A.2 Recycling information ...................................................................................................15
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DA-3GHD-8-DUAL Rev. A
1 Product overview
The Flashlink DA-3GHD-8-DUALis dual 1x8 a multi bit-rate distribution amplifier providing
high performance and high density media distribution for various signal formats from
19.4Mbps up to 2970Mbps. The unit can be configured to do cable equalizing and reclocking
of SMPTE 424M, SMPTE 292 and SMPTE 259M signal formats.
The product provides two inputs each distributed to 8 reclocked non-inverting outputs. It will
detect 3G, HD and SD rates and automatically switch to correct output slew-rate. The
reclocker supports the bit-rates 270Mbps, 1483.5Mbps, 1485Mbps, 2967Mbps and
2970Mbps. For other rates, the reclocker can automatically switch to bypass mode and DA3GHD-8-DUAL will work as a non-reclocking distribution amplifier with cable equalization.
DA-3GHD-8 also supports reclocking of DVB-ASI at 270Mbps, enabling all possible rates
including empty transport streams with only K28.5 padding packets. All 8 outputs are noninverting and suitable for DVB-ASI.
DA-3GHD-8-DUAL is designed for all distribution purposes in studio, duplication and
Broadcast applications.
The backplane board holds two main board, each a 1x8 distribution amplifier. The boards are
totally independent and there are no active components on the backplane. This allows for
hot-swap of one board without affecting the other. There are two versions of backplane board,
one with DIN 1.0/2.3 connectors and one with HD-BNCs, both designed for connection of two
main modules in a single Flashlink slot.
NOTE This product can only be used on the Flashlink enclosures FR202
and Flashcase II
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DA-3GHD-8-DUAL Rev. A
Figure 1: DA-3GHD-8-DUAL
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DA-3GHD-8-DUAL Rev. A
Number of outputs
16
Connectors
75 Ohm DIN 1.0/2.3/HD-BNC
Output Return loss
- < -15dB, 5MHz -1.5GHz
- < -10dB, 1.5GHz - 3GHz
Output signal level
800mV +/- 10%
Output signal rise / fall time
20% - 80%
- SD limit: [0.4ns – 1.5ns]; <0.5ns rise/fall var.
- HD limit: < 270ps, <100ps rise/fall var.
- 3G HD limit: <135ps, <50ps rise/fall var.
Amplitude overshoot
<10%
Polarity
- non-inverting
Output timing jitter
- SD: <0.2 UI
- HD: <1 UI
- 3G HD: <1UI
Output alignment jitter
- SD: <0.15 UI
- HD: <0.15 UI
- 3G HD: <0.2UI
Number of inputs
2
Connectors
75 Ohm DIN 1.0/2.3/HD-BNC
Input Return loss
- < -15dB, 5MHz -1.5GHz
- < -10dB, 1.5GHz - 3GHz
Jitter tolerance
- SD limit:
- 10Hz-10kHz: >1 UI
- 10kHz-10MHz: >0.2 UI
- HD limit:
- 10Hz-100kHz: >1 UI
- 100kHz-150MHz: >0.2 UI
- 3G HD limit:
- 10Hz-100kHz: >2 UI
- 100kHz-300MHz: >0.3 UI
2 Specifications
2.1 Electrical Outputs
2.2 Electrical Inputs
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DA-3GHD-8-DUAL Rev. A
Cable equalization, DA-3GHD-8-DUAL.
Format
Min.
Typical
Comments
SD-SDI
325m
Belden 8281
BER< 10E-12
Total length of cable
included patching between
modules
375m
HD-SDI
170m
Belden 1694A
BER< 10E-12
Total length of cable
included patching between
modules
210m
3GHD-SDI
80m
120m
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DA-3GHD-8-DUAL Rev. A
Re-clocking:
Automatic SD, HD, 3G detection
Automatic output slew rate adjustment according to
SMPTE-259M and SMPTE-292M/ SMPTE424M
The DA-3GHD-8-DUAL supports a number of different formats. The correct configuration can
either be set with a DIP switch or with GYDA Control System. The layout of the main module
is shown in the drawing below with the DIP switch to the upper left position.
Figure 2: DA-3GHD-8-DUAL module layout
DIP switch configuration must be set according to Table 1:
All DIP switches are off when pointing towards the release handle.
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Table 1: DA-3GHD-8-DUAL DIP switches
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DA-3GHD-8-DUAL Rev. A
- - -
- - -
- - -
CD
ABYP
RCL
EQ
OVR
1
8
- - -
- - -
- - -
CD
ABYP
RCL
EQ
OVR
1
8
- - -
- - -
- - -
CD
ABYP
RCL
EQ
OVR
1
8
3.1 Configuration Examples
Typical configurations for DA-3GHD-8-DUAL:
Figure 3: Default all off; Gyda controls the card
Figure 4: DIP control; Equalizing and reclocking turned on
Figure 5: Same as above, but if the input signal is something else than the supported bit-
rates, the reclocker will automatically enter bypass mode
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DA-3GHD-8-DUAL Rev. A
4 Connections
The backplane layout is shown in Figure 6.
Figure 6: Layout of the backplanes DA-3GHD-8-C2/C3
The electrical input signal is connected to the IN BNC. All OUT1 to OUT8 BNC’s provide noninverted signals and can be used for all formats, included DVB-ASI. Unused outputs should
be terminated with 75ohm.
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DA-3GHD-8-DUAL Rev. A
Diode \
state
Red LED
Yellow LED
Green LED
No light
Status
Module is faulty
Module is OK
Module has power
Module has
no power
Signal
No input signal
EQ bypassed or
muted
Input signal
present
Rate
Rate not
detected
Recl. bypassed
Reclocker locked
Fourth LED
not used
Status
Signal
Rate
Not used
5 Operation
The status of the module can be easily monitored visually by LED’s at the front of the module.
The LED’s are visible through the front panel as shown in Figure 10.
Figure 7: Panel indicator overview for DA-3GHD-8-DUAL (text not printed on the front panel).
The functions of the different LED’s are described in Table 2.
Table 2: LED status description
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DA-3GHD-8-DUAL Rev. A
1.
The equipment will meet the guaranteed performance specification under the
following environmental conditions:
-
Operating room temperature
range:
0°C to 50°C
-
Operating relative humidity range:
<90% (non-condensing)
2.
The equipment will operate without damage under the following environmental
conditions:
-
Temperature range:
-5°C to 55°C
-
Relative humidity range:
<95% (non-condensing)
General environmental requirements for Nevion equipment
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DA-3GHD-8-DUAL Rev. A
Product Warranty
The warranty terms and conditions for the product(s) covered by this manual follow the
General Sales Conditions by Nevion, which are available on the company web site:
www.nevion.com
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DA-3GHD-8-DUAL Rev. A
組成名稱
Part Name
Toxic or hazardous substances and elements
鉛
Lead
(Pb)
汞
Mercury
(Hg)
镉
Cadmium
(Cd)
六价铬
Hexavalent
Chromium
(Cr(VI))
多溴联苯
Polybrominated
biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
DA-3GHD-8-Dual
O O O O O
O
<Power supply, if
delivered with unit>
O O O O O
O
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is
below the limit requirement in SJ/T11363-2006.
X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used
for this part is above the limit requirement in SJ/T11363-2006.
Appendix A Materials declaration and recycling
information
A.1 Materials declaration
For product sold into China after 1st March 2007, we comply with the “Administrative Measure
on the Control of Pollution by Electronic Information Products”. In the first stage of this
legislation, content of six hazardous materials has to be declared. The table below shows
the required information.
This is indicated by the product marking:
A.2 Recycling information
Nevion provides assistance to customers and recyclers through our web site
http://www.nevion.com/. Please contact Nevion’s Customer Support for assistance with
recycling if this site does not show the information you require.
Where it is not possible to return the product to Nevion or its agents for recycling, the following
general information may be of assistance:
Before attempting disassembly, ensure the product is completely disconnected from
power and signal connections.
All major parts are marked or labeled to show their material content.
Depending on the date of manufacture, this product may contain lead in solder.
Some circuit boards may contain battery-backed memory devices.
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