Nokia 6820 Service Manual 02 rh26 sysmod
CCS Technical Documentation
RH-26 Series Transceivers
2 - System Module
Issue 1 02/04 ©Nokia Corporation
RH-26
2 - System Module CCS Technical Documentation
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CCS Technical Documentation 2 - System Module
Table of Contents
Page No
Glossary of Terms.......................................................................................................... 4
System Module .............................................................................................................. 7
Baseband........................................................................................................................ 8
Technical summary ......................................................................................................8
Main technical specifications ......................................................................................9
DC characteristics ..................................................................................................... 9
Internal signals and connections ............................................................................. 12
External signals and connections ............................................................................ 13
Baseband functional description ................................................................................16
Modes of operation.................................................................................................. 16
Battery..................................................................................................................... 17
Charging.................................................................................................................. 19
Supported chargers.................................................................................................. 21
Charger interface protection.................................................................................... 24
Power up and reset .................................................................................................. 24
A/D channels........................................................................................................... 25
Bluetooth................................................................................................................. 26
Keypads................................................................................................................... 27
LCD & keyboard illumination ................................................................................ 27
LCD......................................................................................................................... 29
IR module................................................................................................................ 29
Backup battery......................................................................................................... 29
SIM interface........................................................................................................... 30
System connector .................................................................................................... 31
Internal audio........................................................................................................... 34
Memory block......................................................................................................... 35
RF interface block................................................................................................... 35
Security ......................................................................................................................36
After sales interface ...................................................................................................36
FBUS interface........................................................................................................ 36
MBUS Interface ...................................................................................................... 36
RF................................................................................................................................. 37
Main technical specifications ....................................................................................38
Nominal and maximum ratings............................................................................... 38
RF frequency plan................................................................................................... 38
DC characteristics ................................................................................................... 39
Typical current consumption................................................................................... 40
RF characteristics .......................................................................................................42
Channel numbers and frequencies........................................................................... 42
Main RF characteristics........................................................................................... 42
TX characteristics.................................................................................................... 42
RX characteristics ......................................................................................................43
RF block diagram ......................................................................................................43
Receiver .....................................................................................................................45
Transmitter .................................................................................................................46
Connections ...............................................................................................................46
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Antenna ................................................................................................................... 46
RF-BB interface ...................................................................................................... 47
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Glossary of Terms
ACI Accessory Control Interface
ADC Analogue-Digital Converter
AEC Acoustic Echo Canceller
AFC Automatic Frequency Control
AGC Automatic Gain Control
AIF Application Interface
ALWE Background noise suppressor
AMS After Market Service
API Application Programming Interface
ARM Processor architecture
ASIC Application Specific Integrated Circuit
BB Baseband
CMT Cellular Mobile Telephone (MCU and DSP)
CPU Central Processing Unit
CTSI Clocking Timing Sleep Interrupt
COG Chip On Glass
CSP Chip Scale Package
CSTN Color Super Twisted Nematic
DAC Digital-Analog Converter
DAI Digital Audio Interface
DB Dual band
DCN Offset Cancellation control signal
DLL Dynamic Link Library
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DRC Dynamic Range Controller
DSP Digital Signal Processor
EGSM Extended – GSM
EFR Enhanced Full Rate
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
ESD Electro Static Discharge
EXT RF External RF
FBUS Asynchronous Full Duplex Serial Bus
GPRS General Packet Radio Service
GSM Global System for Mobile communications
HS Half Rate Speech
HSCSD High Speed Circuit Switched Data
IC Integrated Circuit
IHF Integrated Hands Free
I/O Input/Output
IRDa Infrared Association
LCD Liquid Crystal Display
LDO Low Drop-Out
LNA Low Noise Amplifier
MBUS 1-wire half duplex serial bus
MCU Micro Controller Unit
MDI MCU-DSP Interface
MFI Modulator and Filter Interface
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PA Transmit Power Amplifier
PC Personal Computer
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
PIFA Planar Inverted F-antenna
PWB Printed Wiring Board
RF Radio Frequency
SIM Subscriber Identity Module
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.
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System Module
The system module TB6 consists of Radio Frequency (RF) and Baseband (BB) blocks. User
Interface (UI) contains display, keyboard, bluetooth, IR link, HF/HS connector and audio
parts. Part of the keyboard is implemented in a separate flip module, TF6.
The electrical part of the TB6 and half of the qwerty keyboard is located inside the flip
module.
RH-26 includes a Pop-Port™ accessory interface. Both two and three wire type of chargers are supported. BL-5C Li-ion battery with nominal capacity of 850 mAh is used as
main power source.
The baseband blocks provide the MCU, DSP, external memory interface and digital control functions in the UPP ASIC. Power supply circuitry, charging, audio processing and RF
control hardware are located in the UEM ASIC.
The purpose of the RF block is to receive and demodulate the radio frequency signal from
the base station and to transmit a modulated RF signal to the base station.
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Baseband
Technical summary
The main functionality of the baseband is implemented into two ASICs:
- UPP (Universal Phone Processor) and
- UEMK Edge (Universal Energy Management)
Figure 1: Baseband block description
UPP8Mv3
Combo
Memor
FLASH 128Mbit
& utRAM 16MBit
Keyboards
Engine QWERTY
Engine control
Flip T9
C
Flip QW ERTY
LCD
Passive colour STN
Led driver
Keyboard &
display
illumination
SIM
DEMI
RF-BB Interface
UEMK
Edge
1.8 V
Battery
BL-5C
BU
IR
Bluetooth
Vibra
Accessory
Regulator
System connector
DC
ack
IHF
IHF Amp
LM4890
HWA
Baseband is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core
voltages can be programmed to 1.053V, 1.35V, 1.57V (default) and 1.8V. UEMK includes
a 6-linear LDO (low drop-out) regulator for baseband and 7 regulators for RF. It also
includes 4 current sources for biasing purposes and internal usage. UEMK also includes
SIM interface, which supports both 1.8V and 3V SIM cards.
The baseband architecture supports a power saving function called ”sleep mode”. This
sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and
baseband. During the sleep mode, the system runs from a 32 kHz crystal. The phone is
waken up by a timer running from this 32 kHz clock supply or from external interrupt.
The sleeping time is determined by network parameters. The sleep mode is entered when
both the MCU and the DSP are in standby mode and the normal VCTCXO clock has been
switched off. Bluetooth has its own sleep period that is not aligned with phone sleep.
CSR BC02
Camera
CIF
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A real time clock function is integrated into the UEMK, which utilises the same 32kHz
clock supply as the sleep clock. A backup power supply is provided for the RTC-battery,
which keeps the real time clock running when the main battery is removed. The backup
power supply is a rechargeable surface mounted cell capacitor. The backup time with the
cell capacitor is 15 minutes minimum.
The interface between the baseband and the RF section is mainly handled by a UEMK
ASIC. UEMK provides A/D and D/A conversion of the in-phase and quadrature receive and
transmit signal paths and also A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEMK supplies the analog TXC and AFC
signals to the RF section according to the UPP DSP digital control. Data transmission
between the UEMK and the UPP is implemented using two serial busses, DBUS for DSP
and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech
processing is handled by the DSP inside UPP ASIC. UEMK is a dual voltage circuit, the
digital parts are running from the baseband supply 1.8V and the analogue parts are running from the analogue supply 2.78V also VBAT is directly used by some specific blocks.
The baseband supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is done by the UEMK
according to control messages from the UPP. Keypad tones, DTMF, and other audio tones
are generated and encoded by the UPP and transmitted to the UEMK for decoding. An
external vibra alert control signal is generated by the UEMK with separate PWM output.
RH-26 has two external serial control interfaces: FBUS and MBUS. FBUS can be accessed
through service test pattern and Pop-PortTM System Connector. FBUS interface and
MBUS can be accessed through the service test pattern.
EMC shielding is implemented using soldered metal cans. Heat generated by the circuitry
is conducted out via ground planes located in the PWB.
The RH-26 PWB is implemented into an 8-layer selective OSP coated PWB using buried
via technology.
Main technical specifications
DC characteristics
Regulators and supply voltage ranges
Table 1: Baseband regulators
Signal Min Nom Max Note
VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I
VFLASH2 2.70V 2.78V 2.86V I
max
max
I
sleep
max
= 80mA
= 70mA
= 1.5mA
= 40mA
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VSIM 1.745V
2.91V
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.283V
1.492V
1.710V
1.8V
3.0V
1.053V
1.35V
1.57V
1.8V
1.855V
3.09V
1.106V
1.418V
1.649V
1.890V
I
= 25mA
max
I
= 0.5mA
sleep
= 150mA
max
= 0.5mA
I
sleep
I
= 200mA
max
I
= 0.2mA
sleep
Default value 1.57V
Table 2: Accessory regulator
Signal Min Nom Max Note
Vout 2.70V 2.78 2.86V I
= 150mA
max
I
quiescent
< 1.5µA
Enable controlled
through GenIO(0)
Table 3: RF regulators
Signal Min Nom Max Note
VR1A / VR1B 4.6V 4.75V 4.9V I
VR2 2.70V
3.20V
2.78V
3.3V
2.86V
3.40V
VR3 2.70V 2.78V 2.86V I
VR4 2.70V 2.78V 2.86V I
VR5 2.70V 2.78V 2.86V I
VR6 2.70V 2.78V 2.86V I
VR7 2.70V 2.78V 2.86V I
max
I
max
max
max
I
sleep
max
I
sleep
max
I
sleep
max
= 10mA
= 100mA
= 20mA
= 50mA
= 50mA
= 50mA
= 45mA
Table 4: Current sources
Signal Min Nom Max Note
IPA1 and IPA2 0mA – 5mA Programmable, +/-6%
V
= 0V - 2.7V
IPA1,2
= 0.1mA
= 0.1mA
= 0.1mA
IPA3 and IPA4 95µA 100µA 105µA V
IPA3,4
= 0V - 2.7V
(used internally in the UEMK)
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Table 5: External BT regulator characteristics
Power source Voltage (V)
Max. load
(mA)
Function
Min Typ Max
VBth 2.72 2.80 2.86 70mA From external 2.8V reg-
ulator
VIO 1.72 1.80 1.88 10 mA I/O-voltage to ensure
compatible IO levels.
Table 6: External camera regulator characteristics
Power source Voltage (V)
Max. load
(mA)
Function
Min Typ Max
VCAMDIG 1.72 1.80 1.88 150 mA I/O-voltage to ensure com-
patible IO levels.
Figure 2: Power distribution diagram
Baseband
BT
Camera
VLED+
White LED
Driver
Battery
Reg.
2.8V
Reg.
1.8V
VBAT
VBAT
Audio
Amplifier
PA Supply
UEM
RTC
RF Regulators
VFLASH2
Baseband
Regulators
CHACON
Accessory
Regulator
Vout
System Connector
VR1A
VR1B
VR2-7
VSIM
VCORE
VANA
VIO
VFLASH1
6
SIM
UPP
Combo
Memor
LCD
Backup
battery
IRDA
VBAT
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Internal signals and connections
Table 7: Internal microphone
Signal Min Nom Max Condition Note
MICP 200mV
2.0 V 2.1 V 2.25 V DC
MICN 2.0V 2.1V 2.25V DC
Table 8: Internal speaker
Signal Min Nom Max Condition Note
EARP
0.75V 0.8V
EARN
0.75V 0.8V
Table 9: Bluetooth clock specifications
Bluetooth clock Specification
BTClk Single ended input
2.0 V
0.85V
2.0 V
0.85V
pp
pp
AC 2.2kΩ to MIC1B
pp
AC
DC
AC
DC
Differential output
(V
= 4.0 Vpp)
diff
Frequency 26MHz (VCTCXO)
Min. level 200 mVpp
Max. level 1.8 Vpp (VIO)
Input impedance Input impedance < 4 pF and >10kohm
Phase noise Max. –129 dBc/Hz @ 1 kHz at 26 MHz
Phase Jitter 15ps rms
Settling time Max. 5ms (BTHostWakeUp -> BTClk stabile)
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External signals and connections
Table 10: UI connector
Pin Signal Min Nom Max Condition Note
16 VDDI 1.72V 1.8V 1.88V Logic voltage supply
Connected to VIO
15 XRES 0.7*VDDI
0
1us t
14 SDA 0.7*VDDI
0
100ns t
100ns t
13 SCLK 0.7*VDDI
0
250ns t
100ns t
100ns t
12 CXS 0.7*VDDI
0
60ns t
VDDI
0.3*VDDI
VDDI
0.3*VDDI
VDDI
0.3*VDDI
6.5MHz
VDDI
0.3*VDDI
Logic ’1’
Logic ’0’
rw
Logic ’1’
Logic ’0’
sds
sdh
Logic ’1’
Logic ’0’
Max frequency
scyc
shw
slw
Logic ’1’
Logic ’0’
css
Reset
Active low
Reset active
Serial data
Data setup time
Data hold time
Serial clock input
Clock cycle
Clock high
Clock low
Chip select
Active low
CXS low before SCLK rising
edge
100ns t
csh
CXS low after SCLK rising edge
11 GND 0V
10 GND 0V
9 GND 0V
8 GND 0V
7 GND 0V
6 GND 0V
5 VDD VDD 2.70V 2.78V 2.86V Supply Voltage.
Connected to VFLASH1
4 GND 0V
3 GND 0V
2 VLED- 0V
0.5V
LED off
LED on
Feedback Voltage to LED Driver
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1 VLED+ 0V
9V
LED off
LED on
Supply Voltage for LEDs
Table 11: FLIP connector
Pin Signal Min Nom Max Condition Note
1 FLIPCLK 0.7*VIO
0
VIO
0.3*VIO
Logic ’1’
Logic ’0’
Bus clock for flip
module
2 VBAT 3.7V 4.2V Supply for flip µC
3 FLIPDATA 0.7*VIO
0
VIO
0.3*VIO
Logic ’1’
Logic ’0’
I/O data for flip
module
Table 12: DC connector
Pin Signal Min Nom Max Condition Note
1 VCHAR 11 . 1V
7.0 V
RMS
8.4 V
peak
RMS
16.9 V
7.9 V
1.0 A
9.2 V
850 mA
peak
RMS
peak
RMS
Standard
charger
Fast charger
Charger positive
input
2 CHGND 0 Charger ground
Table 13: Pop-Port
TM
system connector
Pin Signal Description Spectral Range U/I levels Impedance Notes
1 CHARGE V Charge DC 0-9 V / 0.85 A
2 GND Charge GND 0.85 A 100 mΩ (PWB + conn.)
3 ACI ACI 1 kbit/s Dig 0 / 2.78V 47 Ω Insertion & removal
detection
4 VOUT DC out DC 2.78V / 70mA 100 mΩ (PWB + conn.) 200mW
5 NC DC in DC 4.375-5.25V
6 FBUS RX FBUS 115k FBus 0 / 2.78V 33 Ω
7 FBUS TX FBUS 115k FBus 0 / 2.78V 33 Ω
8 GND Data GND
9 XMIC N Audio in 300 - 8k 1Vpp & 2.78V DC
10 XMIC P Audio in 300 - 8k 1Vpp & 2.78V DC
11 HSEAR N Audio out 20 - 20k 1Vpp 10 Ω
12 HSEAR P Audio out 20 - 20k 1Vpp 10 Ω
13 NC Not Connected
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