND). Headset
V
with closed switch
16
2.8
47
1500
Load DC resistance to SNGD. Head-
Ω
set with closed switch
DC voltage (ref SGND). No acces-
V
sory or headset with open switch
Pull-up resistor to VBB in phone
kΩ
Page 10Nokia Mobile Phones Ltd.Issue 1 03/01
NSB-5
PAMS Technical DocumentationSystem Module
Table 3: System/IBI connector
IB-
Pin
NAMEFunctionMinTypMaxUnitDescription
pin
8YesXMICAnalog
audio input
(from
accessory
to phone)
Headset
microphone
input (from
accessory
to phone)
Accessory
mute. Voltage compared to
SGND.
(from
phone to
accessory)
Headset
detection
(from
accessory
to phone)
(NO TAG)
2.0
100
2.0
2.5
100
2.5
0
1.62.0
1.47
0
49
2.2
1
2.2
600
200
2.9
1.55
2.4
2.9
1.33VV
kΩ
Ω
V
kΩ
kΩµA
mV
p-p
V
V
V
kΩ
Input AC impedance
Accessory source AC impedance
Maximum signal level
p-p
Input AC impedance
Headset source AC impedance
Bias current
Maximum signal level
Not muted
Muted, without headset
Comparator reference in accessory
No headset (ref SGND)
Headset connected (ref SGND)
Pull-up resistor to VBB in phone
Function
DLR-3
Datacable
Detection
9YesSGNDAudio sig-
nal ground.
Separated
from
phone GND
(from
phone to
accessory)
440733mVDLR-3 detected (ref SGN D)
Output AC impedance (ref GND)
Series output capacitance
Resistance to phone ground (DC)
(in phone)
Resistance to accessory ground (in
accessory)
DC voltage compared to phone
GND
DC voltage compared to accessory
GND
-0.2
-5
47
10
380
100
+0.2
+5
Ω
µF
Ω
kΩ
V
V
Issue 1 03/01Nokia Mobile Phones Ltd.Page 11
NSB-5
System ModulePAMS Technical Documentation
Table 3: System/IBI connector
IB-
Pin
NAMEFunctionMinTypMaxUnitDescription
pin
13YesFBUS_TXSerial data
out (from
phone to
accessory)
12YesFBUS_RXSerial data
in (from
accessory
to phone)
0.1
1.7
0
2.0
47
220
47
220
47
0.8
2.8
100
150
1
0.8
2.8
V
V
kΩ
kΩ
Ω
pF
µs
V
V
kΩ
kΩ
Output low voltage @ I
GND)
Output high voltage @ I
(ref GND)
Pull-up resistor in phone
Pull-down resistor in accessory
Serial (EMI filtering) resistor in
phone
Cable capacitance
Rise/fall time
Input low voltage (ref GND)
Input high voltage (ref GND)
Pull-down resistor in phone
Pull-up resistor in accessory
<mA (ref
OL
<4mA
OH
2.2
150
2
1
kΩ
pF
µs
µs
Serial (EMI filtering) resistor in
accessory
Cable capacitance
Rise/fall time @ 115kbits/s
Rise/fall time @ 230kbits/s
Page 12Nokia Mobile Phones Ltd.Issue 1 03/01
Loading...
+ 278 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.