Nokia 7110 Service manual

Programs After Market Services

Technical Documentation

SERVICE

MANUAL

[NMP Part No.0275393 ]

NSE–5 SERIES

CELLULAR

PHONES

Issue 1 07/99

Mobile Phones

Programs After Market Services

Technical Documentation

NSE–5 SERIES DIGITAL CELLULAR PHONES

SERVICE MANUAL

OVERALL CONTENTS

NSE–5 Series Core T ransceiver comprising

Chapter 1: General Information
Chapter 2: System Module

Mechanical Assembly

Service Software Instructions

Other Sections

Service Tools

Disassembly
Troubleshooting Instructions

Handsfree Unit HFU–2
Non–serviceable Accessories

Installation Instructions CARK–64/91

Issue 1 07/99

Programs After Market Services

Technical Documentation

This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will
be included with service bulletins.

While every endeavour has been made to ensure the accuracy of this document,
some errors may exist. If any errors are found by the reader, NOKIA MOBILE
PHONES Ltd should be notified in writing.

Please state:

Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)

IMPORTANT

Page(s) and/or Figure(s) in error

Please send to: Nokia Mobile Phones Ltd

PAMS Technical Documentation
PO Box 86
FIN–24101 SALO
Finland

Issue 1 07/99

Programs After Market Services

Technical Documentation

Warnings and Cautions

Please refer to the phone’s user guide for instructions relating to operation,
care and maintenance including important safety information. Note also the
following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES
FITTED WITH ELECTRONIC ENGINE MANAGEMENT
SYSTEMS AND ANTI–SKID BRAKING SYSTEMS. UNDER
CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE
VEHICLE DEALER/MANUFACTURER TO DETERMINE THE
IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF
ENERGY.

2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED

3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT,

Cautions:

1. Servicing and alignment must be undertaken by qualified

2. Ensure all work is carried out at an anti–static workstation and that

3. Ensure solder, wire, or foreign matter does not enter the telephone

IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE
ATMOSPHERES EG PETROL STATIONS (SERVICE STATIONS),
BLASTING AREAS ETC.

INCLUDING CELLULAR TELEPHONES, MAY INTERFERE WITH
THE FUNCTIONALITY OF INADEQUATELY PROTECTED
MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE
ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY
ALSO BE SUBJECT TO INTERFERENCE.

personnel only.

an anti–static wrist strap is worn.

as damage may result.

4. Use only approved components as specified in the parts list.

5. Ensure all components, modules screws and insulators are
correctly re–fitted after servicing and alignment. Ensure all cables
and wires are repositioned correctly.

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PAMS Technical Documentation

NSE–5 Series Transceivers

Chapter 1

General Information

Issue 1 07/99

NSE–5

PAMS

General Information

Technical Documentation

CONTENTS

Introduction 1 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules and Accessories 1 – 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modules 1 – 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Accessories 1 – 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mobile Accessories 1 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Specifications 1 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General Specifications 1 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Specifications 1 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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General Information

List of Figures

Figure 1. Phone shown with slide open and closed 1 – 5. . . . . . . . . . . . . . . . . .

Figure 2. A side Cross Sectional View 1 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 3. B Side Cross Sectional View 1 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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General Information

Technical Documentation

[This page intentionally left blank]

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General Information

Introduction

This chapter contains details of the technical specifications for the
Transceiver, general technical information and a list of products/modules
together with their associated order codes.

NSE–5 is a handheld cellular phones for the pan–European GSM network.
It has a dualband GSM/DCS1800 transceiver, providing 15 power levels with
a maximum output power of 2W in GSM (Class 4). It also has 16 power levels

with a maximum output power of 1W in DCS1800 (Class 1).

The basic handportable package offers the user a standard battery pack and
travel charger for charging from mains. Accessories and other options are

listed in this chapter also.

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Figure 1. Phone shown with slide open and closed

Page 1 – 5

NSE–5

PAMS

General Information

LCD Module connector

RF Shield can

RF Shield can

Technical Documentation

Antenna

Keypad + LED’s

RF connector

Batt connector

Sim

8 layer pcb

Page 1 – 6

Figure 2. A side Cross Sectional View

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Technical Documentation

Antenna

RF connector

Battery
contacts

sim card
contacts

General Information

IR Module pads

Vibra motor pads

RF Shield can

RF circuits

Baseband
circuits

Buzzer

Back up battery pads

System connector

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Figure 3. B Side Cross Sectional View

Page 1 – 7

NSE–5

PAMS

General Information

Modules and Accessories

Modules

Unit/type: Product code: Module code:
Transceiver NSE–5 0501580
System Module UG8 0201180
UIF Module 9480401
MNSE5 Mechanical Assembly 0261665

Accessories

All accessories are deemed non–serviceable unless stated

Slim Battery BLS–2 900 mAh 0670206
Standard Battery BMS–2 900 mAh 0671323

Technical Documentation

Vibrator Battery BMS–2V 900 mAh 0670204
Extended Battery BLS–4 1500 mAh 0670207
AC Travel Charger ACP–7E (EUR) 207–253 Vac 0675144
AC Travel Charger ACP–7U (US) 108–132 Vac 0675143
AC Travel Charger ACP–7P (US) 207–253 Vac 0675147
AC Travel Charger ACP–7C (US) 198–242 Vac 0675158
AC Travel Charger ACP–7X (UK) 207–253 Vac 0675145
AC Travel Charger ACP–7H (UK) 180–220 Vac 0675146
AC Travel Charger ACP–7X (AUS) 216–264 Vac 0675148
Fast Travel Charger ACP–8E (EUR) 90–264 Vac 0675195
Fast Travel Charger ACP–8U (US) 90–264 Vac 0675196
Fast Travel Charger ACP–8X (UK) 90–264 Vac 0675197
Fast Travel Charger ACP–8A (AUS) 90–264 Vac 0675199
Cigarette Lighter Charger LCH–9 0675120
Desktop Stand DCH–9 0700049
Mobile Holder MBC–1 0700060

Page 1 – 8

Mobile Holder MCC–1 0620043
Handsfree Unit HFU–2 0694049
Power Cable PCH–4J 0730055
HF Microphone HFM–8 0690016
HF Speaker HFS–12 0692008
Mounting Plate MKU–1 0620036
Swivel Mount HHS–9 0620037

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Headset HDC–9 0694053
Belt Clip BCH–12 0720098
External Antenna Cable XRC–1 0730103
Data Adapter Cable DAC–2 0730106

Mobile Accessories

Mobile Holder MBT–5 0620030
Handsfree Unit PHF–3 0694030

•HF/charger module DC9 0200656

• mechanics MPHF3 0260681

Power Cable PCH–4J 0730055
HF Microphone HFM–7 0690012

General Information

HF Speaker HFS–9 0692007
Mounting Plate MKE–7 0650021
Swivel Plate HHS–7 0650020
Power Cable XLC–1 0730060

Technical Specifications

General Specifications

Temperature range
(Extreme conditions)
–specifications fulfilled

Operating time (BLS–2S)

S talk time 2h 30min – 4h 30min
S standby time 55–260h

Battery voltage (nominal)

(Max)

Dimensions (h x w x d) 125 x 53 x 24 mm

–20_C to +55_C

3.6v

4.1

Weight
S transceiver + BLS–2S (battery) 141g

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General Information

Technical Documentation

Electrical Specifications

Parameter Unit

Cellular system GSM and DCS1800
RX frequency band 935.2 ... 959.8 MHz GSM

1805.2 ... 1879.8 MHz DCS1800

TX frequency band 890.2 ... 914.8 MHz GSM

1710.2 ... 1784.8 MHz DCS1800

Output power +5 ...+33 dBm / 3.2 mW ... 2 W GSM

+0 ... +30 dBm/ 1 mW ... 1 W DCS1800

Duplex spacing 45 MHz GSM

95 MHz DCS1800

Number of RF channels 124 GSM

374 DCS1800
Channel spacing 200 kHz
Number of TX power levels GSM 15 DCS1800 16
Sensitivity, static channel –102 dBm/ BER < 2.439 % GSM

–100 dBm/ BER < 2.439 % DCS1800
Frequency error, static channel < 0.1 ppm
RMS phase error < 5.0
Peak phase error < 20.0

o

o

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NSE–5 Series Transceivers

Chapter 2

System Module

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NSE–5
System Module

Technical Documentation

Contents

System Connector 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC Connector 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Slide Microphone 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Slide Connector 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Roller Interface 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Keys and Keymatrix 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Headset Connector 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Connector 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Vibra Alerting Device 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SIM Card Connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAMS

Page No

Infrared Transceiver Module 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Real Time Clock 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Baseband Module 3 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Summary 3 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution 3 – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Up 3 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power up with a charger 3 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Up With The Power Switch (PWRONX) 3 – 22. . . . . . . . . . . . . . . . .

Power Up by RTC 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Up by IBI 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Acting Dead 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Active Mode 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Sleep Mode 3 – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery charging 3 – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Startup Charging 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Overvoltage Protection 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Removal During Charging 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Different PWM Frequencies ( 1Hz and 32 Hz) 3 – 27. . . . . . . . . . . . . . . . . .

Battery Identification 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Temperature 3 – 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply Voltage Regulators 3 – 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Audio Control 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Microphone and Earpiece 3 – 32. . . . . . . . . . . . . . . . . . . . . . . . . . . .

External Audio Connections 3 – 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Audio Connections 3 – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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4–wire PCM Serial Interface 3 – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Speech Processing 3 – 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alert Signal Generation 3 – 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Digital Control 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MAD2PR1 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MAD2PR1 pinout 3 – 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Memories 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Program Memory 32MBit Flash 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SRAM Memory 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EEPROM Emulated in FLASH Memory 3 – 47. . . . . . . . . . . . . . . . . . . . . . .

MCU Memory Requirements 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Flash Programming 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IBI Accessories 3 – 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Phone Power–on by IBI 3 – 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Module

IBI power–on by phone 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MCU Memory Map 3 – 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Module 3 – 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Frequency Plan 3 – 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC Regulators 3 – 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Frequency Synthesizers 3 – 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter 3 – 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AGC 3 – 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AFC function 3 – 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interfacing 3 – 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Interface 3 – 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

LEDs 3 – 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Plastic Window 3 – 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Dust Seal 3 – 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

LCD Adhesive 3 – 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Reflector 3 – 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connector 3 – 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Light Guide 3 – 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UI Module Connection to main PCB 3 – 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts Lists 3 – 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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System Module

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List of Figures.

Figure 1. System Connector – module 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 2. System Connector – detailed. 3 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 3. Combined headset, system connector audio signals 3 – 13. . . . . . . .

Figure 4. Battery connector locations 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 5. Sim Card Reader Ultra phone 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 6. IR transmission frame – example 3 – 16. . . . . . . . . . . . . . . . . . . . . . . .

Figure 7. Block Diagram 3 – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 8. Baseband power distribution 3 – 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 9. Battery Charging 3 – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 10. Battery Identification 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 11. Battery Temperature 3 – 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 12. Audio Control 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAMS

Figure 13. Combined headset and system connector audio signal 3 – 33. . . . .

Figure 14. IBI Power on 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 15. Power Distribution 3 – 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 16. Frequency Synthesisers 3 – 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 17. Receiver Block Diagram 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 18. Transmitter Block Diagram 3 – 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 19. UI module assembled 3 – 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 20. Mounting of LEDs for backlight. Seen from underside. 3 – 66. . . . .

Figure 21. Light guide. 3 – 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 22. Marking specification for the light guide 3 – 68. . . . . . . . . . . . . . . . . .

Schematics/ Layouts

System Block Diagram A –1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF and BB Interconnections A –2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Baseband Block A –3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Audio A –4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CPU A –5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Infrared Module A –6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power A –7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Interface A –8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CRFU3 A –9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PA A –10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SUMMA A –11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Component Layout – Top A –12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Component Layout – Bottom A –13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Page 2 – 4

Issue 1 07/99

PAMS

NSE–5

Technical Documentation

System Connector

This section describes the electrical connection and interface levels

between the baseband, RF and UI parts. The electrical interface

specifications are collected into tables that cover a connector or a defined

interface.

The system connector includes the following parts:

– DC connector for external plug–in charger and a desktop charger
– System connector for accessories and intelligent battery packs

The System connector is used to connect the transceiver to accessories.

System connector pins can also be used to connect intelligent battery

packs to the transceiver.

Contact 1

System Module

2

3

4

6

Slide Detect

7

8

13

Solderable element,

2 pcs

14

DC–jack
2,3,4

Contact 5

Contacts

8...13
Contact 14

Figure 1. System Connector – module

Cable/Cradle connector
guiding/fixing hole, 2 pcs

Issue 1 07/99

Page 2 – 5

NSE–5
System Module

B side view

Fixing pads (2 pcs)

PAMS

Technical Documentation

IBI connector

(6 pads)

14

8

1

7

A side view

PCB

DC Jack

A

B

Charger pads (3 pcs)

Figure 2. System Connector – detailed.

Table 1. System connector signals.

Microphone

acoustic ports BB

Bottom

connector (6 pads)

Cable locking holes (3 pcs)

Pin Name Function Description

1 V_IN Bottom charger contacts Charging voltage.
2 L_GND DC Jack Logic and charging ground.
3 V_IN DC Jack Charging voltage.
4 CHRG_CTRL DC Jack Charger control.
5 CHRG_CTRL Bottom charger contacts Charger control.
6 MIC–P Slide Detect Holder Slide Detect
7 MIC–N Slide Detect Holder Gnd
8 XMIC Bottom & IBI connectors Analog audio input.
9 SGND Bottom & IBI connectors Audio signal ground.

10 XEAR Bottom & IBI connectors Analog audio output.

11 MBUS Bottom & IBI connectors Bidirectional serial bus.

Page 2 – 6

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Technical Documentation

Table 1. System connector signals.

(continued)

12 FBUS_RX Bottom & IBI connectors Serial data in.
13 FBUS_TX Bottom & IBI connectors Serial data out.
14 L_GND Bottom charger contacts Logic and charging ground.

System Module

DescriptionFunctionNamePin

DC Connector

The electrical specifications in NO TAG shows the idle voltage produced
by the acceptable chargers at the DC connector input. The absolute
maximum input voltage is 18V due to the transient suppressor that is
protecting the charger input.

Slide Microphone

The microphone is connected to the slide by means of springs it has a
microphone input level specified in NO TAG. The microphone requires
bias current to operate which is generated by the COBBA_GJP ASIC.

Slide Connector

An Interrupt signal to MAD2PR1 determines whether the slide is in an
open or closed position.

Roller Interface

A mechanical solution is implemented and three interrupts are fed to the
MAD2PR1

Keys and Keymatrix

0–9, *, #, send, end, soft_1, soft_2, power_on_off, roller_push,

Headset Connector

The external headset device is connected to the system connector, from
which the signals are routed to COBBA_GJP microphone inputs and
earphone outputs.

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Page 2 – 7

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aud u

(from

y

accessory

de ec

)

System Module

NA

MICN

mouted

in slide

PAMS

Technical Documentation

Table 2. Mic signals of the system connector

0 2 12.5 mV Connected to COBBA_GJP MIC2N

input. The maximum value corre­sponds to1 kHz, 0 dBmO network
level with input amplifier gain set to
32 dB. typical value is maximum
value – 16 dB.

NA

MICP

0 2 12.5 mV Connected to COBBA_GJP MIC2P

mounted

in slide

Pin IB-

Name Function Min Typ Max Unit Description

pin

10 Yes XEAR Analog

audio out­put

phone to
accessor

input. The maximum value corre­sponds to1 kHz, 0 dBmO network
level with input amplifier gain set to
32 dB. typical value is maximum
value – 16 dB.

Table 3. System/IBI connector

47 W Output AC impedance (ref.

GND) resistor tol. is 5%

10 mF Series output capacitance

16 300 W Load AC impedance to GND:

Headset

4.7 10 kW Load AC impedance to
SGND: External accessory.

Page 2 – 8

Accessory
detection
(fom ac­cessory to
p

phone

1.0 V

Max. output level. No load

p–p

100 kW Resistance to accessory

ground (in accessory)

0.5 V DC V oltage (ref. SGND). Ex­ternal accessory

6.8 kW Load DC resistance to
SGND. External accessory

0 0.2 V DC V oltage (ref. SGND).

Headset with closed switch

16 1500 W Load DC resistance to

SGND. Headset with closed
switch

2.8 V DC V oltage (ref. SGND). No
accessory, or headset with
open switch

47 kW Pull–up resistor to VBB in

phone

Issue 1 07/99

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micro
(from ac

hone)

hone to

accessory to

a

Separated

hone

y)

ry)

NSE–5

Technical Documentation

Table 3. System/IBI connector (continued)

Pin

pin

8 Yes XMIC Analog

audio in­put
(from ac­cessory to
phone)

Headset
phone in-

put
cessory to

p

System Module

DescriptionUnitMaxTypMinFunctionNameIB-

2.0 2.2 kW Input AC impedance
100 W Accessory source AC imped-

ance

1 V

Maximum signal level

p–p

2.0 2.2 kW Input AC impedance

-

-

2.5 kW Headset source AC imped­ance

-

­100 600 mA Bias current

200 mV-

Maximum signal level

p–p

Accessory
mute.
Voltage
compared
to SGND.
(from
phone to
accesso­ry)

Headset
detection
(from
accessory to
phone)
(NO TAG)

9 Yes SGND Audio sig-

nal
ground.

p
from
phone

GND

(from
p

phone to
accesso­r

2.5 2.9 V Not muted

0 1.55 V Muted, without headset

1.6 2.0 2.4 V Comparator reference in ac­cessory

1.47 2.9 V No headset (ref. SGND).
0 1.33 V Headset connected (ref.

SGND).

49 kW Pull–up resistor to VBB in

phone

47 W Output AC impedance (ref.

GND)

10 mF Series output capacitance

380 W Resistance to phone ground

(DC) (in phone)

100 kW Resistance to accessory

ground (in accessory)

–0.2 +0.2 V DC voltage compared to

phone GND

–5 +5 V DC voltage compared to ac-

cessory GND

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Page 2 – 9

NSE–5

da a u

y)

ry)
(from ac

y

al bus

K

Flash seri-

cessory to

System Module

PAMS

Technical Documentation

Table 3. System/IBI connector (continued)

Pin

pin

13 Yes FBUS

_TX

_

12 Yes FBUS

_RX data in

Serial
data out
(from
phone to
accesso­r

Serial

-

­cessory to
phone)

DescriptionUnitMaxTypMinFunctionNameIB-

0.1 0.8 V Output low voltage @ IOL 
4 mA (ref. GND)

1.7 2.8 V Output high voltage @ IOH 
4 mA (ref. GND)

47 kW Pull–up resistor in phone

220 kW Pull–down resistor in acces-

sory

47 100 W Serial (EMI filtering) resistor

in phone

150 pF Cable capacitance

1 ms Rise/Fall time

0 0.8 V Input low voltage (ref. GND)

2.0 2.8 V Input high voltage (ref. GND)

220 kW Pull–down resistor in phone

47 kW Pull–up resistor in accessory

2.2 kW Serial (EMI filtering) resistor
in accessory

11 Yes MBUS Bidirec-

tional seri-

FLAS
H_CL

al data
clock
(from ac-

phone)

150 pF Cable capacitance

2 ms Rise/Fall time @ 115kbits/s
1 ms Rise/Fall time @ 230kbits/s

0 0.8 V Input low voltage (ref. GND)

2.0 2.8 V Input high voltage (ref. GND)
0 0.8 V Output low voltage @ IOL 

-

4 mA (ref. GND)

2.1 2.9 V Output high voltage @ IOH 

100 mA (ref. GND)

4.7 kW Pull–up resistor in phone

220 kW Pull–down resistor in acces-

sory

100 W Serial (EMI filtering) resistor

in phone

200 pF Cable capacitance

5 ms Rise/Fall time @ 9600 bits/s

Page 2 – 10

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PAMS

CLc

,

(from ac

hone)

(

NSE–5

Technical Documentation

Table 3. System/IBI connector (continued)

Pin

pin

2,

14

– L_GNDLogic and

charging
ground
(sepa­rated from
phone
GND by
EMI com­ponents)

4,5 – CHRG

_CTR

_

Charger
control
(from
phone to
accessory

System Module

DescriptionUnitMaxTypMinFunctionNameIB-

0 1.0 A Ground current

0 0.8 V Output low voltage @ IOL 

20 mA

1.7 2.9 V Output high voltage @ IOH 

20 mA

32 37 Hz PWM frequency

1,3 – VIN Fast

charger
cessory to

phone)

Slow
charger
(fom ac­cessory to
phone)

1 99 % PWM duty cycle

20 kW Serial (EMI filtering) resistor

in phone

30 kW Pull–down resistor in phone
0 8.5 V Charging voltage.
0 0.85 A Charging current.

-

­100 mV-

100 mV-

100 mV-

200 mV-

0 15 V

p–p

p–p

p–p

p–p

pea

k

Ripple voltage @ f =

20...200Hz, load = 3 & 10 W
Ripple voltage @ f = 0.2...30

kHz, load = 3 & 10 W
Ripple voltage @ f > 30 kHz,

load = 3 & 10 W
Total ripple voltage @ f > 20

Hz, load = 3 & 10 W
Charging voltage (max. = un-

loaded, +20 % overvoltage in
mains).

0 1.0 A

Charging current (max. =

pea

shorted, +20 % overvoltage

k

in mains).

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System Module

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Technical Documentation

Baseband

HOOKDET

MAD

HEADDET

CCONT

EAD

HF

COBBA
–GJP

AUX
OUT

PD2

AGND

10

10k

100n

AGND

10u

27p

100n

1u

220k

220k

VBB VBB

2k2 47k

2k2

VBB

47k

100MHz

33R

AGND

47R

XEAR

LGND

PC–Board

R01

SW01

+

+

+

C01

C03

C02

HFCM

MIC1N

MIC1P

MIC3N

MIC3P

AGND

100n

100n

AGND

2k2

2k2

100R

100R

XMIC

SGND

L01

Z01

100n

100n

AGND AGND AGND

Note 1: Grey resistor are in the border of ”EMI clean” and ”dirty” areas.
Note 2: AGND is connected directly to the GND on PCB close to HF parts.
Note 3: ESD protection diodes are not shown.

Figure 3. Combined headset, system connector audio signals

27p

27p

330R

R01= 100R
C01=33uF
C02=1000pF
C03=22pF
L01=MMZ2012Y6
01BT/TDK

Page 2 – 12

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Technical Documentation

Battery Connector

The BSI contact on the battery connector is used to detect when the
battery is removed with power switched on enabling the SIM card
operation to shut down first. The BSI contact in the battery pack should be
shorter than the supply power contacts to give enough time for the SIM
shut down.

12

34

System Module

No metal in these areas!
old connector type

B side view.

phone

Vibra Alerting Device

A vibra alerting device is used to give a silent signal to the user of an
incoming call it is mounted in the B–cover. A special battery pack contains
a vibra motor. The vibra is controlled with one PWM signal by the
MAD2PR1 via the BTEMP battery terminal.

Figure 4. Battery connector locations

+VBATT

1

BSI

2

BTEMP

3

–VBATT

4

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System Module

SIM Card Connector

The SIM card connector is located on the PCB. Only small SIM cards are
supported.

PAMS

Technical Documentation

321

456

Figure 5. Sim Card Reader Ultra phone

Table 4. SIM Connector Electrical Specifications

Pin Name Parameter Min Typ Max Unit Notes

1 GND GND 0 0 V Ground
2 VSIM 5V SIM

Card

4.8

2.8

5.0

3.0

5.2

3.2

V Supply voltage

3V SIM

Card

3 DATA 5V Vin/Vout

3V Vin/Vout

4 SIMRS

T

5V SIM

Card

4.0
0

2.8
0

4.0

2.8

”1”
”0”
”1”
”0”

”1”
”1”

VSIM

0.5

VSIM

0.5

VSIM
VSIM

V SIM data

Trise/Tfall max 1us

V SIM reset

3V SIM

Card

5 SIMCLKFrequency

3.25

MHz

SIM clock

Trise/Tfall

6 VPP 5V SIM

Card

3V SIM

Card

VSIM supply voltages are specified to meet type approval requirements
regardless the tolerances in components.

Page 2 – 14

4.8

2.8

5.0

3.0

25

5.2

3.2

ns

V Programming voltage

pin6 and pin2 tied to-

gether

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Technical Documentation

Infrared Transceiver Module

An infrared transceiver module is designed as a substitute for hardwired
connections between the phone and a PC. The infrared transceiver
module is a stand alone component. In DCT3 the module is located
inside and at the top of the phone.

The Rx and Tx is connected to the FBUS via a dual bus buffer. The
module and buffer is activated from the MAD2_pr1 with a pull up on IRON.
The Accif in MAD2_pr1 performs pulse encoding and shaping for
transmitted data pulses and detection and decoding for received data
pulses.

The data is transferred over the IR link using serial FBUS data at speeds

9.6, 19.2, 38.4, 57.6 or 115.2 kbits/s, which leads to maximum throughput
of 92.160 kbits/s. The used IR module complies with the IrDA SIR
specification (Infra Red Data Association), which is based on the HP SIR
(Hewlett–Packard‘s Serial Infra Red) consept.

System Module

The Following figure gives an example of IR transmission pulses. In IR
transmission a light pulse correspondes to 0–bit and a ”dark pulse”
correspondes to 1–bit.

constant pulse

IR TX

UART TX

startbit stopbit1 0100110

Figure 6. IR transmission frame – example

The FBUS cannot be used for external accessory communication, when
the infrared mode is selected. Infrared communication reserves the FBUS
completely.

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System Module

Real Time Clock

Requirements for a real time clock implementation are a basic clock
(hours and minutes), a calender and a timer with alarm and power on/off
–function and miscellaneous calls. The RTC will contain only the time
base and the alarm timer but all other functions (e.g. calendar) will be
implemented with the MCU software. The RTC needs a power backup to
keep the clock running when the phone battery is disconnected. The
backup power is supplied from a rechargable polyacene battery that can
keep the clock running for approximately ten minutes. If the backup has
expired, the RTC clock restarts after the main battery is connected. The
CCONT resets the MCU in approx 62ms and the 32kHz source is settled
(after approx. 1s).

The CCONT is an ideal place for an integrated real time clock as the asic
already contains the power up/down functions and a sleep control with the
32kHz sleep clock, which is always running when the phone battery is
connected. This sleep clock is used for a time source to a RTC block.

PAMS

Technical Documentation

Page 2 – 16

Issue 1 07/99