Nevion QUAD-DA-1x2-PB User Manual

Nevion

Lysaker Torg 5
1366 Lysaker
Norway
Tel: [phone]

nevion.com

QUAD-DA-1x2-PB

Quad 1x2 3G/HD/SD-SDI Distribution Amplifier

with Passive Input Bypass

User manual

Rev. D

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Nevion Support

Nevion AS

Lysaker Torg 5

1366 Lysaker, Norway

Support phone 1: [phone]
Support phone 2: [phone]

Nevion USA

400 West Ventura Boulevard, Suite 155,

Camarillo, CA 93010, USA

Toll free North America: [phone]

Outside North America: [phone]

E-mail: [e-mail]

See http://www.nevion.com/support/ for service hours for customer support globally.

Revision history

Current revision of this document is the uppermost in the table below.

Rev.

Repl.

Date

Sign

Change description

D C 2017-12-19

MR

Added new chapter;

4.4 Passive input bypass (-PB)
In chapter 4.2 Terminal format support:
Removed listing of SMPTE 310.

C B 2017-11-17

MR

2.2 Electrical SDI inputs; changed min. cable
lengths for all formats to be in accordance with
current datasheet.

B A 2017-09-27

MR

Corrected value of saturation voltage in

2.4 Open drain GPIOs
Updated index. Lack of update caused error

messages.
Corrected descriptions of GPIO functions in
the following chapters; 4.2, 4.3, 5.1.2

A - 2017-07-14

GAJ/MR

Initial version

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Contents

Revision history ........................................................................................................ 2

1 Product overview ................................................................................................... 4

1.1 Product versions ........................................................................................................... 4

2 Specifications ........................................................................................................ 5

2.1 General ......................................................................................................................... 5

2.2 Electrical SDI inputs ...................................................................................................... 5

2.3 Electrical SDI outputs .................................................................................................... 6

2.4 Open drain GPIOs ......................................................................................................... 6

2.5 Features ........................................................................................................................ 7

2.6 Supported standards ..................................................................................................... 7

3 Configuration ......................................................................................................... 8

3.1 Multicon GYDA configuration ........................................................................................ 8

3.1.1 Card label ................................................................................................................... 9

3.1.2 Firmware upgrade ...................................................................................................... 9

3.1.3 Electrical inputs .......................................................................................................... 9

3.1.4 Reclockers ................................................................................................................. 9

3.1.5 Electrical outputs ................................................................ ........................................ 9

3.2 Configuration through DIP settings ...............................................................................10

3.2.1 Selection of power supply..........................................................................................11

4 Connections ........................................................................................................ 12

4.1 Mounting the connector module ...................................................................................12

4.2 Terminal format support ...............................................................................................13

4.3 GPIO connections ........................................................................................................14

4.4 Passive input bypass (-PB) ..........................................................................................14

5 Operation ............................................................................................................. 15

5.1 Module status ...............................................................................................................15

5.1.1 Multicon GYDA status interface .................................................................................15

5.1.2 GPI ALARM – Module Status Outputs .......................................................................16

5.1.3 Front panel - Status monitoring ................................................................ .................16

General environmental requirements for Nevion equipment .................................. 18

Product Warranty.................................................................................................... 19

Appendix A Materials declaration and recycling information .................................. 20

A.1 Materials declaration ....................................................................................................20

A.2 Recycling information ...................................................................................................20

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1 Product overview

The QUAD-DA-1x2-PB is a quad 1x2 3G/HD/SD-SDI Distribution amplifier with passive
input bypass well suited for quad stream UHD/4K applications.

The card can operate as either four independent DAs or a quad stream DA monitoring the 4
inputs as one. When operated in quad stream mode the card´s signal alarming will be given
on the combined stream.

A passive relayed bypass of all four main inputs enables signal pass-thru in case of mains
or card failure.

The Flashlink element manager Multicon enables web and SNMP interface for configuring
card settings and monitoring signal status.

Figure 1: Block diagrams of the QUAD-DA-1x2-PB

1.1 Product versions

There are two connector backplane versions, one with DIN 1.0/2.3 and one with HD-BNC
connectors.

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2 Specifications

2.1 General

Power (DC) +5 V / +15 V (Configurable DIP switch setting)

3.0 W / +5 V, 0.6 W / +15 V maximum

2.8 W / +5 V, 0.6 W / +15 V typical
User interface Status LED, Status GPIOs, configuration DIP switches
Web interface and SNMP thru Multicon controller
Operating environmental
temperature 0 to +45 °C

2.2 Electrical SDI inputs

Number of inputs 4, relay protected
Data rate 125 Mbps – 2970 Mbps
Connectors 75 Ohm, DIN 1.0/2.3 or HD-BNC

(depends on backplane type)
Input Return loss < -15 dB, 5 MHz – 1.5 GHz
< -10 dB, 1.5 GHz – 3 GHz
Jitter tolerance SD limit:
10 Hz – 10 kHz: > 1 UI
10 kHz – 10 MHz: > 0.2 UI
HD limit:
10 Hz – 10 kHz: > 1 UI
10 kHz – 10 MHz: > 0.2 UI
3G limit:
10 Hz – 10 kHz: > 2 UI
10 kHz – 10 MHz: > 0.3 UI
Equalized cable lengths SD:
(BER < 10E-12) 280m min. 300m typ. (Belden 8281)
Checkfield pattern 400m min. 450m typ. (Belden 1694A)
HD:
Unused outputs terminated 90m min. 100m typ. (Belden 1694A)
with 75 ohm terminators 3G:
50m min. 55m typ. (Belden 1694A)
Remark The I-xA input signals pass through relays resulting in

degraded levels and rise/fall time equivalent to 15

meters of 1694A cable. The cable lengths above include

this.

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2.3 Electrical SDI outputs

Number of outputs 8, 4 relay protected
Connectors 75 Ohm, DIN 1.0/2.3 or HD-BNC

(depends on backplane type)
Output Return loss < -15 dB, 5 MHz – 1.5 GHz
< -10 dB, 1.5 GHz – 3 GHz
Output signal level 800 mV +/- 10%
Output signal rise / fall time - SD limit: [0.4 ns – 1.5 ns]; < 0.5 ns rise/fall variation
(20% - 80 %) - HD limit: < 270 ps, < 100 ps rise/fall variation

- 3G limit: < 135 ps, < 50 ps rise/fall variation

Remark Due to Nevion’s design philosophy with use of passive

backplanes, the output signals pass significant PCB

trace lengths between the cable drivers and output

ports. This will result in significant degradation of levels

and rise/fall times at HD and 3GHD at the backplane

connectors compared to the listed specifications above

which states launch levels at the cable drivers. The

degradation equals approximately 10 meters of 1694A

cable.
Remark The O-xA outputs pass through relays resulting in

degraded levels and rise/fall time equivalent to 15

meters of 1694A cable.
Amplitude overshoot/undershoot < 10%
Polarity All non-inverting (DVB-ASI compliant)
Output timing jitter SD: < 0.2 UI
HD: < 1 UI
3G: < 1 UI
Output alignment jitter SD: < 0.15 UI
HD: < 0.15 UI
3G: < 0.2 UI

2.4 Open drain GPIOs

Connector PTSA 0,5 mm2 Push-in spring wire connector
No of ports 3
Applied voltage (DC) 25V max.
Permitted current drain

in output “low” state 150 mA max.
Saturation voltage at

max. permitted current drain 600 mV max.

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2.5 Features

Re-clocking: Automatic SD, HD, 3GHD detection

Automatic output slew rate adjustment according to

SMPTE- 259M, SMPTE-292 and SMPTE424M
Supported clock rates: 125Mbps, 270Mbps, 1.485 and 1.485/1.001Gbps, 2.97

and 2.97/1.001Gbps
MADI: According to AES10 with the following exemption;

Amplitude and rise and fall times according to SD-SDI

(SMPTE- 292M) at electrical outputs.

2.6 Supported standards

SMPTE: SMPTE259M, SMPTE292 and SMPTE424M
DVB-ASI: EN50083-9
MADI: AES10

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3 Configuration

Configuration of this card can either be done from Multicon GYDA element manager or locally
on the card by DIP switches.

3.1 Multicon GYDA configuration

Below is a snapshot from the Multicon GYDA interface.

Figure 2: Configuration tab example

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3.1.1 Card label

Figure 3: Card label

Assign a name to the Flashlink module, up to 31 characters. When the “locate card” button

is pushed, all indicators/LED’s on the front of the module will flash for 120 seconds,

alternatively a period can be entered into the sec box.

3.1.2 Firmware upgrade

Figure 4: Firmware upgrade

Update the firmware on the Flashlink module. The firmware file first has to be uploaded to
Multicon Gyda by ftp. See user manual for Multicon Gyda concerning help on uploading.

3.1.3 Electrical inputs

Figure 5: Electrical inputs

For SDI signals set the electrical input to “normal”. For non-supported signal formats

“bypass” mode may be used. The cable equalizer will then be bypassed. This may give

better performance since the cable equalizer is optimized for the supported standards.

3.1.4 Reclockers

Figure 6: Reclockers

For supported formats; set to enable, else it may be set to bypass. Autobypass only works if
the reclocker is enabled. In “autobypass” mode the reclocker will bypass not supported
formats.

3.1.5 Electrical outputs

Figure 7: Electrical outputs

With slew rate set to “Auto” the rise- and fall time of the cable driver will be automatically
adjusted according to the actual signal format.
For bit rates below 270Mbps the slew rate is automatically set to SD slew rate.For not
supported signals with bitrates above 270Mbps the proper slew rate can be selected
manually.

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3.2 Configuration through DIP settings

The correct configuration can either be set with the DIP switch on the card or through the
GYDA Control System. The layout is shown in the drawing below with the DIP switch to the
upper left position.

Figure 8: QUAD-DA-1x2-PB board layout

Figure 9: DIP switch

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Table 1: DIP settings

Switch #

Label

Function, DIP=OFF

Function, DIP=ON

Comment

1

+15V

Board supplied by

+15 V DC

Board supplied by

+5 V DC

Selection of power

Attention:

Must only be operated

when the board is

unpowered

2 1 Not used

Not used

3 2 Not used

Not used

4 3 Not used

Not used

5

4

Reclocker Bypass

(Loss of lock will not

work on this mode)

Reclocker ON

Reclocker mode

6

5

Cable Equalizer

Bypass

(Loss of signal will not

work on this mode)

Cable Equalizer

ON

Equalizer mode

7 6 Not used

Not used

8

OVR

GYDA control.

Config. with GYDA

Override GYDA

control Config. with

DIP switch

Select config. from

GYDA

All DIP switches are off when pointing towards the release handle.

3.2.1 Selection of power supply

(Only DIP configurable)
The module can be configured to be powered from either +5 V or +15 V DC power rails with

DIP switch labeled “+15V”. This feature is useful to improve utilization of, or balancing the
available power in a frame.

The DIP switch must only be operated when the board is unpowered
to prevent instability.

The configuration is set to +5 V as default.

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4 Connections

The QUAD-DA-1x2-PB has a dedicated connector module; DA-CHO-C1 and –C2/-C3. This
module is mounted at the rear of the sub-rack. The layout of the module is shown in the figure
below.

Figure 10: Backplane connector module for QUAD-DA-1x2-PB

• Passive input bypass is connected through the I-xA to O-xA connectors
respectively, where x is the stream number from 1 to 4.

• In QUAD-DA-1x2-PB, the I/O-xB connectors are O-xB outputs, while in
QUAD-CHO-2x1-PB the I/O-xB connectors are I-xB inputs.

4.1 Mounting the connector module

Product consists of three main parts as seen in Figure 11.

Figure 11: the three main parts of the product

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Some assembly is needed before this can be installed into a frame:

1. Connect connector module (3, Figure 11) to relay module (2, Figure 11) and make
sure the connectors are completely mated with the two guide pins located on
top/bottom as seen in Figure 11.

2. Slide the assembled modules into the back of the frame while making sure the C1
board slides correctly into the frame’s guide rail. Make sure the pins align and
correctly connects to the power bus connector as seen in Figure 12.

3. Fasten the backplane with the supplied screws.

More details on how the connector module is mounted, are found in the user manual for the
sub-rack frame FR-2RU-10-2.

This manual is also available from our web site: http://www.nevion.com

Figure 12: Instalment from the back of the frame

(NB: Picture of CONV-SFP-4, but the procedure is equal).

4.2 Terminal format support

The different input and output ports on QUAD-DA-1x2-PB can support a number of formats.
The table below show which signal formats are supported on the selected terminals.

Unused input and output ports should be terminated with 75 Ohm terminators.

Table 2: Signal support

Terminal

Function

Supported Format

Mode

I-xA

(x = 1,2,3,4)

Electrical Input

SDI, DVB-ASI, Transparent

Input

O-xA
I/O-xB

(x = 1,2,3,4)

Electrical Output

Reclocked Output

SDI, DVB-ASI, Transparent

Output

GPIO-(2-3)

Status

Wired alarms

Open Drain

output

GPIO-5

Module status

Wired alarms

Open drain

0utput

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4.3 GPIO connections

GPI connector is shown in figures below.

Table 3: QUAD-DA-1x2-PB module GPI pinning

Signal

Function

Pin #

Mode

GPIO-1 /

Status

Not used

Pin 1

GPIO-2

Reflects “Info 1” LED. See also

5.1.2

Pin 2

Open drain

GPIO-3

Reflects “Info 2” LED. See also

5.1.2

Pin 3

Open drain

GPIO-4

Not used

Pin 4

Open drain

GPIO-5

Module status, reflects the status

LED. See also 5.1.2

Pin 5

Open drain

Ground

0V / gnd pin

Pin 8

0V

Figure 13: GPI connector

4.4 Passive input bypass (-PB)

The equalized cable lengths specified under chapter “2.2 Electrical SDI inputs” are valid only
when the main board is active and are based on the equalizing properties of the specific
cable equalizer solution used in this product.

When utilizing the “Passive input bypass” solution, the sum of cable lengths from the source
via the relay inside QUAD-CHO-2x1-PB to the next product in the chain must be dimensioned
according to the equalizing properties of this next product.

It is strongly recommended to perform thorough testing of the function before taking it into
use.

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5 Operation

5.1 Module status

The status of the module can be monitored in three ways.

1. Multicon GYDA System Controller (optional).

2. GPI at the rear of the sub-rack.

3. LEDs at the front of the sub-rack.

Of these three, the GPI and the LEDs are mounted on the product itself, whereas the Multicon
GYDA System Controller is a separate module giving detailed information on the card status.

5.1.1 Multicon GYDA status interface

Figure 14: Status tab example

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The on-board temperature measurement is a feature used for monitoring
variations in temperature over time and can be accessed thru SNMP. The
absolute value of the temperature measurement has little value of its own as it
does not reflect the temperature inside the electronics nor the ambient frame
temperature.

When +5V is chosen as supply source, the presented current value for +15V will
be approximately 0.04A due to current drain of the four high frequency relays.

If a reclocker is configured to “Bypass” mode and a recognizable signal rate is

applied, the shown info will be “Locked” and “Actual rate” though the signal is not

reclocked. Otherwise the shown info will be “Bypass” and no rate information.

5.1.2 GPI ALARM – Module Status Outputs

These outputs can be used for wiring up alarms for third party control systems. All GPIO
outputs are of open drain type.

Open drain GPIO (#5) function:
This output is low ohmic referred to GND when no severe system errors are detected
and high ohmic in opposite situation and when no main board is connected

Open drain GPIOs (#2-3) function:
These outputs reflect the status on LEDs “INFO 1-2” respectively as follows;

- Low ohmic referred to GND when LED is green or orange

- High ohmic referred to GND when LED is red

Open drain GPIO #5 function:
This output reflects the status on the “Status” LED as follows;

- Low ohmic referred to GND when LED is green

- High ohmic referred to GND when LED is red

5.1.3 Front panel - Status monitoring

The status of the module can be easily monitored visually by the LEDs at the front of the
module. The LEDs are visible through the front panel of FR-2RU-10-2(-MkII) as shown in
the figure below.

Figure 15: Front panel LEDs

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Table 4: Front panel LEDs

LED \

State

Red

Orange

Green

No light

Comment

Status

Module is faulty,

or module is

initializing

N/A

Module is OK

Module power

is OK

Module

has no

power

INFO 1

Loss Of Signal,

all inputs

1-3 Inputs

Loss Of Signal

Signal present

at all inputs

N/A

All Input

Equalizer

alarms OR’ed

INFO 2

Loss Of Lock,

all inputs

1-3 Inputs

Loss Of Lock

Lock present

at all inputs

N/A

All Input

Reclocker

alarms OR’ed

INFO 3

Not used

Not used

Not used

Constant

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General environmental requirements for Nevion equipment

1.

The equipment will meet the guaranteed performance specification under the
following environmental conditions:

-

Operating room temperature range:

0°C to 45°C

-

Operating relative humidity range:

<90% (non-condensing)

2.

The equipment will operate without damage under the following environmental
conditions:

-

Temperature range:

-10°C to 55°C

-

Relative humidity range:

<95% (non-condensing)

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Product Warranty

The warranty terms and conditions for the product(s) covered by this manual follow the
General Sales Conditions by Nevion, which are available on the company web site:

www.nevion.com

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Appendix A Materials declaration and recycling
information

A.1 Materials declaration

For product sold into China after 1st March 2007, we comply with the “Administrative Measure

on the Control of Pollution by Electronic Information Products”. In the first stage of this

legislation, content of six hazardous materials has to be declared. The table below shows
the required information.

組成名稱

Part Name

Toxic or hazardous substances and elements

鉛

Lead

(Pb)

汞

Mercury

(Hg)

镉

Cadmium

(Cd)

六价铬

Hexavalent

Chromium

(Cr(VI))

多溴联苯

Polybrominated

biphenyls

(PBB)

多溴二苯醚

Polybrominated

diphenyl ethers

(PBDE)

QUAD-DA-1x2-PB

O O O O O

O

O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement in SJ/T11363-2006.

X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used
for this part is above the limit requirement in SJ/T11363-2006.

This is indicated by the product marking:

A.2 Recycling information

Nevion provides assistance to customers and recyclers through our web site
http://www.nevion.com/. Please contact Nevion’s Customer Support for assistance with
recycling if this site does not show the information you require.

Where it is not possible to return the product to Nevion or its agents for recycling, the following
general information may be of assistance:

 Before attempting disassembly, ensure the product is completely disconnected from

power and signal connections.

 All major parts are marked or labeled to show their material content.
 Depending on the date of manufacture, this product may contain lead in solder.
 Some circuit boards may contain battery-backed memory devices.