Nokia 6620 Service Manual 06 nhl12 baseband

Nokia Customer Care

NHL-12 Series Transceivers

6 - Baseband Description &

Troubleshooting

Issue 3 05/2005 COMPANY CONFIDENTIAL

NHL-12 Company Confidential

6 - Baseband Description & Troubleshooting Nokia Customer Care

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NHL-12 6 - Baseband Nokia Customer Care

Glossary of Terms............................................................................................... 5

Baseband Top-Level Description ......................................................................8

Baseband block diagram ................................................................................... 8

Environmental specifications ............................................................................. 9

Normal and extreme voltages ..........................................................................9

Humidity ...........................................................................................................9

Frequencies in baseband................................................................................... 9

Baseband Architecture..................................................................................... 11

CMT side.......................................................................................................... 11

CMT memories ..............................................................................................12

APE side.......................................................................................................... 13

APE memories ...............................................................................................13

Energy management........................................................................................ 14

Power supply modes ......................................................................................14

Battery BL-5C ................................................................................................16

Current gauge (Zocus) ...................................................................................17

RTC capacitor ................................................................................................17

Power distribution ..........................................................................................18

DC characteristics............................................................................................ 19

Regulators ......................................................................................................19

Voltage regulators in BB for RF....................................................................... 21

Charging .......................................................................................................... 22

Audio circuitry .................................................................................................. 22

Earpiece .........................................................................................................23

Internal microphone ....................................................................................... 23

Integrated hands-free .....................................................................................23

Audio accessory receive path ........................................................................23

Audio control signals ......................................................................................24

Acoustics.......................................................................................................... 24

Earpiece acoustics .........................................................................................24

IHF speaker acoustics ...................................................................................24

Microphone acoustics .................................................................................... 24

Vibra motor ....................................................................................................25

Audio modes.................................................................................................... 25

Hand portable ................................................................................................25

Integrated hands-free audio mode (IHF) ........................................................25

Accessory audio mode ................................................................................... 26

APE audio mode ............................................................................................26

Bluetooth audio mode ....................................................................................26

Baseband External and Internal Signals and Connections .......................... 27

CMT internal signals and connections............................................................. 27

CMT external signals and connections............................................................ 27

BB-RF Interface................................................................................................. 30

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Nokia Customer Care 6 - Baseband

NHL-12 User Interface....................................................................................... 32

S60 - LCD interface ......................................................................................... 32

LCD & keypad illumination .............................................................................34

Current consumption ......................................................................................35

Maximum ratings ............................................................................................ 35

Camera interface ............................................................................................. 35

Keyboard.......................................................................................................... 36

Bluetooth.......................................................................................................... 36

SIM Interface...................................................................................................... 38

System Connector Interface ............................................................................ 40

Universal Serial Bus (USB).............................................................................. 41

Accessory Control Interface (ACI) ................................................................... 42

VOUT (Accessory Voltage Regulator) ...........................................................42

HookInt............................................................................................................. 43

Charging .......................................................................................................... 43

DC-plug ..........................................................................................................44

VCHAR pins of system connector ..................................................................44

Baseband Serial Interfaces ..............................................................................45

Internal serial interfaces between CMT and APE ............................................ 45

XBUS .............................................................................................................45

XABUS ...........................................................................................................45

External serial interfaces.................................................................................. 45

MMC interface ................................................................................................45

IrDA interface .................................................................................................45

USB interface .................................................................................................45

Baseband Test Points....................................................................................... 46

List and description.......................................................................................... 46

Test points on bottom-side............................................................................... 50

Test points on top-side..................................................................................... 51

Baseband Troubleshooting.............................................................................. 53

Top level flowchart........................................................................................... 54

“Contact Service” on display............................................................................ 55

Dead or jammed phone ................................................................................... 56

Flash faults....................................................................................................... 57

CMT flash faults ............................................................................................58

APE flash faults ..............................................................................................59

APE memory troubleshooting.......................................................................... 60

OMAP1510 flash (Seija) ................................................................................60

OMAP1510 SDRAM ......................................................................................66

Energy management troubleshooting.............................................................. 69

Device does not stay on .................................................................................69

General power checking ................................................................................ 69

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APE power checking (SMPS) ........................................................................71

Energy management calibration .................................................................... 72

ADC-reading ..................................................................................................73

Backup battery ...............................................................................................74

Charging troubleshooting................................................................................. 75

APE reset......................................................................................................... 78

OMAP1510 (Helen).......................................................................................... 79

Clocks troubleshooting..................................................................................... 82

Clocks troubleshooting..................................................................................... 89

APE-CMT troubleshooting............................................................................... 96

APE-CMT interfaces ......................................................................................96

CMT serial interfaces troubleshooting ............................................................. 98

CBUS .............................................................................................................98

FBUS .............................................................................................................98

MBUS .............................................................................................................98

USB troubleshooting........................................................................................ 99

IrDa interface troubleshooting........................................................................ 102

SIM card error................................................................................................ 106

UI failure......................................................................................................... 107

Display blank ................................................................................................107

Display distorted ..........................................................................................111

Display backlight dim or no backlight ...........................................................112

Keyboard backlight ......................................................................................113

Keyboard malfunction .................................................................................. 115

Bluetooth troubleshooting.............................................................................. 117

Bluetooth settings for Phoenix .....................................................................117

Bluetooth troubleshooting flowchart ............................................................. 118

Multimedia card (MMC) troubleshooting........................................................ 119

Audio faults.................................................................................................... 124

HP earpiece failure .....................................................................................124

HP microphone failure .................................................................................125

External earpiece failure .............................................................................. 126

External microphone failure ......................................................................... 128

IHF speaker failure .......................................................................................129

Accessory detection troubleshooting ............................................................. 131

Camera module troubleshooting.................................................................... 133

Terms ...........................................................................................................133

Image taking conditions effect on image quality .......................................... 133

Camera hardware failure message .............................................................. 138

Image quality analysis.................................................................................... 142

Possible faults in image quality .................................................................... 142

Testing for dust ............................................................................................ 142

Testing for sharpness ..................................................................................143

Bit errors ......................................................................................................143

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Nokia Customer Care 6 - Baseband

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1. Glossary of Terms

A/D Analog to Digital ACI Accessory Interface AFC Automatic Frequency Control APE Application Program Engine ASIC Application Specific Integrated Circuit BSI Battery Size Indicator BT Bluetooth BTEMP Battery Temperature CBUS Nokia Proprietary Serial Interface for MCU CDMA Code Division Multiple Access CMT Cellular Mobile Telephone D/A Digital to Analogue DAC Digital to Analogue Converter DAI Digital Audio Interface DBUS Nokia Proprietary Serial Interface for DSP DC Direct Current DCT Digital Core Technology DMA Direct Memory Access DSP Digital Signal Processor EMC Electro Magnetic Compatibility FBUS Nokia Proprietary Serial Interface FM Frequency Modulation FMEA Failure Mode and Effect Analysis GSM G lobal System for Mobile Communications Helen P rocessor from Texas Instruments (also called OMAP1510) HF Hands Free HFCM Hands Free Common Mode HW Hardware electronics including Audio, Energy Management, UIHW and BB I2C Inter-IC Control bus

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Nokia Customer Care 6- Baseband

IC Integrated Circuit IF Interface IHF Integrated Hands Free IMEI International Mobile Equipment Identity IO, I/O Input Output LCD Liquid Crystal Display LDO Low Drop Out LED Light Emitting Diode LSB Least Significant Bit LTPSi Low Temperature Poly Silicon MBUS Nokia Proprietary Serial Interface MCU Micro Controller Unit MMC Multi Media Card MMU Memory Management Unit MPU Micro Processing Unit MSB Most Significant Bit NTC Negative Temperature Coefficient PS Power Save signal PURX Power Up Reset PWB Printed Wiring Board PWM Pulse Width Modulation RF Radio Frequency RTC Real Time Clock SDRAM Synchronous Dynamic Random Access Memory SIM Subscriber Identity Module SMPS Switch Mode Power Supply SW Software TFT Thin Film Transistor TI Texas Instruments uBGA Micro Ball Grid Array package UEM Univer sal En ergy Management

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UI User Interface UPP Universal Ph one Processor USB Univer sal Serial Bus VBAT Battery Volt age VCTCXO Voltage Controlled VGA Video Graphics Array XBUS Proprietary Nokia serial communication bus

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2. Baseband Top-Level Description

NHL-12 is an imaging category (IP2.5) phone introducing a high-quality colour LCD, improved camera and EDGE for Americas. NHL-12 operates on triple-band GSM (850/1800/1900) and E-GPRS networks, and supports enhanced interfaces for connectivity with BT (Bluetooth) and USB (Universal Serial Bus).

The NHL-12 baseband consists of a dual-processor engine and some product specific blocks, such as IrDA and S60-display.

NHL-12 hardware and baseband consist of two parts: application part APE and phone part CMT.

The APE part is constructed around an OMAP 1510 processor with SDRAM and NAND flash memory as the core. Other major parts for APE are power, UI, audio, Bluetooth and camera.

APE and CMT parts are connected by serial communication buses and by a few control lines. APE part reset and power control comes from the CMT side. Audio control is mostly performed on the APE side, and phone audio is routed from the CMT side.

■ Baseband block diagram

The below system block shows the main BB function blocks.

Figure 1:Baseband block diagram

Flash 32Mb

ARM7

Lead3

UEM

UPP8M

Regulators

CODEC

SIM I/F

LPRFUART

DSPSIO

Hands-free In

Hands-free Out

SIM

XBUS

XABUS

BT Clk Buffer

Battery

NAND 32MB

REGULATORS

DAC

Bluetooth

SDRAM 64MB

APE

Seija IF Adapter

McBSP2

I2C

McBSP1

UART2

GPIO I/F

MCSI2

McBSP3

UART1

MCSI1

SDRAM I/F

Flash I/F

OMAP1510

ARM925T

LEAD3ph3

LCD I/F CLKM

USB

UART3 /

PWT/PWL

SD-MMC

uWire

ARMIO

Keyboard

Camera

Bottom Connector

MIC

OUTL

OUTR

USB

MMC

Rocker

Keyb

Display

12MHz

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■ Environmental specifications

Normal and extreme voltages

• Nominal voltage:3.7V

• Lower extreme voltage:3.1V

• Higher extreme voltage:4.2V

Humidity

Operational humidity range is < 95%. Condensed or splashed water may cause interim or permanent phone malfunction.

Table 1: Operational conditions

Environmental condition

Normal operation Reduced performance

No operation

No operation or storage

Charging allowed Long term storage condi-

tions

■ Frequencies in baseband

Ambient

temperature

-10 oC... +55 oC +55 oC... +75 oC

C... -10 oC

-25

-40 oC... -20 oC

< -40 oC and > +85 oC

-25 oC... +60 oC 0 oC... +40 oC

Table 2: CMT clocks

Notes

Specifications fulfilled Operational only for short periods

Operation not possible but an attempt to operate will not damage the phone

No storage; an operation attempt may cause permanent damage

Function Clock speed Location On/Off

VCTCXO 26 MHz VCTCXO/HELGO DSP/MCU is awake all the

time.

System Clock 13 MHz UPP DSP/MCU is awake all the

time. DSP 195 MHz UPP DSP is awake all the time. MCU 50.38 MHz UPP MCU is awake all the time. Sleep clock 32.768 kHz UEM – UPP - OMAP During sleep mode

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Nokia Customer Care 6- Baseband

Table 2: CMT clocks

Function Clock speed Location On/Off

Cbus 1 MHz UPP–UEM/Zocus

Interface Dbus 13 MHz UPP/UEM Interface During transceiver activity RFConvClk 13 MHz UPP/UEM Interface During transceiver activity RFBusClk 13 MHz UPP/HELGO Inter-

face Flash 50.38 MHz UPP/Flash Interface Burst read accesses SIM 3.25 MHz UPP/SIM Interface SIM accesses

Table 3: APE clocks

Function Clock Speed Source To Parameter

APE system clock 12 MHz Crystal OMAP1510 Frequency OMAP DSP 150 MHz OMAP Internal DSP clock Frequency OMAP MCU 150 MHz OMAP Internal MCU clock Frequency CLK32K_IN 32768 Hz UEM OMAP1510

Generated continuously whilst MCU is awake

During transceiver activity

Frequency

Sleep mode Flash interface 37.5 MHz OMAP Flash – APE Frequency SDCLK 75 MHz OMAP SDRAM – APE Frequency BT 12 MHz Crystal BT module Frequency MMC_CLK 16 MHz OMAP MMC Frequency SCLK 12 MHz OMAP Audio DAC Frequency Camera clock 12 MHz OMAP Camera Frequency

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3. Baseband Architecture

■ CMT side

The CMT architecture is based on DCT4 Common Baseband. The main functionality of the CMT baseband is implemented into two ASICs: UPP (Universal

Phone Processor) and UEM (Universal Energy Management). System clock for the CMT is derived from the RF circuits. For the CDMA system, the RF clock

is 19.2 MHz and for GSM it is 26 MHz. The low frequency sleep clock is generated in the UEM using an external 32.768kHz crystal. The I/O voltage of the CMT baseband is 1.8V. The analogue parts are powered from 2.8V power rails. The core voltage of UPP can be altered with SW, depending on the prevailing processing power requirements.

UEM is a dual voltage circuit. The digital parts are running from the baseband supply (1.8V) and the analogue parts are running from the analogue supply (2.8V). Some of th e UEM blocks are also connected directly to the battery voltage (VBAT). UEM includes 6 linear LDO (low drop-out) regulator for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. Some parts of the SIM interface have been integrated into UEM. The SIM interface supports 1.8V and 3V SIM cards. Data transmission between the UEM and UPP is handled via two serial buses: DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP and the audio codec is in UEM.

The analogue interface between the baseband and the RF sections is implemented into UEM. UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and supplies the analogue TXC and AFC signals to the RF section under the UPP DSP control. The digital RF-BB interface, consisting of a dedicated RFIC control bus and a group of GenIO pins, is located in UPP.

The baseband supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is done in the UEM according to control messages from the UPP. Keypad tones, DTMF and other audio tones are generated and encoded by the UPP and transmitted to UEM for decoding.

NHL-12 has two galvanic serial control interfaces for CMT: FBUS and MBUS. Communication between the APE and CMT parts is handled through two serial buses: XBUS

and XABUS. XBUS is the main communication channel for general use, and XABUS is for audio data transfer. Also the system reset (PURX) and SleepClk for APE are coming from the CMT side. The PURX is delayed approximately 130ms to fulfil OMAP1510 reset timing requirements and one of UEM’s IR level shifters is used for SleepClk level shifting.

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Nokia Customer Care 6- Baseband

Figure 2:Simplified block diagram for CMT side

RF-BB

R&D

Test IF

Ostrich

Memory

32Mb Flash

RFConv

RFIC

Control

RFClk

CMT - APE interface

XBUS XABUS

UPP 8M

PWREn

130ms delay + 1V8 -> 2V8 LS

PURX

SleepClk

RFConvIF

Internal SIM IF

Audio IF

MBUS

FBUS

DBUS

CBUS

SleepClk

(2V8)

MIC+ACI

IRLEDC IRTX

Prod/AS

Test IF

FBUS

MBUS

UEMK

UEM

Zocus

XEAR

L+R

Audio

DAC

Audio

AMP

32kH

L+R

CHRG current sense

PWR key

Vibra

SIM

EAR

MIC

BATT. IF CHRG. IF

Control

from APE

Accessory

regulator

System Connector

IHF

CMT memories

The memory interface supports 16-bit burst mode NOR FLASH with multiplexed add ress/data bus, standard asynchronous 8-bit SRAM and 16-bit address/data multiplexed SRAM. The UPP has two dedicated CS pins for FLASH and one GenIO that can be used as RAM CS.

The maximum amount of 16-bit SRAM with multiplexed address/data bus that can be connected to UPP is 2MBytes.

Memory configuration

The maximum amount of memory supported by UPP is 2*16MBytes of FLASH plus 2MBytes of external SRAM.

CMT memory configuration includes 32Mbits of 54MHz NOR FLASH. The flash has readwhile-write capabilities.

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■ APE side

The functionality of the APE engine is based on the OMAP1510 processor and memories. APE has a total of 32 Mbytes of NAND type flash memory and 64 Mbytes of SDRAM.

The application engine has two separate clock sources: one for the system clock (12MHz) and one for the sleep clock (32.768kHz), which is called Clk32k. The Clk32k is not generated by the application engine, but is derived from the CMT SleepClk using a level shifter. The Clk32k is always running when the engine is powered.

The 12MHz system clock is generated by OMAP1510. The crystal driver and related circuitry is internal to the processor and an external quartz crystal is used as a frequency reference. The Bluetooth clock is also derived from this clock using a clock buffer. Note that the system clock is switched off during sleep mode.

The APE reset (MPU_nReset) is controlled by the CMT reset (PURX) generated by UEM. PURX and MPU_nReset have different logic levels, but the latter is not simply a level shifted version of the former. There is also an external delay circuit connected between the PURX and MPU_nReset lines that keeps the APE reset active circa 130ms after CMT reset is released.

OMAP1510 consists of:

• DSP megamodule with internal program and data memory, instruction cache, DMA controller and hardware accelerator

• ARM925T based processor megamodule with memory management unit (MMU), instruction and data cache

• local bus with MMU

• multi-channel system DMA controller

• peripherals (local and shared) that support glueless system interface

• connecting modules that facilitate communication between these megamodules and system memory (external and internal), and enhance system’s throughput and software development.

OMAP 1510 is optimized for various multimedia and wireless applicat ions such as wireless video and image processing, wireless audio applications, graphics and video display acceleration.

APE memories

APE memory system consists of a 64Mbyte(32Mx16) SDRAM device connected to the OMAP1510 fast external memory interface (EMIFF) and a 32Mbytes(32Mx8) of NAND-flash device connected via Seija Flash-Interface Adapter ASIC to the OMAP1510 slow external memory interface, EMIFS. The memory interface is shown in Figure 3, “APE external memories,” on page 14. NAND-flash is used as a boot the device and mass memory. User data is stored in NAND. The operating voltage of all memory components is 1.8V, supplied from V18.

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Nokia Customer Care 6- Baseband

Figure 3: APE external memories

INT

256Mb

NAND-flash

32Mx8

fCLE fALE

fnCE1

fnRE fnWE fnWP

4.7kohm

fR/B

I/O

Seija Flash-

interface

adapter

512Mb SDRAM 32Mx16

[11:0]

FCLK

NFCS0

NFOE NFWE NFRP

NFAVD

FADD

FDATA

SDATA

SADD

SBANK

22ohm SDCLK

NSCAS NSRAS

SDCLK_EN

NSWE NSDQML NSDQMU

NFCS0

EMIFS

[24:1]->[12:1]

EMIFF

Traffic Controller

OMAP1510

GPIO9

Interrupt

Handler

Memories are packaged as follows:

• SDRAM, 54ball CSP, 10x11.5x1.1mm, 0.8mm pitch Pb-free balls

• NAND, 63ball TBGA, 11x9x0.9mm, 0.8mm pitch Pb-free balls

• Seija ASIC, 64ball FBGA, 6x6x1.2mm, 0.5mm pitch Pb-free balls

■ Energy management

The energy management of NHL-12 is based on BB 4.0 architecture. BL-5C battery supplies power primarily to the UEM ASIC and the RF PA. UEM includes several regulators to supply RF and baseband. It provides the energy management including power up/down procedure.

Power supply modes

The state machine in UEM controls mainly the operating modes of the eng ine. State transitions are enabled by signals taken from UEM, UPP and OMAP1510. In general, the state transitions are based on the following information:

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• Battery voltage (HW limits and cutoffs)

• Back-up battery voltage limits and cutoffs

• Power key status (in NHL-12 engine power key connected to PWRONX pin of UEM)

• Delays generated by the state machines

• Real time clock (RTC) alarms

• Watchdogs

• Thermal shutdowns

• SLEEPX signal from UPP

• LOW_PWR signal from OMAP1510

The functional behaviour of the UEM can be divided into 6 different states. Since the UEM controls the regulated power distribution of the phone, each of these states affects the general functionality of the phone:

• No supply

•Backup

• Power off

•Reset

• Power on

•Sleep

Brief description of operating modes

• NO_SUPPLY mode means that the main battery is not present or its voltage is too low (below UEM master reset threshold limit) and back-up battery voltage is too low.

• In BACK_UP mode the main battery is disconnected or empty but back-up battery has sufficient charge in it

• IN POWER_OFF mode the main battery is present and its voltage is over UEM master threshold limit. All regulators are disabled.

• RESET mode is a synonym for start-up sequence and contains in fact several modes. In this mode certain regulators and system oscillators are enabled and after they have stabilized, the system reset (PURX) is released and PWR ON mode entered.

• In POWER_ON mode SW is running and controlling the system.

• SLEEP mode is entered only from PWR ON mode when system activity is low. CMT and APE sides can be in sleep mode independent of each other.

For controlling transitions between modes, UEM includes:

• RC oscillator (32kHz)

• crystal oscillator (32kHz)

• comparators

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• digital circuitry These are used for generating limits and time delays. Controlled powering off is done when the user requests it or when the battery voltage is fallin g

too low. Complete power down is done, if SW does not write to the watchdog register anymore and a defined time after previous writing is elapsed. As this happen s, PURX is forced low and all regulators are disabled. If the battery voltage falls below the very last SW–cutoff level, SW will power off the system by letting the UEM’s watchdog elapse. If a thermal shutdown limit in UEM regulator block is exceeded, the system is powered off. System reset PURX is forced low.

Uncontrolled powering off happens, when the battery is suddenly removed. This is problematic as data may corrupt in memories, if the removal takes place during the access phase to these devices. UEM’s state machine notices battery removal after battery voltage has been below VCOFF– for 5 us and enters PWR_OFF mode. PURX is set low and all UEM’s regulators are disabled.

There are three watchdogs in UEM. First one is for controlling system power-on and powerdown sequences. The initial time for this watchdog after reset is 32s. The time can be set using a register. This watchdog is used for powering the system off in a controlled manner. The second one is for security block and is used during IMEI code setting. The third one is a power key watchdog. It is used to power off the system in case SW is stuck and the user presses the power key. This watchdog, if not acknowledged by the SW, shuts down the system after a predefined delay (2–15 seconds). The feature is enabled as default and can be disabled by SW.

OMAP1510 also includes a hardware watchdog. This resets OMAP1510, BT and Seija at the same time. It is possible to disable this watchdog with the help of SW.

Table 4: Reset thresholds and cutoff limits

VMSTR+ Master reset threshold 2.1 V VMSTR– Master reset threshold 1.9 V VCOFF+ Hardware cutoff 3.1 V VCOFF– Hardware cutoff 2.8 V VCHAR+ VCHAR detection threshold 2.0 V VCHAR- VCHAR detection threshold 1.8 V

CUTOFF

SW cutoff limit System dependent

VBUCOFF+ Backup battery cutoff 2.1 V VBUCOFF– Backup battery cutoff 2.0 V

Battery BL-5C

The main battery of NHL-12 is a lithium ion battery BL-5C with the capacity of 850mA.

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The battery interface has three pins: VBAT, GND and BSI. Temperature indication is located on the engine PWB. Temperature measurement is performed using an NTC resistor (47k nom) on the engine PWB.

Current gauge (Zocus)

The NHL-12 engine supports HW for phone and charging current measuring. The current measurement chip that is used is LM3820. Current gauge is also supported by the ISA EM Core SW. It can be used to estimate the battery charge level presented as batt ery bars on the display.

Current is measured from the positive battery terminal using a sense resistor, so that all phone’s consumed current flows through that resistor. Correspondingly, when charging, all current to phone’s battery flows through this resistor, but the direction is reversed. The sense resistor is formed from PWB tracks arranged as a 4-terminal resistor. LM3820 senses voltage across the resistor. The maximum current depends on the sense resistor value.

RTC capacitor

Real Time Clock (RTC), crystal oscillator and backup battery circuitry are located inside the UEM. Two regulators are used to provide needed voltages for external backup supply and backup battery charging: VRTC for internal clock circuitry and VBU for backup battery charging. The backup battery has voltage range VBACK = 2.0V and discharged down to 2.0V).

min

– 3.2V

– 3.3V

typ

(charged to 3.2V

max

Charging the backup battery is controlled by the UEM’s digital block by enabling VBU regulator and backup battery is charged with constant voltage up to 3.2V. By default, VBU regulator is disabled in reset and it is reset always when PURX='0'.

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Nokia Customer Care 6- Baseband

Power distribution

Figure 4: Power distribution diagram

Measurement resistor

TypeUnitOrDepartmentHere

LM3820

TypeYourNameHere TypeDateHere

UEM

VR1..7

VSIM

VANA VFLASH1 VFLASH2

VCORE

VIO

BATTERY

RF PA Various

SIM

UPP CORE I/O

DOCUMENTTYPE 1 (1)

CMT FLASH

VCC I/O

AUDIO PA

LP3985-2.8

2.8V

GENIO28 of UPP

LP3981-2.8

2.8V

LM2708-1.57

1.57V (SMPS)

LM2608-1.8

1.8V (SMPS)

LP3985-3.0

3.0V

GPIO15 of OMAP1510

Vout

V28

V15

V18

VMMC

Vbus

Klight (UEM) Uidrv(3)

Dlight (UEM) Uidrv(4)

System connector

Vout USB cable

LP2985-3.3

3.3V

GPIO3 of OMAP1510

OMAP1510

I/O (2.8V) USB I/O (1.8V) CORE

TK11851L

(SMPS)

LM3350-4.1V

(SMPS)

V33

CORE I/O

AUDIO DAC

NAND FLASH+Seija

CORE+I/O

SDRAM

I/O CORE

MMC

Display

Keyboard

Camera

Battery line

Power line Control signal

Measurement signal

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■ DC characteristics

Regulators

The transceiver baseband section has a multi-function analogue ASIC, UEM, which contains six pieces of 2.78 V linear regulators and a 4.8 V switching regulator. All the regulators can be controlled individually by the 2.78 V logic directly or through a control register.

The seven regulators are named VR1 to VR7. VrefRF01 and VrefRF02 are used as the reference voltages for Helgo, VrefRF01 (1.35V) for the bias reference and VrefRF02 (1.35V) for the Rx ADC (analog-to-digital converter) reference.

The regulators (except VR7) are connected to Helgo. Different modes of operation can be selected inside Helgo according to the control information coming through the RFBus. UEM’s internal regulators are used for the powering of the baseband module. In addition to this, VIO and VFLASH1 regulators of UEM are used to enable/disable APE side regulators.

VCORE and VSIM are programmable linear regulators. Default state for VCORE voltage is

1.57V. There are also internal regulators in UEM. They are used for the powering of the CMT BB. In

addition to this, VIO and VFLASH1 regulators of UEM are used to enable/disable APE side regulators. BB4.0 supports only UEMKEdge or UEMC with UPP8Mv3.

NHL-12 APE energy management uses two switch mode power supplies: LM2608 and LM2708, generating 1.57V and 1.8V to OMAP1510 and memories. In addition, the APE side EM HW consists of several other discrete regulators:

• One linear regulator for 2.8V APE side logic (LP3981)

• One 2.8V linear regulator (LP3985) for powering the MMC card.

• One 3.3V linear regulator (LP2985) for powering the USB block of OMAP1510.

LM2608 is used to generate 1.8V for I/O’s OMAP1510 processor and APE side memories. Normally, LM2608 works in constant frequency PWM mode. But in the case of light loads, it is possible to control LM2608 via SYNC/MODE pin to low quiescent current mode. In this mode, LM2608 works as a linear regulator and the output current capacity is only 3mA. LM2608 ne eds an external 1.35V reference voltage. In the case of NHL-12 engine, this reference voltage is taken from VrefRF01 of the UEM.

LM2708 is used to generate 1.57V for the core of OMAP1510 processor. LM2708 does not need external reference voltage. Pin (Isel) can be used to adjust the current limit external coil. NHL-12 engine has a higher current limit, which allows 400mA output current capacity.

In NHL-12 engine, LOW_PWR signal of OMAP1510 (multiplexed on pin ARMIO_5) is used to control LM2708/LM2608 to linear mode when processor goes to deep sleep mode. The functionality of the LOW_PWR signal is the following: when OMAP1510 is in a low power state (deep sleep mode), this signal is high. At reset and when in normal func tional mode, this signal is low. Because the polarity SYNC/MODE pin is reverse, an additional inverter is used in this control line.

Table 5: CMT regulators

Regulator

VIO 1.72 1.8 1.88 150

Issue 3 05/2005 COMPANY CONFIDENTIAL 19

Min VoltageVNom. VoltageVMax.VoltageVMax. Current

NHL-12

Nokia Customer Care 6- Baseband

Table 5: CMT regulators

Regulator

VCORE 1.053

VFLASH1 2.70 2.78 2.86 70 VFLASH2 2.70 2.78 2.86 40 VANA 2.70 2.78 2.86 80 VSIM 1.745

Regulator

Output

V15 SMPS

Type

mode

Min VoltageVNom. VoltageVMax.VoltageVMax. Current

200

1.35

1.57

1.8

2.91

Regulator

Type

LM2708-

1.57

1.8

3.0

Table 6: APE regulators

Main

Voltage

1.523 1.57 1.617 400 VFLASH1OMAP Core

Min

Voltage

1.855

3.09

Max

Voltage

Max

Current

Enabled byUsed for

Block

Linear mode

V18 SMPS

mode

Linear mode

V28 Linear LP3981-2.8 2.716 2.8 2.884 300 VIO OMAP I/O,

VMMC Linear LP2985ITL

V33 Linear LP2985-3.3 3.201 3.3 3.399 150 GPIO3 Helen USB

LM2608-

1.8

X-3.0

1.282 1.35 1.418 15

1.764 1.8 1.836 400 VIO OMAP I/O, SDRAM Core+I/O, NAND Flashes+ Seija, LCD, camera

1.710 1.8 1.890 3

BT Audio DAC, LCD, camera, IR

2.91 3.0 3.09 150 GPIO15 MMC

20 COMPANY CONFIDENTIAL Issue 3 05/2005

NHL-12 6 - Baseband Nokia Customer Care

Table 6: APE regulators

Regulator

Output

Type

Regulator

Type

Main

Voltage

Min

Voltage

Max

Voltage

Max

Current

Enabled byUsed for

Block

USB host - 4.3 5.0 5.25 100 USB Regu-

lator Input range

VOUT Linear LP3985-2.8 2.716 2.8 2.884 150 GENIO28Accessory

powering

V15 SMPS

mode Linear

LM2708-

1.57

1.523 1.57 1.617 400 VFLASH1OMAP Core

1.282 1.35 1.418 15

mode

V18 SMPS

mode

LM2608-

1.8

1.764 1.8 1.836 400 VIO OMAP I/O, SDRAM Core+I/O, NAND Flashes+ Seija

VKEYB SMPS

mode

LM3353NOPB4.038 4.1 4.161 80mA UEM

Klight

Keypad leds

■ Voltage regulators in BB for RF

Values are referenced to GND unless otherwise specified.

Table 7: Voltage regulators in BB for RF

Signal Min Nom Max Note

VR1A / VR1B 4.6V 4.75V 4.9V I VR2 2.70V 2.78V 2.86V I VR3 2.70V 2.78V 2.86V I VR4 2.70V 2.78V 2.86V I

VR5 2.70V 2.78V 2.86V I

VR6 2.70V 2.78V 2.86V I

VR7 2.70V 2.78V 2.86V I

= 10mA

max

= 100mA

max

= 20mA

max

= 50mA

max

sleep

= 50mA

max

sleep

= 50mA

max

sleep

= 45mA

max

= 0.1mA

Issue 3 05/2005 COMPANY CONFIDENTIAL 21

NHL-12

Nokia Customer Care 6- Baseband

Table 7: Voltage regulators in BB for RF

Signal Min Nom Max Note

VrefRF01 1.334 1.35 1.366 Reference voltage

Imax = 0.1mA

VrefRF02 1.323 1.35 1.377 Reference voltage

Imax = 0.1mA

■ Charging

Charging control and charge switch are located in the UEM. There is a thermal protection circuitry in the UEM to protect the chip. If temperature rises above

the threshold(150×C typ.), a charge switch is opened immediately and charging is stopped. When the chip cools down, charging is continued normally.

HW supports all DCT4 chargers. 3-wire chargers are supported, but 3-wire charging is not. In practice this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers.

■ Audio circuitry

This section describes the audio HW of the engine. External audio components and acoustics are not considered in detail in this section.

As this engine is based on dual-processor architecture, also audio is divided into separate APE and CMT parts. Audio control is mostly on the APE side; phone audio is routed from the CMT side to APE in analogue form, except Bluetooth which is in digital form. On the CMT side, audio HW is integrated into the UEM ASIC. On the APE side, the most important parts are OMAP1510, audio DAC and audio power amplifier.

The stereo output of this amplifier is designed for use with the ext ended Pop-port It also has a differential mono output for driving the handsfree speaker.

The battery voltage (VBATT) is used directly as supply voltage for audio amp lifier. The nominal battery voltage is 3.6V.

The type of DAC used is TLV320AIC23B and the supply voltage for this is coming from V28.

connector.

22 COMPANY CONFIDENTIAL Issue 3 05/2005

NHL-12 6 - Baseband Nokia Customer Care

Figure 5:NHL-12 audio block diagram

Earpiece

NHL-12 uses an earpiece which is a 32 ohm speaker with a diameter of 8 mm. The supply voltage is 2.7V. The earpiece is driven differentially directly by the UEM. The ca psule is mou nted into the LCD frame assembly.

Internal microphone

The internal microphone is mounted in the B-cover. The microphone is omnidirectional and it is connected to the UEM microphone input MIC1P/N. The microphon e input is asymmetric and the UEM (MICB1) provides the bias voltage. Nominal impedance of the microphone is

1.8kOhms. The microphone input to UEM is ESD protected. Spring contacts are used to connect the microphone to the main PWB.

Integrated hands-free

Integrated hands-free speaker (IHF), 16mm, is used to generate alertin g and warning tones in NHL-12. The IHF speaker is driven with audio amplifier. The speaker capsule is mounted in the antenna module. Spring contacts are used to connect the IHF speaker contacts to the main PWB.

Audio accessory receive path

In NHL-12 the accessory receive path is directly driven from the UEM HF / HFCM differential audio outputs. The output signal complies with the Pop-port accessory interface.

For EMC protection, ferrites are connected in series to the earpiece and for ESD protection bizener is used.

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NHL-12

Nokia Customer Care 6- Baseband

Audio control signals

The HEADINT signal is needed for recognizing the external device (e.g. headset) connected to the system. The recognition is based on the ACI-pin on the system connector.

The button of the external device generates HOOKINT. This is used, for example, to answer or to end a phone call.

■ Acoustics

Earpiece acoustics

The earpiece is a PSS 8mm element. The earpiece is placed inside the plastic UI frame. It is sealed to UI support frame with a foam ring. This cavity is ported to a second cavity formed between the UI support frame and A-cover with Bezel. Sound holes vent this cavity out of the UI support flame. All holes are shielded to prevent dust and small particles from entering the phone.

IHF speaker acoustics

In NHL-12, the IHF speaker is used for integrated hands-free and ringing tone applications. It has a structure, which consists of two cavities: one back cavity and one front cavity.

When using the phone in the IHF mode, speech is fed to the IHF-speaker. Ringing tones are optimized according to bandwidth and frequency response. The sound holes are placed in the B-cover. Sound holes are shielded to prevent dust and small particles from entering the phone.

Figure 6:Exploded view of antenna assembly.

Microphone acoustics

NHL-12 has a standard microphone module. The module is embedded into a so-called "rubber boot" and connected to the system module by spring contacts.

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NHL-12 6 - Baseband Nokia Customer Care

The microphone is placed close to the system connector. The sound port of the microphone is located towards the bottom of the phone.

Vibra motor

A vibra alerting device is used to generate a vibration signal for an incoming call. It is located in the middle part of the phone and it is connect ed to the main PWB with spring contacts. The vibra is controlled by a PWM signal coming from UEM. The vibra motor is mounted in the Bcover assembly.

■ Audio modes

This section describes NHL-12’s engine audio modes. The following audio modes are supported:

• Hand portable

• Integrated hands-free

• Accessory audio mode

• APE audio mode

• Bluetooth audio mode

Hand portable

Hand portable mode is the basic audio mode. This is entered when no audio accessories are connected and the hands-free mode is not selected.

In the hand portable mode, earpiece path and internal microphone path are in use. A call is created by the CMT. The uplink signal is generated by the microphone and transferred

to MIC1P/N differential inputs. The internal microphone is enabled using the MICB1 bias voltage O/P on UEM. The signal is amplified at least by 20 dB, low pass filtered, converted into digital domain and then postponed through UPP to transducer equalizer and finally to APE for speech encoding.

The EAR output on the UEM is selected for Rx audio via the internal earpiece. The UEM sets the audio uplink gain and downlink attenuation. Different downlink attenuation levels function as the volume control.

The internal earpiece is driven by the CMT engine for voice calls. The internal microphone is driven by the CMT for voice calls and voice recording.

All volume controls are handled by the UEM.

Integrated hands-free audio mode (IHF)

This mode is entered by user selection. A call is created by the CMT. The uplink signal is generated by the microphone and transferred

to MIC1P/N differential inputs. The internal microphone is enabled using the MICB1 bias voltage O/P on the UEM.

The downlink audio is processed in the UPP and transferred to the UEM. Then the downlink signal is amplified in the single-ended XEAR Output driver in the UEM. The mono XEAR output is connected to the MICIN input of the APE Audio DAC via a low-pass filter. The signal is then routed through the line output of DAC (LHPOUT), high pass filtered and routed to the Phone_In_IHF input. This drives the internal speaker via the SPKRout driver.

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NHL-12

Nokia Customer Care 6- Baseband

Accessory audio mode

This mode is entered when an audio accessory (mono/ stereo headset, loopset, basic ca r kit) is connected to the system connector. The routing of the audio signal is identical for all accessories (except for the stereo headset), but gain control depends on the accessory used.

The call is created by the CMT. The uplink signal is generated by the external microphone and transferred to the UEM MIC2 input, after which the MIC2B bias voltage and MIC2P/N inputs are enabled on the UEM.

The downlink audio signal is routed through the single-ended XEAR output driver by the UEM. The mono XEAR output is connected to the MICIN input of the DAC via a lo pes filter. Then signal is routed through L Accessories are driven via the system connector using the L stereo headset is used also the R

OUT

and R

drivers of DAC to the L

OUT

driver is connected. Both channels play the same mono

OUT

and RIN inputs of the LM4855.

driver of LM4855. When a

OUT

audio signal.

APE audio mode

This mode is entered when a user starts a multimedia application (e.g. MP3, AAC etc.) or in the case of ringing tones/ other notification tones played via the IHF speaker or the system connector.

When an MP3 is played, encoded data is read from the MMC card and the decoding is performed by OMAP1510. After decoding, the raw linear data is sent to the external audio DAC as a 16-bit PCM audio through the I2S connection. The DAC performs the digital-to-analogue-audio conversion.

For playback and streaming of digital audio, synthesized ring tones, miscellaneous tones, and game sounds, the APE side can be selected to drive either the IHF speaker or the system connector.

For playback via the internal speaker, the LHPOUT output on the audio DAC is used. The signal is routed to Phone_in_IHF input on LM4855.

For playback via the stereo/ mono headset or other accessories, the L of the Audio DAC are used. These are routed to the L

/RIN inputs of the LM4855. In the case

OUT

and R

OUT

outputs

of mono accessory, OMAP1510 produces a monophonic signal to DAC.

Bluetooth audio mode

Bluetooth audio data is transferred using a separate interface, MCSI. MCSI is a serial (voice) interface with multi-channels transmission capability. There are two in-

dependent MCSI interfaces in OMAP1510 and one of them, MCSI1, is connected to the PCM interface of BC02. The MCSI1 is a half-duplex interface and it can work as either master or slave. This 4-wire interface has a bi-directional serial clock and frame synchronization. MCSI has a programmable word length (from 3 to 16 bits) and frame configuration.

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4. Baseband External and Internal Signals and Connections

This section describes some of the external and internal electrical connections and interface levels on both CMT and APE side. The electrical interface specifications are collected into tables that cover a connector or a defined interface.

■ CMT internal signals and connections

Table 8: Internal microphone

Signal Min Nom Max Condition Note

MICP 200mV

AC 2.2kΩ to MIC1B

2.0 V 2.1 V 2.25 V DC

MICN 2.0V 2.1V 2.25V DC

Table 9: Internal speaker

Signal Min Nom Max Condition Note

EARP

0.75V 0.8V

EARN

0.75V 0.8V

2.0 V

0.85V

2.0 V

0.85V

AC DC

Differential output

= 4.0 Vpp)

diff

■ CMT external signals and connections

Table 10: DC connector

Pin Signal Min Nom Max Condition Note

1 VCHAR 11.1V

7.0 V

RMS

8.4 V

peak

RMS

16.9 V

7.9 V

1.0 A

9.2 V

850 mA

peak RMS peak

RMS

Standard charger Charger positive

input

Fast charger

2 CHGND 0 Charger ground

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NHL-12

Nokia Customer Care 6- Baseband

U/I

levels

connector

Impedance Notes

Pin Signal Description

Table 11: Pop-port

Spectral

range

1 CHARGE V Charge DC 0-9 V /

0.85 A 2 GND Charge GND 0.85 A 100 mΩ (PWB + conn.) 3 ACI ACI 1 kbit/s Dig 0 /

2.78V 4 VOUT DC out DC 2.78V /

47 Ω Insertion & removal

detection

100 mΩ (PWB + conn.) 200mW

70mA

5 USB VBUS DC in DC 4.375-

Connected to APE side

5.25V 6 USB D+ 12M 0-3.3V Connected to APE side 7 USB D- 12M 0-3.3V Connected to APE side 8 USB Data

GND

Data GND Ferrite to

engine GND

9 XMIC N Audio in 300 - 8k 1Vpp &

2.78V 10 XMIC P Audio in 300 - 8k 1Vpp &

2.78V 11 HSEAR N Audio out 20 - 20k 1Vpp 10 Ω 12 HSEAR P Audio out 20 - 20k 1Vpp 10 Ω 13 HSEAR R NAudio out 20 - 20k 1Vpp 10 Ω Not conn. In mono

14 HSEAR R PAudio out 20 - 20k 1Vpp 10 Ω Not conn. In mono

Table 12: Electrical characteristics of SIM connector

Pin Name Parameter Min Typ Max Unit Notes

1 VSIM 1.8V SIM Card 1.62 1.8 1.98 V Supply voltage

3V SIM Card 2.7 3.0 3.3 V

2 SIMRST 1.8V SIM Card 0.8xVSIM

VSIM

0.2xV

V SIM reset (output)

SIM

3V SIM Card 0.8xVSIM

VSIM

0.2xV

SIM

28 COMPANY CONFIDENTIAL Issue 3 05/2005

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