NEC UPC8182TB-E3, UPC8182TB Datasheet
PRELIMINARY DATA SHEET
BIPOLAR ANALOG INTEGRATED CI RCUIT
PC8182TB
µµµµ
3 V, 2.9 GHz SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
FOR MOBILE COMMUNICATIONS
DESCRIPTION
The
PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
µ
IC is low current consumption and wide band than µPC2771TB.
This IC is manufactured using NEC’s 25 GHz fT UHS0 silicon bipolar process. This process uses direct silicon
nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent
corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
• Supply voltage : VCC = 2.7 to 3.3 V
• Circuit current : ICC = 30 mA TYP. @ VCC = 3.0 V
• Medium output power : P
• Power gain : GP = 21.5 dB TYP. @ f = 0.9 GHz
• Upper limit operating frequency : fu = 2.9 GHz TYP. @ 3 dB bandwidth
O(1dB)
= +9.5 dBm TYP. @ f = 0.9 GHz
O(1dB)
P
= +9.0 dBm TYP. @ f = 1.9 GHz
O(1dB)
P
= +8.0 dBm TYP. @ f = 2.4 GHz
GP = 20.5 dB TYP. @ f = 1.9 GHz
GP = 20.5 dB TYP. @ f = 2.4 GHz
APPLICATION
• Buffer amplifiers on 1.9 GHz to 2.4 GHz mobile communications system.
ORDERING INFORMATION
Part Number Package Marking Supplying Form
µ
PC8182TB-E3 6-pin super minimold C3F Embossed tape 8 mm wide.
1, 2, 3 pins face to perforat i on side of the tape.
Qty 3 kp/reel.
Remark
To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order:
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
PC8182TB)
µ
Document No. P14543EJ1V0DS00 (1st edition)
Date Published December 1999 N CP(K)
Printed in Japan
©
1999
PIN CONNECTIONS
µµµµ
PC8182TB
(Top View)
3
2
1
4
5
6
C3F
PRODUCT LINE-UP (TA = +25 °C, VCC = V
u
Part No.
PC2762T 2.9 +8.0 @ f = 0.9 GHz 13.0 @ f = 0.9 GHz 26.5 6-pin m i ni m ol d C1Z
µ
PC2762TB +7.0 @ f = 1.9 GHz 15.5 @ f = 1.9 GHz 6-pin super minimold
µ
PC2763T 2.7 +9.5 @ f = 0.9 GHz 20.0 @ f = 0.9 GHz 27.0 6-pin m i ni m ol d C2A
µ
PC2763TB +6.5 @ f = 1.9 GHz 21.0 @ f = 1.9 GHz 6-pin super minimold
µ
PC2771T 2.2 +11.5 @ f = 0.9 GHz 21.0 @ f = 0.9 GHz 36.0 6-pin m i ni m ol d C2H
µ
PC2771TB +9.5 @ f = 1.5 GHz 21.0 @ f = 1.5 GHz 6-pin super minimold
µ
PC8182TB
µ
f
(GHz)
2.9 +9.0 @ f = 1.9 GHz 20.5 @ f = 1.9 GHz 30.0 C3F
+8.0 @ f = 2.4 GHz 20.5 @ f = 2.4 GHz
O (1 dB)
P
(dBm)
(Bottom View)
4
5
6
out
= 3.0 V, ZS = ZL = 50
3
2
1
)
ΩΩΩΩ
G
(dB)
P
CC
I
(mA)
Pin No. Pin Name
1 INPUT
2GND
3GND
4OUTPUT
5GND
6V
Package Marking
6-pin super minimold
CC
Remark
Notice
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
The package size distinguishes between minimold and super minimold.
2
Preliminary Data Sheet P14543EJ1V0DS00
SYSTEM APPLICATION EXAMPLE
Digital cellular telephone
µµµµ
PC8182TB
TX
SW
RX
PA
µ
PC8182TB
÷N
PLL
Phase
shifter
0 °
90 °
DEMO
PLL
I
Q
I
Q
Preliminary Data Sheet P14543EJ1V0DS00
3
PIN EXPLANATION
µµµµ
PC8182TB
Applied
Pin No. Pin Name
1 INPUT – – Signal input pi n. A internal
4 OUTPUT Vol t age
6VCC2.7 to 3.3 – Power supply pi n, whi ch biases
2
3
5
GND 0 – Ground pin. This pi n should be
Voltage
(V)
as same
CC
as V
through
external
inductor
Pin
Voltage
Note
(V)
– Signal output pi n. The inductor
Function and Applications Internal Equivalent Circ ui t
matching circuit, configured with
resistors, enables 50
connection over a wide band.
A multi-feedback ci rcuit is
designed to cancel the
deviations of h
This pin must be coupled to
signal source with capac i t or for
DC cut.
must be attached between V
and output pins to supply
current to the internal output
transistors.
the internal input transis tor.
This pin should be externally
equipped with bypass capaci t or
to minimize its i m pedance.
connected to system ground
with minimum inductanc e.
Ground pattern on the board
should be formed as wide as
possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
Ω
FE
and resistance.
6
CC
4
1
3
GND GND
52
Pin voltage is measured at V
Note
4
CC
= 3.0 V.
Preliminary Data Sheet P14543EJ1V0DS00
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