Nokia 7190 Service manual

Programmes After Market Services
Technical Documentation
SERVICE
MANUAL
[NMP Part No. 0275496]
NSB-5 Series Cellular Phones
Issue 1
Programmes After Market Services
Technical Documentation
Issue 1
Programmes After Market Services
Technical Documentation
NSB-5 Series Core Transceiver comprising General Information System Module Mechanical Assembly Service Software Instructions Service Tools Disassembly Troubleshooting Instructions Nonserviceable Accessories Installation Instructions CARK 64/91
Issue 1
Programmes After Market Services
This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service bulletins.
While every endeavour has been m ade to ensure the accuracy of this do cument, some errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Ltd should be notified in writing.
Please state:
Technical Documentation
IMPORTANT
Title of the Document + Issue Number/Date of publication Latest Amendment Number (if applicable) Page(s) and/or Figure(s) in error
Please send to: Nokia Mobile Phones Ltd
PAMS Technical Documentation PO Box 86 FIN-24101 SAL O Finland
Issue 1
Programmes After Market Services
Technical Documentation

Warnings and Cautions

Please refer to the phone's user guide for instructions relating to operation, care and maintenance including important safety information. Note also the following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELEC­TRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYS­TEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/ MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLU-
Cautions:
1. Servicing and alignment must be undertaken by qualified personnel only.
2. Ensure all work is carried out at an anti-static workstation and that an anti-
3. Ensure solder, wire, or foreign matter does not enter the telephone as dam-
4. Use only approved components as specified in the parts list.
5. Ensure all components, modules screws and insulators are correctly re-fit-
LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADE­QUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
static wrist strap is worn.
age may result.
ted after servicing and alignment. Ensure all c ables and wires are reposi­tioned correctly.
Issue 1
Programmes After Market Services
Technical Documentation
Issue 1
Programmes After Market Services
NSB-5 Series Transceivers

General Information

Issue 1 03/01 Nokia Mobile Phones Ltd.
NSB-5
General Information PAMS Technical Documentation
AMENDMENT RECORD SHEET
Amendment Number
Date Inserted by Comments
03/01 J Fraser Issue 1
Contents
Introduction.................................................................................................................. 3
Modules and Accessories............................................................................................. 6
Modules .......................................................................................................................6
Accessories ..................................................................................................................6
Mobile Accessories ......................................................................................................7
Technical Specifications .............................................................................................. 7
General Specifications .................................................................................................7
Electrical Specifications ..............................................................................................7
Page No
List of Figures
Page No
Fig 1 A Side Cross Sectional View .....................................................................................4
Fig 2 B Side Cross Sectional View......................................................................................5
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NSB-5
PAMS Technical Documentation G eneral Information

Introduction

This chapter contains details of the technical specifications for the Transceiver, general technical information and a list of products/modules together with their associated order codes.
NSB–5 is a handheld cellular phone for the US GSM network. It has a GSM 1900 trans­ceiver, providing16 power levels with a maximum output power of 1W (Power class 4).
The basic handportable package offers the user a standard battery pack and travel charger for charging from mains. Accessories and other options are also listed in this chapter.
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General Information PAMS Technical Documentation
Antenna
LCD Module connector
RF Shield can
RF Shield can
Keypad + LED’s
RF connector
Batt connector
Sim
8 layer pcb
Figure 1: A Side Cross Sectional View
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PAMS Technical Documentation G eneral Information
Antenna
IR Module pads
RF Shield can
RF connector
Battery contacts
sim card contacts
RF circuits
Baseband circuits
Buzzer pads
Back up battery pads
System connector
Figure 2: B Side Cross Sectional View
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NSB-5
General Information PAMS Technical Documentation

Modules and Accessories

Modules
Unit/Type: Product Code: Module Code:
Transceive r NSB-5 050168 9 System Module UG8 0201192 UIF Module 9480401 MNSE5 Mechanical Assembly 0261713
Accessories
All accessories are deemed non-serviceable unle ss stated.
Slim Battery BLS-2 900mAh 0670206 Standard Battery BMS-2 900 mAh 0671323 Vibrator Battery BMS-2V 900 mAh 0670204 Extended Battery BLS-4 1500 mAh 0670207 AC Travel Charger ACP-7E (EUR) 207-253 Vac 0675144 AC Travel Charger ACP-7U (US) 108-132 Vac 0675143 AC Travel Charger ACP-7P (US) 207-253 Vac 0675147 AC Travel Charger ACP-7C (US) 198-242 Vac 0675158 AC Travel Charger ACP-7X (UK) 207-253 Vac 0675145 AC Travel Charger ACP -7H (UK) 180-220 Vac 067514 6 AC Travel Charger ACP-7A (AUS) 216-264 Vac 0675148 Cigarette Lighter Charger LCH-9 0675120 Desktop Stand DCH-9 0700049 Mobile Holder MBC-1 0700060 Mobile Holder MCC-1 0620043 Handsfree Unit HFU-2 0694049 Power Cable PCH-4J 0730055 HF Microphone HFM-8 0690016 HF Speaker HFS-12 0692008 Mounting Plate MKU-1 0620036 Swivel Mount HHS-9 0620037 Headset HDC-9P 0694069
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PAMS Technical Documentation G eneral Information
Belt Clip BCH-12 0720098 External Antenna Cable XRC-1 0730103 Data Adapter Cable DAC-2 0730106 DLR-3P 0730183
Mobile Accessories
Mobile Holder MBT-5 0620030 Handsfree Unit PHF-3 0694030
• HF/charger module DC9 0200656
• mechanics MPHF3 0260681 Power Cable PCH-4J 0730055 HF Microphone HFM-7 0690012 HF Speaker HFS-9 0692007 Mounting Plate MKE-7 0650021 Swivel Plate HHS-7 0650020 Power Cable XLC-1 0730060

Technical Specifications

General Specifications
Temperature range (Extreme condi­tions) - specifications fulfilled
Operating time (BLS-2S)
• talk time 2 h 30 min - 4 h 30 min
• standby time 55-260 h Battery voltage
(nominal) (max)
o
-10
C to +55oC
3.6v
4.1 Dimensions (H x W x D) 125 x 53 x 24 mm Weight
• transceiver + BLS-2S (battery) 141 g
Electrical Specifications
Parameter Unit
Cellular system GSM1900
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General Information PAMS Technical Documentation
Parameter Unit
RX frequency band 1930.2 ... 1989.8 MHz GSM1900 TX frequency band 1850.2 ... 1909.8 MHz GSM1900 Output power +/-2 ... +30 dBm/ 1 mW ... 1 W GSM1900 Duplex spacing 80 MHz GSM1900 Number of RF channels 299 GSM1900 Channel spacing 200 kHz Number of TX power levels GSM1900 16 Sensitivity, static channel -102 dBm/ BER <2.439% GSM Frequency error, static channel ± 180 Hz RMS phase error
Peak phase error
< 5.0 < 20.0
o
o
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Transceiver NSB-5

Mechanical A ssembly

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NSB-5
Mechanical Assembly PAMS Technical Documentation
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PAMS Technical Documentation Mechanical Assembly

Exploded View of NSB-5

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Mechanical Assembly PAMS Technical Documentation

Assembly Parts

1 1 9497009 Slide Assembly 2 1 9500065 Metal Slide 3 1 9451486 A-cover Assembly 4 1 9790354 Power Keymat 5 1 5140067 Speaker 6 1 5200013 Roller Key 7 1 9794014 Keymat Module 8 1 9480401 Display Assembly 9 1 5200017 Slide Sensor Switch 10 1 0201192 PCB Assembly 11 4 62900 7 3 Screw (4x) 12 2 62900 79 Screw (2x) 13 1 5140123 Buzzer 14 1 4700057 RTC Battery 15 1 9456326 B-cover Assembly 16 1 066P001 DCT3.5 Antenna 17 1 Type Label 18 2 9460299 Rubber Plug (2x) 19 1 9451139 Dust Cap 20 1 OEM Badge
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Programmes After Market Services
NSB-5 Series Transceivers

System Module

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System Module PAMS Technical Documentation
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PAMS Technical Documentation System Module
Contents
Page No
System Connector ........................................................................................................ 7
DC Connector ............................................................................................................. 9
Slide Microphone ........................................................................................................ 9
Slide Connector ...........................................................................................................9
Roller Interface ........................................................................................................... 9
Keys and Keymatrix ................................................................................................... 9
Headset Connector ...................................................................................................... 9
Battery Connector ......................................................................................................15
Vibra Alerting Device............................................................................................. 16
SIM Card Connector ..................................................................................................16
Infrared Transceiver Module .................................................................................... 17
Real Time Clock ....................................................................................................... 18
Baseband Module....................................................................................................... 18
Technical Summary .................................................................................................. 18
Power Distribution .................................................................................................... 20
Power Up .................................................................................................................. 22
Power up with a charger.......................................................................................... 22
Power Up With the Power Switch (PWRONX)...................................................... 22
Power Up by RTC....................................................................................................23
Power Up by IBI ..................................................................................................... 23
Acting Dead............................................................................................................. 23
Active Mode............................................................................................................ 23
Sleep Mode.............................................................................................................. 23
Battery charging...................................................................................................... 24
Startup Charging ..................................................................................................... 25
Battery Overvoltage Protection.............................................................................. 25
Battery Removal During Charging ......................................................................... 26
Different PWM Frequencies (1Hz and 32 Hz)........................................................ 27
Battery Identification............................................................................................... 28
Battery Temperature................................................................................................ 29
Supply Voltage Regulators...................................................................................... 29
Audio Control ........................................................................................................... 30
Internal Microphone and Earpiece......................................................................... 31
External Audio Connections .................................................................................. 32
Analog Audio Accessory Detection....................................................................... 32
Internal Audio Connections ................................................................................... 33
4–wire PCM Serial Interface................................................................................... 33
Speech Processing.................................................................................................. 34
Alert Signal Generation........................................................................................... 34
Digital Control ...........................................................................................................34
MAD2WD1............................................................................................................. 34
MAD2PR1 pinout .................................................................................................. 35
Memories .................................................................................................................. 46
Program Memory 32MBit Flash............................................................................. 47
SRAM Memory...................................................................................................... 47
EEPROM Emulated in FLASH Memory............................................................... 47
MCU Memory Requirements ................................................................................... 47
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System Module PAMS Technical Documentation
Flash Programming ................................................................................................... 47
IBI Accessories ......................................................................................................... 48
Phone Power–on by IBI ......................................................................................... 48
IBI power–on by phone.......................................................................................... 49
RF Module.................................................................................................................. 50
RF Frequency Plan ................................................................................................... 50
DC Characteristics ................................................................................................... 50
Power Distribution Diagram ..................................................................................... 50
Control Signals ...................................................................................................... 53
Regulator Specifications ........................................................................................... 53
Functional Description ............................................................................................. 54
RF Block Diagram .................................................................................................... 54
Receiver .................................................................................................................... 55
Transmitter ................................................................................................................ 56
Power Detection Circuit ........................................................................................... 57
Frequency Synthesizers ............................................................................................ 60
AGC .......................................................................................................................... 61
AFC ........................................................................................................................... 62
Software Compensations .......................................................................................... 62
Power Levels (TXC) vs. Channel .......................................................................... 62
Modulator Output Level ........................................................................................... 62
Power Levels vs temperature .................................................................................... 62
RSSI .......................................................................................................................... 62
TX power range ........................................................................................................ 62
PA select function ..................................................................................................... 63
RF Block Specifications............................................................................................ 63
GSM1900 Duplex Filter ........................................................................................... 64
Receiver Blocks ......................................................................................................... 65
LNA in CRFU_2a ..................................................................................................... 65
GSM1900 Receive Interstage Filter ......................................................................... 65
First Mixer (UHF) in CRFU_2a ............................................................................... 66
First IF Filter.............................................................................................................. 67
Second Mixer (VHF) in CRFU_2a ........................................................................... 67
Second IF Filter ........................................................................................................ 68
AGC and Third Mixer in SUMMA .......................................................................... 69
Third IF Filter ........................................................................................................... 70
Third IF Buffer in SUMMA ..................................................................................... 70
Transmitter Block..................................................................................................... 70
IQ Modulator and TX AGC in SUMMA ................................................................. 70
Upconversion Mixer and Buffer in CRFU_2a .......................................................... 72
GSM1900 TX SAW Filter ........................................................................................ 73
TX Buffer............................................................................................................... 73
GSM1900 TX Ceramic Filter................................................................................. 73
Power Amplifier MMIC ............................................................................................74
Directional Coupler................................................................................................ 76
Power Detector ......................................................................................................... 76
Power Control Section in SUMMA, Closed Loop Characteristics .......................... 76
Synthesizer Blocks .................................................................................................... 77
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VC(TC)XO, Reference Oscillator.......................................................................... 77
VHF PLL in SUMMA .............................................................................................. 78
VHF VCO and Lowpass Filter............................................................................... 79
UHF PLL .................................................................................................................. 80
GSM1900 UHF VCO module .................................................................................. 81
UHF LO signal into CRFU_2a ................................................................................. 82
Data Interface and Timing .........................................................................................83
Synthesizer Timing Control ...................................................................................... 84
Transmit Power Timing ............................................................................................ 86
Interfacing ................................................................................................................. 86
User Interface............................................................................................................. 87
LEDs ......................................................................................................................... 87
Plastic Window ......................................................................................................... 88
Dust Seal ................................................................................................................... 88
LCD Adhesive .......................................................................................................... 88
Reflector ................................................................................................................... 88
Connector .................................................................................................................. 88
Light Guide ............................................................................................................... 88
UI Module Connection to Main PCB ....................................................................... 90
Parts Lists .................................................................................................................. 92
System Module (0201192) ...................................................................................... 92
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System Module PAMS Technical Documentation
List of Figures
Page No
Figure 1: System Connector - module .......................................................................7
Figure 2: System Connector - detailed ..................................................................... 8
Figure 3: Combined headset, system connector audio signals ............................... 15
Figure 4: Battery connector locations .................................................................... 16
Figure 5: SIM Card Reader Ultra phone .................................................................16
Figure 6: IR tramsmission frame - example ........................................................... 18
Figure 7: Block Diagram .........................................................................................19
Figure 8: Baseband power distribution .................................................................. 20
Figure 9: Battery Charging ......................................................................................24
Figure 10: Battery Identification ............................................................................ 28
Figure 11: Battery Temperature ............................................................................. 29
Figure 12: Audio Control ....................................................................................... 31
Figure 13: Combined headset and system connector audio signal ......................... 32
Figure 14: IBI power on ..........................................................................................49
Figure 15: RF frequency plan ................................................................................. 50
Figure 16: RF power distribution: maximum currents ........................................... 51
Figure 17: RF power distribution: typical currents ................................................ 52
FIGURE 18: Power Control Loop ......................................................................... 60
FIGURE 19: Phase Control Loop .......................................................................... 61
Figure 20: UI module assembled ........................................................................... 87
Figure 21: Mounting of LEDs for backlight (seen from underside) ...................... 88
Figure 22: Light guide ............................................................................................ 89
Figure 23: Marking specification for the light guide ............................................. 89
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PAMS Technical Documentation System Module

System Connector

This section describes the elect rical connection and interface levels b etween the base­band, RF and UI parts. The electrical interface specifications are collected into tables that cover a connector or a defined int erface.
The system connector includes the following parts: – DC connector for external plug–in charger and a desktop charger – System connector for accessories and intelligent battery packs The System connector is used to connect the transceiver to accessories. System connector pins can be used to connect intelligent battery packs to the trans-
ceiver.
Contact 1
DC–jack
2,3,4
Contact 5
2
3
Slide Detect
4
Contacts
8...13
6
7
8
13
Contact 14
Figure 1: System connector module
Solderable element,
14
Cable/Cradle connector guiding/fixing hole, 2 pcs
2 pcs
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System Module PAMS Technical Documentation
IBI connector
(6 pads)
B side view
14
8
Fixing pads (2 pcs)
1
7
PCB
DC Jack
Microphone
acoustic ports BB
Bottom
connector (6 pads)
A
B
Charger pads (3 pcs)
A side view
Cable locking holes (3 pcs)
Figure 2: System Connector - detailed
Table 1: System connector signals
Pin Name Function Description
1 V_IN Bottom charger contacts Charging voltage 2 L_GND DC Jack Logic and charging ground 3 V_IN DC Jack Charging voltage 4CHRG_CTRLDC Jack Charger control
5CHRG_CTRLBottom charger contacts Charger control
6 MIC-P Slide Detect Holder Slide Detect 7 MIC-N Slide Detect Holder Gnd 8 XMIC Bottom & IBI connectors Analog audio input
9 SGND Bottom & IBI connectors Audio signal ground 10 XEAR Bottom & IBI connectors Analog audio output 11 MBUS Bottom & IBI connectors Bidirectional serial bus 12 FBUS_RX Bottom & IBI connectors Serial data in 13 FBUS_TX Bottom & IBI connectors Serial data out 14 L_GND Bottom charger contacts Logic and charging ground
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PAMS Technical Documentation System Module
DC Connector
The electrical specifications in Table 3 shows the idle voltage produced by the acceptable chargers at the DC connector input. The absolute maximum input voltage is 18V due to the transient suppressor that is protecting the charger input.
Slide Microphone
The microphone is connected to the slide by means of springs it has a microphone input level specified in Table 2. The microphone requires bias current to operate which is gen­erated by the COBBA_GJP ASIC.
Slide Connector
An Interrupt signal to MAD2WD1 determines whether the slide is in an open or closed position.
Roller Interface
A mechanical solution is implemented and thre e interrupts are fed to the MAD2WD1.
Keys and Keymatrix
0–9, *, #, send, end, soft_1, soft_2, power_on_off, rolle r_push,
Headset Connector
The external headset device is connected to the system connector, from which the sig­nals are routed to COBBA_GJP microphone inputs and earphone outputs.
NA MICN mounted in
slide
NA MICP mounted in
slide
Table 2: Mic signals of the system connector
0 2 12.5 mV Connected to COBBA_GJP MIC2N input. The
maximum value corresponds to 1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB, typical value is maximum value - 16 dB.
0 2 12.5 mV Connected to COBBA_GJP MIC2P input. The
maximum value corresponds to 1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB, typical value is maximum value - 16 dB.
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System Module PAMS Technical Documentation
Table 3: System/IBI connector
IB-
Pin
NAME Function Min Typ Max Unit Description
pin
10 Yes XEAR Analog
audio out­put (from phone to accessory)
Accessory detection (from accessory to phone)
16
4.7
47
10
300
10
1.0
100
0.5
6.8
0
0.2
V
Output AC impedance (ref GND) resistor tol. is 5%
uF
Series output capacitance Load AC impedance to GND: Head-
set Load AC impedance to SGND:
k
External accessory Max. output level. No load
p-p
Resistance to accessory ground (in
k
accessory)
V
DC voltage (ref. SNGD). External accessory
Load DC resistance to SGND. Exter-
k
nal accessory DC voltage (ref SGND). Headset
V
with closed switch
16
2.8
47
1500
Load DC resistance to SNGD. Head-
set with closed switch DC voltage (ref SGND). No acces-
V
sory or headset with open switch Pull-up resistor to VBB in phone
k
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Table 3: System/IBI connector
IB-
Pin
NAME Function Min Typ Max Unit Description
pin
8 Yes XMIC Analog
audio input (from accessory to phone)
Headset micro­phone input (from accessory to phone)
Accessory mute. Volt­age com­pared to SGND. (from phone to accessory)
Headset detection (from accessory to phone) (NO TAG)
2.0 100
2.0
2.5
100
2.5
0
1.6 2.0
1.47
0
49
2.2
1
2.2
600 200
2.9
1.55
2.4
2.9
1.33VV
k
V k
k µA mV
p-p
V V V
k
Input AC impedance Accessory source AC impedance Maximum signal level
p-p
Input AC impedance Headset source AC impedance Bias current Maximum signal level
Not muted Muted, without headset Comparator reference in accessory
No headset (ref SGND) Headset connected (ref SGND) Pull-up resistor to VBB in phone
Function DLR-3 Datacable Detection
9 Yes SGND Audio sig-
nal ground. Separated from phone GND (from phone to accessory)
440 733 mV DLR-3 detected (ref SGN D)
Output AC impedance (ref GND) Series output capacitance Resistance to phone ground (DC)
(in phone) Resistance to accessory ground (in
accessory) DC voltage compared to phone
GND DC voltage compared to accessory
GND
-0.2
-5
47 10 380
100
+0.2
+5
Ω µF
k
V
V
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Table 3: System/IBI connector
IB-
Pin
NAME Function Min Typ Max Unit Description
pin
13 Yes FBUS_TXSerial data
out (from phone to accessory)
12 Yes FBUS_RXSerial data
in (from accessory to phone)
0.1
1.7
0
2.0
47 220 47
220 47
0.8
2.8
100
150 1
0.8
2.8
V
V
k k
pF µs V V k k
Output low voltage @ I GND)
Output high voltage @ I (ref GND)
Pull-up resistor in phone Pull-down resistor in accessory Serial (EMI filtering) resistor in
phone Cable capacitance Rise/fall time
Input low voltage (ref GND) Input high voltage (ref GND) Pull-down resistor in phone Pull-up resistor in accessory
<mA (ref
OL
<4mA
OH
2.2
150 2 1
k
pF
µs µs
Serial (EMI filtering) resistor in accessory
Cable capacitance Rise/fall time @ 115kbits/s Rise/fall time @ 230kbits/s
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