Nokia 6620 Service Manual 06 nhl12 baseband

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Page 1

Nokia Customer Care

NHL-12 Series Transceivers

6 - Baseband Description &

Troubleshooting

Issue 3 05/2005 COMPANY CONFIDENTIAL

Page 2

NHL-12 Company Confidential

6 - Baseband Description & Troubleshooting Nokia Customer Care

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NHL-12 6 - Baseband Nokia Customer Care

Glossary of Terms............................................................................................... 5

Baseband Top-Level Description ......................................................................8

Baseband block diagram ................................................................................... 8

Environmental specifications ............................................................................. 9

Normal and extreme voltages ..........................................................................9

Humidity ...........................................................................................................9

Frequencies in baseband................................................................................... 9

Baseband Architecture..................................................................................... 11

CMT side.......................................................................................................... 11

CMT memories ..............................................................................................12

APE side.......................................................................................................... 13

APE memories ...............................................................................................13

Energy management........................................................................................ 14

Power supply modes ......................................................................................14

Battery BL-5C ................................................................................................16

Current gauge (Zocus) ...................................................................................17

RTC capacitor ................................................................................................17

Power distribution ..........................................................................................18

DC characteristics............................................................................................ 19

Regulators ......................................................................................................19

Voltage regulators in BB for RF....................................................................... 21

Charging .......................................................................................................... 22

Audio circuitry .................................................................................................. 22

Earpiece .........................................................................................................23

Internal microphone ....................................................................................... 23

Integrated hands-free .....................................................................................23

Audio accessory receive path ........................................................................23

Audio control signals ......................................................................................24

Acoustics.......................................................................................................... 24

Earpiece acoustics .........................................................................................24

IHF speaker acoustics ...................................................................................24

Microphone acoustics .................................................................................... 24

Vibra motor ....................................................................................................25

Audio modes.................................................................................................... 25

Hand portable ................................................................................................25

Integrated hands-free audio mode (IHF) ........................................................25

Accessory audio mode ................................................................................... 26

APE audio mode ............................................................................................26

Bluetooth audio mode ....................................................................................26

Baseband External and Internal Signals and Connections .......................... 27

CMT internal signals and connections............................................................. 27

CMT external signals and connections............................................................ 27

BB-RF Interface................................................................................................. 30

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NHL-12

Nokia Customer Care 6 - Baseband

NHL-12 User Interface....................................................................................... 32

S60 - LCD interface ......................................................................................... 32

LCD & keypad illumination .............................................................................34

Current consumption ......................................................................................35

Maximum ratings ............................................................................................ 35

Camera interface ............................................................................................. 35

Keyboard.......................................................................................................... 36

Bluetooth.......................................................................................................... 36

SIM Interface...................................................................................................... 38

System Connector Interface ............................................................................ 40

Universal Serial Bus (USB).............................................................................. 41

Accessory Control Interface (ACI) ................................................................... 42

VOUT (Accessory Voltage Regulator) ...........................................................42

HookInt............................................................................................................. 43

Charging .......................................................................................................... 43

DC-plug ..........................................................................................................44

VCHAR pins of system connector ..................................................................44

Baseband Serial Interfaces ..............................................................................45

Internal serial interfaces between CMT and APE ............................................ 45

XBUS .............................................................................................................45

XABUS ...........................................................................................................45

External serial interfaces.................................................................................. 45

MMC interface ................................................................................................45

IrDA interface .................................................................................................45

USB interface .................................................................................................45

Baseband Test Points....................................................................................... 46

List and description.......................................................................................... 46

Test points on bottom-side............................................................................... 50

Test points on top-side..................................................................................... 51

Baseband Troubleshooting.............................................................................. 53

Top level flowchart........................................................................................... 54

“Contact Service” on display............................................................................ 55

Dead or jammed phone ................................................................................... 56

Flash faults....................................................................................................... 57

CMT flash faults ............................................................................................58

APE flash faults ..............................................................................................59

APE memory troubleshooting.......................................................................... 60

OMAP1510 flash (Seija) ................................................................................60

OMAP1510 SDRAM ......................................................................................66

Energy management troubleshooting.............................................................. 69

Device does not stay on .................................................................................69

General power checking ................................................................................ 69

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NHL-12 6 - Baseband Nokia Customer Care

APE power checking (SMPS) ........................................................................71

Energy management calibration .................................................................... 72

ADC-reading ..................................................................................................73

Backup battery ...............................................................................................74

Charging troubleshooting................................................................................. 75

APE reset......................................................................................................... 78

OMAP1510 (Helen).......................................................................................... 79

Clocks troubleshooting..................................................................................... 82

Clocks troubleshooting..................................................................................... 89

APE-CMT troubleshooting............................................................................... 96

APE-CMT interfaces ......................................................................................96

CMT serial interfaces troubleshooting ............................................................. 98

CBUS .............................................................................................................98

FBUS .............................................................................................................98

MBUS .............................................................................................................98

USB troubleshooting........................................................................................ 99

IrDa interface troubleshooting........................................................................ 102

SIM card error................................................................................................ 106

UI failure......................................................................................................... 107

Display blank ................................................................................................107

Display distorted ..........................................................................................111

Display backlight dim or no backlight ...........................................................112

Keyboard backlight ......................................................................................113

Keyboard malfunction .................................................................................. 115

Bluetooth troubleshooting.............................................................................. 117

Bluetooth settings for Phoenix .....................................................................117

Bluetooth troubleshooting flowchart ............................................................. 118

Multimedia card (MMC) troubleshooting........................................................ 119

Audio faults.................................................................................................... 124

HP earpiece failure .....................................................................................124

HP microphone failure .................................................................................125

External earpiece failure .............................................................................. 126

External microphone failure ......................................................................... 128

IHF speaker failure .......................................................................................129

Accessory detection troubleshooting ............................................................. 131

Camera module troubleshooting.................................................................... 133

Terms ...........................................................................................................133

Image taking conditions effect on image quality .......................................... 133

Camera hardware failure message .............................................................. 138

Image quality analysis.................................................................................... 142

Possible faults in image quality .................................................................... 142

Testing for dust ............................................................................................ 142

Testing for sharpness ..................................................................................143

Bit errors ......................................................................................................143

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NHL-12

Nokia Customer Care 6 - Baseband

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NHL-12 6 - Baseband Nokia Customer Care

1. Glossary of Terms

A/D Analog to Digital ACI Accessory Interface AFC Automatic Frequency Control APE Application Program Engine ASIC Application Specific Integrated Circuit BSI Battery Size Indicator BT Bluetooth BTEMP Battery Temperature CBUS Nokia Proprietary Serial Interface for MCU CDMA Code Division Multiple Access CMT Cellular Mobile Telephone D/A Digital to Analogue DAC Digital to Analogue Converter DAI Digital Audio Interface DBUS Nokia Proprietary Serial Interface for DSP DC Direct Current DCT Digital Core Technology DMA Direct Memory Access DSP Digital Signal Processor EMC Electro Magnetic Compatibility FBUS Nokia Proprietary Serial Interface FM Frequency Modulation FMEA Failure Mode and Effect Analysis GSM G lobal System for Mobile Communications Helen P rocessor from Texas Instruments (also called OMAP1510) HF Hands Free HFCM Hands Free Common Mode HW Hardware electronics including Audio, Energy Management, UIHW and BB I2C Inter-IC Control bus

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NHL-12

Nokia Customer Care 6- Baseband

IC Integrated Circuit IF Interface IHF Integrated Hands Free IMEI International Mobile Equipment Identity IO, I/O Input Output LCD Liquid Crystal Display LDO Low Drop Out LED Light Emitting Diode LSB Least Significant Bit LTPSi Low Temperature Poly Silicon MBUS Nokia Proprietary Serial Interface MCU Micro Controller Unit MMC Multi Media Card MMU Memory Management Unit MPU Micro Processing Unit MSB Most Significant Bit NTC Negative Temperature Coefficient PS Power Save signal PURX Power Up Reset PWB Printed Wiring Board PWM Pulse Width Modulation RF Radio Frequency RTC Real Time Clock SDRAM Synchronous Dynamic Random Access Memory SIM Subscriber Identity Module SMPS Switch Mode Power Supply SW Software TFT Thin Film Transistor TI Texas Instruments uBGA Micro Ball Grid Array package UEM Univer sal En ergy Management

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NHL-12 6 - Baseband Nokia Customer Care

UI User Interface UPP Universal Ph one Processor USB Univer sal Serial Bus VBAT Battery Volt age VCTCXO Voltage Controlled VGA Video Graphics Array XBUS Proprietary Nokia serial communication bus

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Nokia Customer Care 6- Baseband

2. Baseband Top-Level Description

NHL-12 is an imaging category (IP2.5) phone introducing a high-quality colour LCD, improved camera and EDGE for Americas. NHL-12 operates on triple-band GSM (850/1800/1900) and E-GPRS networks, and supports enhanced interfaces for connectivity with BT (Bluetooth) and USB (Universal Serial Bus).

The NHL-12 baseband consists of a dual-processor engine and some product specific blocks, such as IrDA and S60-display.

NHL-12 hardware and baseband consist of two parts: application part APE and phone part CMT.

The APE part is constructed around an OMAP 1510 processor with SDRAM and NAND flash memory as the core. Other major parts for APE are power, UI, audio, Bluetooth and camera.

APE and CMT parts are connected by serial communication buses and by a few control lines. APE part reset and power control comes from the CMT side. Audio control is mostly performed on the APE side, and phone audio is routed from the CMT side.

■ Baseband block diagram

The below system block shows the main BB function blocks.

Figure 1:Baseband block diagram

Flash 32Mb

ARM7

Lead3

UEM

UPP8M

Regulators

CODEC

SIM I/F

LPRFUART

DSPSIO

Hands-free In

Hands-free Out

SIM

XBUS

XABUS

BT Clk Buffer

Battery

NAND 32MB

REGULATORS

DAC

Bluetooth

SDRAM 64MB

APE

Seija IF Adapter

McBSP2

I2C

McBSP1

UART2

GPIO I/F

MCSI2

McBSP3

UART1

MCSI1

SDRAM I/F

Flash I/F

OMAP1510

ARM925T

LEAD3ph3

LCD I/F CLKM

USB

UART3 /

PWT/PWL

SD-MMC

uWire

ARMIO

Keyboard

Camera

Bottom Connector

MIC

OUTL

OUTR

USB

MMC

Rocker

Keyb

Display

12MHz

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NHL-12 6 - Baseband Nokia Customer Care

■ Environmental specifications

Normal and extreme voltages

• Nominal voltage:3.7V

• Lower extreme voltage:3.1V

• Higher extreme voltage:4.2V

Humidity

Operational humidity range is < 95%. Condensed or splashed water may cause interim or permanent phone malfunction.

Table 1: Operational conditions

Environmental condition

Normal operation Reduced performance

No operation

No operation or storage

Charging allowed Long term storage condi-

tions

■ Frequencies in baseband

Ambient

temperature

-10 oC... +55 oC +55 oC... +75 oC

C... -10 oC

-25

-40 oC... -20 oC

< -40 oC and > +85 oC

-25 oC... +60 oC 0 oC... +40 oC

Table 2: CMT clocks

Notes

Specifications fulfilled Operational only for short periods

Operation not possible but an attempt to operate will not damage the phone

No storage; an operation attempt may cause permanent damage

Function Clock speed Location On/Off

VCTCXO 26 MHz VCTCXO/HELGO DSP/MCU is awake all the

time.

System Clock 13 MHz UPP DSP/MCU is awake all the

time. DSP 195 MHz UPP DSP is awake all the time. MCU 50.38 MHz UPP MCU is awake all the time. Sleep clock 32.768 kHz UEM – UPP - OMAP During sleep mode

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Nokia Customer Care 6- Baseband

Table 2: CMT clocks

Function Clock speed Location On/Off

Cbus 1 MHz UPP–UEM/Zocus

Interface Dbus 13 MHz UPP/UEM Interface During transceiver activity RFConvClk 13 MHz UPP/UEM Interface During transceiver activity RFBusClk 13 MHz UPP/HELGO Inter-

face Flash 50.38 MHz UPP/Flash Interface Burst read accesses SIM 3.25 MHz UPP/SIM Interface SIM accesses

Table 3: APE clocks

Function Clock Speed Source To Parameter

APE system clock 12 MHz Crystal OMAP1510 Frequency OMAP DSP 150 MHz OMAP Internal DSP clock Frequency OMAP MCU 150 MHz OMAP Internal MCU clock Frequency CLK32K_IN 32768 Hz UEM OMAP1510

Generated continuously whilst MCU is awake

During transceiver activity

Frequency

Sleep mode Flash interface 37.5 MHz OMAP Flash – APE Frequency SDCLK 75 MHz OMAP SDRAM – APE Frequency BT 12 MHz Crystal BT module Frequency MMC_CLK 16 MHz OMAP MMC Frequency SCLK 12 MHz OMAP Audio DAC Frequency Camera clock 12 MHz OMAP Camera Frequency

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NHL-12 6 - Baseband Nokia Customer Care

3. Baseband Architecture

■ CMT side

The CMT architecture is based on DCT4 Common Baseband. The main functionality of the CMT baseband is implemented into two ASICs: UPP (Universal

Phone Processor) and UEM (Universal Energy Management). System clock for the CMT is derived from the RF circuits. For the CDMA system, the RF clock

is 19.2 MHz and for GSM it is 26 MHz. The low frequency sleep clock is generated in the UEM using an external 32.768kHz crystal. The I/O voltage of the CMT baseband is 1.8V. The analogue parts are powered from 2.8V power rails. The core voltage of UPP can be altered with SW, depending on the prevailing processing power requirements.

UEM is a dual voltage circuit. The digital parts are running from the baseband supply (1.8V) and the analogue parts are running from the analogue supply (2.8V). Some of th e UEM blocks are also connected directly to the battery voltage (VBAT). UEM includes 6 linear LDO (low drop-out) regulator for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. Some parts of the SIM interface have been integrated into UEM. The SIM interface supports 1.8V and 3V SIM cards. Data transmission between the UEM and UPP is handled via two serial buses: DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP and the audio codec is in UEM.

The analogue interface between the baseband and the RF sections is implemented into UEM. UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and supplies the analogue TXC and AFC signals to the RF section under the UPP DSP control. The digital RF-BB interface, consisting of a dedicated RFIC control bus and a group of GenIO pins, is located in UPP.

The baseband supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is done in the UEM according to control messages from the UPP. Keypad tones, DTMF and other audio tones are generated and encoded by the UPP and transmitted to UEM for decoding.

NHL-12 has two galvanic serial control interfaces for CMT: FBUS and MBUS. Communication between the APE and CMT parts is handled through two serial buses: XBUS

and XABUS. XBUS is the main communication channel for general use, and XABUS is for audio data transfer. Also the system reset (PURX) and SleepClk for APE are coming from the CMT side. The PURX is delayed approximately 130ms to fulfil OMAP1510 reset timing requirements and one of UEM’s IR level shifters is used for SleepClk level shifting.

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Nokia Customer Care 6- Baseband

Figure 2:Simplified block diagram for CMT side

RF-BB

R&D

Test IF

Ostrich

Memory

32Mb Flash

RFConv

RFIC

Control

RFClk

CMT - APE interface

XBUS XABUS

UPP 8M

PWREn

130ms delay + 1V8 -> 2V8 LS

PURX

SleepClk

RFConvIF

Internal SIM IF

Audio IF

MBUS

FBUS

DBUS

CBUS

SleepClk

(2V8)

MIC+ACI

IRLEDC IRTX

Prod/AS

Test IF

FBUS

MBUS

UEMK

UEM

Zocus

XEAR

L+R

Audio

DAC

Audio

AMP

32kH

L+R

CHRG current sense

PWR key

Vibra

SIM

EAR

MIC

BATT. IF CHRG. IF

Control

from APE

Accessory

regulator

System Connector

IHF

CMT memories

The memory interface supports 16-bit burst mode NOR FLASH with multiplexed add ress/data bus, standard asynchronous 8-bit SRAM and 16-bit address/data multiplexed SRAM. The UPP has two dedicated CS pins for FLASH and one GenIO that can be used as RAM CS.

The maximum amount of 16-bit SRAM with multiplexed address/data bus that can be connected to UPP is 2MBytes.

Memory configuration

The maximum amount of memory supported by UPP is 2*16MBytes of FLASH plus 2MBytes of external SRAM.

CMT memory configuration includes 32Mbits of 54MHz NOR FLASH. The flash has readwhile-write capabilities.

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NHL-12 6 - Baseband Nokia Customer Care

■ APE side

The functionality of the APE engine is based on the OMAP1510 processor and memories. APE has a total of 32 Mbytes of NAND type flash memory and 64 Mbytes of SDRAM.

The application engine has two separate clock sources: one for the system clock (12MHz) and one for the sleep clock (32.768kHz), which is called Clk32k. The Clk32k is not generated by the application engine, but is derived from the CMT SleepClk using a level shifter. The Clk32k is always running when the engine is powered.

The 12MHz system clock is generated by OMAP1510. The crystal driver and related circuitry is internal to the processor and an external quartz crystal is used as a frequency reference. The Bluetooth clock is also derived from this clock using a clock buffer. Note that the system clock is switched off during sleep mode.

The APE reset (MPU_nReset) is controlled by the CMT reset (PURX) generated by UEM. PURX and MPU_nReset have different logic levels, but the latter is not simply a level shifted version of the former. There is also an external delay circuit connected between the PURX and MPU_nReset lines that keeps the APE reset active circa 130ms after CMT reset is released.

OMAP1510 consists of:

• DSP megamodule with internal program and data memory, instruction cache, DMA controller and hardware accelerator

• ARM925T based processor megamodule with memory management unit (MMU), instruction and data cache

• local bus with MMU

• multi-channel system DMA controller

• peripherals (local and shared) that support glueless system interface

• connecting modules that facilitate communication between these megamodules and system memory (external and internal), and enhance system’s throughput and software development.

OMAP 1510 is optimized for various multimedia and wireless applicat ions such as wireless video and image processing, wireless audio applications, graphics and video display acceleration.

APE memories

APE memory system consists of a 64Mbyte(32Mx16) SDRAM device connected to the OMAP1510 fast external memory interface (EMIFF) and a 32Mbytes(32Mx8) of NAND-flash device connected via Seija Flash-Interface Adapter ASIC to the OMAP1510 slow external memory interface, EMIFS. The memory interface is shown in Figure 3, “APE external memories,” on page 14. NAND-flash is used as a boot the device and mass memory. User data is stored in NAND. The operating voltage of all memory components is 1.8V, supplied from V18.

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NHL-12

Nokia Customer Care 6- Baseband

Figure 3: APE external memories

INT

256Mb

NAND-flash

32Mx8

fCLE fALE

fnCE1

fnRE fnWE fnWP

4.7kohm

fR/B

I/O

Seija Flash-

interface

adapter

512Mb SDRAM 32Mx16

[11:0]

FCLK

NFCS0

NFOE NFWE NFRP

NFAVD

FADD

FDATA

SDATA

SADD

SBANK

22ohm SDCLK

NSCAS NSRAS

SDCLK_EN

NSWE NSDQML NSDQMU

NFCS0

EMIFS

[24:1]->[12:1]

EMIFF

Traffic Controller

OMAP1510

GPIO9

Interrupt

Handler

Memories are packaged as follows:

• SDRAM, 54ball CSP, 10x11.5x1.1mm, 0.8mm pitch Pb-free balls

• NAND, 63ball TBGA, 11x9x0.9mm, 0.8mm pitch Pb-free balls

• Seija ASIC, 64ball FBGA, 6x6x1.2mm, 0.5mm pitch Pb-free balls

■ Energy management

The energy management of NHL-12 is based on BB 4.0 architecture. BL-5C battery supplies power primarily to the UEM ASIC and the RF PA. UEM includes several regulators to supply RF and baseband. It provides the energy management including power up/down procedure.

Power supply modes

The state machine in UEM controls mainly the operating modes of the eng ine. State transitions are enabled by signals taken from UEM, UPP and OMAP1510. In general, the state transitions are based on the following information:

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NHL-12 6 - Baseband Nokia Customer Care

• Battery voltage (HW limits and cutoffs)

• Back-up battery voltage limits and cutoffs

• Power key status (in NHL-12 engine power key connected to PWRONX pin of UEM)

• Delays generated by the state machines

• Real time clock (RTC) alarms

• Watchdogs

• Thermal shutdowns

• SLEEPX signal from UPP

• LOW_PWR signal from OMAP1510

The functional behaviour of the UEM can be divided into 6 different states. Since the UEM controls the regulated power distribution of the phone, each of these states affects the general functionality of the phone:

• No supply

•Backup

• Power off

•Reset

• Power on

•Sleep

Brief description of operating modes

• NO_SUPPLY mode means that the main battery is not present or its voltage is too low (below UEM master reset threshold limit) and back-up battery voltage is too low.

• In BACK_UP mode the main battery is disconnected or empty but back-up battery has sufficient charge in it

• IN POWER_OFF mode the main battery is present and its voltage is over UEM master threshold limit. All regulators are disabled.

• RESET mode is a synonym for start-up sequence and contains in fact several modes. In this mode certain regulators and system oscillators are enabled and after they have stabilized, the system reset (PURX) is released and PWR ON mode entered.

• In POWER_ON mode SW is running and controlling the system.

• SLEEP mode is entered only from PWR ON mode when system activity is low. CMT and APE sides can be in sleep mode independent of each other.

For controlling transitions between modes, UEM includes:

• RC oscillator (32kHz)

• crystal oscillator (32kHz)

• comparators

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• digital circuitry These are used for generating limits and time delays. Controlled powering off is done when the user requests it or when the battery voltage is fallin g

too low. Complete power down is done, if SW does not write to the watchdog register anymore and a defined time after previous writing is elapsed. As this happen s, PURX is forced low and all regulators are disabled. If the battery voltage falls below the very last SW–cutoff level, SW will power off the system by letting the UEM’s watchdog elapse. If a thermal shutdown limit in UEM regulator block is exceeded, the system is powered off. System reset PURX is forced low.

Uncontrolled powering off happens, when the battery is suddenly removed. This is problematic as data may corrupt in memories, if the removal takes place during the access phase to these devices. UEM’s state machine notices battery removal after battery voltage has been below VCOFF– for 5 us and enters PWR_OFF mode. PURX is set low and all UEM’s regulators are disabled.

There are three watchdogs in UEM. First one is for controlling system power-on and powerdown sequences. The initial time for this watchdog after reset is 32s. The time can be set using a register. This watchdog is used for powering the system off in a controlled manner. The second one is for security block and is used during IMEI code setting. The third one is a power key watchdog. It is used to power off the system in case SW is stuck and the user presses the power key. This watchdog, if not acknowledged by the SW, shuts down the system after a predefined delay (2–15 seconds). The feature is enabled as default and can be disabled by SW.

OMAP1510 also includes a hardware watchdog. This resets OMAP1510, BT and Seija at the same time. It is possible to disable this watchdog with the help of SW.

Table 4: Reset thresholds and cutoff limits

VMSTR+ Master reset threshold 2.1 V VMSTR– Master reset threshold 1.9 V VCOFF+ Hardware cutoff 3.1 V VCOFF– Hardware cutoff 2.8 V VCHAR+ VCHAR detection threshold 2.0 V VCHAR- VCHAR detection threshold 1.8 V

CUTOFF

SW cutoff limit System dependent

VBUCOFF+ Backup battery cutoff 2.1 V VBUCOFF– Backup battery cutoff 2.0 V

Battery BL-5C

The main battery of NHL-12 is a lithium ion battery BL-5C with the capacity of 850mA.

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NHL-12 6 - Baseband Nokia Customer Care

The battery interface has three pins: VBAT, GND and BSI. Temperature indication is located on the engine PWB. Temperature measurement is performed using an NTC resistor (47k nom) on the engine PWB.

Current gauge (Zocus)

The NHL-12 engine supports HW for phone and charging current measuring. The current measurement chip that is used is LM3820. Current gauge is also supported by the ISA EM Core SW. It can be used to estimate the battery charge level presented as batt ery bars on the display.

Current is measured from the positive battery terminal using a sense resistor, so that all phone’s consumed current flows through that resistor. Correspondingly, when charging, all current to phone’s battery flows through this resistor, but the direction is reversed. The sense resistor is formed from PWB tracks arranged as a 4-terminal resistor. LM3820 senses voltage across the resistor. The maximum current depends on the sense resistor value.

RTC capacitor

Real Time Clock (RTC), crystal oscillator and backup battery circuitry are located inside the UEM. Two regulators are used to provide needed voltages for external backup supply and backup battery charging: VRTC for internal clock circuitry and VBU for backup battery charging. The backup battery has voltage range VBACK = 2.0V and discharged down to 2.0V).

min

– 3.2V

– 3.3V

typ

(charged to 3.2V

max

Charging the backup battery is controlled by the UEM’s digital block by enabling VBU regulator and backup battery is charged with constant voltage up to 3.2V. By default, VBU regulator is disabled in reset and it is reset always when PURX='0'.

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Power distribution

Figure 4: Power distribution diagram

Measurement resistor

TypeUnitOrDepartmentHere

LM3820

TypeYourNameHere TypeDateHere

UEM

VR1..7

VSIM

VANA VFLASH1 VFLASH2

VCORE

VIO

BATTERY

RF PA Various

SIM

UPP CORE I/O

DOCUMENTTYPE 1 (1)

CMT FLASH

VCC I/O

AUDIO PA

LP3985-2.8

2.8V

GENIO28 of UPP

LP3981-2.8

2.8V

LM2708-1.57

1.57V (SMPS)

LM2608-1.8

1.8V (SMPS)

LP3985-3.0

3.0V

GPIO15 of OMAP1510

Vout

V28

V15

V18

VMMC

Vbus

Klight (UEM) Uidrv(3)

Dlight (UEM) Uidrv(4)

System connector

Vout USB cable

LP2985-3.3

3.3V

GPIO3 of OMAP1510

OMAP1510

I/O (2.8V) USB I/O (1.8V) CORE

TK11851L

(SMPS)

LM3350-4.1V

(SMPS)

V33

CORE I/O

AUDIO DAC

NAND FLASH+Seija

CORE+I/O

SDRAM

I/O CORE

MMC

Display

Keyboard

Camera

Battery line

Power line Control signal

Measurement signal

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NHL-12 6 - Baseband Nokia Customer Care

■ DC characteristics

Regulators

The transceiver baseband section has a multi-function analogue ASIC, UEM, which contains six pieces of 2.78 V linear regulators and a 4.8 V switching regulator. All the regulators can be controlled individually by the 2.78 V logic directly or through a control register.

The seven regulators are named VR1 to VR7. VrefRF01 and VrefRF02 are used as the reference voltages for Helgo, VrefRF01 (1.35V) for the bias reference and VrefRF02 (1.35V) for the Rx ADC (analog-to-digital converter) reference.

The regulators (except VR7) are connected to Helgo. Different modes of operation can be selected inside Helgo according to the control information coming through the RFBus. UEM’s internal regulators are used for the powering of the baseband module. In addition to this, VIO and VFLASH1 regulators of UEM are used to enable/disable APE side regulators.

VCORE and VSIM are programmable linear regulators. Default state for VCORE voltage is

1.57V. There are also internal regulators in UEM. They are used for the powering of the CMT BB. In

addition to this, VIO and VFLASH1 regulators of UEM are used to enable/disable APE side regulators. BB4.0 supports only UEMKEdge or UEMC with UPP8Mv3.

NHL-12 APE energy management uses two switch mode power supplies: LM2608 and LM2708, generating 1.57V and 1.8V to OMAP1510 and memories. In addition, the APE side EM HW consists of several other discrete regulators:

• One linear regulator for 2.8V APE side logic (LP3981)

• One 2.8V linear regulator (LP3985) for powering the MMC card.

• One 3.3V linear regulator (LP2985) for powering the USB block of OMAP1510.

LM2608 is used to generate 1.8V for I/O’s OMAP1510 processor and APE side memories. Normally, LM2608 works in constant frequency PWM mode. But in the case of light loads, it is possible to control LM2608 via SYNC/MODE pin to low quiescent current mode. In this mode, LM2608 works as a linear regulator and the output current capacity is only 3mA. LM2608 ne eds an external 1.35V reference voltage. In the case of NHL-12 engine, this reference voltage is taken from VrefRF01 of the UEM.

LM2708 is used to generate 1.57V for the core of OMAP1510 processor. LM2708 does not need external reference voltage. Pin (Isel) can be used to adjust the current limit external coil. NHL-12 engine has a higher current limit, which allows 400mA output current capacity.

In NHL-12 engine, LOW_PWR signal of OMAP1510 (multiplexed on pin ARMIO_5) is used to control LM2708/LM2608 to linear mode when processor goes to deep sleep mode. The functionality of the LOW_PWR signal is the following: when OMAP1510 is in a low power state (deep sleep mode), this signal is high. At reset and when in normal func tional mode, this signal is low. Because the polarity SYNC/MODE pin is reverse, an additional inverter is used in this control line.

Table 5: CMT regulators

Regulator

VIO 1.72 1.8 1.88 150

Issue 3 05/2005 COMPANY CONFIDENTIAL 19

Min VoltageVNom. VoltageVMax.VoltageVMax. Current

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NHL-12

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Table 5: CMT regulators

Regulator

VCORE 1.053

VFLASH1 2.70 2.78 2.86 70 VFLASH2 2.70 2.78 2.86 40 VANA 2.70 2.78 2.86 80 VSIM 1.745

Regulator

Output

V15 SMPS

Type

mode

Min VoltageVNom. VoltageVMax.VoltageVMax. Current

200

1.35

1.57

1.8

2.91

Regulator

Type

LM2708-

1.57

1.8

3.0

Table 6: APE regulators

Main

Voltage

1.523 1.57 1.617 400 VFLASH1OMAP Core

Min

Voltage

1.855

3.09

Max

Voltage

Max

Current

Enabled byUsed for

Block

Linear mode

V18 SMPS

mode

Linear mode

V28 Linear LP3981-2.8 2.716 2.8 2.884 300 VIO OMAP I/O,

VMMC Linear LP2985ITL

V33 Linear LP2985-3.3 3.201 3.3 3.399 150 GPIO3 Helen USB

LM2608-

1.8

X-3.0

1.282 1.35 1.418 15

1.764 1.8 1.836 400 VIO OMAP I/O, SDRAM Core+I/O, NAND Flashes+ Seija, LCD, camera

1.710 1.8 1.890 3

BT Audio DAC, LCD, camera, IR

2.91 3.0 3.09 150 GPIO15 MMC

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NHL-12 6 - Baseband Nokia Customer Care

Table 6: APE regulators

Regulator

Output

Type

Regulator

Type

Main

Voltage

Min

Voltage

Max

Voltage

Max

Current

Enabled byUsed for

Block

USB host - 4.3 5.0 5.25 100 USB Regu-

lator Input range

VOUT Linear LP3985-2.8 2.716 2.8 2.884 150 GENIO28Accessory

powering

V15 SMPS

mode Linear

LM2708-

1.57

1.523 1.57 1.617 400 VFLASH1OMAP Core

1.282 1.35 1.418 15

mode

V18 SMPS

mode

LM2608-

1.8

1.764 1.8 1.836 400 VIO OMAP I/O, SDRAM Core+I/O, NAND Flashes+ Seija

VKEYB SMPS

mode

LM3353NOPB4.038 4.1 4.161 80mA UEM

Klight

Keypad leds

■ Voltage regulators in BB for RF

Values are referenced to GND unless otherwise specified.

Table 7: Voltage regulators in BB for RF

Signal Min Nom Max Note

VR1A / VR1B 4.6V 4.75V 4.9V I VR2 2.70V 2.78V 2.86V I VR3 2.70V 2.78V 2.86V I VR4 2.70V 2.78V 2.86V I

VR5 2.70V 2.78V 2.86V I

VR6 2.70V 2.78V 2.86V I

VR7 2.70V 2.78V 2.86V I

= 10mA

max

= 100mA

max

= 20mA

max

= 50mA

max

sleep

= 50mA

max

sleep

= 50mA

max

sleep

= 45mA

max

= 0.1mA

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Table 7: Voltage regulators in BB for RF

Signal Min Nom Max Note

VrefRF01 1.334 1.35 1.366 Reference voltage

Imax = 0.1mA

VrefRF02 1.323 1.35 1.377 Reference voltage

Imax = 0.1mA

■ Charging

Charging control and charge switch are located in the UEM. There is a thermal protection circuitry in the UEM to protect the chip. If temperature rises above

the threshold(150×C typ.), a charge switch is opened immediately and charging is stopped. When the chip cools down, charging is continued normally.

HW supports all DCT4 chargers. 3-wire chargers are supported, but 3-wire charging is not. In practice this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers.

■ Audio circuitry

This section describes the audio HW of the engine. External audio components and acoustics are not considered in detail in this section.

As this engine is based on dual-processor architecture, also audio is divided into separate APE and CMT parts. Audio control is mostly on the APE side; phone audio is routed from the CMT side to APE in analogue form, except Bluetooth which is in digital form. On the CMT side, audio HW is integrated into the UEM ASIC. On the APE side, the most important parts are OMAP1510, audio DAC and audio power amplifier.

The stereo output of this amplifier is designed for use with the ext ended Pop-port It also has a differential mono output for driving the handsfree speaker.

The battery voltage (VBATT) is used directly as supply voltage for audio amp lifier. The nominal battery voltage is 3.6V.

The type of DAC used is TLV320AIC23B and the supply voltage for this is coming from V28.

connector.

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Figure 5:NHL-12 audio block diagram

Earpiece

NHL-12 uses an earpiece which is a 32 ohm speaker with a diameter of 8 mm. The supply voltage is 2.7V. The earpiece is driven differentially directly by the UEM. The ca psule is mou nted into the LCD frame assembly.

Internal microphone

The internal microphone is mounted in the B-cover. The microphone is omnidirectional and it is connected to the UEM microphone input MIC1P/N. The microphon e input is asymmetric and the UEM (MICB1) provides the bias voltage. Nominal impedance of the microphone is

1.8kOhms. The microphone input to UEM is ESD protected. Spring contacts are used to connect the microphone to the main PWB.

Integrated hands-free

Integrated hands-free speaker (IHF), 16mm, is used to generate alertin g and warning tones in NHL-12. The IHF speaker is driven with audio amplifier. The speaker capsule is mounted in the antenna module. Spring contacts are used to connect the IHF speaker contacts to the main PWB.

Audio accessory receive path

In NHL-12 the accessory receive path is directly driven from the UEM HF / HFCM differential audio outputs. The output signal complies with the Pop-port accessory interface.

For EMC protection, ferrites are connected in series to the earpiece and for ESD protection bizener is used.

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Audio control signals

The HEADINT signal is needed for recognizing the external device (e.g. headset) connected to the system. The recognition is based on the ACI-pin on the system connector.

The button of the external device generates HOOKINT. This is used, for example, to answer or to end a phone call.

■ Acoustics

Earpiece acoustics

The earpiece is a PSS 8mm element. The earpiece is placed inside the plastic UI frame. It is sealed to UI support frame with a foam ring. This cavity is ported to a second cavity formed between the UI support frame and A-cover with Bezel. Sound holes vent this cavity out of the UI support flame. All holes are shielded to prevent dust and small particles from entering the phone.

IHF speaker acoustics

In NHL-12, the IHF speaker is used for integrated hands-free and ringing tone applications. It has a structure, which consists of two cavities: one back cavity and one front cavity.

When using the phone in the IHF mode, speech is fed to the IHF-speaker. Ringing tones are optimized according to bandwidth and frequency response. The sound holes are placed in the B-cover. Sound holes are shielded to prevent dust and small particles from entering the phone.

Figure 6:Exploded view of antenna assembly.

Microphone acoustics

NHL-12 has a standard microphone module. The module is embedded into a so-called "rubber boot" and connected to the system module by spring contacts.

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NHL-12 6 - Baseband Nokia Customer Care

The microphone is placed close to the system connector. The sound port of the microphone is located towards the bottom of the phone.

Vibra motor

A vibra alerting device is used to generate a vibration signal for an incoming call. It is located in the middle part of the phone and it is connect ed to the main PWB with spring contacts. The vibra is controlled by a PWM signal coming from UEM. The vibra motor is mounted in the Bcover assembly.

■ Audio modes

This section describes NHL-12’s engine audio modes. The following audio modes are supported:

• Hand portable

• Integrated hands-free

• Accessory audio mode

• APE audio mode

• Bluetooth audio mode

Hand portable

Hand portable mode is the basic audio mode. This is entered when no audio accessories are connected and the hands-free mode is not selected.

In the hand portable mode, earpiece path and internal microphone path are in use. A call is created by the CMT. The uplink signal is generated by the microphone and transferred

to MIC1P/N differential inputs. The internal microphone is enabled using the MICB1 bias voltage O/P on UEM. The signal is amplified at least by 20 dB, low pass filtered, converted into digital domain and then postponed through UPP to transducer equalizer and finally to APE for speech encoding.

The EAR output on the UEM is selected for Rx audio via the internal earpiece. The UEM sets the audio uplink gain and downlink attenuation. Different downlink attenuation levels function as the volume control.

The internal earpiece is driven by the CMT engine for voice calls. The internal microphone is driven by the CMT for voice calls and voice recording.

All volume controls are handled by the UEM.

Integrated hands-free audio mode (IHF)

This mode is entered by user selection. A call is created by the CMT. The uplink signal is generated by the microphone and transferred

to MIC1P/N differential inputs. The internal microphone is enabled using the MICB1 bias voltage O/P on the UEM.

The downlink audio is processed in the UPP and transferred to the UEM. Then the downlink signal is amplified in the single-ended XEAR Output driver in the UEM. The mono XEAR output is connected to the MICIN input of the APE Audio DAC via a low-pass filter. The signal is then routed through the line output of DAC (LHPOUT), high pass filtered and routed to the Phone_In_IHF input. This drives the internal speaker via the SPKRout driver.

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Accessory audio mode

This mode is entered when an audio accessory (mono/ stereo headset, loopset, basic ca r kit) is connected to the system connector. The routing of the audio signal is identical for all accessories (except for the stereo headset), but gain control depends on the accessory used.

The call is created by the CMT. The uplink signal is generated by the external microphone and transferred to the UEM MIC2 input, after which the MIC2B bias voltage and MIC2P/N inputs are enabled on the UEM.

The downlink audio signal is routed through the single-ended XEAR output driver by the UEM. The mono XEAR output is connected to the MICIN input of the DAC via a lo pes filter. Then signal is routed through L Accessories are driven via the system connector using the L stereo headset is used also the R

OUT

and R

drivers of DAC to the L

OUT

driver is connected. Both channels play the same mono

OUT

and RIN inputs of the LM4855.

driver of LM4855. When a

OUT

audio signal.

APE audio mode

This mode is entered when a user starts a multimedia application (e.g. MP3, AAC etc.) or in the case of ringing tones/ other notification tones played via the IHF speaker or the system connector.

When an MP3 is played, encoded data is read from the MMC card and the decoding is performed by OMAP1510. After decoding, the raw linear data is sent to the external audio DAC as a 16-bit PCM audio through the I2S connection. The DAC performs the digital-to-analogue-audio conversion.

For playback and streaming of digital audio, synthesized ring tones, miscellaneous tones, and game sounds, the APE side can be selected to drive either the IHF speaker or the system connector.

For playback via the internal speaker, the LHPOUT output on the audio DAC is used. The signal is routed to Phone_in_IHF input on LM4855.

For playback via the stereo/ mono headset or other accessories, the L of the Audio DAC are used. These are routed to the L

/RIN inputs of the LM4855. In the case

OUT

and R

OUT

outputs

of mono accessory, OMAP1510 produces a monophonic signal to DAC.

Bluetooth audio mode

Bluetooth audio data is transferred using a separate interface, MCSI. MCSI is a serial (voice) interface with multi-channels transmission capability. There are two in-

dependent MCSI interfaces in OMAP1510 and one of them, MCSI1, is connected to the PCM interface of BC02. The MCSI1 is a half-duplex interface and it can work as either master or slave. This 4-wire interface has a bi-directional serial clock and frame synchronization. MCSI has a programmable word length (from 3 to 16 bits) and frame configuration.

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4. Baseband External and Internal Signals and Connections

This section describes some of the external and internal electrical connections and interface levels on both CMT and APE side. The electrical interface specifications are collected into tables that cover a connector or a defined interface.

■ CMT internal signals and connections

Table 8: Internal microphone

Signal Min Nom Max Condition Note

MICP 200mV

AC 2.2kΩ to MIC1B

2.0 V 2.1 V 2.25 V DC

MICN 2.0V 2.1V 2.25V DC

Table 9: Internal speaker

Signal Min Nom Max Condition Note

EARP

0.75V 0.8V

EARN

0.75V 0.8V

2.0 V

0.85V

2.0 V

0.85V

AC DC

Differential output

= 4.0 Vpp)

diff

■ CMT external signals and connections

Table 10: DC connector

Pin Signal Min Nom Max Condition Note

1 VCHAR 11.1V

7.0 V

RMS

8.4 V

peak

RMS

16.9 V

7.9 V

1.0 A

9.2 V

850 mA

peak RMS peak

RMS

Standard charger Charger positive

input

Fast charger

2 CHGND 0 Charger ground

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U/I

levels

connector

Impedance Notes

Pin Signal Description

Table 11: Pop-port

Spectral

range

1 CHARGE V Charge DC 0-9 V /

0.85 A 2 GND Charge GND 0.85 A 100 mΩ (PWB + conn.) 3 ACI ACI 1 kbit/s Dig 0 /

2.78V 4 VOUT DC out DC 2.78V /

47 Ω Insertion & removal

detection

100 mΩ (PWB + conn.) 200mW

70mA

5 USB VBUS DC in DC 4.375-

Connected to APE side

5.25V 6 USB D+ 12M 0-3.3V Connected to APE side 7 USB D- 12M 0-3.3V Connected to APE side 8 USB Data

GND

Data GND Ferrite to

engine GND

9 XMIC N Audio in 300 - 8k 1Vpp &

2.78V 10 XMIC P Audio in 300 - 8k 1Vpp &

2.78V 11 HSEAR N Audio out 20 - 20k 1Vpp 10 Ω 12 HSEAR P Audio out 20 - 20k 1Vpp 10 Ω 13 HSEAR R NAudio out 20 - 20k 1Vpp 10 Ω Not conn. In mono

14 HSEAR R PAudio out 20 - 20k 1Vpp 10 Ω Not conn. In mono

Table 12: Electrical characteristics of SIM connector

Pin Name Parameter Min Typ Max Unit Notes

1 VSIM 1.8V SIM Card 1.62 1.8 1.98 V Supply voltage

3V SIM Card 2.7 3.0 3.3 V

2 SIMRST 1.8V SIM Card 0.8xVSIM

VSIM

0.2xV

V SIM reset (output)

SIM

3V SIM Card 0.8xVSIM

VSIM

0.2xV

SIM

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Table 12: Electrical characteristics of SIM connector

Pin Name Parameter Min Typ Max Unit Notes

3 SIMCLK Frequency 3.25 MHz SIM clock

rise/Tfall

max 50 ns

rise/Tfal

1.8V V

3V V

4 DATA 1.8V V

1.8V V 3V V

3V V

1.8V V

3V V

l 50 ns

oh ol

0.7xVSIM 0

VSIM

0.2xV SIM

0.7xVSIM

-0.3

VSIM

0.2xV SIM

oh ol

ih il

0.7xVSIM

-0.3

0.7xVSIM

-0.3

0.7xVSIM

-0.3

VSIM

0.3 VSIM

+0.3

0.2xV SIM

0.7xVSIM

-0.3

VSIM +0.3

0.2xV SIM

V SIM data (output)

V SIM data (input)

rise/Tfall

max 1µs

5 NC Not connected 6 GND GND 0 0 V Ground

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5. BB-RF Interface

The interface between the baseband and the RF section is mainly handled by the UEM ASIC. UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of the received and transmitted audio signals to and from the user interface.

The UEM supplies the analogue TXC and AFC signals to the RF section according to the UPP DSP digital control. Data transmission between the UEM and the UPP is implemented using two serial busses: DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC. UEM is a dual voltage circuit: the digital parts are running from the baseband supply 1.8V and the analogue parts are running from the analogue supply 2.78V; also VBAT is directly used.

The table below describes all the analogue signals from the baseband block to the RF block and back. The signal names are based on the schematics.

Table 13: Analogue signals between BB and RF

Signal

Name

VCTCXO VCTCXO UPP Frequency 26 MHz High stability

From To Parameter Min Typ Max Unit Function

clock signal for the logic circuits, AC coupled. Distorted sinewave e.g. sawtooth.

Signal amplitude

BB load resistance

BB load capacitance

DC level 1.3 1.35 1.4 V Input imped-

ance DC level 1.17 1.20 1.23 V

0.2 1.32 Vpp

10 kohm

10 pF

500 kohm

Source impedance

TXQP / TXQN

30 COMPANY CONFIDENTIAL Issue 3 05/2005

UEM Helgo Same spec

as for TXIP / TXIN

200 ohm

Page 33

NHL-12 6 - Baseband Nokia Customer Care

Table 13: Analogue signals between BB and RF

Signal

Name

AFC UEM VCTCXO Voltage Min

TXC UEM Helgo Voltage Min

RFTemp Helgo UEM Voltage at -

From To Parameter Min Typ Max Unit Function

Max

Source impedance

Max

Source impedance

Load resistance capacitance

20 deg.C

0.0

2.4

200 ohm

2.4

1,57 V Temperature

0.1

2.55

0.1 V Transmitter

200 ohm

V Automatic fre-

kohm pF

quency control svoltage for the VCTCXO

power level and ramping control

sensor of the RF.

Voltage at +25 deg.C

Voltage at +60 deg.C

DC_sensePA UEM Voltage 0.7 1.35 2.0 V PA final stage

IPA1&IPA2UEM PA Output volt-

age

Current range

Resolution 4 bit s

0 2.7 V PA final stage

0 5 mA

1,7

1,79

quiescent current level information

quiescent current adjustment

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NHL-12

Nokia Customer Care 6- Baseband

6. NHL-12 User Interface

The row and column lines of the UI are controlled by OMAP1510 and backlights by UEM. Figure 7, “BB UI connections,” describes the BB user interface connections:

Figure 7:BB UI connections

Keyboard

LCD

Display

IR Link

Earpiece

IHF

speaker

Baseband

Microphone

Vibra

Pop-Port

System Connector

■ S60 - LCD interface

The user interface features a 176x208 pixel active matrix colour TFT display with 65536 colours.

The backlight voltage is generated using a regulator (D4451). Figure 8, “Interface connections.,” shows the LCD interface connections:

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Figure 8:Interface connections.

OMAP1510

!FLASH.OE

!FLASH.CS1

FLASH.AD(2)

!FLASH_WR

FLASH.D(7:0)

ARMIO2

V28

100k

Level shifter

100R

RC1

470p

PURX

100p

RC2

220R

LCD module

E M

E S D

I L T

E R

!RD

!CS

D_!C

!WR

D(7:0)

!RESET

The interface uses a 8-bit data transfer. Partial display function is implemented in the module.

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LCD & keypad illumination

In NHL-12, white LEDs are used for LCD lighting and blue for keypad lighting. There are four blue LEDs for keypad backlight. All LEDs have their own series resistors. A step-up DC-DC converter is used as a LED driver.

Table 14: DC characteristics and PIN assignments

Pin no. Symbol i/O Description

1 GND Ground 2

3 4

5 D1 Bi-directional Data bus 6 D2 Bi-directional Data bus 7 D3 Bi-directional Data bus 8 GND Ground 9

10 11

12 LEDin Power supply LED anode 13 LEDout Power supply LED cathode 14 L_GND Ground Guard ring ground for LEDs 15 ICS Input Chip select (low active) 16

17 18

IWR GND D0

VDDI VDD LGND

DAC GND D7

Input Ground Bi-directional

Power supply Power supply Ground

Input Ground Bi-directional

Memory write enable (low active Data bus

Supply voltage for digital circuits Supply voltage for analogue circuits Guard ring ground for LEDs

Data/command information signal

Data bus 19 D6 Bi-directional Data bus 20 D5 Bi-directional Data bus 21 D4 Bi-directional Data bus 22 TF Output Tearing effect 23

34 COMPANY CONFIDENTIAL Issue 3 05/2005

IRD IRES

Input Input

Memory read enable (low active)

Reset signal (low active)

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NHL-12 6 - Baseband Nokia Customer Care

Current consumption

Table 15: LCD interface current consumption

Maximum ratings

Table 16: LCD interface absolute maximum ratings

■ Camera interface

NHL-12 features a built-in VGA camera. The camera control interface operates by I2C bus. The camera module itself is assembled into the metal frame and connected to the PWB via a

20-pin spring connector. Camera powering voltages, V28&V18, are routed through the X4450 connector.

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■ Keyboard

The keyboard interface of OMAP1510 is a 6x5 matrix interface. The keyboard interface pins are normal IOs with 30/70 decision limits at 2,8 operating voltage: 1.96V high level an d 0,84V low level.

Table 17: Key connection example

Kbr(0) Kbr(1) Kbr(2) Kbr(3) Kbr(4) Kbr(5) Kbc(0) Soft1 Soft2 Kbc(1) App/Averell Kbc(2) Edit 1 4 7 Kbc(3) * 2 5 8 Kbc(4) # 3 6 9 Kbc(5) Clear 0 Send End

Table 18: Rocker connection

ARMIO0

ARMIO7 ARMIO4 ARMIO1

ARMIO6

■ Bluetooth

Bluetooth provides a fully digital link for communication between master unit and one or more slave units. The system provides a radio link that offers a high degree of flexibility to support various applications. Data and control interface for a low power RF module is provided. Data is regulated between the master and the slave.

The Bluetooth system in NHL-12 is compliant with the Bluetooth specification V1 .1. The system is based on single chip Bluetooth solution, BC02. The chip contains radio and baseband parts as well as MCU and on-chip ROM memory. Together with some external components (matching components, filter, balun etc.) and an antenna, it forms the Bluetooth system, which can be attached to the host (OMAP1510). Bluetooth components are mounted directly to the PWB.

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NHL-12 6 - Baseband Nokia Customer Care

Figure 9:Bluetooth system

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7. SIM Interface

UEM contains the SIM interface logic level shifting. SIM interface supports 3V and 1.8V SIMs. SIM supply voltage is selected by a register in the UEM. It is only allowed to change the SIM supply voltage when the SIM IF is powered down.

The SIM interface is powered up when the SIMCardDet signal indicates "card in". This signal is derived from the BSI signal.

Table 19: SIM interface signals

Parameter Variable Min. Typ Max Unit

SIMCARDet, BSI comparator Threshold Vkey 1.94 2.1 2.26 V SIMCARDet, BSI comparator Hysteresis (1) Vsimhyst 50 75 100 mV

The entire SIM interface is located in two chips: UPP and UEM. The SIM interface in the UEM contains:

• power up/down

• port gating

• card detect

• data receiving

• ATR-counter

• registers

• level shifting buffers logic

The SIM interface is the electrical interface between the SIM card and the mobile phone (via UEM device).

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Figure 10:SIM interface NHL-12

SIM

C5 C6 C7

From

SIM

ASIP

SIMIO

SIMCl

SIMRst VSIM

BSI

UEM

SIMIF

SIMIO

SIMCl

SIMRst

UEM digital logic

UPP

SIMIO

SIMClk

SIMR

UEMInt CBusDa

CBusEnX

CBusClk

UIF Block

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8. System Connector Interface

The system connector in NHL-12 is a Pop-Port

connector. It consists of a charging plug socket and system connector. The Pop-Port is a feature-based interface. The accessory contains information about its features (ACI ASIC) and it is detected with a fully digital detection procedure.

Four new functions are introduced with the Pop-Port

system connector interface:

• Accessory control interface (ACI)

• Power out

• Stereo audio output

• Universal serial bus (USB)

Table 20: Pop-port

functions

Function Note

Charging Pads for 2-wire charging in cradles Audio 4-wire fully differential stereo audio output Power supply for

2.78V/70mA output to accessories

accessories ACI (Accessory Con-

Accessory detection/removal & controlling

trol Interface) FBUS Standard FBUS, Fast FBUS

Note! NHL-12 does not support accessories using FBUS serial interface.

USB (default) USB v.2.0 device mode (full speed 12M)

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Figure 11:Pop-PortTM connections

PWB

Charge

Shielding GND

Charge GND

Table 21: Pop-port

ACI

Vout

USB D-

USB D+

USB VBUS

connections

DATA GND

XMIC N

XMIC

HSEAR N

HSEAR

HSEAR R N

Pin # Signal Note

1 VCHAR 2 GND Charge ground 3 ACI Insertion & removal detection /Serial data

bi-directional 1 kbit/s 4 Vout 200mW 5 USB VBUS 6 USB D+/FBUS Rx 7 USB D-/FBUS Tx 8 USB data GND Data ground

HSEAR R

Shielding GND

9 XMIC N Negative audio in signal 10 XMIC P Positive audio in signal 11 HSEAR N Negative audio out signal.

Max bandwidth from the phone 12 HSEAR P Positive audio out signal.

Max bandwidth from the phone 13 HSEAR R N Not connected or grounded in mono. 14 HSEAR R P Not connected or grounded in mono.

■ Universal Serial Bus (USB)

The USB interface of OMAP1510 supports the implementation of a full speed device, fully compliant to USB2.0 standard. NHL-12 uses an integrated USB transceiver.

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OMAP1510 can provide a maximum of three sets of USB ports. One set is an integrated USB transceiver and the other two sets are LVCMOS I/O pins that implement interfaces to external transceivers. However, only the first set is available by default and used in the NHL-12 engine.

■ Accessory Control Interface (ACI)

ACI (Accessory Control Interface) is a point-to-point, bi-directional serial bus. ACI has two main features: 1) detecting the insertion and/or removal of an accessory device and 2) acting as a data bus.

Third feature provided by ACI is to identify and authenticate a specific accessory which is connected to the system connector interface.

All accessories cause headint interrupt when connected to or disconnected from the system connector. The insertion of an accessory generates a headint interrupt by pulling the ACI line

down. When no accessory is present, the UEM’s internal headint pull-up resistor keeps the line

high All accessories have a common detection start sequence, when phone gets headint interrupt

from high to low transition in the ACI pin.

Figure 12:Principle schematics of ACI accessory and engine

VOUT (Accessory Voltage Regulator)

An external LDO Regulator is needed for accessory power supply purposes. All ACI accessories require this power supply. Regulator input is connected to the battery voltage VBAT and output is connected to the Vout pin. The regulator is controlled via UPP (On/Off-function).

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Figure 13:Accessory power supply diagram

Table 22: Accessory power supplies

Signal Min Nom Max Note

Vout 2.70V 2.78 2.86V I GenIO(28) 1.4 1.8 1.88

0.6

= 150mA

max

High (ON) Low (OFF)

■ HookInt

The hookInt signal is generated by creating a short circuit between the headset microphone signals. An LP filter is needed on the hookInt input to filter the audio signal. In this mode, the earpiece signal on the HF and HFCM pins is in the opposite phase. The earpiece is driven differentially.

When no accessory is present, the hookInt signal is pulled up with the UEM resistor. When the accessory is inserted and the microphone path is biased, the hookInt signal decreases to 1.8V due to the microphone bias current flowing through the resistor. When the microphone button is pressed, the microphone signals are connected together, and the hookInt input will get half of micbias dc value 1.1 V. This change in DC level causes the hookInt comparator output to change state, in this case from 0 to 1. The button can be used for answering incoming calls but not to initiate outgoing calls.

Table 23: HookInt signals

Signal Min Nom Max Unit

VFLASH1 2.7 2.78 2.86 V MICB2 2.0 2.1 2.25

600VuA

Vhook1 1.25 1.35 1.45 V

■ Charging

NHL-12 can be charged via a DC-plug or charging pins on the system connector. Only 2-wire charging is supported.

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DC-plug

NHL-12 uses a 3.5mm DC-plug. 3-wire chargers are supported, but 3-wire charging is not. In practice this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers. 1Hz PWM signal is used to control UEM's charge switch.

VCHAR pins of system connector

The VCHAR and ChargeGND pin are directly connected to the normal charger lines of the DCplug.

Table 24: VCHAR pins of system connector

Signal Min Nom Max Unit Note

Input voltage range (fast charger)

Input voltage range (standard charger)

5.5 8.4 9.3 VRMS I= 850mA

11.1

7.9

-0.3 20 V Absolute maximum VHAR volt-

16 Vpeak

VRMS

age

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9. Baseband Serial Interfaces

■ Internal serial interfaces between CMT and APE

XBUS

XBUS is the main communication interface between the CMT and APE engines. This 6-pin interface is a combination of a general 4-pin UART based interface and two wake-up signals. XBUS has no test points and the signals are routed in the inner layers of the PWB.

XABUS

XABUS is a synchronous serial interface used for uncompressed PCM audio data transfer between the DSPs of UPP (CMT) and OMAP1510 (APE).

■ External serial interfaces

MMC interface

The MMC interface consists of a control block in OMAP1510, MMC regulator and EMC protection ASIP (R5200). MMC interface is a serial bus with three wires: data, command and clock run at 16MHz. The regulator (N5200) output is VMMC.

IrDA interface

NHL-12 uses a TDFU5103 IR-module (V4451). It is compatible with 1.152Mbit IrDA 1.3. Speeds up to 115kbits/sec are supported. Operating voltages are VBAT and V28.

USB interface

Pop-Port compliant access. The interface consists of a USB regulator (N2001) supplying V33 to OMAP1510 USB control block, and USB ASIP (R2003) for EMC protection.

system connector has pins for USB interface, for a USB 2.0 full speed (12Mb/s)

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10. Baseband Test Points

■ List and description

Table 25: Baseband test points

Test point Signal Function Characteristics Note

J2400 MCSI2_DIN XABUS

receive data

J2401 MCSI2_DOUT XABUS trans-

mit data

J2402 MCSI2_SYNC XABUS syn-

chronization

J2404 COM_MCLK_REQXABUS clock

request

J2405 MCSI2_CLK XABUS clock 12 MHz digital

N4800#3 PURX Power_up

reset

J2801 SLEEPX Sleep mode

control signal

J2802 SLEEPClk Sleep mode

timing clock

1.8V digital signal Data to OMAP1510

1.8V digital signal Data from

8 kHz digital clock

1.8V

1.8V digital signal Clock request to

clock 1.8V

1.8V digital signal From UEM to UPP

1.8V when not in sleep mode

0 V when in sleep mode

32.768kHz digital clock 1.8V

from UPP

OMAP1510 to UPP Sync clock from

UPP to OMAP1510

OMAP1510 from UPP

Clock from OMAP1510

From UPP to UEM

From UEM to UPP;

J2803 UEMINT Interrupt

request from UPP

J4815 CLK32k sleep mode

clock

J2807 MB USTX MBUS from

UPP to UEM

J2808 MBUSRX MBUS from

UEM to UPP

J2809 FBUSTX FBUS from

UPP to UEM

J2810 FBUSRX FBUS from

UEM to UPP

46 COMPANY CONFIDENTIAL Issue 3 05/2005

1.8V digital signal From UEM to UPP

32.768kHz digital clock 1.8V

1.8V digital signal

From UEM to OMAP1510

Page 49

NHL-12 6 - Baseband Nokia Customer Care

Table 25: Baseband test points

Test point Signal Function Characteristics Note

J2811 DBUSClk Dbus clock 13MHz digital

clock signal 1.8V

J2813 DBUSEN1X UPP 1.8V digital signal From UPP (DSP) to

J2815 EXTRDX Flash memory

write enable

J2817 FLSCLK Flash memory

clock

J2818 FLSCSX Flash memory

chip select

J4100 DIN I2S format

serial data input

J4801 NFWE Flash write

enable

J4802 NFOE flash output

enable

1.8V digital signal

3.5MHz digital clock signal 1.8V

1.8V digital signal

2.8V digital signal from OMAP1510 to

1.8V digital signal From omap1510 to

From UPP (DSP) to UEM

Generated by UPP

UEM

In burst mode

stereo DAC

NAND flash

J4803 NFRP flash reset/

power down

J4804 NFADV address valid

strobe

J4805 NFCSO flash chip

select

J4806 FCLK flash clock 37.5MHz(typ.)

J4807 FDATA flash data bus 1.8V digital signal from/to OMAP1510

R4802 MPU_nRESET power on/reset from UPP/UEM to

J4810 NSRAS SDRAM row

address strobe

J4811 NSCAS SDRAM col-

umn address strobe

1.8V digital signal From omap1510 to NAND flash

From omap1510 to

digital clock 1.8V

1.8V digital signal from OMAP1510 to

NAND flash

to/from NAND flash

OMAP1510

SDRAM

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Table 25: Baseband test points

Test point Signal Function Characteristics Note

J4812 NSWE SDRAM write

enable

J4813 SDCLK_EN SDRAM clock

enable

J4814 SDATA SDRAM data

bus

J5000 INT Seija flash

interface interrupt signal

R4808 SDCLK SDRAM clock 72 MHz (typ.) dig-

R2902 RFclk system clock

for baseband

J2020 VBATT battery voltage J2021 BSI Battery size

indicator; flash programming start signal

1.8V digital signal from OMAP1510 to

1.8V digital signal from/to OMAP1510

max. 0.2V digital signal

ital clock 1.8V 26 MHz analog

clock signal >300mVpp

1V in normal mode

SDRAM

to/from SDRAM from seija interface

to OMAP1510

from OMAP1510 to SDRAM

from Helgo to UPP

To UEM A/D converter

0V in local mode If bsi line rises >

2.1V

2.78 BSI pulse

J2022 GND Ground J2031 VBATT zocus IC cali-

bration point

J2032 VBAT zocus IC cali-

bration point

J4450 TXD transmit data 2.78V digital sig-

J4451 RXD receive data 2.78V digital sig-

J4452 SD shutdown 2.78V digital sig-

3.0 mOhm PWB

trace

3.0 mOhm PWB

trace

nal

from OMAP1510 to irda

from Irda to OMAP1510

from OMAP1510 to irda

48 COMPANY CONFIDENTIAL Issue 3 05/2005

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Table 25: Baseband test points

Test point Signal Function Characteristics Note

PRODTP1 FBUS_TX Flash program-

ming data and phone control

PRODTP2 FBUS_RX Flash program-

ming data and

phone control PRODTP3 GND Ground PRODTP4 USB_D+ USB data full speed 12M,

PRODTP5 MBUS Flash program-

ming data and

phone control PRODTP6 VPP Flash program-

ming voltage

PRODTP7 GND Ground PRODTP8 USB_5V USB Vbus, DC in4.375V -5.25V

2.78V digital signal

voltage range 0V-

3.3V

2.78 digital signal

6.5MHz max.

1.8V internal voltage or 12 V external voltage

voltage range

From phone to FPS8

From FPS-8 to phone

bi-directional data between OMAP1510 and USB

Bi-directional phone control

to OMAP1510

PRODTP9 USB_D- USB data full speed 12M,

voltage range 0V-

3.3V

bi-directional data between OMAP1510 and USB

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■ Test points on bottom-side

50 COMPANY CONFIDENTIAL Issue 3 05/2005

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NHL-12 6 - Baseband Nokia Customer Care

■ Test points on top-side

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[This page intentionally blank]

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11. Baseband Troubleshooting

This section is a guide for localizing and repairing electrical faults in NHL-12 baseband. Before any service operation you must be familiar with the NHL-12 product and module level

architecture. You have to be also familiar with the NHL-12 specific service tools such as the Phoenix service software and flashing tools.

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■ Top level flowchart

START

Phone doesn’t start up or is jammed

Flash programming doesn’t work

Charging doesn’t work

IRDA doesn’t work

Phone doesn’t read SIM card

Keypad doesn’t work

Display doesn’t work

Illumination doesn’t work

Phone doesn’t read MMC

Bluetooth doesn’t work

YES

Dead or jammed

phone

Flash faults

Charging

troubleshooting

IRDA interface

troubleshooting

SIM card error

UI failure

Display/keyboard

Image quality analysis

backlights

Bluetooth

MMC troubleshooting

troubleshooting

Audios(Mic/Ext.mic/earpiece/

Phone doesn’t read MMC MMC troubleshooting

ext.earpiece/IHF) doesn’t work

Audios(Mic/Ext.mic/earpiece/

Accessory doesn’t work

ext.earpiece/IHF) doesn’t work

Camera doesn’t work

Accessory doesn’t work

Bluetooth doesn’t work

Illumination doesn’t work

YES

END

Audio faults

Accessory detection

Audio faults

troubleshooting

Camera module

Accessory detection

troubleshooting

Bluetooth

Camera module

Image quality analysisCamera doesn’t work

troubleshooting

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■ “Contact Service” on display

When the phone is powered on, self-test functions are executed and if one or more self-test functions fails, the message “Contact Service” is shown on the display.

This fault means that the phone software is able to run and thus the watchdog of UEM can be served.

MCU self-test cases can be split into two categories: the ones that are executed during power up and the ones that are executed only with a PC connected. These tests and the items included are as follows:

Figure 14:MCU self-tests

If some self-test failed, kindly refer to the relevant chapter in this troubleshooting document.

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■ Dead or jammed phone

Phone is jammed

or dead

Is the power

switch (S2400)

OK?

Yes

Are the LCD

connector and UI

Board to Board connecto r OK?

Yes

Phone current

is 0mA ?

Phone current

is ~1 A ?

Yes

Change the power

switch (S2400) and

retest

Check soldering.

Change LCD connector

or UI Board to Board

connector (X4452) and

retest.

There must be open c ircuit

on VBAT line. Check

battery connector( X2020)

and VBAT line, including

soldering

Is there any

hot devices ?

Yes

There must be short

circuit somewhere,

especially in the device

connected to VBAT line.

Replac e the device an d

retest

Is connection to

Phoenix SW in

local mode OK?

Yes

Perform BB selftest and other

related tests such as LCD. When

you find any problem go to

relevant troubleshooting, or

continue to flashing state.

Flashing

works?

Yes

Phone is still

dead?

No No

Yes

Check BSI line (R2035,C2020,X2020, R2202,C 2225,R2201).

Are they OK?

Yes

Go to the flashing

troubleshoot ing

Go to the general power

checking

Phone is working

Change the faulty part.

Repeat test.

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■ Flash faults

NHL-12 has three memory components installed on the main PWB. SDRAM and NAND components are interfaced with OMAP1510, while CMT flash is interfaced with the UPP8M ASIC.

You can flash the phone to find which one is causing problems. The necessary steps are described below. Phoenix error messages displayed during the flashing process help on defining what is wrong. To be able to flash the device, the majority of device BB area components must function properly.

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CMT flash faults

Measure BSI

CMT Flash

programming

fault

Is the FBUS TX-line high after startup ?

NO NO

pulse (J2021)

during flash

programming. Is it

ok ?

Check BSI-line inclu ding

X2020,C2225,C2020,R20

35,R2202 and R2201.

IS FBUSTX-line set

to LOW after it has

been HIGH?

YES

Wrong

manufacturer ID

and device ID?

YES

line (J2809) during

flash programming.

Measure FBUSTX-

Is it ~1.8V ?

YES

Change flash

(D3000). Retest

Change UEM (D2200).

Retest.

Change UPP

(D2800).Retest.

Phone doesn’t

start up or it’ s

jammed

END

YES

Dead or jammed

phone

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APE flash faults

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■ APE memory troubleshooting

OMAP1510 flash (Seija)

Figure 15:OMAP1510 flash (Seija) (1/2)

All signal s in this

troubleshooting are in

range 0 - V18

Signals as in Figure: V18 and

fnRB du ring bo ot

Start

Measure fnRB

at R5000 and V18 at C5000

No pulses

Check R5000 Undamaged

Damaged

Change R5000

V18 risetime from 1.0V to

1.6V slower than 150us

Backup user data before

Seija/NAND

troubleshooting, if possible

Boot phone. Seija(D5000) reads 8 pages from NAND flash at boot-up.

Go to Power

troubleshooting

Check Seija

and NAND

voltage V18 at

C5000

No power in

either or bo th

or voltage

levels invalid

Measur e

resistance, should

be >>1M.

Change damaged

capacitors

Correct

voltages

NAND damaged,

replace D5001

Check Seija

Goto NAND/Seija

troubleshooting

page 2

Signals

as in

Figure:

V18

and

fnRB

during boot

Measure ag ain fRnB at R5000

and V18 with

oscilloscope

Invalid signals

NAND damaged,

replace D5001

and NAND

voltage V18

C5000

Voltage OK

Problem

persists?

Voltage levels

still invalid

Go to APE Power

troubleshooting

EndNoYes

60 COMPANY CONFIDENTIAL Issue 3 05/2005

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Figure 16:OMAP1510 flash (Seija) (2/2)

Continued from

Seija/NAND

troubleshooting

page 1

Measure

INT J5000 and

NFCS0 J4805

when NFRP

J4803 rises

Invalid signaling

Figure: NFRP, NFCSO and INT during boot

Correct signaling

Figure: NFOE and NFCSO during first read operation, use trigger to falling edge of NFOE

NAND filesystem

corrupted or

device damaged.

Re-flash, if

problem persists,

replace NAND

D5001

Negative

pulses in

NFCS0(J4805)

and

NFOE(J4802)?

Yes, but no traffic

in DA0 when CS0 and OE low

Seija faulty,

replace D5000

Go to OMAP1510

troubleshooting

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Figure 17:V18 and fnRB during boot

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Figure 18:NFRP, NFCSO and INT during boot

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Figure 19:NFOE and NFCSO during first read operation, use trigger to falling edge of

NFOE

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Figure 20:Oscilloscope signals

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OMAP1510 SDRAM

Figure 21:OMAP1510 SDRAM (1/2)

All signals in this

Start

Run

ST_APE_RAM

_TEST, with

Phoenix.

Result?

troubleshooting are in

range 0 - V18

Problem

Pass

occurs only in

heat or cold?

Use cold spray/ hot air to SDRAM device or customer feedback

Phone might been

Yes

dropped, solder

balls cracked,

replace D5080

Fail

Measur e

SDRAM

voltage V18 at

C5083

Correct

Measur e

SDCLK

frequency at

R4808

>70MHz?, level

0 - ~V18

Incorrect

Yes

Go to OMAP1510

troubleshooting

Check and replace

if needed C5083-

C5089, resistance

>>1Mohm

Correct

Figure: SDCLK characteristics, 75MHz, SDRAM end of serial clock resistor

Phone might been

dropped, solder

balls cracked,

replace D5080

Measure

SDRAM

voltages V18 at

C5083

Incorrect

Correct

Visit APE Power

troubleshooting

Measure

SDRAM

voltages V18 at

C5083

Incorrect

Change SDRAM

D5080

Go to SDRAM

troubleshooting

page 2

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Figure 22:OMAP1510 SDRAM (2/2)

From SDRAM

troubleshooting

page 1

Inspect R4808

value, approx

22ohm

Replace

R4808 and

measure

SDCLK

frequency

>>70Mhz

Figure: SDCLK characteristics, 75MHz, SDRAM end of serial clock resistor

Yes

ST_APE_RAM

_TEST with

Rerun

Phoenix

Pass

Fail

Change SDRAM

D5080

Yes

Problem occurs

while booting?

Yes

Go to Seija/NAND

troubleshooting

Go to OMAP1510

troubleshooting

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Figure 23:SDCLK characteristics, 75MHz, SDRAM end of serial clock resistor

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■ Energy management troubleshooting

Device does not stay on

If the device turns off without any visible reason, there may be problems in the following areas:

• UEM watchdog (WD) problem (WD is not updated by SW)

• BSI line problem (BSI line is floating => contact failure)

• Battery line problem

• Soldering problem

The most likely reason is UEM WD, which turns the device off after about 32 seconds if SW is jammed.

This may caused by a software problem, UPP8M problem (Not served by SW), UEM or memory malfunctions.

The following tests are recommended:

• General power checking

•Clocks

• Memory testing

• Serial Interface

If there is something wrong in the BSI line, the device seems to be dead after the power key is pressed. However the regulators of the device are on a few seconds before the power down mode.

This mode can easily be detected from the current consumption of the device. After a few seconds the current consumption drops almost to 0 mA.

In this case check the following components and/or their soldering:

• Battery connector X2020

• BSI pull up R2201 and series resistor R2202

• UEM D2200 (pin number C2)

If the phone boots to TEST or LOCAL mode with a normal battery, BSI is short circuited to ground. Check EMI-filter and filtering capacitors, which are located in the BSI.

General power checking

For power checking, use service tool SF-8. Battery voltage should be at least 3.6V. After disassembling the phone, use module jig MJ-13.

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Figure 24:General power checking.

CMT side power

checking in normal

mode with module

jig MJ-13

Measure VIO,Vflash1,VCORE, VANA,VR3. Are they

ok?

Yes

Check sle ep clock

32.768kHz

(C2206), OK?

Yes

Measure 26 Mhz

RFClk at

R2902,OK ?

Check VBATT1-

5,VBATTVR1-7, OK?

Check B2200 and

C2207, are they

Measure 26 MHz

RFClk at G7200,

ok?

OK?

Yes

NoNo

Open circuit on

VBAT line to UEM

(D2200)

Check BSI/Btemp

lines. If ok, replace

UEM (D22 00).

Change B2200 and/

or C2207

Check UEM

(D2200), if not ok ,

change it

Change G7200

Yes

Measure PURX at

N4800#3, Is it 1.8V?

Yes

Phone shutdown

after 30 sec

(watchdog) ?

Yes

Change NHL-12

module or retest

Measure signal at

J2811 and J2813

,OK?

Yes

Check N7300, if not

ok, change i t

Change UEM

(D2200)

Change UPP

(D2800)

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APE power checking (SMPS)

Power on

Supply voltage

drops(o r current

is large) ?

Measure VBAT

from input filters

C4200, C4209,

L4205(both sides)

OK?

YES

Check

V28(~2.8V),

OK?

YES

Visit APE reset troubleshooting

Check SYNC/

MODE from

R4202 (both

sides), High

(>2V)?

YES

Short circuit in

VBAT line

Failure on VBAT

line, check

components and

connectors

Check enable(VIO), high (1.8V)?

UEM fault

Faulty V4200 or R4202, ch ange

and retest

YES

Change V28

regulator(N4200)

and retest, OK?

Shortcut in V28

line

YES

Check

V15(~1.57V),

OK?

YES

Check V18

(~1.8V), OK?

YES

END

NO NO

V15 > 1.62V ?

V18 >1.89V ?NO

Check

enable (VIO),

high (1.8V)?

UEM fault

YES

Check en able

(VFLASH1), high (2.8V)?

UEM fault

Check

ref. voltage

at C4211,

1.35V ?

Ref.

voltage fou nd

at either end of

L4200 ?

YES

Check

voltage at L4201

(both sid es low) ,

~0V ?

Change coil and

retest V15

YES

Check

voltage at L4202

(both sid es low) ,

<1V ?

Change filter

(L4200)

YES

Change coil and

retest V18

Change SMPS

chip(N4201) and

retest, OK?

Shortcut in V15

YES

line

Change SMPS

chip (N4202)

and retest, OK?

Shortcut in

V18 line

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Energy management calibration

During energy management calibration, A/D-converter, BSI, BTEMP, Battery Voltage, Charger Voltage and Charger Current are calibrated

Figure 25:Example of Phoenix settings:

Limits for calculated calibration values are as follows:

Table 26: Limits for calibration values

Channel Low High

ADC Offset -50 50 ADC Gain 25400 29500 BSI Gain 970 1100 Vbatt Offset 2300 2900 Vbatt Gain 10000 11000 Vchar 58000 63000 Ichar 4050 4800

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Table 26: Limits for calibration values

Channel Low High

lbat 80 150

If ADC Offset is over limits: Inspect the BSI line and its components (R2202, Pull-up resistor R2201). If these are OK, change the UEM.

If BSI Gain is over limits: Inspect the BSI line and its components (R2202, Pull-up resistor R2201). If these are OK, change the UEM.

If Vbatt Offset and Gain are over limits: Inspect Vbatt lines and its components. If Vchar is over limits: Inspect components, which are connected to the Vchar line: V2020,

F2020 and L2020 If Ichar is over limits: Inspect components which are connected at Vchar line. If those are OK,

First change current sense resistor (R2200), if calibration is not successful, change the UEM. You can check calibration by using ADC-readings. Known voltages, currents and resistance

are fed and read by ADC-readings. These read values and known values can be compared.

ADC-reading

Divided and scaled battery voltage, Charger voltage, Charger current, BSI and Btemp values can be read by this tool. Read values a few times before you can be sure that results are accurate.

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Figure 26:ADC Reading window

NOTE: IF Vbatt Scaled and Divided unit results are different default calibration valu es are used. In this case perform EM-calibration to get full performance of the phone.

Table 27: Maximum reading tolerances

Reading Check point Tolerance

Vbatt SCAL

4.2V ± 25mV Vchar 8.4V ± 40mV Ichar 500mA ± 20mA BSI 75k ± 1.3kohm Btemp 273K(47k) ± 5K

Backup battery

If there is a backup battery fault, one of the symptoms is Real Time Clock losing the correct time during short main battery removal.

The same symptom may also occur when the backup battery is empty. About 5 hours is needed to fully charge the backup battery.

NOTE: Backup battery is only charged at the same time as the main battery or when the device is in either LOCAL or TEST mode.

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Always check the backup battery visually for any leakage or any other visual defect. Check that the backup battery is correctly mounted in the device before closing the cover. Check with Phoenix that backup battery is OK. Measure the voltage of backup battery:

• Normal operation when the voltage is > 2.0V

• Fully charged when the voltage is about 3.2V (because of large internal impedance voltage won’t stay above 3.0V a long time after charging is disabled)

Enable backup battery charging (start to charge main battery or boot de vice to LOCAL or TEST mode).

Measure the voltage of the backup battery during charging. It should rise, if it is not 3.2V, yet. When the voltage is over 2.0V for sure, check the backup b attery with Phoenix. If not OK, then

D2200 is probably faulty. Ensure that the RTC is running.

■ Charging troubleshooting

Use the BL5-C battery and JBV-1 calibration set to test charging.

NOTE: power supply cannot be charged, if it does not have a current sinking capability.

When you are charging a totally empty battery, remember that start-up charging might take a little bit longer time than normally. During this time the display is blank.

If a charger is not of Nokia approved type and its current and voltage are not within Nokia charger window, software does not start charging and “NOT CHARGING” is displayed. The voltage should be between 5.3V - 9.5V and current between 200mA – 900mA

Remove and reconnect the battery and charger a few times before you start to measure the device. This check ensures that the fault really exists.

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Figure 27:Charging troubleshooting (1/2)

Connect NMP

”Not charging” on

display

NMP approved

charger ?

Yes

Perform EM-calibration with phoenix and JBV-1

(see EM calibration

chapter)

approved charger

and retest

Chargi ng

works?

Read

BSI,Btemp,Vbatt,Vchar

and Ichar by phoenix

(see ADC-reading

chapter)

Chargi ng OK? Retest.

Disassemble phone.

Check BL-5C, Btemp,BSI

(X2020, X2022, R2201,

R2202)

Charging OK ?

Yes

Retest.

Charging works

fine.

Flash phone and make

EM calibration

Chargi ng works ?

Yes

Change UEM

(D2200)

D2200

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Figure 28:Charging troubleshooting (2/2)

Nothing happens when

charger is connected

Perform EM-calibration and

verify it by ADC-reading(see

EM-calibration and ADC

reading chapter)

Charging OK ?

Disassemble phone.

Measure Vchar at

C2026. Is it >3.0Vdc?

Yes

Measure is charging

current flowing?

Yes

C2026,V2020 and

Yes

Charging OK.

Check

L2020.

Yes

Replace R2200

and retest.

Change UEM

(D2200) and retest

Check R2200, is it

OK ?

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■ APE reset

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■ OMAP1510 (Helen)

Figure 29:OMAP1510 (Helen) (1/2)

Start

APE Power

Booting

problems?

Yes

Visit APE Power

troubleshooting

OK/fixed,

problem

solved?

Check resist or

R4806, replace

if needed.

Problem

solved?

Yes

Yes End

SW crashes

often (after

flashing also)?

Yes

Visit APE clock

troubleshooting

Visit SDRAM

troubleshooting

Was it a SDRAM

problem?

Yes

APE clocks/

reset OK/fixed,

problem solved?

Go to /(visit) Seija

troubleshooting

Was it a Seija/

NAND

problem?

Yes

End

Yes

End

Go to OMAP1510

troubleshooting

page 2

Replace

OMAP1510 D4800

Issue 3 05/2005 COMPANY CONFIDENTIAL 79

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Nokia Customer Care 6- Baseband

Figure 30:OMAP1510 (Helen) (2/2)

Continued from

OMAP1510

troubleshooting

page 1

NHL-12

Problem with

OMAP

peripherals

End

Yes

Measure V15 at C4813; V18 at C4817;

V28 at C4815

Voltages OK? No

Yes

Visit APE Power

troubleshooting

Problem

solved?

Go to the

appropriate

accessory or

interface

troubleshooting

EndYes

Was it a OMAP

problem?

End

Yes

Replace

OMAP1510 D4800

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Figure 31:Reset signals (PURX and MPU_nReset)

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■ Clocks troubleshooting

Clocks include the following:

• RF clock

• CAMclkDBUS

•CBUS clocks

• Flash and SDRAM clocks

•Sleep clock

• Bluetooth clock

•SIM clock

•MMC clock

• XABUS

• Camera

RF-ASIC Helgo

Flash

memory

• Audio

RFClk 26 MHz

Rfbusclk 10MHz max.

Flash clk 54 MHz max.

Figure 32:NHL-12 clocks

SleepClk 32.768 kHz

CbusClk 1 MHz

DBusClk 13 MHz

SIMClk 3.25 MHz

UPP8M

XabusC lk 12MHz

XABUS sync. 8kHz

SDRAM cl k 75MHz

SDRAM memory

NAND Flash

memory

typ.,105MH z max.

Flash clk 37 .5MHz typ .

NAND

adapter

60MHz max.

ZOCUS

UEM

SIM

OMAP1510

12 MHz crystal

MMC_CLk 16MHz typ.

CAM_EXClk 12MHz

I2C SClk 400 kHz

SClk 12 MHz typ.

PCM clock 240kHz

BTclk 12 Mhz

MMC

CAMERA

Audio DAC

I2S Clk 6 MHz

The main clock signal for the CMT is generated from the voltage controlled crystal oscillator VCTCXO. This 26 MHz triangle wave clock signal is supplied to OSC_IN pin of Helgo and out to UPP8M. Inside the UPP8M, the clock frequency is divided to 13 MHz and then fed to RFCLK.

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In SLEEP mode, the VCTCXO is off. UEM generates a low frequency clock signal (32.768 kHz) that is fed to UPP8M and ZOCUS.

When the flashing of the device does not succeed, but powering is OK, follow these instructions.

Note: The absence of clocks may indicate that the device (set phone to LOCAL mo de when the sleep is not allowed or press buttons so that phone is not in sleep mode) is in sleep mode. Make sure that the device is not in sleep during clocks measuring.

IMPORTANT: Clock signals have to be measured with 1MW (or greater) probes!

• Measure signal from G7200. This should be 26Mhz clock signal.

• Check that the crystal oscillator (B2200) is oscillating at 32.768kHz frequency. If not, change B2200. If OK, measure sleepclk from test point J2802. Frequency should be the same, 32.678kHz. If not, change the UEM.

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Figure 33:APE clocks troubleshooting flowchart

APE clocks

trouble

shooting

Reflash the phone

Clk32k (J4815 ):

Voh ~ 2.8V &

f ~ 32.768kHz ?

(Figure 1)

SleepClk (J2802 ):

Voh ~ 1.8V &

f ~ 32.768kHz ?

(Figure 2)

first and check that

Clk32k is not shorted

Yes

to GND or some

power line. If Clk32k

still doesn't work,

change UEM

Yes

12Mhz clock

(C4800, OSC1_IN):

Vpp ~ 1.7V &

f ~ 12.0MHz ?

(Figure 3)

Yes

Check that

(C4800, OSC1_IN)

DC-offset ~ 720mV

(C4802, OSC1_OUT)

DC-offset ~760mV

(Figures 3&4)

Yes

Solder joints of C4800, C4801,

C4802 and B4800

OK ?

Yes

Go to general power

checking

NoNo

Solder joints of

OMAP1510 damaged

Fix solder joints

Check solder joints of

V6031 and replace

the component, if

necessary.

Check completed

Measure

resistance over

C4801.

R >>1M ?

Yes

Change B4800. If

this doesn't help,

change C4800,

C4801 and C4802.

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Figure 34: Sleep clock

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Figure 35:12 MHz APE system clock (measured from the OSC1_IN pin of OMAP1510)

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Figure 36:12MHz APE system clock (measured from the OSC1_OUT pin of OMAP1510)

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Figure 37:Clk32k

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■ Clocks troubleshooting

Clocks include the following:

• RF clock

• CAMclkDBUS

•CBUS clocks

• Flash and SDRAM clocks

•Sleep clock

• Bluetooth clock

•SIM clock

•MMC clock

• XABUS

• Camera

RF-ASIC Helgo

Flash

memory

• Audio

RFClk 26 MHz

Rfbusclk 10MHz max.

Flash clk 54 MHz max.

Figure 38:NHL-12 clocks

SleepClk 32.768 kHz

CbusClk 1 MHz

DBusClk 13 MHz

SIMClk 3.25 MHz

UPP8M

XabusC lk 12MHz

XABUS sync. 8kHz

SDRAM cl k 75MHz

SDRAM memory

NAND Flash

memory

typ.,105MH z max.

Flash clk 37 .5MHz typ .

NAND

adapter

60MHz max.

ZOCUS

UEM

SIM

OMAP1510

12 MHz crystal

MMC_CLk 16MHz typ.

CAM_EXClk 12MHz

I2C SClk 400 kHz

SClk 12 MHz typ.

PCM clock 240kHz

BTclk 12 Mhz

MMC

CAMERA

Audio DAC

I2S Clk 6 MHz

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In SLEEP mode, the VCTCXO is off. UEM generates a low frequency clock signal (32.768 kHz) that is fed to UPP8M and ZOCUS.

When the flashing of the device does not succeed, but powering is OK, follow these instructions.

IMPORTANT: Clock signals have to be measured with 1MW (or greater) probes!

• Measure signal from G7200. This should be 26Mhz clock signal.

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Figure 39:APE clocks troubleshooting flowchart

APE clocks

trouble

shooting

Reflash the phone

Clk32k (J4815 ):

Voh ~ 2.8V &

f ~ 32.768kHz ?

(Figure 1)

SleepClk (J2802 ):

Voh ~ 1.8V &

f ~ 32.768kHz ?

(Figure 2)

first and check that

Clk32k is not shorted

Yes

to GND or some

power line. If Clk32k

still doesn't work,

change UEM

Yes

12Mhz clock

(C4800, OSC1_IN):

Vpp ~ 1.7V &

f ~ 12.0MHz ?

(Figure 3)

Yes

Check that

(C4800, OSC1_IN)

DC-offset ~ 720mV

(C4802, OSC1_OUT)

DC-offset ~760mV

(Figures 3&4)

Yes

Solder joints of C4800, C4801,

C4802 and B4800

OK ?

Yes

Go to general power

checking

NoNo

Solder joints of

OMAP1510 damaged

Fix solder joints

Check solder joints of

V6031 and replace

the component, if

necessary.

Check completed

Measure

resistance over

C4801.

R >>1M ?

Yes

Change B4800. If

this doesn't help,

change C4800,

C4801 and C4802.

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Figure 40: Sleep clock

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NHL-12 6 - Baseband Nokia Customer Care

Figure 41:12 MHz APE system clock (measured from the OSC1_IN pin of OMAP1510)

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Figure 42:12MHz APE system clock (measured from the OSC1_OUT pin of OMAP1510)

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Figure 43:Clk32k

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■ APE-CMT troubleshooting

APE-CMT interfaces

XBUS

XBUS trouble

shooting

Phone starts

to boot, but jams

after a while ?

No

Reflashing

succeeds ?

Yes

Phone start up

correct ?

Go to APE flashing

No

Yes

troubleshooting

Possible failure of

APE_Wake and/or

CMT_Wake lines

Possible XBUS

failure

CMT

Yes

Check completed

functionality OK

and automatically

ran self test

passed ?

Yes

Go to OMAP1510

troubleshooting

No

Go to CMT

troubleshooting

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XABUS

trouble

shooting

This test will fail, if

XBUS doesn't work.

Always check XBUS

functionality first!

Run XABUS_TEST

with Phoenix

Passed ?

Yes

Check completed

Noticeable

damage on

PWB ?

Yes

PWB failure

Changing

OMAP helps

Yes Yes

Check completed PWB failure

Changing

UPP helps ?

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■ CMT serial interfaces troubleshooting

CBUS

CBUS is a three wire serial interface between the main baseband components. The bus consists of data, clock and bus_enable signals. In NHL-12 the bus is connected from UPP8M to ZOCUS and UEM. UPP8M takes care of controlling the traffic on the bus. If needed, CBUS can also be controlled by DSP. The CBUS electrical interface consists of a clock pin (CBusClk) , a serial data input/output pin (CBusDa) and an enable pin (CBusEnX).

The transmission protocol used on CBUS is simple. One frame consists of an address byte, read/write flag (write = low) and 1 to 32 data bits (MSB first). Actually, the address byte is a combination of a 3-bit device address and a 5-bit register address. UPP writes data to and reads data from CBUS at the falling edge of CBusClk, while the slave device (UEM) uses the rising edges for both operations.

If you are able to get the phone to boot up and can reach Phoenix BB self tests, it is possible to test the functionality of each component attached to Cbus.

Use:

• ST_CURRENT_GAUGE_IF TEST

• ST_UEM_CBUS_IF_TEST to test UEM Cbus interface

If an error is found while testing any of the above components, you should replace the failing component.

FBUS

FBUS is a two wire Rx and Tx interface between the UPP and flash/test interface. Th e bus goes through the UEM which adjusts the voltage levels to suit UPP8M. The interface voltage level on the phone flash/test pad pattern is 2.78V and on the UPP8M end it is 1.8V. The functionality of this interface should not affect the device boot in NORMAL, LOCAL or TEST modes. Phoenix tests can be performed through MBUS interface in the case of a failure in FBUS interface. Flashing is not possible if there is a problem with FBUS.

MBUS

MBUS is a two wire Rx and Tx interface between the UPP and UEM. From the UEM, the MBUS interface continues to flash/test interface as a one wire interface. The UEM also adjusts the voltage levels. The interface voltage level on the phone flash/test pad pattern is 2.78V and on the UPP8M end it is 1.8V. MBUS traffic between the UPP8M and UEM can be tested with PHOENIX (ST_MBUS_RX_TX_LOOP_TEST). Flashing is not possible, if there is a problem with MBUS.

98 COMPANY CONFIDENTIAL Issue 3 05/2005

Nokia 6620 Service Manual 06 nhl12 baseband

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Glossary of Terms

2. Baseband Top-Level Description

■ Baseband block diagram

■ Environmental specifications

Normal and extreme voltages

Humidity

■ Frequencies in baseband

3. Baseband Architecture

■ CMT side

CMT memories

■ APE side

APE memories

■ Energy management

Power supply modes

Battery BL-5C

Current gauge (Zocus)

RTC capacitor

Power distribution

■ DC characteristics

Regulators

■ Voltage regulators in BB for RF

■ Charging

■ Audio circuitry

Earpiece

Internal microphone

Integrated hands-free

Audio accessory receive path

Audio control signals

■ Acoustics

Earpiece acoustics

IHF speaker acoustics

Microphone acoustics

Vibra motor

■ Audio modes

Hand portable

Integrated hands-free audio mode (IHF)

Accessory audio mode

APE audio mode

Bluetooth audio mode

■ CMT internal signals and connections

■ CMT external signals and connections

5. BB-RF Interface

6. NHL-12 User Interface

■ S60 - LCD interface

LCD & keypad illumination

Current consumption

Maximum ratings

■ Camera interface

■ Keyboard

■ Bluetooth

7. SIM Interface

8. System Connector Interface

■ Universal Serial Bus (USB)

■ Accessory Control Interface (ACI)

VOUT (Accessory Voltage Regulator)

■ HookInt

■ Charging

DC-plug

VCHAR pins of system connector

9. Baseband Serial Interfaces

■ Internal serial interfaces between CMT and APE

XBUS

XABUS

■ External serial interfaces

MMC interface

IrDA interface

USB interface

10. Baseband Test Points

■ List and description

■ Test points on bottom-side

■ Test points on top-side

11. Baseband Troubleshooting

■ Top level flowchart

■ “Contact Service” on display

■ Dead or jammed phone

■ Flash faults