Nokia 6610i Service Manual 07 rm37 sysmod

Customer Care Solutions
RM-37 Series Transceivers
7-System Module and User
Interface
Issue 1 04/2004 Company Confidential ©Nokia Corporation
RM-37 Company confidential
7-System Module and User Interface CCS Technical Documentation
Page No
Glossary of Terms ..........................................................................................................5
Introduction ....................................................................................................................8
Electrical Modules .......................................................................................................8
Interconnection Diagram .............................................................................................8
Temperature Conditions ..............................................................................................9
Humidity ......................................................................................................................9
System Module : Baseband ..........................................................................................10
Baseband Module, technical summary ......................................................................10
Technical Summary ...................................................................................................11
Environmental Specifications ....................................................................................11
Temperature Conditions ..........................................................................................11
Humidity and Water Resistance ..............................................................................12
Baseband Technical Specifications ...........................................................................13
Absolute Maximum Ratings ....................................................................................13
DC Characteristics ...................................................................................................13
Power Distribution diagram ....................................................................................15
Baseband External and Internal Signals and Connections ........................................16
Camera interface .....................................................................................................17
Integrated HF Speaker .............................................................................................18
FM Radio Interface .................................................................................................18
Internal Speaker .......................................................................................................19
Integrated HF Speaker .............................................................................................19
External Signals and Connections .............................................................................23
Keyboard (board-to-board) Connector ....................................................................23
LCD Connector (Board to Board) ...........................................................................24
DC Connector ..........................................................................................................25
Bottom Connector ...................................................................................................25
SIM connector .........................................................................................................26
Internal Signals and Connections ............................................................................27
Baseband Functional Description ................................................................................28
Modes of Operation ...................................................................................................28
No Supply ................................................................................................................28
Back-up ...................................................................................................................28
Acting Dead .............................................................................................................28
Active ......................................................................................................................28
Sleep Mode ..............................................................................................................29
Charging ..................................................................................................................29
Battery .....................................................................................................................29
Power Up and Reset ...................................................................................................30
Power Up with PWR key ........................................................................................31
Power Up when Charger is connected ....................................................................31
Power Up when Battery is connected .....................................................................31
RTC Alarm Power Up .............................................................................................32
A/D Channels .............................................................................................................32
FM Radio ...................................................................................................................33
IR Module ...............................................................................................................33
SIM Interface ...........................................................................................................33
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ACI ..........................................................................................................................34
External Accessory Regulator .................................................................................35
External Audio ...........................................................................................................35
External Microphone Connection ...........................................................................35
External Earphone Connections ..............................................................................36
Internal Audio ............................................................................................................37
IHF Speaker & Stereo Audio Amplifier .................................................................37
Internal Microphone ................................................................................................37
Internal Speaker .......................................................................................................37
IHF Speaker & Stereo Audio Amplifier .................................................................38
Camera ....................................................................................................................39
Signal descriptions ..................................................................................................39
Memory Block ...........................................................................................................40
Security ....................................................................................................................40
Clock Distribution .....................................................................................................41
Audio Control ..........................................................................................................42
Accessory identification and Power Supply ............................................................42
Backup Battery ........................................................................................................43
RF Module Introduction ...............................................................................................43
RF Frequency Plan ....................................................................................................45
DC characteristics ......................................................................................................46
Regulators ................................................................................................................46
Typical current consumption ...................................................................................47
Power Distribution ..................................................................................................48
RF characteristics .........................................................................................................49
Channel Numbers and Frequencies .........................................................................49
Main RF characteristics ...........................................................................................49
Transmitter characteristics ......................................................................................49
Receiver characteristics ...........................................................................................50
RF Block Diagram ..................................................................................................50
RF Block Diagram RM-37 ......................................................................................51
Frequency Synthesizers .............................................................................................52
Receiver .....................................................................................................................52
Transmitter .................................................................................................................52
Front End .................................................................................................................52
Power Amplifier ......................................................................................................53
RF ASIC Helga .......................................................................................................54
AFC function ...........................................................................................................54
Antenna ..................................................................................................................54
User Interface Modules ................................................................................................55
UI Board TK8 ............................................................................................................55
Keyboard .................................................................................................................55
Display ....................................................................................................................56
LCD & Keypad Illumination ...................................................................................57
Internal Speaker .......................................................................................................57
Buzzer ......................................................................................................................57
Vibra ........................................................................................................................57
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Schematics/Layouts, TK8_12 module (A3 size)................................................................................................
User Interface diagram 1 (ver.0.0 ed.16) ................................................................................................ 1
Parts Placement diagram ............................................................................................................................ 2
Schematics/Layouts, TB3_18 module (A3 size)................................................................................................
Block diagram 1 (ver.0.0 ed.4) ....................................................................................................................1
Block Diagram 2 (ver. 0 ed. 275) ............................................................................................................... 2
System connector/baseband (ver.0.0 ed. 51) ..........................................................................................3
User Interface (ver. 0.0 ed. 53) ................................................................................................................... 4
SIM reader (ver.0.0 ed. 15) ..........................................................................................................................5
Power management (ver. 1.3 ed. 106) ...................................................................................................6
DC/DC converter (ed. 0.0 ver.8) ..................................................................................................................7
Old power discrete (ver. 0 ed.7) .................................................................................................................8
Light filtering (ed. 2.0 ver 27)......................................................................................................................9
Power thermal resistor ...............................................................................................................................10
UPP_8M (ed. 2.0 ver. 101) .........................................................................................................................11
UPP decoupling capacitors (ed.1.3 ver. 9) ............................................................................................ 12
Flash (ed. 2.0 ver.28) .................................................................................................................................. 13
Flash decoupling capacitors (ver. 2.0 ed.4) .......................................................................................... 14
FM radio IC (ver.1.3 ed 145) .................................................................................................................... 15
FM radio unit (Ver. 0.0 ed. 117) ............................................................................................................... 16
RF/BB interface (ver. 1.3 ed. 40) ............................................................................................................ 17
Audio (ver. 0.0 ed. 41) ................................................................................................................................ 18
IR (Ver. 0.0 ed. 32) ....................................................................................................................................... 19
IR thermal resistor (ver. 0.0 ed. 5) .......................................................................................................... 20
RF Block Diagram (ver. 0.0 ed.5) ..............................................................................................................21
RF shields (ver. 0.0 ed.6)............................................................................................................................ 22
RF IC HELGA (ver. 0.0 ed.2) ...................................................................................................................... 23
RX Front End and Antenna Switch (ver. 0.0 ed.2 ) ............................................................................ 24
Power amplifier detection (ver. 0.2 ed. 3) ........................................................................................ 25
Parts Placement TB3_18, bottom .......................................................................................................... 26
Parts Placement TB3_18, top ................................................................................................................ 27
Test Points TB3_18, top side ................................................................................................................... 28
List of Test Points ........................................................................................................................................ 30
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CCS Technical Documentation 7-System Module and User Interface

Glossary of Terms

ACI Accessory Control Interface
ADC Analog-Digital Converter
AEC Acoustic Echo Canceller
AFC Automatic Frequency Control
AGC Automatic Gain Control
AIF Application Interface
ALWE Background noise suppressor
AMS After Market Service
API Application Programming Interface
ARM Processor architecture
ASIC Application Specific Integrated Circuit
BB Baseband
BT Bluetooth
CBus Control Bus connecting UPP_WD2 with UEM
CCI Camera Control Interface
CCP Compact Camera Port
CMT Cellular Mobile Telephone (MCU and DSP)
CPU Central Processing Unit
CTSI Clocking Timing Sleep Interrupt
COBBA_GJP DCT3 RF-interface and audio codec ASIC with serial MAD interface
COG Chip On Glass
CSP Chip Scale Package
CSTN Color Super Twisted Nematic
DAC Digital-Analog Converter
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DAI Digital Audio Interface
DB Dual band
DCS1800 Digital Cellular system at 1800 MHz
DCT3 Digital Core Technology, 3rd generation
DCN Offset Cancellation control signal
DLL Dynamic Link Library
DRC Dynamic Range Controller
DSP Digital Signal Processor
EGSM Extended – GSM
EFR Enhanced Full Rate
EGPRS Enhanced General Packet Radio Service
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
ESD Electro Static Discharge
EXT RF External RF
FBUS Asynchronous Full Duplex Serial Bus
GPRS General Packet Radio Service
GSM Global System for Mobile communications
HS Half Rate Speech
HSCSD High Speed Circuit Switched Data
IC Integrated Circuit
HF Integrated Hands Free
I/O Input/Output
IrDA Infrared Association
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CCS Technical Documentation 7-System Module and User Interface
LCD Liquid Crystal Display
LDO Low Drop-Out
LNA Low Noise Amplifier
MBUS 1-wire half duplex serial bus
MCU Micro Controller Unit
MDI MCU-DSP Interface
MFI Modulator and Filter Interface
PA Transmit Power Amplifier
PC Personal Computer
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
PIFA Planar Inverted F-antenna
PWB Printed Wiring Board
RF Radio Frequency
SIM Subscriber Identity Module
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.
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7-System Module and User Interface CCS Technical Documentation

Introduction

Electrical Modules

The system module TB3 consists of Radio Frequency (RF) and baseband (BB). User Inter­face (UI) contains display, keyboard, IR link, vibra, HF/HS connector and audio parts.
FM radio is located on the main PWB TB3.
The electrical part of the keyboard is located in separate UI PWB named TK8. TK8 is con­nected to radio PWB through spring connectors.
The Baseband blocks provide the MCU, DSP, external memory interface and digital con­trol functions in the UPP ASIC. Power supply circuitry, charging, audio processing and RF control hard ware are in the UEM ASIC.
The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station.
The UI module is described in this section of the manual.

Interconnection Diagram

Keyboard
module
SIM Battery
Antenna
Microphone
Figure 1: Interconnection diagram
Display
Radio Module
Radio
Module
RM-37
IHF
speaker
NHL-
IR Link
Earpiece
CIF Camera
Charger
Tomahawk
Accessories
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Temperature Conditions

Specifications are met within range of -10...+55 deg. C ambient temperature Storage temperature range -40...+70 deg. C

Humidity

Relative humidity range is 5... 95%. This module is not protected against water. Condensated or splashed water might cause malfunction momentary. Long term wetness will cause permanent damage.
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System Module : Baseband

The System module (or Engine) consists of Baseband and RF sub-modules, each described below.

Baseband Module, technical summary

Main functionality of the baseband is implemented into two ASICs: UPP (Universal Phone Processor) and UEM (Universal Energy Management).
UPP8M
v2
COMBO FLASH
128Mbit Flash 8Mbit SRAM
Keyboard
Keyboard
Illumination
LCD
Passive colour STN
SIM
Battery
BLD-3
RF Interface
UEMK
1.8 V
IR
Vibra
Accessory
Regulator
Charger
ack
DC
IHF
Mo/St Amp
LM4855
System connector
Tomahawk
Figure 2: Baseband block diagram
FM radio
TEA5767
CIF VV6450
HWA
STV0900
Baseband is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core voltages can be lowered down to 1.0V, 1.3V and 1.5V. UEM includes 6 linear LDO (Low Drop-Out) regulator for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. UEM also includes SIM interface which has supports both 1.8V and 3V SIM cards. Note: 5V SIM cards are no longer supported by DCT-4 generation baseband.
A real time clock function is integrated into the UEM, which utilizes the same 32kHz clock supply as the sleep clock. A backup power supply is provided for the RTC-battery, which keeps the real time clock running when the main battery is removed. The backup power supply is a rechargeable surface mounted Li-Ion battery. The backup time with the battery is 30 minutes minimum.
A UEM ASIC handles the analog interface between the baseband and the RF section.
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UEM provides A/D and D/A conversion of the in-phase and quadrature receive and trans­mit signal paths and also A/D and D/A conversions of received and transmitted audio sig­nals to and from the user interface. The UEM supplies the analog TXC and AFC signals to RF section according to the UPP DSP digital control. Data transmission between the UEM

Technical Summary

Baseband of the RM-37 is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core voltages can be lowered down to 1.0V, 1.3V and 1.5V. UEM includes 6 linear LDO regulators for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. UEM also includes SIM interface which has supports both 1.8V and 3V SIM cards.
A real time clock function is integrated into the UEM, which utilizes the same 32kHz clock supply as the sleep clock. A backup power supply is provided for the RTC-battery, which keeps the real time clock running when the main battery is removed. The backup power supply is a rechargeable surface mounted Li-Ion battery. The backup time with the battery is 30 minutes minimum.
A UEM ASIC handles the analog interface between the baseband and the RF section. UEM provides A/D and D/A conversion of the in-phase and quadrature receive and trans­mit signal paths and also A/D and D/A conversions of received and transmitted audio sig­nals to and from the user interface. The UEM supplies the analog TXC and AFC signals to RF section according to the UPP DSP digital control. Data transmission between the UEM and the UPP is implemented using two serial busses, DBUS for DSP and CBUS for MCU. There are also separate signals for PCM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and the analog parts are running from the analog supply
2.78V. Also VBAT is directly used (Vibra, LED-driver, Audio amplifier).
The baseband supports both internal and external microphone inputs and speaker out­puts. Input and output signal source selection and gain control is performed by the UEM according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEM for decoding. An external vibra alert control signals are generated by the UEM with separate PWM out­puts.
RM-37 has two serial control interfaces: FBUS and MBUS. FBUS can be accessed through a test pad and the System Connector as described later. The MBUS can be accessed through the test pads as described in section MBUS Interface
EMC shielding is implemented using a metallized plastic frame. On the other side, the engine is shielded with PWB grounding.

Environmental Specifications

Temperature Conditions
o
Full functionality through ambient temperature range -10
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C to +55 oC.
RM-37 Company confidential
7-System Module and User Interface CCS Technical Documentation
Reduced functionality between -25 oC to -10 oC and +55 oC to +75 oC.
Humidity and Water Resistance
Full functionality in humidity range is 5% - 95%.
Condensed or dripping water may cause intermittent malfunctions. Protection against dripping water is implemented.
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Baseband Technical Specifications

Absolute Maximum Ratings
Signal Note
Battery Voltage (Idle) -0.3V - 5.5V
Battery Voltage (Call) Max 4.8V
Charger Input Voltage -0.3V - 16V
DC Characteristics
Regulators and Supply Voltage Ranges
Battery Voltage Range
Signal Min. Nom Max Note
VBAT 3.1V 3.6V 4.2V (charging
high limit voltage)
3.1V SW cut off
Camera Regulator
Vout/ V (min) Vout/ V (typ) Vout/ V (max) Notes
1.728 1.80 1.872 Imax=150mA
BB Regulators
Signal Min. Nom Max Note
VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I
VFLASH2 2.70V 2.78V 2.86V I
VSIM 1.745V
2.91V
1.8V
3.0V
1.855V
3.09V
max
max
I
sleep
max
I
max
I
sleep
= 80mA
= 70mA
= 1.5mA
= 40mA
= 25mA
= 0.5mA
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.235V
1.425V
1.710V
1.053V
1.3V
1.5V
1.8V
1.106V
1.365V
1.575V
1.890V
= 150mA
max
I
= 0.5mA
sleep
I
= 200mA
max
= 0.2mA
I
sleep
Default value 1.5V
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Accessory Regulator
Signal Min Nom Max Note
Vout 2.72V 2.80 2.88V I
max
= 70mA
RF Regulators
Signal Min Nom Max Note
VR1A 4.6V 4.75V 4.9V I
VR2 2.70V
3.20V
2.78V
3.3V
2.86V
3.40V
VR3 2.70V 2.78V 2.86V I
VR4 2.70V 2.78V 2.86V I
VR5 2.70V 2.78V 2.86V I
VR6 2.70V 2.78V 2.86V I
VR7 2.70V 2.78V 2.86V I
max
I
max
max
max
I
sleep
max
I
sleep
max
I
sleep
max
= 10mA
= 100mA
= 20mA
= 50mA
= 0.1mA
= 50mA
= 0.1mA
= 50mA
= 0.1mA
= 45mA
Current Sources
Signal Min Nom Max Note
IPA1 and IPA2 0mA - 5mA Programmable, +/-6%
IPA3 and IPA4 50µA 100µA 105µA V
V
IPA1,VIPA1
IPA1
= 0V - 2.7V
= 0V - 2.7V
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Power Distribution diagram
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Baseband External and Internal Signals and Connections

This section describes the external and internal electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that cover a connector or a defined interface.
Figure 3: RF/BB connections block diagram
PA
DC_sense
Battery
13
Iref1,2
PCS LNA+
SAW's
3
4
TxC
RFtemp
Vreg
UEM
RFI and CODEC BB & RF regulators, charger switch
2
2
HELGA
TxI/Q
7
4
RxI/Q
2
VCO
VRef's
2
RF Control Lines
6
VCTCXO
Data to & from RF
Vmode
CODEC Samples
UPP
UI
Module
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Camera interface
Table 1: Power supply characteristics
Signal name Type Min Typical Max Unit Description
VIO IN 1.7 1.8 1.9 V Digital supply
VANA IN 2.7 2.78 2.9 V Analogue supply
GND 0 V System GND
Table 2: DC characteristics
Signal name
CSX IN H: 0.7xVIO
DaClk IN H: 0.7xVIO
TxDa OUT H: 0.8xVIO L: 0 H: VIO
RxDa IN H: 0.7xVIO
ExtClk IN 0.5Vp-p 1Vp-p VIOp-p V All modes
VCtrl IN H: 0.7xVIO
Signal name
DaCLK IN 0 -
Type Min Typical Max Unit Description
H: VIO
L: 0
L: 0
L: 0
L: 0
NOTE! H stands for high signal level and L for low signal level.
Table 3: AC Characteristics
Type Min Typ Max Unit Description
L: 0.3xVIO
H: VIO L: 0.3xVIO
L: 0.2xVIO
H: VIO L: 0.3xVIO
H: VIO L: 0.3xVIO
1
8.8
V Camera chip-select
V Voltage levels
V Data to transmit, camera
V Data to receive
V Logic 0: shutdown.
MHz Frequency
(active low)
interrupt (active low)
45/55 50/50 55/45 % Duty cycle
ExtClk IN 12.9 13.0 13.1 MHz External system clock
(mode 4)
NOTE! However, DaClk frequency will not exceed ExtClk/2.
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Integrated HF Speaker
Signal Min Nom Max Condition Note
IHFP
0.75V 0.8V
IHFN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
pp
AC DC
AC DC
Differential output (V
= 4.0 Vpp)
diff
FM Radio Interface
BB Signal FM Radio Signal Min Nom Max Condition Note
VFLASH2 Vcca 2.7V 2.78V 2.86V I
Vcc(vco) 2.7V 2.78V 2.86V I
Vccd 2.7V 2.78V 2.86V I
GenIO(3) FMClk 1.4V
0
30ppm Stability
GenIO(8) FMWrEn 1.4V
0V
1.8V 1.88V
0.4V
32kHz Frequency Also 6.5 MHz can be
1.8V 1.88V
0.4V
High Low
High Low
=10.5 mA
max
=940 µA
max
= 3.9 mA
max
Reference clock for FM radio module
used
Write/Read enable
GenIO(12) FMCtrlDa 1.4V
0
GenIO(11) FMCtrlClk 1.4V
0
FM Antenna RFI1, RFI2 76 MHz 108 MHz FM Input frequency
FM Radio L FM Radio R
VAFL VAFR
24 dB 30 dB Channel sep-
54dB 60 dB (S+N)/N
1.8V 1.88V
0.6V
1.8V 1.88V
0.6V
1 MHz Frequency
100mV Audio level
2% Harmonic
High Low
High Low
aration
distortion
Bi-directional data
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Internal Speaker
Signal Min Nom Max Condition Note
EARP
0.75V 0.8V
EARN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
pp
AC DC
AC DC
Integrated HF Speaker
Signal Min Nom Max Condition Note
IHFP
0.75V 0.8V
IHFN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
pp
AC DC
AC DC
AC and DC Characteristics of RF-Baseband Voltage Supplies
Signal name
From To Parameter Min Typ Max Unit Function
Differential out­put (V
= 4.0 Vpp)
diff
Differential out­put
(V
= 4.0 Vpp)
diff
VBAT Battery PA, UEM Voltage 2.95 3.6 4.2 V Battery supply. Cut-off
level of DCT4 regulators is
3.04V. Losses in PWB tracks and ferrites are taken account to mini­mum battery voltage level.
Current 2000 mA
Current drawn by PA when ”off”
VR1A UEM HELGA Voltage 4.6 4.75 4.9 V Supply for charge pump
Current 2 10 mA
VR2 UEM HELGA Voltage 2.70 2.78 2.86 V Supply for I/Q-modula-
Current 65 100 mA
VR3 UEM VCTCXO,
HELGA
Voltage 2.70 2.78 2.86 V Supply for VCTCXO, PLL
Current 1 20 mA
0.8 2 µA
for SHF VCO tuning.
tors, buffers, ALS
digital parts
VR4 UEM HELGA Voltage 2.70 2.78 2.86 V Supply for Helga RX; PA
bias blocks.
Current 50 mA
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VR5 UEM HELGA Voltage 2.70 2.78 2.86 V Supply for Helga PLL;
dividers, LO- buffers, prescaler,
Current 50 mA
VR6 UEM HELGA Voltage 2.70 2.78 2.86 V Supply for Helga BB and
LNAs
Current 50 mA
VR7 UEM SHF VCO Voltage 2.70 2.78 2.86 V Supply for SHF VCO
Current 30 mA
VrefRF01 UEM HELGA Voltage 1.334 1.35 1.366 V Voltage Reference for
HELGA DCN2 op.amps.
Current 100 µA
VrefRF02 UEM VB_EXT Voltage 1.334 1.35 1.366 V Voltage reference for
HELGA bias block.
Current 100 µA
Temp Coefficient -65 +65 µV/C
AC and DC Characteristics of RF-Baseband Digital Signals
Signal name From To Parameter Input Characteristics Function
Min Typ Max Unit
TXP (RFGenOut3)
TXA UPP HELGA ”1” 1.38 1.88 V Power con-
UPP HELGA ”1” 1.38 1.88 V Power
amplifier enable
”0” 0 0.4 V
Load Resistance 10 220 k
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
trol loop enable
”0” 0 0.4 V
Load Resistance 10 220 k
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
RFBusEna1X UPP HELGA ”1” 1.38 1.88 V RFbus ena-
ble
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”0” 0 0.4 V
Current 50 µA
Load resistance 10 220 k
Load capacitance 20 pF
RFBusData UPP HELGA ”1” 1.38 1.88 V RFbus
data; read/ write
”0” 0 0.4 V
Load resistance 10 220 k
Load capacitance 20 pF
Data frequency 10 MHz
RFBusClk UPP HELGA ”1” 1.38 1.88 V RFBus
clock
”0” 0 0.4 V
Load resistance 10 220 k
Load capacitance 20 pF
Data frequency 10 MHz
Mode Select (GENIO9)
RESET (GENIO6)
UPP HELGA ”1” 1.38 1.85 V Band
”0” 0 0.4 V
UPP HELGA ”1” 1.38 1.85 V Reset to
”0” 0 0.4 V
Load capacitance 20 pF
Load resistance 10 220 k
Timing accuracy 1/4 symbol
AC and DC Characteristics of RF-Baseband Analogue Signals
Selection
Helga
Signal name From To Parameter Min Typ Max Unit Function
VCTCXO VCTCXO UPP Frequency 13 26 MHz High stability clock
signal for the logic circuits, AC cou­pled. Distorted sine­wave e.g. sawtooth.
Signal amplitude 0.2 0.8 2.0 Vpp
Input Impedance 10 k
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Input Capacitance 10 pF
Duty Cycle 40 60 %
VCTCXOGnd VCTCXO UPP DC Level 0 V Ground for refer-
ence clock
RXI/RXQ HELGA UEM Voltage swing
(static)
DC level 1.3 1.35 1.4 V
TXIP / TXIN UEM HELGA Differential voltage
swing (static)
DC level 1.17 1.20 1.23 V
Source Impedance 200 W
TXQP / TXQN UEM HELGA Same spec as for TXIP / TXIN
AFC UEM VCTCXO Voltage Min
Max
Resolution 11 bits
Load resistance and capacitance
Source Impedance 200 W
1.35 1.4 1.45 Vpp Received demodu-
2.15 2.2 2.25 Vpp Programmable volt-
0.0
2.4
1
0.1
2.6
100
lated IQ signals
age swing. Programmable com­mon mode voltage. Between TXIP-TXIN
V Automatic fre-
quency control sig­nal for VCTCXO
k nF
TxC UEM HELGA Voltage Min
Max
Source Impedance 200 W
Resolution 10 bits
RFTemp HELGA UEM Voltage at -20oC 1,57 V Temperature sensor
Voltage at +25oC 1,7
Voltage at +60oC 1,79
DC_sense PA UEM Voltage 0.6 V PA final stage quies-
IPA1 / IPA2 UEM PA Output Voltage 0 2.7 V PA final stage quies-
Current range 0 5 mA
2.4
0.1 V Transmitter power level and ramping control
of RF.
cent current level information
cent current adjust­ment
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External Signals and Connections

Keyboard (board-to-board) Connector
Pin Signal Min. Nom Max Condition Note
1 GND 0V
2 VLED+ VBAT
7.5V
3 ROW(4) 0.7xVIO
0
4 ROW(3) 0.7xVIO
0
5 COL(2) 0.7xVIO
0
6 ROW(2) 0.7xVIO
0
7 COL(1) 0.7xVIO
0
8 ROW(0) 0.7xVIO
0
9 VLED1- 0V
1.9V
10 ROW(1) 0.7xVIO
0
11 COL(3) 0.7xVIO
0
1.8V
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
LED off LED on
High Low
High Low
High Low
High Low
High Low
High Low
LED off LED on
High Low
High Low
Supply Voltage for Key­board LEDs
Keyboard matrix row 4
Keyboard matrix row 3
Keyboard matrix column 2
Keyboard matrix row 2
Keyboard matrix column 1
Keyboard matrix row 0
LED Katode Voltage
Keyboard matrix row 1
Keyboard matrix column 3
12 COL(4) 0.7xVIO
0
13 VLED2- 0V
1.9V
14 GND 0V
15 VLED3- 0V
1.9V
16 GND 0V
VIO
0.3xVIO
High Low
LED off LED on
LED off LED on
Keyboard matrix column 4
LED Katode Voltage
LED Katode Voltage
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LCD Connector (Board to Board)
Pin Signal Min. Nom Max Condition Note
1 VDDI 1.72V 1.8V 1.88V Logic voltage supply
Connected to VIO
2 XRES 0.7*VDDI
0
1us t
3 SI 0.7*VDDI
0
100ns t
100ns t
4 SCLK 0.7*VDDI
0
250ns t
100ns t
100ns t
5 CXS 0.7*VDDI
0
60ns t
VDDI
0.3*VDDI
VDDI
0.3*VDDI
VDDI
0.3*VDDI
Logic ’1’ Logic ’0’
rw
Logic ’1’ Logic ’0’
sds
sdh
Logic ’1’ Logic ’0’
Reset Active low
Reset active
Serial data
Data setup time
Data hold time
Serial clock input
6.5MHz Max frequency
Clock cycle
Clock high
Clock low
Chip select Active low
CXS low before SCLK ris-
VDDI
0.3*VDDI
scyc
shw
slw
Logic ’1’ Logic ’0’
css
ing edge
100ns t
csh
CXS low after SCLK rising edge
6 VLED+ VBAT
7.5V
7 VLED- 0V
0.525V
LED off LED on
LED off LED on
Supply Voltage for LEDs
Feedback Voltage to LED Driver
8 GND 0V 9V Ground
9 NC Not Connected
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1
CCS Technical Documentation 7-System Module and User Interface
DC Connector
Pin Signal Min. Nom Max Condition Note
1 VCHAR 11 .1 V
7.0 V
RMS
2 CHGND 0 Charger ground
8.4 V
peak
RMS
16.9 V
7.9 V
1.0 A
9.2 V
850 mA
peak
RMS
peak
RMS
Standard charger
Fast charger
Charger positive input
Bottom Connector
Bottom connector, or the system connector is of type Pop-Port (TM)
Figure 4: Bottom connector pinout
Contacts, 14 pcs
14
Locking holes for accessories, 2 pcs
Bottom connector pins and signals:
Pin/ Signal name
1 CHARGE V Charge DC 0-9 V / 0.85 A
2 GND Charge GND 0.85 A (PWB + conn.)
3 ACI ACI 1 kbit/s Dig 0 / 2.78V Insertion & removal
4 VOUT DC out DC 2.78V / 70mA (PWB + conn.)
5 NC Not connected
6 FBUS RX FBUS 115kbit 0 / 2.78V
7 FBUS TX FBUS 115kbit 0 / 2.78V
Signal description
Spectral range
Voltage / Current levels
Max or nominal serial impedance
Note
detection
200mW
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8 GND Data GND
9 XMIC N Audio in 300 - 8k 1Vpp & 2.78V Ext. Mic Input
10 XMIC P Audio in 300 - 8k 1Vpp & 2.78V Ext. Mic Input
11 HSEAR N Audio out 20 - 20k 1Vpp Ext. audio out (left)
12 HSEAR P Audio out 20 - 20k 1Vpp Ext. audio out (left)
13 HSEAR R N Audio out 20 - 20k 1Vpp Ext. audio out
(right)
14 HSEAR R P Audio out 20 - 20k 1Vpp Ext. audio out
(right)
SIM connector
Pin Name Parameter Min. Typ Max Unit Notes
1 VSIM 1.8V SIM Card 1.6 1.8 1.9 V Supply voltage
3V SIM Card 2.8 3.0 3.2 V
2 SIMRST 1.8V SIM Card 0.9xVSIM
0
3V SIM Card 0.9xVSIM
0
3 SIMCLK Frequency 3.25 MHz SIM clock
Trise/Tfall 50 ns
1.8V Voh
1.8V Vol
3V Voh 3V Vol
4 DATA 1.8V Voh
1.8V Vol
3V Voh 3V Vol
1.8V Vih
1.8V Vil
3V Vil 3V Vil
0.9xVSIM 0
0.9xVSIM 0
0.9xVSIM 0
0.9xVSIM 0
0.7xVSIM 0
0.7xVSIM 0
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM V
VSIM V
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
V SIM reset (output)
V
V SIM data (output)
V SIM data (input)
Trise/Tfall max 1us
5 NC Not connected
6 GND GND 0 0 V Ground
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Internal Signals and Connections
Internal microphone
Signal Min. Nom Max Condition Note
MICP 200mV
2.0 V 2.1 V 2.25 V DC
MICN 2.0V 2.1V 2.25V DC MICN
AC 2.2k to
pp
MICP
MIC1B
Internal speaker
Signal Min. Nom Max Condition Note
EARP
0.75V 0.8V
EARN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
pp
AC DC
AC DC
Differential output (V
= 4.0 Vpp)
diff
Integrated HF speaker
Signal Min. Nom Max Condition Note
IHFP
0.75V 0.8V
IHFN
0.75V 0.8V
2.0 V
0.85V
2.0 V
0.85V
pp
pp
AC DC
AC DC
Differential output (V
= 4.0 Vpp)
diff
EARP
EARN
IHFP
IHFN
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Baseband Functional Description

Modes of Operation

TB3 baseband has six different functional modes:
No supply
• Back-up
Acting Dead
• Active
• Sleep
Charging
No Supply
In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of main battery and backup battery or low battery voltage level in both of the batteries.
Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > V
connecting charger and charging the battery above V
Back-up
In BACK_UP mode the backup battery has sufficient charge but the main battery can be disconnected or empty (VBAT < V
VRTC regulator is disabled in BACK_UP mode. VRTC output is supplied without regulation from backup battery (VBACK). All the other regulators are disabled in BACK_UP mode.
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.
and VBACK > VBU
MSTR
MSTR+
COFF
or by
MSTR+
.
).
Active
In the Active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception or burst transmission.
One of the sub-states of the active mode is FM radio on state. In that case, Audio Ampli­fier and FM radio are powered on. FM radio circuitry is controlled by the MCU and 13MHz-reference clock is generated in the UPP. VFLASH2 regulator is operating.
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In Active mode the RF regulators are controlled by SW writing into EM’s registers wanted settings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and its output voltage can be programmed to be 2.78V or 3.3V. VR4 -VR7 can be enabled, disabled, or forced into low quiescent current mode. VR3 is always enabled in Active mode.
Sleep Mode
Sleep mode is entered when both MCU and DSP are in stand–by mode. Sleep is con­trolled by both processors. When SLEEPX low signal is detected UEM enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All the RF regulators are disabled in SLEEP. When SLEEPX=1 detected UEM enters ACTIVE mode and all functions are activated.
The sleep mode is exited either by the expiration of a sleep clock counter in the UEM or by some external interrupt, generated by a charger connection, key press, headset con­nection etc.
In sleep mode VCTCXOr is shut down and 32 kHz sleep clock oscillator is used as refer­ence clock for the baseband.
Charging
Charging can be performed in any operating mode.
RM-37 supports the standard NMP charger interface.
Supported chargers are ACP-7, ACP-8, ACP-9, ACP-12, LCH-8 and LCH-9.
Charging is controlled by the UEM ASIC and external components are needed for EMC, reverse polarity and transient protection of the input to the baseband module. The charger connection is through the system connector interface. The RM-37 baseband is designed to support DCT3 chargers from an electrical point of view. Both 2- and 3-wire type chargers are supported.
The operation of the charging circuit has been specified in such a way as to limit the power dissipation across the charge switch and to ensure safe operation in all modes.
Battery
720 mAh Li-ion battery pack BLD-3 is used in RM-37.
Description Value
Nominal discharge cut-off voltage 3.1V
Nominal battery voltage 3.6V
Nominal charging voltage 4.2V
Maximum charger output current 850 mA
Minimum charger output current 200 mA
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Pin numbering of battery pack
Signal name Pin number Function
VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the battery
pack)
BTEMP 3 Battery temperature measurement (measured by ntc resistor
inside pack)
GND 4 Negative/common battery terminal
BLD-3 battery pack pin order
Figure 5:

Power Up and Reset

Power up and reset is controlled by the UEM ASIC. RM-37 baseband can be powered up in following ways:
Press power button which means grounding the PWRONX pin on UEM
Connect the charger to the charger input
Supply battery voltage to the battery pin.
RTC Alarm, the RTC has been programmed to give an alarm
After receiving one of the above signals, the UEM counts a 20ms delay and then enters its reset mode. The watchdog starts up, and if the battery voltage is greater than Vcoff+, a 200ms delay is started to allow references etc. to settle. After this delay elapses the VFLASH1 regulator is enabled.
4(GND)
3(BTEMP)
2(BSI)
1 (+)
500us later VR3, VANA, VIO and VCORE are enabled. Finally the PURX line is held low for 20 ms. This reset, PURX, is fed to the baseband ASIC UPP, resets are generated for the DSP and the MCU. During this reset phase the UEM forces the VCXO regulator on regard­less of the status of the sleep control input signal to the UEM.
The sleep signal from the ASIC is used to reset the flash during power up and to put the flash in power down during sleep. All baseband regulators are switched on at the UEM power on except for the SIM regulator that is controlled by the MCU. The UEM internal
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watchdog is running during the UEM reset state, with the longest watchdog time selected. If the watchdog expires, the UEM returns to power off state. The UEM watch­dog is internally acknowledged at the rising edge of the PURX signal in order to always give the same watchdog response time to the MCU.
Power Up with PWR key
When the Power on key is pressed the UEM enters the power up sequence as described in the previous paragraph. Pressing the power key causes the PWRONX pin on the UEM to be grounded. The UEM PWRONX signal is not part of the keypad matrix. The power key is only connected to the UEM. This means that when pressing the power key an interrupt is generated to the UPP that starts the MCU.
The MCU then reads the UEM interrupt register and notices that it is a PWRONX inter­rupt. The MCU now reads the status of the PWRONX signal using the UEM control bus, CBUS. If the PWRONX signal stays low for a certain time the MCU accepts this as a valid power on state and continues with the SW initialization of the baseband. If the power on key does not indicate a valid power on situation, the MCU powers off the baseband.
Power Up when Charger is connected
In order to be able to detect and start charging in a case where the main battery is fully discharged (empty) and hence UEM has no supply (NO_SUPPLY or BACKUP mode of UEM), charging is controlled by START-UP CHARGING circuitry.
Whenever VBAT level is detected to be below master reset threshold (VMSTR-) charging is controlled by START_UP charge circuitry. Connecting a charger forces VCHAR input to rise above charger detection threshold, VCHDET+.
By detection start-up charging is started. UEM generates 100mA constant output cur­rent from the connected charger’s output voltage. As battery charges its voltage rises, and when VBAT voltage level higher than master reset threshold limit (VMSTR+) is detected START_UP charge is terminated.
Monitoring the VBAT voltage level is done by charge control block (CHACON). MSTRX=‘1’ output reset signal (internal to UEM) is given to UEM’s RESET block when VBAT>VMSTR+ and UEM enters into reset sequence described in section Power Up and Reset.
If VBAT is detected to fall below VMSTR- during start-up charging, charging is cancelled. It will restart if new rising edge on VCHAR input is detected (VCHAR rising above VCH­DET+).
Power Up when Battery is connected
Baseband can be powered up by connecting battery with sufficient voltage. Battery volt­age has to be over UEM internal comparator threshold level, Vcoff+. Battery low limit is specified in Table 2. Battery Voltage Range. When battery voltage is detected, UEM enters to reset sequence as described in section Power Up and Reset
Phone can be powered up to LOCAL mode by setting BSI resistor 560. This causes MCU to wake up directly when battery voltage is supplied.
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RTC Alarm Power Up
If phone is in power off mode when RTC alarm occurs the wake up procedure is as described in section Power Up and Reset. After baseband is powered on, an interrupt is given to MCU. When RTC alarm occurs during power on state the interrupt for MCU is generated.

A/D Channels

The UEM contains the following A/D converter channels that are used for several mea­surement purpose. The general slow A/D converter is a 10 bit converter using the UEM interface clock for the conversion. An interrupt will be given at the end of the measure­ment.
The UEM’s 11-channel analog to digital converter is used to monitor charging functions, battery functions, user interface and RF functions.
The monitored battery functions are battery voltage (VBATADC), battery type (BSI) and battery temperature (BTEMP) indication.
The battery type is recognized through a resistive voltage divider. In phone there is a 100k pull up resistor in the BSI line and the battery has a pull down resistor in the same line. Depending on the battery type the pull down resistor value varies. The battery temperature is measured in the same way except that the battery has a NTC pull down resistor in the BTEMP line.
KEYB1&2 inputs are used for keyboard scanning purposes. These inputs are also routed internally to the miscellaneous block.
The monitored RF functions are PATEMP and VCXOTEMP detection. PATEMP input is used to measure temperature of the RFIC, the Helga.
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FM Radio

The FM radio in the transceiver RM-37 is a single chip electronically tuned FM srereo radio with fully integrated IF selectivity and demodulation. The FM radio is completely adjustment free.
It can be tuned into the European FM bands.
The channel tuning and bus data are controlled by UPP. A variable capacitance diode, two coils and some resistors and capacitors are the external components for the FM radio.
The audio frequency is fed via UEM to a headset of the phone. The FM radio antenna is implemented in a cable of the headset.
Figure 6: FM radio
IR Module
The IR interface is designed into the UPP. The IR link supports speeds from 9600 bit/s to
1.152 MBit/s up to distance of 80 cm. Transmission over the IR if half-duplex.
SIM Interface
UEM contains the SIM interface logic level shifting. SIM interface can be programmed to support 3V and 1.8V SIMs. SIM supply voltage is selected by a register in the UEM. It is only allowed to change the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEM. This means that the UEM generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEM. The card detection is taken from the BSI signal, which detects the removal of the battery.
The SIM interface is powered up when the SIMCardDet signal indicates "card in". This
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signal is derived from the BSI signal.
Parameter Variable Min. Typ Max Unit
SIMCARDet, BSI comparator Threshold Vkey 1.94 2.1 2.26 V
SIMCARDet, BSI comparator Hysteresis (1) Vsimhyst 50 75 100 mV
The entire SIM interface locates in two chips: UPP and UEM.
The SIM interface in the UEM contains power up/down, port gating, card detect, data receiving, ATR-counter, registers and level shifting buffers logic. The SIM interface is the electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEM device).
The data communication between the card and the phone is asynchronous half duplex. The clock supplied to the card is 1.083 MHz or 3.25 MHz.
ACI
Figure 7: SIM interface RM-37
SIM
C5 C6 C7
C1
C3
C2
C8
C4
From
SIM
ASIP
SIMIO
SIMCl
SIMRst
VSIM
BSI
UEM
SIMIF
register
SIMIO
SIMCl
SIMRst
UEM digital logic
UEMInt CBusDa
CBusEnX
CBusClk
SIMIO
SIMClk
SIMR
UIF Block
UPP
ACI is a point-to-point, bi-directional serial bus. ACI has two main features: 1)The inser­tion and removal detection of an accessory device 2) acting as a data bus, intended mainly for control purposes. A third function provided by ACI is to identify and authenti­cate the specific accessory which is connected to the System interface.
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External Accessory Regulator
An external LDO Regulator exists for accessory power supply purposes. All ACI-accesso­ries require this power supply. Regulator input is connected to battery voltage VBAT and output is connected to Vout pin in the system connector. Regulator is controlled via UPP (On/Off-function).
Accessory Regulator Signals
Signal Min. Nom Max Note
Vout 2.70V 2.78 2.86V I
GenIO(0) 1.4 1.8 1.88
0.6
Figure 8: External Accessory regulation
UPP
Genio(0)
VBAT
Accessory Regulator
System Connector

External Audio

RM-37 is designed to support fully differential external audio accessory connection by using Pop-Port [TM] system connector. Pop-Port [TM] connector has serial data bus called ACI (Accessory Control Interface) for accessory insertion and removal detection and identification and authentication. ACI line is also used for accessory control pur­poses. See section ACI, Accessory Control Interface. Audio support from Pop-Port [TM] system connector:
max
High (ON) Low (OFF)
Vout
= 150mA
4-wire fully differential stereo audio (used also FM-radio antenna connection)
2-wire differential mic input
External Microphone Connection
The external microphone input is fully differential and lines are connected to the UEM microphone input MIC2P/N. The UEM (MICB2) provides bias voltage. Microphone input lines are ESD protected.
Creating a short circuit between the headset microphone signals generates the hook sig­nal. When the accessory is not connected, the UEM resistor pulls up the HookInt signal. When the accessory is inserted and the microphone path is biased the HookInt signal decreases to 1.8V due to the microphone bias current flowing through the resistor. When the button is pressed the microphone signals are connected together, and the HookInt input will get half of micbias dc value 1.1 V. This change in DC level will cause the Hook-
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Int comparator output to change state, in this case from 0 to 1. The button can be used for answering incoming calls but not to initiate outgoing calls.
Figure 9: External microphone connection
HookInt
MICB2
UEM
MIC2P
MIC2N
External Earphone Connections
Headset implementation uses separate microphone and earpiece signals. The accessory is detected by the HeadInt signal when the plug is inserted (see section ACI, Accessory Control Interface).
Figure 10: Figure 22 External Earphone & IHF Connections
FM Radio
VAFR VAFL
MIC3P
UEM
MIC3N
XEAR
Audio
Rin
Lin
SPKRout+ SPKRout-
PhoneIN (HS)
PhoneIN
Rout+ Rout­Lout+ Lout-
EMC/ESD
onents
Com
EMC/ESD
Components
XMICP
XMICN
IHF Speaker
When the accessory is inserted and the microphone path is biased the HookInt signal decreases to 1.8V due to the microphone bias current flowing through the resistor. When the button is pressed the microphone signals are connected together, and the HookInt input will get half of micbias dc value 1.1 V. This change in DC level will cause the Hook­Int comparator output to change state, in this case from 0 to 1. The button can be used for answering incoming calls but not to initiate outgoing calls.
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Internal Audio

IHF Speaker & Stereo Audio Amplifier
Integrated Hands Free Speaker, 16mm MALT, is used to generate speech audio, alerting and warning tones in RM-37. Audio amplifier is controlled by the UPP. Speaker capsule is mounted in the C-cover. Spring contacts are used to connect the IHF Speaker contacts to the main PWB.
Figure 11: IHF speaker and amplifier
VBAT
UPP
UEM
FM radio
Control Interface
XEAR
Stereo Audio
Stereo audio Amplifier
2x 22p
1k
100MHz
2 x var 14V
IHF sp e aker
Internal Microphone
The internal microphone capsule is mounted to in the UI-frame. The microphone is omni­directional and it’s connected to the UEM microphone input MIC1P/N. The microphone input is asymmetric and the UEM (MICB1) provides bias voltage. The microphone input on the UEM is ESD protected. Spring contacts are used to connect the microphone to the mainPWB.
Figure 12: Internal microphone
Internal Speaker
The internal earpiece is a dynamic earpiece with impedance of 32 ohms. The earpiece must be low impedance one since the sound pressure is to be generated using current and not voltage as the supply voltage is restricted to 2.7V. The earpiece is driven directly
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by the UEM and the earpiece driver in UEM is a bridge amplifier. In RM-37, 8mm PICO type earpiece is used.
Figure 13: Internal speaker
EARP
UEM
EARN
IHF Speaker & Stereo Audio Amplifier
Integrated Hands Free Speaker, 16mm MALT, is used to generate speech audio, alerting and warning tones in RM-37. Audio amplifier is controlled by the UPP. Speaker capsule is mounted in the C-cover. Spring contacts are used to connect the IHF Speaker contacts to the main PWB.
Figure 14: Digital Interface of Audio Amplifier
Common mode
choke
VBAT
Phone In IHF
Phone In HS
Bypass
Rin
Lin
Bias
Digital Volume Control
=
EN CL
Output Mode Select
SPI
DAT
Amplifier
Amplifier
Amplifier
GND
IHF Speaker
out +
out -
Rout +
Rout -
Lout +
Lout -
Stereo Headset
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Camera
Camera is connected to the BB by UIF –bus. UIF is a slow (10MHz bus) which may be shared with other UI functions (e.g. LCD). This version has unidirectional TX and Rx data lines and consists of a chip enable, chip select, Tx data, Rx data, data clock and system clock. Note there is a severe restriction on image transfer in UPP v2 devices due to a DMA shortcoming. A block transfer mode is available to workaround this but the perfor­mance in frame rate terms will not be brilliant.
Figure 15: Camera and HWA connections to the baseband using UIF bus
CamClk 13MHz Vctrl
EXTCLK
2.8V 1.8V GND 2.8V 1.8V GND
XSHUTDOWN
Camel Dune
Camera Module
Signal descriptions
Chip-select tional function of CSX during the power up sequence is to determine the communication mode of the HWA (UIF or CCI/CCP).
CECLK
Image data
Control
TXDA
DACLK
Hardware
Accelerator
RXDA
CSX
CamRxDa LCDCamClk
BaseBand
LCDCamTxDa
CamCSX
GND GND
1.8V
2.8V
CSX enables and disables the camera serial bus. CSX is active low. An addi-
DaClk is a serial data clock and is typically set to ExtClk/2. The clock can be driven low when data is not transmitted, but may be running when CSX is inactive as well.
RxDa data-length is 8 bits + D/C-bit. The first bit to be received is D/C-bit which indi-
cates to the camera the status of following 8 bit data. In the case of command data to camera the D/C-bit is low (‘0’). The camera must not react to received data if D/C-bit is high (‘1’).
TxDa data-length is 8 bits + TxEnd-bit. The first bit to be transmitted is the TxEnd-bit which indicates if the data is the last byte from image frame. When a byte is the last byte of an image frame from the camera, the TxEnd-bit is set high (‘1’). Otherwise the TxEnd-bit is set low (‘0’) by the camera. The camera can interrupt the baseband by driv­ing TxDa low for at least one ExtClk cycle when not transferring an image. The interrupt is initiated by the falling edge of the signal.
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ExtClk is external system clock for the camera module. The clock may be AC or DC cou­pled. Four fixed frequencies are available (8.4, 9.6, 9.72,13 and 16.8 MHz each within +/
-100kHz).
VCAMDIG is a regulated 1.8V nominal I/O logic supply for the HWA and sensor. Regula­tor output voltages are seen in Table 5. Global net is named VCAMDIG in schematics and connected to the sensor’s and HWA’s VIO –interface.
VCtrl is a control signal to place the camera and HWA in their lowest power consump­tion modes. It must be permissible to pull this signal up if this functionality is not required.
VANA is a regulated 2.78V nominal voltage from the engine to the camera module.
GND is system GND for camera module.

Memory Block

Security
For the MCU UPP includes ROM, 2 Kbytes, that is used mainly for boot code of MCU. To speed up the MCU operation small 64-byte cache is also integrated as a part of the MCU memory interface.
For program memory 8Mbit (512 x 16bit) PDRAM is integrated. RAM block can also be used as data memory and it is byte addressable. RAM is mainly for MCU purposes but also DSP has also access to it if needed.
MCU code is stored into external flash memory. Size of the flash is 128Mbit (8k x 16bit) The HDb16 baseband supports a burst mode flash with multiplexed address/data bus. Access to the flash memory is performed as 16-bit access. The flash has Read While Write capabilities, which makes the emulation of EEPROM within the flash easy.
The phone flash program and IMEI codes are software protected using an external secu­rity device that is connected between the phone and a PC.
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Company confidential RM-37

Clock Distribution

Figure 16: Clock Distribution Diagram
32 kHz
MC
DSP
26
UPP
CTSI
PLL
SLICE
HELG
HELG
26 MHz
RFBUSCLK CBUSCLK
DBUSCLK 13MHz
CAMCLK max.
LCDCLK max.
VR3
UEM
VCTCX
26MH
32 kHz
SLEEP
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Audio Control
Figure 17: Audio block diagram RM-37
earpiece
Tomahawk bottom connector
microfone
Mic ACI
Lout Rout
SPKR Lout
Rout
IHF ­Speaker
PA
Phs Pihf
Lin Rin
Accessory identification and Power Supply
Figure 18: Accessory identification and Power supply
UEM
earp mic1 mic2 headint xear
mic3
Control Bus
ear data
mic data
Radio
L
antenna
R
UPP
Vhead
Vflash1
4.7k
Vflash1
headint=
UEM
HEADINT
ACI switch
MBUS
UPP
Vflash1
Enable
100k
VBatt
Accessory Regulator
2.8V/70mA
ACI-line
Vout
Tomahawk
56k
ACI
Chip
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Backup Battery
Backup battery is used in case when main battery is either removed or discharged. Backup battery is used for keeping real-time clock running for minimum of 30 minutes.
Rechargeable backup battery is connected between UEM VBACK and GND. In UEM backup battery charging high limit is set to 3.2V. The cut–off limit voltage (V BUCoff–) for backup battery is 2.0V. Backup battery charging is controlled by MCU by writing into UEM register.
Li-Ion SMD battery type is used. The nominal capacity of the battery is 0.01 mAh.
Table 28. Backup Battery circuitry
Parameter
Test conditions
Back-up battery voltage VBACK 2.43 3.3 V
Back-up battery cut-off limit V_BU
Charging voltage (VBAT ? 3.4V)
Charging current I
Symbol Min Typ Max Units
COFF+
V_BU
COFF-
VBU 3.1 3.2 3.3 V
LIMVBU
2.04
1.94
150 500 mA
2.10
2.0
2.16
2.06

RF Module Introduction

The RF module performs the necessary high frequency operations of the EGSM900/ DCS1800/PCS1900 tripleband engine. Both the transmitter and receiver have been implemented by using direct conversion architecture which means that the modulator and demodulator operate at the channel frequency.
The core of the RF is an application-specific integrated circuit, Helga. Another core com­ponent is a power amplifier module which includes two amplifier chains, one for EGSM900 and the other for DCS1800/PCS1900.
V V
Other key components include
26 MHz VCTCXO for frequency reference
3420-3980 MHz SHF VCO (super high frequency voltage controlled oscillator)
front end module comprising a RX/TX switch and two RF bandpass SAW filters
three additional SAW filters
The control information for the RF is coming from the baseband section of the engine through a serial bus, referred later on as RFBus. This serial bus is used to pass the infor-
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mation about the frequency band, mode of operation, and synthesizer channel for the RF. In addition, exact timing information and receiver gain settings are transferred through the RFBus. Physically, the bus is located between the baseband ASIC called UPP and Helga. Using the information obtained from UPP Helga controls itself to the required mode of operation and further sends control signals to the front end and power amplifier modules. In addition to the RFBus there are still other interface signals for the power control loop and VCTCXO control and for the modulated waveforms.
RF circuitry is located on one side of the 8 layer PWB.
EMC leakage is prevented by using a metal cans. The RF circuits are separated to three blocks.
FM radio.
PA, front end module, LNA and 1900 band SAWs.
Helga RF IC, VCO, VCTCXO, baluns and balanced filters.
The RF transmission lines constitute of striplines and microstriplines after PA.
The baseband circuitry is located on the one side of the board, which is shielded with a metallized frame and ground plane of the UI-board.
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RF Frequency Plan

RF frequency plan is shown below. The VCO operates at the channel frequency multiplied by two or four depending on the frequency band of operation. This means that the base­band modulated signals are directly converted up to the transmission frequency and the received RF signals directly down to the baseband frequency.
Figure 19: RF Frequency plan
925-960 MHz
1805-1990 MHz
1710-1910 MHz
f/4
HELGA
I-signal
I-signalI-signalI-signal Q-signal
f
f
RX
f/2f/4
f
f
f/2
3420-
PLL
3980 MHz
26 MHz
VCTCXO
880-915 MHz
I-signal
Q-signal
TX
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DC characteristics

Regulators
The transceiver baseband section has a multi function analog ASIC, UEM, which contains among other functions six pieces of 2.78 V linear regulators and a 4.8 V switching regu­lator. All the regulators can be controlled individually by the 2.78 V logic directly or through a control register. Normally, direct control is needed because of switching speed requirement: the regulators are used to enable the RF-functions which means that the controls must be fast enough.
The use of the regulators can be seen in the power distribution diagram which is pre­sented in Figure 20, “Power distribution diagram,” on page 48.
The seven regulators are named VR1 to VR7. VrefRF01 and VrefRF02 are used as the ref­erence voltages for the Helga, VrefRF01 (1.35V) for the bias reference and VrefRF02 (1.35V) for the RX ADC (analog-to-digital converter) reference.
The regulators (except for VR7) are connected to the Helga. Different modes of operation can be selected inside the Helga according to the control information coming through the RFBus.
List of the needed supply voltages
Volt. source Load
VR1 PLL charge pump (4.8 V)
VR2 TX modulators, ALCs, driver
VR3 VCTCXO, synthesizer digital parts
VR4 Helga pre-amps, mixers, DtoS
VR5 dividers, LO-buffers, prescaler
VR6 LNAs, Helga baseband (Vdd_bb)
VR7 VCO
VrefRF01 ref. voltage for Helga
VrefRF02 ref. voltage for Helga
Vbatt PA
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Typical current consumption
The table shows the typical current consumption in different operation modes.
Operation mode Current consumption Notes
Power OFF < 10 uA Leakage current (triple band PA)
RX, EGSM900 75 mA, peak
RX, DCS1800/PCS1900 70 mA, peak
TX, power level 5, EGSM900 1700 mA, peak
TX, power level 0, DCS1800/PCS1900 1000 mA, peak
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Power Distribution
Figure 20: Power distribution diagram
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RF characteristics

Channel Numbers and Frequencies

System Channel number TX frequency RX frequency Unit EGSM 0 <= n <=124 F = 890 + 0.2 * n F = 935 + 0.2 * n MHz
975 <= n <= 1023 F= 890+0.2* (n -1024) F= 935+0.2* (n -1024) MHz
DCS1800 512 <= n <= 885 F=1710.2+0.2*(n-512) F=1805.2+0.2*(n-512) MHz
PCS1900 512 <= n <=810 F=1850.2+0.2*(n-512) F=1930.2+0.2*(n-512) MHz

Main RF characteristics

Parameter Unit and value
Cellular System GSM900, DCS1900 and PCS1900
RX Frequency Band EGSM: 925 - 935 MHz
GSM900: 935 - 960 MHz DCS1900: 1805 - 1880 MHz PCS1900: 1930 - 1990 MHz
TX Frequency Band EGSM: 880 - 890 MHz
Output Power EGSM900: +5...+33 dBm / 3.2 mW... 2 W
Number of RF Channels EGSM: 124
Channel Spacing 200 kHz
Number of TX Power Levels GSM900 *: 15

Transmitter characteristics

Item Values (E-GSM/GSM1800)
Type Direct conversion, nonlinear, FDMA/TDMA
LO frequency range 3520...3660 MHz / 3420...3570 MHz
GSM900: 890 - 915 MHz DCS1900: 1710 - 1785 MHz PCS1900: 1850 - 1910 MHz
DCS1900: +0...+30 dBm / 1.0 mW... 1 W PCS1900: +0...+30 dBm / 1.0 mW... 1 W
DCS1900: 374 PCS1900: 300
DCS1900: 16 PCS1900: 16
Output power 2 W / 1 W peak
Gain control range min. 30 dB
Maximum phase error (RMS/peak) max 5 deg./20 deg. peak
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Receiver characteristics

Item Values, E-GSM/GSM1800
Type Direct conversion, Linear, FDMA/TDMA
LO frequencies 3700...3840 MHz / 3610...3760 MHz
Typical 3 dB bandwidth +/- 91 kHz
Sensitivity min. - 102 dBm (GSM1800 norm.cond. only)
Total typical receiver voltage gain (from antenna to RX ADC)
Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX ADCs
Typical AGC dynamic range 83 dB
Accurate AGC control range 60 dB
Typical AGC step in LNA 30 dB GSM1800 25 dB EGSM
Usable input dynamic range -102... -10 dBm
RSSI dynamic range -110... -48 dBm
Compensated gain variation in receiving band +/- 1.0 dB
86 dB

RF Block Diagram

The block diagram of the RF module can be seen in Chapter on “RF Block Diagram”. The detailed functional description is given in the following sections
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RF Block Diagram RM-37

Figure 21: RF Block Diagram
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Frequency Synthesizers

The VCO frequency is locked by a PLL (phase locked loop) into a stable frequency source given by a VCTCXO which is running at 26 MHz. The frequency of the VCTCXO is in turn locked into the frequency of the base station with the help of an AFC voltage which is generated in UEM by an 11 bit D/A converter. The PLL is located in Helga and it is con­trolled through the RFBus.
The required frequency dividers for modulator and demodulator mixers are integrated in Helga.
Loop filter filters out the comparison pulses of the phase detector and generates a DC control voltage to the VCO. The loop filter determines the step response of the PLL (set­tling time) and contributes to the stability of the loop.
The frequency synthesizer is integrated in Helga except for the VCTCXO, VCO, and the loop filter.

Receiver

Each receiver path is a direct conversion linear receiver. From the antenna the received RF-signal is fed to a front end module where a diplexer first divides the signal to two separate paths according to the band of operation: either lower, EGSM900 or upper, DCS1800/PCS1900 path.
Most of the receiver circuitry is included in Helga.

Transmitter

The transmitter consists of two final frequency IQ-modulators and power amplifiers, for the lower and upper bands separately, and a power control loop. The IQ-modulators are integrated in Helga, as well as the operational amplifiers of the power control loop. The two power amplifiers are located in a single module and the power detector, directional coupler, and loop filter parts of the power control loop are implemented as discrete com­ponents on the PWB. In the GMSK mode the power is controlled by adjusting the DC bias levels of the power amplifiers.
Front End
The front end features include:
- Antenna 50 ohm input
- RX PCS single output, RX EGSM/DCS balanced output
- TXs single 50 ohm input
-3 control lines from the Helga
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Figure 22: Front End
Ant
TX EGSM
TX DCS/PCS
RX PCS
RX DCS
RX EGSM
Power Amplifier
The power amplifier features include:
- 50 ohm input and output, EGSM/DCS/PCS
- internal power detector
- low power (EGSM) and EDGE mode
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Figure 23: Power amplifier
EGSM out
DCS/ PCS out
EGSM Power control
DCS/PCS Power control
EGSM in
DCS/ PCS in
Power detector
Mode
RF ASIC Helga
The RF ASIC features include
- Package uBGA108
- Balanced I/Q demodulator and balanced I/Q modulator
- Power control operational amplifier, acts as an error amplifier
- The signal from VCO is balanced, frequencies 3420 to 3980 MHz
- EGSM and DCS low noise amplifier (LNA) are integrated.
The Helga can be tested by test points only.
AFC function
AFC is used to lock the transceiver’s clock to the frequency of the base station.
Antenna
The RM-37 GSM900/DCS1800/PCS1900 transceiver features an internal antenna.
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User Interface Modules

UI module consist of a separate 4-layer UI PWB TK8 for RM-37.
The User Interface features a 130 x 130 8bpp (bits per pixel) passive matrix color STN display, 4096 colours. Interface is using 9-bit data transfer.
The LCD display is connected to transceiver PWB by board-to-board connector.
The diagram below describes the user interface connections.
Figure 24:
IHF
BASEBAND IR
TOMAHAWK
System Connector
Keyboard
LCD
Vibra

UI Board TK8

TK8 includes contacts for the keypad domes and LEDs for keypad illumination. UI board is connected to main PWB through 16 pole board-to-board connector with springs. Signals of the connector are described in External and Internal Signals and Connections.
Keyboard
5x4 matrix keyboard is used in RM-37. Key pressing is detected by scanning procedure. Keypad signals are connected UPP keyboard interface.
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Figure 25:
Row4
Row3
U P P
When no key is pressed row inputs are high due to UPP internal pull-up resistors. The columns are written zero. When key is pressed one row is pulled down and an interrupt is generated to MCU. After receiving inte rupt MCU starts scanning procedure. All columns are first written high and then one column at the time is written down. All other col­umns except one which was written down are set as inputs.
Rows are read while column at the time is written down. If some row is down it indicates that key which is at the cross point of selected column and row was pressed. After detect ing pressed key all register inside the UPP are reset and columns are written back to zero.
Row2 Row1 Row0
Col0 Col1 Col2 Col3 Col4
U E M
Power Switch
PWRONX
Display
The phone display is colour LCD.
Board to Board connector
LED LED
Figure 26: LCD
Clk, Sda, Csx
VLED+
VLED-
White
LED
Driver
GenIo (Rst)
VFlash1, Vio
UPP
UEM
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LCD & Keypad Illumination
In RM-37 white leds are used for LCD and keypad illumination. For LCD illumination two leds are used and for keypad six leds.
Figure 27:
VBAT
Cin
DLIGHT
Cosc
V in
En
Cx
Coil
Is
LED Driver
Ext
Schottky
Vovp
FB
Gnd
Cout
Rlcd
LCD Illumination
R
Keyboard Illumination
Current through leds is controlled by transistor circuitry. External transis tor driver cir­cuitry is used as constant current source in order to prevent any change in battery volt­age be seen as changing led brightness.
LEDs are controlled by the UEM PWM outputs. Both LEDs are controlled by KLight output of the UEM. Current flow through the LEDS is set by biasing the transistor and limiting the current by resistors.
Internal Speaker
The internal earpiece is a dynamic earpiece with an impedance of 32 ohms. The earpiece is low impedance one since the sound pressure is to be generated using current and not voltage as the supply voltage is re stricted to 2.7V. The earpiece is driven directly by the UEM and the ear piece driver in UEM is a bridge amplifier.
Buzzer
Buzzer is used to generate alerting tones and melodies to indicate incom ing call. It is also used to generate keypress and warning tones for the user. Buzzer is controlled by PWM (Pulse Width Modulation) signal generated by the buzzer driver of the UEM. Target SPL is 100dB (A) at 5cm.

Vibra

A vibra alerting device is used to generate a vibration signal for an incoming call. Vibra is located in the bottom end of the phone and connection is done with spring contacts. Vibra interface is the same like other DCT4 projects. The vibra is controlled by a PWM signal from the UEM. Frequency can be set to 64, 129, 258 or 520 Hz and duty cycle can vary between 3% - 97%.
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