A.2 Recycling information ...................................................................................................14
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DVI-SDI-2-SFP Rev. C
Optical output 1
Microcontroller
Optical output 2
HDMI/DVI input 1
HDMI/DVI input 2
Remote control
1 Product overview
DVI-SDI-2-SFP will convert DVI-R or HDMI signal into an optical SDI. Used together with
DVI-SDI-2-SFP this card can be used as an optical extender for transporting DVI signal.
The dual optical transmitter is SFP based and can be 1310nm for short haul application or
18 channel CWDM transmitter. The CWDM option can be combined with Flashlink CWDM18 filter making it possible to transport 18 DVI signals over one fiber.
Figure 1 Block diagram of the DVI-SDI-2 converter
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DVI-SDI-2-SFP Rev. C
2 Specifications
2.1 General
Power +5V DC / 5W, max
Control Control system for access to setup and module status
with BITE (Built-In Test Equipment)
Temperature range 0 to +40 °C
2.1 Electrical Inputs
Number of inputs 2
Connector HDMI type D
HDMI type A with use of adapter cable
DVI-D with use of adapter cable
Supported format 525i/ 625i
720p/ 1080i, 50/59.94/60Hz
1080p, 50/ 59.94/ 60Hz
640x480: converted to 720p by adding black lines
800x600: converted to 720p by adding black lines.
1024x768: converted to 1080p by adding black lines.
1280x1024: converted to 1080p by adding black lines.
Other graphical format may work.
Number of bits 24bit (3x8bit)
Bandwidth 165MHz
Format RGB 4:4:4, YCbCr 4:2:2, YCbCr 4:4:4
Only non-HDCP protected signal
RGB Range Full or SMPTE
Audio embedding 2 channels, AES 1 group. L-PCM, 48kHz
2.2 Optical output
Number of outputs 2
Connector LC/UPC
SFP type Nevion Video SFP range, Dual transmitter
See SFP datasheet for additional specifications
The electrical DVI/HDMI signal is converted into an electrical SDI signal. The audio is
embedded into the SDI signal before the SDI is converted to optical by the optical SFP. In
DVI mode no audio is embedded into the SDI signal.
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DVI-SDI-2-SFP Rev. C
Switch #
Label
Function, DIP = ON
Function, DIP = OFF
Comment
1
DIP1
To be defined
2
DIP2
To be defined
3
DIP3
To be defined
4
DIP4
To be defined
5
DIP5
To be defined
6
DIP6
To be defined
7
DIP7
To be defined
8
OVR
Override GYDA
control.
Configuration with
DIP switch
GYDA control.
Configuration with
GYDA
Select configuration
from GYDA
4 Configuration
The correct configuration can either be set with a DIP switch or with the GYDA Control
System. The layout of DVI-SDI-2 is shown in the drawing below with the DIP switch to the
upper left position.
Figure 3 DVI-SDI-2 board layout
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All DIP switches are off when pointing towards the release handle.
DVI-SDI-2-SFP Rev. C
Terminal
Function
Supported Format
Mode
SFP3
Optical output
Optical SD/HD/3G-SDI
Output
SFP1
Electrical input
HDMI or DVI
Input
SFP2
Electrical input
HDMI or DVI
Input
GPI ALARM
Open Collector Alarms
Wired alarms
OC Output
5 Connections
Figure 4 Connector module for DVI-SDI-2
5.1 Mounting the connector module
The details of how the connector module is mounted, is found in the user manual for the subrack frame FR-2RU-10-2.
This manual is also available from our web site:
http://www.nevion.com/.
5.2 Terminal ports
The connector module must be fitted with three SFP’s. SFP3 is for the dual optical receiver
module. While the SFP1 and SFP2 are for the HDMI/DVI SFP. The HDMI/DVI SFP are fitted
with an HDMI type D connector, if other connect are preferred see chapter Error! Reference ource not found. for alternatives.
Unused inputs should be terminated to avoid alarms triggered by noise.
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DVI-SDI-2-SFP Rev. C
5.3 Cable adapter
5.3.1 HDMI type A
An HDMI type D to HDMI type A can be delivered with the module for interfacing for
interfacing to HDMI type A equipment.
5.3.2 DVI-D
An HDMI type D to DVI-D can be delivered with the module for interfacing to DVI-D
equipment.
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DVI-SDI-2-SFP Rev. C
Signal
Name
Pin #
Mode
Status
General error status for the module.
Pin 1
Open Collector
LOS1
Loss of signal or missing SFP on
channel 1.
Pin 2
Open Collector
LOS2
Loss of signal or missing SFP on
channel 2.
Pin 3
Open Collector
Ground
0V / gnd pin.
Pin 8
0V.
6 Module status
The status of the module can be monitored in three ways.
1. Multicon Gyda System Controller (optional).
2. GPI at the rear of the sub-rack.
3. LED’s at the front of the sub-rack.
Of these three, the GPI and the LED’s are mounted on the module itself, whereas the GYDA
System Controller is a separate module giving detailed information on the card status.
6.1 Multicon Gyda
6.2 GPI ALARM – Module Status Outputs
These outputs can be used for wiring up alarms for third party control systems. The GPI
outputs are open collector outputs, sinking to ground when an alarm is triggered. The GPI
connector is shown in figures below.
Electrical Maximums for GPI outputs
Max current : 100mA
Max voltage : 30V
6.2.1 GPI connections
DVI-SDI-2 module GPI pinning:
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Figure 1GPI connector
DVI-SDI-2-SFP Rev. C
Diode \ State
Red LED
Yellow LED
Green LED
No light
Status
Module is faulty, or
module is initializing.
N/A
Module is OK
Module power
is OK
Module
has no
power
LOS/LOCK1
No input signal on
input 1.
Channel 1 is not
in lock or
unsupported
format.
Channel 1 is in
lock and
supported
format.
Missing
SFP on
signal 1
LOS/LOCK2
No input signal on
input 2.
Channel 2 is not
in lock or
unsupported
format.
Channel 1 is in
lock and
supported
format.
Missing
SFP on
signal 1
Transmitter
SFP
Missing SFP
NA
Present SFP
NA
6.3 Front panel – Status monitoring
The status of the module can be easily monitored visually by the LED’s at the front of the
module. The LEDs are visible through the front panel as shown in the figure below.
The DVI-SDI-2 has 4 LED’s each showing a status corresponding to the GPI pinning.
Table 1: LED states and what they mean
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DVI-SDI-2-SFP Rev. C
1.
The equipment will meet the guaranteed performance specification under the
following environmental conditions:
-
Operating room temperature
range:
0°C to 45°C
-
Operating relative humidity range:
<90% (non-condensing)
2.
The equipment will operate without damage under the following environmental
conditions:
-
Temperature range:
-10°C to 55°C
-
Relative humidity range:
<95% (non-condensing)
General environmental requirements for Nevion equipment
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DVI-SDI-2-SFP Rev. C
Product Warranty
The warranty terms and conditions for the product(s) covered by this manual follow the
General Sales Conditions by Nevion, which are available on the company web site:
www.nevion.com
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DVI-SDI-2-SFP Rev. C
組成名稱
Part Name
Toxic or hazardous substances and elements
鉛
Lead
(Pb)
汞
Mercury
(Hg)
镉
Cadmium
(Cd)
六价铬
Hexavalent
Chromium
(Cr(VI))
多溴联苯
Polybrominated
biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
<Product>
O O O O O
O
<Power supply, if
delivered with unit>
O O O O O
O
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement in SJ/T11363-2006.
X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used
for this part is above the limit requirement in SJ/T11363-2006.
Appendix A Materials declaration and recycling
information
A.1 Materials declaration
For product sold into China after 1st March 2007, we comply with the “Administrative Measure
on the Control of Pollution by Electronic Information Products”. In the first stage of this
legislation, content of six hazardous materials has to be declared. The table below shows
the required information.
This is indicated by the product marking:
A.2 Recycling information
Nevion provides assistance to customers and recyclers through our web site
http://www.nevion.com/. Please contact Nevion’s Customer Support for assistance with
recycling if this site does not show the information you require.
Where it is not possible to return the product to Nevion or its agents for recycling, the following
general information may be of assistance:
Before attempting disassembly, ensure the product is completely disconnected from
power and signal connections.
All major parts are marked or labeled to show their material content.
Depending on the date of manufacture, this product may contain lead in solder.
Some circuit boards may contain battery-backed memory devices.
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