Nokia 7190 Service Manual 4SysMod

Programmes After Market Services

NSB-5 Series Transceivers

System Module

Issue 1 03/01 Nokia Mobile Phones Ltd.

NSB-5

System Module PAMS Technical Documentation

Page 2 Nokia Mobile Phones Ltd. Issue 1 03/01

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PAMS Technical Documentation System Module

Contents

Page No

System Connector ........................................................................................................ 7

DC Connector ............................................................................................................. 9

Slide Microphone ........................................................................................................ 9

Slide Connector ...........................................................................................................9

Roller Interface ........................................................................................................... 9

Keys and Keymatrix ................................................................................................... 9

Headset Connector ...................................................................................................... 9

Battery Connector ......................................................................................................15

Vibra Alerting Device............................................................................................. 16

SIM Card Connector ..................................................................................................16

Infrared Transceiver Module .................................................................................... 17

Real Time Clock ....................................................................................................... 18

Baseband Module....................................................................................................... 18

Technical Summary .................................................................................................. 18

Power Distribution .................................................................................................... 20

Power Up .................................................................................................................. 22

Power up with a charger.......................................................................................... 22

Power Up With the Power Switch (PWRONX)...................................................... 22

Power Up by RTC....................................................................................................23

Power Up by IBI ..................................................................................................... 23

Acting Dead............................................................................................................. 23

Active Mode............................................................................................................ 23

Sleep Mode.............................................................................................................. 23

Battery charging...................................................................................................... 24

Startup Charging ..................................................................................................... 25

Battery Overvoltage Protection.............................................................................. 25

Battery Removal During Charging ......................................................................... 26

Different PWM Frequencies (1Hz and 32 Hz)........................................................ 27

Battery Identification............................................................................................... 28

Battery Temperature................................................................................................ 29

Supply Voltage Regulators...................................................................................... 29

Audio Control ........................................................................................................... 30

Internal Microphone and Earpiece......................................................................... 31

External Audio Connections .................................................................................. 32

Analog Audio Accessory Detection....................................................................... 32

Internal Audio Connections ................................................................................... 33

4–wire PCM Serial Interface................................................................................... 33

Speech Processing.................................................................................................. 34

Alert Signal Generation........................................................................................... 34

Digital Control ...........................................................................................................34

MAD2WD1............................................................................................................. 34

MAD2PR1 pinout .................................................................................................. 35

Memories .................................................................................................................. 46

Program Memory 32MBit Flash............................................................................. 47

SRAM Memory...................................................................................................... 47

EEPROM Emulated in FLASH Memory............................................................... 47

MCU Memory Requirements ................................................................................... 47

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Flash Programming ................................................................................................... 47

IBI Accessories ......................................................................................................... 48

Phone Power–on by IBI ......................................................................................... 48

IBI power–on by phone.......................................................................................... 49

RF Module.................................................................................................................. 50

RF Frequency Plan ................................................................................................... 50

DC Characteristics ................................................................................................... 50

Power Distribution Diagram ..................................................................................... 50

Control Signals ...................................................................................................... 53

Regulator Specifications ........................................................................................... 53

Functional Description ............................................................................................. 54

RF Block Diagram .................................................................................................... 54

Receiver .................................................................................................................... 55

Transmitter ................................................................................................................ 56

Power Detection Circuit ........................................................................................... 57

Frequency Synthesizers ............................................................................................ 60

AGC .......................................................................................................................... 61

AFC ........................................................................................................................... 62

Software Compensations .......................................................................................... 62

Power Levels (TXC) vs. Channel .......................................................................... 62

Modulator Output Level ........................................................................................... 62

Power Levels vs temperature .................................................................................... 62

RSSI .......................................................................................................................... 62

TX power range ........................................................................................................ 62

PA select function ..................................................................................................... 63

RF Block Specifications............................................................................................ 63

GSM1900 Duplex Filter ........................................................................................... 64

Receiver Blocks ......................................................................................................... 65

LNA in CRFU_2a ..................................................................................................... 65

GSM1900 Receive Interstage Filter ......................................................................... 65

First Mixer (UHF) in CRFU_2a ............................................................................... 66

First IF Filter.............................................................................................................. 67

Second Mixer (VHF) in CRFU_2a ........................................................................... 67

Second IF Filter ........................................................................................................ 68

AGC and Third Mixer in SUMMA .......................................................................... 69

Third IF Filter ........................................................................................................... 70

Third IF Buffer in SUMMA ..................................................................................... 70

Transmitter Block..................................................................................................... 70

IQ Modulator and TX AGC in SUMMA ................................................................. 70

Upconversion Mixer and Buffer in CRFU_2a .......................................................... 72

GSM1900 TX SAW Filter ........................................................................................ 73

TX Buffer............................................................................................................... 73

GSM1900 TX Ceramic Filter................................................................................. 73

Power Amplifier MMIC ............................................................................................74

Directional Coupler................................................................................................ 76

Power Detector ......................................................................................................... 76

Power Control Section in SUMMA, Closed Loop Characteristics .......................... 76

Synthesizer Blocks .................................................................................................... 77

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VC(TC)XO, Reference Oscillator.......................................................................... 77

VHF PLL in SUMMA .............................................................................................. 78

VHF VCO and Lowpass Filter............................................................................... 79

UHF PLL .................................................................................................................. 80

GSM1900 UHF VCO module .................................................................................. 81

UHF LO signal into CRFU_2a ................................................................................. 82

Data Interface and Timing .........................................................................................83

Synthesizer Timing Control ...................................................................................... 84

Transmit Power Timing ............................................................................................ 86

Interfacing ................................................................................................................. 86

User Interface............................................................................................................. 87

LEDs ......................................................................................................................... 87

Plastic Window ......................................................................................................... 88

Dust Seal ................................................................................................................... 88

LCD Adhesive .......................................................................................................... 88

Reflector ................................................................................................................... 88

Connector .................................................................................................................. 88

Light Guide ............................................................................................................... 88

UI Module Connection to Main PCB ....................................................................... 90

Parts Lists .................................................................................................................. 92

System Module (0201192) ...................................................................................... 92

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List of Figures

Page No

Figure 1: System Connector - module .......................................................................7

Figure 2: System Connector - detailed ..................................................................... 8

Figure 3: Combined headset, system connector audio signals ............................... 15

Figure 4: Battery connector locations .................................................................... 16

Figure 5: SIM Card Reader Ultra phone .................................................................16

Figure 6: IR tramsmission frame - example ........................................................... 18

Figure 7: Block Diagram .........................................................................................19

Figure 8: Baseband power distribution .................................................................. 20

Figure 9: Battery Charging ......................................................................................24

Figure 10: Battery Identification ............................................................................ 28

Figure 11: Battery Temperature ............................................................................. 29

Figure 12: Audio Control ....................................................................................... 31

Figure 13: Combined headset and system connector audio signal ......................... 32

Figure 14: IBI power on ..........................................................................................49

Figure 15: RF frequency plan ................................................................................. 50

Figure 16: RF power distribution: maximum currents ........................................... 51

Figure 17: RF power distribution: typical currents ................................................ 52

FIGURE 18: Power Control Loop ......................................................................... 60

FIGURE 19: Phase Control Loop .......................................................................... 61

Figure 20: UI module assembled ........................................................................... 87

Figure 21: Mounting of LEDs for backlight (seen from underside) ...................... 88

Figure 22: Light guide ............................................................................................ 89

Figure 23: Marking specification for the light guide ............................................. 89

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System Connector

This section describes the elect rical connection and interface levels between the base­band, RF and UI parts. The electrical interface specifications are collected into tables that
cover a connector or a defined int erface.

The system connector includes the following parts:
– DC connector for external plug–in charger and a desktop charger
– System connector for accessories and intelligent battery packs
The System connector is used to connect the transceiver to accessories.
System connector pins can be used to connect intelligent battery packs to the trans-

ceiver.

Contact 1

DC–jack

2,3,4

Contact 5

2

3

Slide Detect

4

Contacts

8...13

6

7

8

13

Contact 14

Figure 1: System connector module

Solderable element,

14

Cable/Cradle connector
guiding/fixing hole, 2 pcs

2 pcs

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IBI connector

(6 pads)

B side view

14

8

Fixing pads (2 pcs)

1

7

PCB

DC Jack

Microphone

acoustic ports BB

Bottom

connector (6 pads)

A

B

Charger pads (3 pcs)

A side view

Cable locking holes (3 pcs)

Figure 2: System Connector - detailed

Table 1: System connector signals

Pin Name Function Description

1 V_IN Bottom charger contacts Charging voltage
2 L_GND DC Jack Logic and charging ground
3 V_IN DC Jack Charging voltage
4CHRG_CTRLDC Jack Charger control

5CHRG_CTRLBottom charger contacts Charger control

6 MIC-P Slide Detect Holder Slide Detect
7 MIC-N Slide Detect Holder Gnd
8 XMIC Bottom & IBI connectors Analog audio input

9 SGND Bottom & IBI connectors Audio signal ground
10 XEAR Bottom & IBI connectors Analog audio output
11 MBUS Bottom & IBI connectors Bidirectional serial bus
12 FBUS_RX Bottom & IBI connectors Serial data in
13 FBUS_TX Bottom & IBI connectors Serial data out
14 L_GND Bottom charger contacts Logic and charging ground

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DC Connector

The electrical specifications in Table 3 shows the idle voltage produced by the acceptable
chargers at the DC connector input. The absolute maximum input voltage is 18V due to
the transient suppressor that is protecting the charger input.

Slide Microphone

The microphone is connected to the slide by means of springs it has a microphone input
level specified in Table 2. The microphone requires bias current to operate which is gen­erated by the COBBA_GJP ASIC.

Slide Connector

An Interrupt signal to MAD2WD1 determines whether the slide is in an open or closed
position.

Roller Interface

A mechanical solution is implemented and thre e interrupts are fed to the MAD2WD1.

Keys and Keymatrix

0–9, *, #, send, end, soft_1, soft_2, power_on_off, rolle r_push,

Headset Connector

The external headset device is connected to the system connector, from which the sig­nals are routed to COBBA_GJP microphone inputs and earphone outputs.

NA MICN mounted in

slide

NA MICP mounted in

slide

Table 2: Mic signals of the system connector

0 2 12.5 mV Connected to COBBA_GJP MIC2N input. The

maximum value corresponds to 1 kHz, 0 dBmO
network level with input amplifier gain set to
32 dB, typical value is maximum value - 16 dB.

0 2 12.5 mV Connected to COBBA_GJP MIC2P input. The

maximum value corresponds to 1 kHz, 0 dBmO
network level with input amplifier gain set to
32 dB, typical value is maximum value - 16 dB.

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Table 3: System/IBI connector

IB-

Pin

NAME Function Min Typ Max Unit Description

pin

10 Yes XEAR Analog

audio out­put (from
phone to
accessory)

Accessory
detection
(from
accessory
to phone)

16

4.7

0

47

10

10

1.0

100

0.5

6.8

300

0.2

V

Ω

Output AC impedance (ref GND)
resistor tol. is 5%

uF

Series output capacitance
Load AC impedance to GND: Head-

Ω

set
Load AC impedance to SGND:

kΩ

External accessory
Max. output level. No load

p-p

Resistance to accessory ground (in

kΩ

accessory)

V

DC voltage (ref. SNGD). External
accessory

Load DC resistance to SGND. Exter-

kΩ

nal accessory
DC voltage (ref SGND). Headset

V

with closed switch

16

2.8

47

1500

Load DC resistance to SNGD. Head-

Ω

set with closed switch
DC voltage (ref SGND). No acces-

V

sory or headset with open switch
Pull-up resistor to VBB in phone

kΩ

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Table 3: System/IBI connector

IB-

Pin

NAME Function Min Typ Max Unit Description

pin

8 Yes XMIC Analog

audio input
(from
accessory
to phone)

Headset
micro­phone
input (from
accessory
to phone)

Accessory
mute. Volt­age com­pared to
SGND.
(from
phone to
accessory)

Headset
detection
(from
accessory
to phone)
(NO TAG)

2.0
100

2.0

2.5

100

2.5

0

1.6 2.0

1.47

0

49

2.2

1

2.2

600
200

2.9

1.55

2.4

2.9

1.33VV

kΩ

Ω

V
kΩ

kΩ
µA
mV

p-p

V
V
V

kΩ

Input AC impedance
Accessory source AC impedance
Maximum signal level

p-p

Input AC impedance
Headset source AC impedance
Bias current
Maximum signal level

Not muted
Muted, without headset
Comparator reference in accessory

No headset (ref SGND)
Headset connected (ref SGND)
Pull-up resistor to VBB in phone

Function
DLR-3
Datacable
Detection

9 Yes SGND Audio sig-

nal ground.
Separated
from
phone GND
(from
phone to
accessory)

440 733 mV DLR-3 detected (ref SGND)

Output AC impedance (ref GND)
Series output capacitance
Resistance to phone ground (DC)

(in phone)
Resistance to accessory ground (in

accessory)
DC voltage compared to phone

GND
DC voltage compared to accessory

GND

-0.2

-5

47
10
380

100

+0.2

+5

Ω
µF
Ω

kΩ

V

V

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Table 3: System/IBI connector

IB-

Pin

NAME Function Min Typ Max Unit Description

pin

13 Yes FBUS_TXSerial data

out (from
phone to
accessory)

12 Yes FBUS_RXSerial data

in (from
accessory
to phone)

0.1

1.7

0

2.0

47
220
47

220
47

0.8

2.8

100

150
1

0.8

2.8

V

V

kΩ
kΩ

Ω

pF
µs
V
V
kΩ
kΩ

Output low voltage @ I
GND)

Output high voltage @ I
(ref GND)

Pull-up resistor in phone
Pull-down resistor in accessory
Serial (EMI filtering) resistor in

phone
Cable capacitance
Rise/fall time

Input low voltage (ref GND)
Input high voltage (ref GND)
Pull-down resistor in phone
Pull-up resistor in accessory

<mA (ref

OL

<4mA

OH

2.2

150
2
1

kΩ

pF

µs
µs

Serial (EMI filtering) resistor in
accessory

Cable capacitance
Rise/fall time @ 115kbits/s
Rise/fall time @ 230kbits/s

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Table 3: System/IBI connector

IB-

Pin

NAME Function Min Typ Max Unit Description

pin

11 Yes MBUS

FLASH_
CLK

2,

- L_GND Logic and

14

Bidirec­tional
serial bus

charging
ground
(separated
from
phone GND
by EMI
compo­nents)

0

2.0

0

0.8

2.8

0.8

V
V
V

Input low voltage (ref GND)
Input high voltage (ref GND)
Output low voltage @ I

(ref GND)

2.1

2.9

V

Output high voltage @ I
µA (ref GND)

4.7
220
100

kΩ
kΩ

Ω

Pull-up resistor in phone
Pull-down resistor in accessory
Serial (EMI filtering) resistor in

phone

200
5

pF
µs

Cable capacitance
Rise/fall time @ 9600 bits/s

0 1.0 A Ground current

<4mA

OL

OH

<100

4,5 - CHRG_

CTRL

Charger
control
(from
phone to
accessory)

0

1.7

1

32

20

30

0.8

2.9
37
99

V
V
Hz
%
kΩ

kΩ

Output low voltage @ I

Output high voltage @ I

<20 µA

OL

<20 µA

OH

PWM frequency
PWM duty cycle
Serial (EMI filtering) resistor in

phone
Pull-down resistor in phone

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Table 3: System/IBI connector

IB-

Pin

NAME Function Min Typ Max Unit Description

pin

1,3 - VIN Fast

charger
(from
accessory
to phone)

Slow
charger
(from
accessory
to phone)00

0
0

8.5

0.85
100

100

100

200

15

V
A
mV

p-p

mV

p-p

mV

p-p

mV
p-p

V

peak

Charging voltage
Charging current
Ripple voltage @ f = 20...200Hz,

load = 3 & 10 Ω
Ripple voltage @ 4 = 0.2...30kHz,

load = 3 & 10 Ω
Ripple voltage @ f > 30kHz, load =

3 & 10 Ω
Total ripple voltage @ f > 20Hz,

load = 3 & 10 Ω
Charging voltage (max . =

unloaded, +20% overvoltage in
mains)

1.0

A

Charging current (max. = shorted,

peak

+20% overvoltage in mains)

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Baseband

HOOKDET

MAD

HEADDET

CCONT

EAD

HF

COBBA
–GJP

AUX
OUT

PD2

AGND

10m

10k

100n

AGND

10u

27p

100n

1u

220k

220k

VBB VBB

2k2 47k

2k2

VBB

47k

100MHz

33R

AGND

47R

XEAR

LGND

PC–Board

R01

SW01

+

+

+

C01

C03

C02

HFCM

MIC1N

MIC1P

MIC3N

MIC3P

AGND

Note 1: Grey resistor are in the border of ”EMI clean” and ”dirty” areas.
Note 2: AGND is connected directly to the GND on PCB close to HF parts.
Note 3: ESD protection diodes are not shown.

Battery Connector

The BSI contact on the battery co nnector is used to detect when thebattery is removed
with power switched on enabling the SIM card operation to shut down first. The BSI con­tact in the battery pack should be shorter than the supply power contacts to give enough
time for the SIM shut down.

AGND

27p

2k2

27p

100n

100n

100n

100n

AGND AGND AGND

2k2

100R

100R

330R

XMIC

SGND

R01= 100R
C01=33uF
C02=1000pF
C03=22pF
L01=MMZ2012Y6
01BT/TDK

Figure 3: Combined headset, system connector audio signals

L01

Z01

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No metal in these areas!
old connector type

12

B side view.

phone

1+VBATT
2BSI
3BTEMP
4-VBATT

34

Vibra Alerting Device

A special battery pack contains a vibra motor. The vibra is controlled with one PWM sig­nal by the MAD2WD1 via the BTEMP battery terminal.

Figure 4: Battery connector locations

SIM Card Connector

The SIM card connector is located on the PCB. Only small SIM cards are supported.

321

456

Figure 5: SIM Card Reader Ultra phone

Table 4: SIM Connector Electrical Specifications

Pin Name Parameter Min Typ Max Unit Notes

1GND GND 0 0 V Ground

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Table 4: SIM Connector Electrical Specifications

Pin Name Parameter Min Typ Max Unit Notes

2 VSIM 5V SIM Card

3V SIM Card

3DATA5V Vin/Vout

3V Vin/Vo ut

4 SIMRST 5V SIM Card

3V SIM Card

5SIMCLK Frequency

Trise/Tfall

6 VPP 5V SIM Card

3V SIM Card

VSIM supply voltages are specified to meet type approval requirements regardless of the
tolerances in components.

Infrared Transceiver Module

An infrared transceiver module is designed as a substitute for hardwired connections
between the phone and a PC. The infrared transceiver module is a stand alone compo­nent. In DCT3 the module is located inside and at the top of the phone.

4.8

2.8

4.0
0

2.8
0

4.0

2.8

4.8

2.8

5.0

3.0
“1”

“0”
“1”
“0”

“1”
“1”

3.25

5.0

3.0

5.2

3.2

VSIM

0.5

VSIM

0.5

VSIM
VSIM

25

5.2

3.2

V Supply voltage

V SIM data

Trise/Tfall max 1 us

V SIM reset

MHz

ns

V Programming voltage

SIM clock

pin6 and pin2 tied

together

The Rx and Tx is connected to the FBUS via a dual bus buffer. The module and buffer is
activated from the MAD2 with a pull up on IRON. The Accif in MAD2 performs pulse
encoding and shaping for transmitted data pulses and detection and decoding for
received data pulses.

The data is transferred over the IR link using serial FBUS data at speeds 9.6, 19.2, 38.4,

57.6 or 115.2 kbits/s, which leads to maximum throughput of 92.160 kbits/s. The used IR
module complies with the IrDA SIR specification (Infra Red Data Association), which is
based on the HP SIR (Hewlett–Packard‘s Serial Infra Red) concept.

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The following figure gives an example of IR transmission pulses. In IR transmission, a
light pulse corresponds to 0–bit and a ”dark pulse” corresponds to 1–bit.

constant pulse

IR TX

UART TX

startbit stopbit

The FBUS cannot be used for external accessory communication, when the infrared mode
is selected. Infrared communication reserves the FBUS completely.

Real Time Clock

Requirements for a real time clock implementation are a basic clock (hours and minutes),
a calender and a timer with alarm and power on/off –function and miscellaneous calls.
The RTC will contain only the time base and the alarm timer but all other functions (e.g.
calendar) will be implemented with the MCU software. The RTC needs a power backup to
keep the clock running when the phone battery is disconnected. The backup power is
supplied from a rechargable polyacene battery that can keep the clock running for
approximately ten minutes. If the backup has expired, the RTC clock restarts after the
main battery is connected. The CCONT resets the MCU in approx 62ms and the 32kHz
source is settled (after approx. 1s).

The CCONT is an ideal place for an integrated real time clock as the asic already contains
the power up/down functions and a sleep control with the 32kHz sleep clock, which is
always running when the phone battery is connected. This sleep clock is used for a time
source to a RTC block.

1

0100110

Figure 6: IR tramsmission frame - example

Baseband Module

Technical Summary

The baseband architecture is basically similar to DCT3 GSM phones. DCT3.5 differs from
DCT3 in the single PCB concept and the serial interface between MAD2WD1 and
COBBA_GJP and MAD2WD1 and CCONT. In DCT3.5 the MCU, the system-specific ASIC
and the DSP are intergrated into one ASIC, called the MAD2WD1 chip, which takes care
of all the signal processing and operation controlling tasks of the phone.

The baseband architecture supports a power saving function called ”sleep mode”. This
sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and
baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is
wakened up by a timer running from this 32 kHz clock supply. The sleeping time is deter-

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mined by some network parameters. When the sleep mode is entered both the MCU and
the DSP are in standby mode and the normal VCTCXO clock has been switched off.

The battery voltage range in DCT3 family is 3.0V to 4.5V depending on the battery charge
and used cell type (Li–Ion or NiMH). Because of the lower battery voltage the baseband
supply voltage is lowered to a nominal of 2.8V.

The baseband is running from a 2.8V power rail which is supplied by a power controlling
asic (CCONT). In the CCONT there are seven individually controlled regulator outputs for
the RF section, one 2.8V output for the baseband plus a core voltage for MAD2WD1.
However this is not used in NSB–5 because the chipset support s 2.8 Volts. In addition
there is one +5V power supply output(V5V). TheCCONTalso contains a SIM interface
which supports both 3V and 5V SIM cards. A real time clock function is integrated into
the CCONT which utilizes the same 32KHz clock supply as the sleep clock. A backup
power supply is provided for the RTC, which keeps the real time clock running when the
main battery is removed. The backup power supply is a rechargeable polyacene battery
with a backup time of ten minutes.

The interface between the baseband and the RF section is handled by a specific asic. The
COBBA_GJP asic provides A/D and D/A conversion of the in–phase and quadrature
receive and transmit signal paths and also A/D and D/A conversions of received and
transmitted audio signals to and from the UI parts. Data transmission between the
COBBA_GJP and the MAD2WD1 is implemented using serial connections. Digital speech
processing is handled by the MAD2WD1 asic. The COBBA_GJP asic is a dual supply volt­age circuit, the digital parts are running from the baseband supply VBB and the analog
parts are running from the analog supply VCOBBA (VR6).

LCD

vibra
motor

IR

roller

TX/RX SIGNALS

COBBA SUPPLY

COBBA_GJP

MAD2WD1
+

MEMORIES

RF SUPPLIES

CCONT

BB SUPPLY

core voltage

CHAPS

PA SUPPLY

SIM

32kHz
CLK

SLEEP CLOCK

VBAT

13MHz
CLK

SYSTEM CLOCK

BATTERY
NiMH LiIon

AUDIOLINES

BASEBAND

SYSCON

Figure 7: Block Diagram

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Power Distribution

In normal operation the baseband is powered from th e phone‘s battery. The battery con­sists of one Lithium–Ion cell. There is also a possibility to use batteries consisting of
three Nickel Metal Hydride cells or one solid state cell. An external charger can be used
for recharging the battery and supplying power to the phone. The charger can be either
so called fast charger, which can deliver supply current up to 1600 mA or a standard
charger that can deliver approx 300 mA.

The CCONT provides voltage to th e circuitry excluding the RF PA, LCD, and IrDa, which
are supplied via a continuous power rail direct from the battery. The RF PA module has a
cutoff voltage of 3.1V. The batter y(see note) feeds power directly to several parts of the
system: CCONT, PA, and UI circuitry (display lights, buzzer). The four dedicated control
lines, RxPwr, TxPwr, SIMCardPwr, and SynthPwr from MAD2 to CCONT have changed to a
serial control signal between MAD2WD1 and CCONT. Figure 8 shows a simplified block
diagram of the power distribution.

Note : In battery terms there is VBATT and VB, the difference is a filter (coil and capacitors).

The power management circuitry provides protection against overvoltages, charger fail­ures, and pirate chargers, etc., that could cause damage to the phone.

PA SUPPLY

VCOBBA

COBBA_GJP

LCD
MODULE

VBAT

VBB

MAD2WD1

+

MEMORIES

BASEBAND

RF SUPPLIES

CCONT

PWRONX

CNTVR

VBB

core volta ge

PURX

POWER
MGMT

VIN

VSIM

VBAT

PWM

SIM

RTC

BACKUP

BATTERY

sram

CONNECTOR

Figure 8: Baseband power distribution

The heart of the power distribution is the CCONT. It includes all the voltage regulators
and feeds the power to most of the system. The whol e baseband is powered from the
same regulator which provides 2.8V baseband supply VBB. The baseband regulator is
active always when the phone is powered on. The core baseband regulator feeds,
amongst others, MAD2WD1 and memories, COBBA_GJP digital parts and the LCD driver
in the UI section. COBBA_GJP analog parts are powered from a dedicated 2.8V supply

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VCOBBA by the CCONT. There is a separate regulator for a SIM card which is selectable
between 3V and 5V and controlled by the SIMPwr line from MAD2WD1 to CCONT.

The CCONT contains a real time clock function, which is powered from a RTC backup
when the main battery is disconnected. The RTC backup is rechargable polyacene battery.

CCONT includes also six additional 2.8V regulators providing power to the RF section.
These regulators can be controlled by the seriel interface from MAD2WD1; i.e., RF regu­lator control register in CCONT which MAD2WD1 can update.

CCONT supplies a core voltage to the MAD2WD1. The core voltage is by default 1.975V,
but can be set lower, depending on the MAD2 silicon technology.

RAM_BCK is not used.
CCONT generates also a 1.5 V reference voltage VREF to COBBA_GJP, SUMMA. The VREF

voltage is also used as a reference to some of the CCONT A/D converters and as a refer­ence for al the other regulators.

In addition to the above-mentioned signals, MAD2WD1 includes also TXP control signal
which goes to SUMMA power control block and to the power amplifier. The transmitter
power control TXC is led from COBBA_GJP to SUMMA.

Table 5: CCONT current output capability/nominal voltage

Regulator

VR1 25 mA 2.8 V VCTCXO
VR2 25 mA 2.8 V CRFU Rx

VR3/switch 50 mA 2.8 V PLL VSYN

VR4 90 mA 2.8 V VCO VSYN
VR5 80 mA 2.8 V SUMMA Rx
VR6 100 mA 2.8 V COBBA_GJP
VR7 150 mA 2.8 V SUMMA+CRFU Tx

VBB ON

VBB SLEEP

VSIM 30 mA 3.0/

Maximum

current

125

1

Unit Vout Unit Notes

mA
mA

2.8

2.8

5.0

V
V

V
V

current limit 250mA

current limit 5mA

VSIM

outout voltage selectable

V_core 50 mA 1.975 V programmable core supply for CPU/

DSP/SYS ASIC dV=225V

V_RAM_bck/VR3 50 mA 2.8 V n ormal mode 2.8V. 2.0V for data

retention. (not used)

VSIM must fulfill the GSM11.10 current spike requirements.

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VSIM and V5V can give a total of 30 mA.

Power Up

The baseband is powered up by:

1 Pressing the power key, that generates a PWRONX interrupt signal from the

power key to the CCONT, which starts the power up procedure.

2 Connecting a charger to the phone. The CCONT recognizes the charger from the

VCHAR voltage and starts the power up procedure.

3 A RTC interrupt. If the real time clock is set to alarm and the phone is switched

off, the RTC generates an interrupt signal, when the alarm is gone off. The RTC
interrupt signal is con-nected to the PWRONX line to give a power on signal to
the CCONT just like the power key.

4 A battery interrupt. Intelligent battery packs have a possibility to power up the

phone. When the battery gives a short (10ms) voltage pulse through the BTEMP
pin, the CCONT wakes up and starts the power on procedure.

Power up with a charger

When the charger is connected, CCONT will switch on the CCONT digital voltage as soon
as the battery voltage exeeds 3.0V. The reset for CCONT’s digital parts is released when
the operating voltage is stabilized ( 50 us from switching on the voltages). Operating
voltage for VCXO is also switched on. The counter in CCONT digital section will keep
MAD in reset for 62 ms (PURX) to make sure that the clock provided by VCXO is stable.
After this delay, MAD reset is released, and VCXO–control (SLEEPX) is given to MAD. The
diagram assumes empty battery, but the situation would be the same with full battery:

When the phone is powered up with an empty batter y pack using the standard charger,
the charger may not supply enough current for standard power-up procedure and the
powerup must be delayed.

Power Up With the Power Switch (PWRONX)

When the power on switch is pressed the PWRONX signal will go low. CCONT will switch
on the CCONT digital section and VCXO as was the case with the charger-driven power
up. If PWRONX is low when the 64 ms delay expires, PURX is released and SLEEPX control
goes to MAD. If PWRONX is not low when 64 ms expires, PURX will not be released, and
CCONT will go to power off ( digital section will send power off signal to analog parts)

.

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SLEEPX

PURX

CCPURX

PWRONX

VR1,VR6
VBB (2.8V)

Vchar

12 3

1: Power switch pressed ==> Digital voltages on in CCONT (VBB).
2: CCONT digital reset released. VCXO turned on.
3: 62 ms delay to see if power switch is still pressed.

Po wer Up by RTC

RTC ( internal in CCONT) can power the phone up by changing RTCPwr to logical ”1”.
RTCPwr is an internal signal from the CCONT digital section.

Po wer Up by IBI

IBI can power CCONT up by sending a short pulse to logical ”1”. RTCPwr is an internal
signal from the CCONT digital section.

Acting Dead

If the phone is off when the charger is connected, the phone is powered on but enters a
state called ”acting dead”. To the user the phone acts as if it was switched off. A battery
charging alert is given and/or a battery charging indication on the display is shown to
acknowledge the user that the battery is being charged.

Active Mode

In the active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. All the CCONT regulators are
operating. There are several substates in the active mode depending on if the phone is in
burst reception, burst transmission, if DSP is working etc.

Sleep Mode

In the sleep mode all the regulators except the baseband VBB, Vcore, and the SIM card
VSIM regulators are off. Sleep mode is activated by the MAD2WD1 after MCU and DSP
clocks have been switched off. The voltage regulators for the RF section are switched off

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and the VCXO power control, VCXOPwr is set low. In this state only the 32 kHz sleep
clock oscillator in CCONT is running. The flash memory power down input is connected to
the VCXO power control, so that the flash is deep powered down during sleep mode. Dur­ing sleep mode, the phone wakes up periodically to page the base station for incoming
calls, location update, etc. The paging rate is a parameter set by the BS.

The sleep mode is exited either by the expiration of a sleep clock counter in the
MAD2WD1 or by some external interrupt, gener ated by a charger connection, key press,
headset connection, etc. The MAD2WD1 starts the wake up sequence and sets the VCX­OPwr control high. After VCXO settling time other regulators and clocks are enabled for
active mode.

If the battery pack is disconnect during the sleep mode, the CCONT shall power down the
SIM in the sleep mode as there is no time to wake up the MCU.

Battery charging

The electrical specifications give the idle voltages produced by the acceptable chargers
at the DC connector input. The absolute maximum input voltage is 30V due to the tran­sient suppressor that is protecting the charger input. At phone end there is no difference
between a plug–in charger or a desktop charger. The DC–jack pins and bottom connector
charging pads are connected together inside the phone.

MAD

MAD

VBAT

CCONTINT

CCONT

0R22

PWM_OUT

GND

ICHAR

VCHAR

LIM
VOUT

CHAPS

RSENSE

PWM

22k

VCH

GND

1n

27pf

Figure 9: Battery Charging

TRANSCEIVER

33R/100MHz

1u

47k

47k

30V

1.5A

EMI

VIN

CHRG_CTRL

L_GND

CHARGER

NOT IN
ACP–7/8

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Startup Charging

When a charger is connected, the CHAPS is supplying a startup current minimum of
130mA to the phone. The startup current provides initial charging to a phone with an
empty battery. Startup circuit charges the battery until the battery voltage level reaches

3.0V (+/– 0.1V) and the CCONT releases the PURX reset signal and program execution
starts. Charging mode is changed from startup charging to PWM charging that is con­trolled by the MCU software. If the battery voltage reaches 3.55V (3.75V maximum)
before the program has taken control over the charging, the startup current is switched
off. The startup current is switched on again when the battery voltage is sunken
100mV (nominal).

Table 6: Startup Charging Parameters

Parameter Symbol Min Typ Max Unit

VOUT start-up mode cutoff limit Vstart 3.45 3.55 3.75 V

VOUT start-up mode hysteresis

Note: COUT = 4.7µF

Start-up regulator output current

VOUT = 0V ... Vstart

Battery Overvoltage Protection

Output overvoltage protection is used to protect phone from damage. This function is
also used to define the protection cutoff voltage for different battery types (Li or Ni). The
power switch is immediately turned OFF if th e voltage in VOUT rises above the selected
limit VLIM1 or VLIM2.

Table 7: Battery O v ervoltage Protection

Parameter Symbol

Output voltage cutoff limit (during

transmission or Li-battery)

Output voltage cutoff limit (no

transmission or Ni-battery)F

Vstarthys 80 100 200 mV

Istart 130 165 200 mA

LIM

input

VLIM1 LOW 4.4 4.6 4.8 V

VLIM2 HIGH 4.8 5.0 5.2 V

Min Typ Max Unit

The voltage limit (VLIM1 or VLIM2) is selected by logic LOW or logic HIGH on the CHAPS
(N101) LIM– input pin. Default value is lower limit VLIM1.

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When the switch in output overvoltage situation has once turned OFF, it stays OFF until
the the battery voltage falls below VLIM1 (or VLIM2) and PWM = LOW is detected. The
switch can be turned on again by setting PWM = HIGH.

VCH

VCH<VOUT

t

VOUT

VLIM1 or VLIM2

t

SWITCH

PWM (32Hz)

ON OFF

Battery Removal During Cha r g i n g

Output overvoltage protection is also needed in case the main battery is removed when
charger connected or charger is connected before the battery is connected to the phone.

With a charger connected, if VOUT exceeds VLIM1 (or VLIM2), CHAPS turns switch OFF
until the charger input has sunken below Vpor (nominal 3.0V, maximum 3.4V). MCU soft­ware will stop the charging (turn off PWM) when it detects that battery has been
removed. The CHAPS remains in protection state as long as PWM stays HIGH after the
output overvoltage situation has occurred.

ON

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VCH
(Standard
Charger)

VOUT

PWM

SWITCH

Vpor

VLIM

4V

Vstart

”1”

”0”

ON

OFF

Droop depends on load

& C in phone

2134

Istart off due to VCH<Vpor

Vstarthys

t

t

5

67

t

1 Battery removed, (standard) charger connected, VOUT rises (follows charger volt-

age)
2 VOUT exceeds limit VLIM(X), switch is turned immediately OFF
3 VOUT falls (because no battery), also VCH<Vpor (standard chargers full–rectified

output). When VCH > Vpor and VOUT < VLIM(X) –> switch turned on again (also

PWM is still HIGH) and VOUT again exceeds VLIM(X).
4 Software sets PWM = LOW –> CHAPS does not enter PWM mode
5 PWM low –> Startup mode, startup current flows until Vstart limit reached
6 VOUT exceeds limit Vstart, Istart is turned off
7 VCH falls below Vpor

Different PWM Frequencies (1Hz and 32 Hz)

When a travel charger (2–wire charger ) is used, the power switch is turned ON and OFF
by the PWM input when the PWM rate is 1Hz. When PWM is HIGH, the switch is ON and
the output current Iout = charger current – CHAPS supply current. When PWM is LOW,
the switch is OFF and the output current Iout = 0. To prevent the switching transients
inducing noise in audio circuitry of the phone soft switching is used.

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The performance travel charger (3– wire charger) is controlled with PWM at a frequency
of 32Hz. When the PWM rate is 32Hz CHAPS keeps the power switch continuously in the
ON state.

SWITCH

PWM (1Hz)

SWITCH

PWM (32Hz)

Battery Identification

Different battery types are identified by a pulldown resistor inside the battery pack. The
BSI line inside transceiver has a 100k pullup to VBB.

The MCU can identify the battery by reading the BSI line DC–voltage level with a CCONT
(N100) A/D–converter.

ON ONON OFF OFF

ON

BVOLT

BATTERY

BTEMP

BSI

R

s

BGND

Figure 10: Battery Identification

Vbb

Vibra Schematic

100k

10k

10n

BSI

SIMCardDetX

TRANSCEIVER

CCONT

MAD

The battery identification line is used also for battery removal detection. The BSI line is
connected to a SIMCardDetX line of MAD2 (D300). SIMCardDetX is a threshold detector
with a nominal input switching level 0.85xVcc for a rising edge and 0.55xVcc for a falling
edge. The battery removal detection is used as a trigger to power down the SIM card
before the power is lost. The BSI contact in the battery pack is made 0.7mm shorter than
the supply voltage contacts so that there is a delay between battery removal detection

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and supply power off.

Vcc

0.850.05 Vcc

0.550.05 Vcc

SIMCARDDETX

S

GND

IGOUT

Battery Temperature

The battery temperature is measured with a NTC inside the battery pack. The BTEMP line
inside transceiver has a 100k pullup to VREF. The MCU can calculate the battery temper­ature by reading the BTEMP line DC–voltage level with a CCONT (N100) A/D–converter.

BVOLT

BATTERY

NTC

Supply Voltage Regulators

The heart of the power distrubution is the CCONT. It includes all the voltage regulators
and feeds the power to the whole system. The baseband digital parts are powered from
the VBB regulator which provides 2.8V baseband supply. The baseband regulator is active
always when the phone is powered on. The VBB baseband regulator feeds M AD and
memories, COBBA digital parts and the LCD driv er in the UI section. There is a separate
regulator for a SIM card. The regulator is selectable between 3V and 5V and controlled by
the SIMPwr line from MAD to CCONT. The COBBA analog parts are powered from a dedi­cated 2.8V supply VCOBBA. The CCONT also supplies 5V for RF. The CC ONT contains a real
time clock function, which is powered from a RTC backup when the main battery is dis­connected.

TRANSCEIVER

BSI

BTEMP

R

T

BGND

1k

VREF

100k

2k2

10k

10n

BTEMP

VibraPWM

MCUGenIO4

CCONT

MAD

Figure 11: Battery Temperature

The RTC backup is rechargable polyacene battery, which has a capacity of 50uAh (@3V/
2V) The battery is charged from the main battery v o ltage by the CHAPS when the main
battery voltage is over 3.2V. The charging current is 200uA (nominal).

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Table 8: Regulator States for Different Modes of Oper atio n

Operating mode Vref RF REG VCOBBA VBB VSIM SIMIF

Pow er o ff
Pow er o n
Reset

Sleep

Off

On

On

Off

Note: CCONT includes five additional 2.8V regulators providing power to the RF section. These reg­ulators can be controlled either by the direct control signals from MAD or by the RF r egulator control
register in CCONT which MAD can update. Below are the listed the MAD control lines and the regu­lators they control:

- TxPwr controls VTX regulator (VR7)

- RxPwr controls VRX regulators (VR2 and VR5)

- SynthPwr controls VSYN_1 and VSYN_2 regulators (VR1_SW and VR4)
VCXOPwr controls VXO regulator (VR1)

Off Off Off Off Pull down
On/Off On On On On/off
Off

VR1 On
Off Off On On On/off

On On On Pull down

CCONT generates also a 1.5 V reference voltage VREF to COBBA, SUMMA, and CRFU. The
VREF voltage is also used as a reference to some of the CCONT A/D converters.

In addition to the above-mentioned signals, MAD includes TXP control signal, which goes
to SUMMA power control block and to the power amplifier. The transmitter power con­trol TXC is led from COBBA to SUMMA.

Audio Control

The audio control and processing is handled by the COBBA–GJP, which contains the
audio and RF codecs, and the MAD2, which contains the MCU, ASIC, and DSP blocks
handling and processing the audio signals.

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