NEC UPC8179TB-E3, UPC8179TB Datasheet

DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

PC8179TB

µµµµ

SILICON MMIC LOW CURRENT AMPLIFIER

FOR MOBILE COMMUNICATIONS

DESCRIPTION

The µPC8179TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC can realize low current consumption with external chip inductor which can not be realized on internal 50 wideband matched IC. This low current amplifier operates on 3.0 V.

This IC is manufactured using NEC’s 30 GHz f process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

max

UHS0 (Ultra High Speed Process) silicon bipolar process. This

Ω

FEATURES

• Low current consumption : ICC = 4.0 mA TYP. @ VCC = 3.0 V

• Supply voltage : VCC = 2.4 to 3.3 V

• High efficiency : P

• Power gain : GP = 13.5 dB TYP. @ f = 1.0 GHz

• Excellent isolation : ISL = 44 dB TYP. @ f = 1.0 GHz

• Operating frequency : 0.1 to 2.4 GHz (Output port LC matching)

• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)

• Light weight : 7 mg (Standard value)

APPLICATION

• Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system

O (1 dB)

= +3.0 dBm TYP. @ f = 1.0 GHz

O (1 dB)

P

= +1.5 dBm TYP. @ f = 1.9 GHz

O (1 dB)

P

= +1.0 dBm TYP. @ f = 2.4 GHz

GP = 15.5 dB TYP. @ f = 1.9 GHz GP = 15.5 dB TYP. @ f = 2.4 GHz

ISL = 42 dB TYP. @ f = 1.9 GHz ISL = 41 dB TYP. @ f = 2.4 GHz

The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.

Document No. P14730EJ2V0DS00 (2nd edition) Date Published August 2000 N CP(K) Printed in Japan

Caution Electro-static sensitive devices

2000©

ORDERING INFORMATION

Part Number Package Marking Supplying Form

PC8179TB-E3 6-pin super minimold C3C Embossed tape 8 mm wide.

µ

1, 2, 3 pins face the perforat i on side of the tape. Qty 3 kpcs/reel.

µµµµ

PC8179TB

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:

PIN CONNECTIONS

(Top View)

3

2

1

C3C

PC8179TB)

µ

(Bottom View)

4

5

6

4

5

6

3

2

1

Pin No. Pin Name

1 INPUT 2GND 3GND 4OUTPUT 5GND 6V

CC

2

Data Sheet P14730EJ2V0DS00

µµµµ

PC8179TB

PRODUCT LINE-UP (TA = +25 °C, VCC = V

Parameter

Part No.

PC8178TB 1.9 11 39

µ

PC8179TB 4.0 13.5 44 +3.0

µ

PC8128TB 2.8 12.5 39

µ

PC8151TB 4.2 12.5 38 +2.5 15 36 +1.5 15 34 +0.5

µ

PC8152TB 5.6 23 40

µ

Remark

(mA)

Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.

1.0 GHz output port matching frequency

G

CC

I

(dB)

P

ISL

(dB)

O(1 dB)

P (dBm)

4.0

−

4.0 13 39

−

4.5 19.5 38

−

out

= 3.0 V, ZS = ZL = 50

1.66 GHz output port matching frequency

P

G

ISL

(dB)

−−−

O(1 dB)

P (dBm)

4.0 13 37

−

8.5 17.5 35

−

)

ΩΩΩΩ

1.9 GHz output port matching frequency

P

G

ISL

(dB)

11.5 40

15.5 42 +1.5 15.5 41 +1.0 C3C

SYSTEM APPLICATION EXAMPLE

Location examples in digital cellular

Low Noise Tr.

RX

2.4 GHz output port matching frequency

O(1 dB)

P (dBm)

7.0 11.5 38

−

4.0

−

8.5

−

P

G

(dB)

−−−

DEMOD.

ISL

(dB)

O(1 dB)

P (dBm)

7.5 C3B

−

I

Q

Marking

C2P C2U C2V

SW

TX

PA

÷N PLL

PLL

I

0°

φ

90°

Q

These ICs can be added to your system around V parts, when you need more isolation or gain. The application herein, however, shows only examples, therefore the application can depend on your kit evaluation.

Data Sheet P14730EJ2V0DS00

3

PIN EXPLANATION

µµµµ

PC8179TB

Pin No.

Pin Name

1 INPUT

GND 0

2 3 5

4 OUTPUT voltage

Applied Voltage (V)

as same as V through external inductor

Pin Voltage

Note

(V)

−

CC

1.09

−

Function and Applications Internal Equivalent Circ ui t

Signal input pin. A internal matching circuit, configured with resisters, enables 50 Ω connection over a wide band. This pin must be coupled to signal source with capacitor for DC c ut.

Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be c onnected together with wide ground pattern to decrease impedance defference.

Signal output pin. This pin i s designed as collector output. Due to the high impedance output, this pin should be externall y equipped with LC matching circuit to next s tage. For L, a size 1005 chip inductor c an be chosen.

↓

3

1

6

4

2

5

6VCC2.4 to 3.3

Pin voltage is measured at V

Note

−

CC

Power supply pin. This pin should be externally equipped with bypass capacit or to minimize its im pedanc e.

= 3.0 V.

4

Data Sheet P14730EJ2V0DS00

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Ratings Unit

µµµµ

PC8179TB

Supply Voltage V Circuit Current I Power Dissipation P

CC

TA = +25 °C, Pin 4, Pin 6 3.6 V TA = +25 °C 15 mA

D

Mounted on double sided copper clad 50 × 50 × 1.6

mm epoxy glass PWB (T Operating Ambient Temperature T Storage Temperature T Input Power P

A

stg

in

TA = +25 °C +5 dBm

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit Remarks

Supply Voltage V

Operating Ambient Temperature T

CC

A

2.4 3.0 3.3 V The same voltage should be applied

40 +25 +85 °C

−

ELECTRICAL CHARACTERISTICS (Unless otherwise specified, T

Parameter Symbol Conditions MIN. TYP. MAX. Unit

A

= +25 °C, VCC = V

A

= +85 °C)

out

= 3.0 V, ZS = ZL = 50

270 mW

40 to +85 °C

−

55 to +150 °C

−

to pin 4 and pin 6.

, at LC matched frequency)

ΩΩΩΩ

Circuit Current I Power Gain G

CC

No signal 2.9 4.0 5.4 mA

P

f = 1.0 GHz, Pin = −30 dBm f = 1.9 GHz, P f = 2.4 GHz, P

in

= −30 dBm

in

= −30 dBm

Isolation ISL f = 1.0 GHz, Pin = −30 dBm

in

= −30 dBm

in

= −30 dBm

1 dB Gain Compression Output Power

P

o(1dB)

f = 1.9 GHz, P f = 2.4 GHz, P

f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz

Noise Figure NF f = 1.0 GHz

f = 1.9 GHz f = 2.4 GHz

Input Return Loss (Without matching circ ui t)

RL

in

f = 1.0 GHz, Pin = −30 dBm f = 1.9 GHz, P f = 2.4 GHz, P

in

= −30 dBm

in

= −30 dBm

11.0

13.0

13.0 39

37 36

0.5

−

2.0

−

3.0

−

4 4 6

13.5

15.5

15.5 44

42 41

+3.0 +1.5 +1.0

5.0

5.0 7

7 9

15.5

17.5

−

6.5

−

dB

dBm

dB

Data Sheet P14730EJ2V0DS00

5

TEST CIRCUITS

<1> f = 1.0 GHz

<2> f = 1.9 GHz

V

CC

C

3

Output port matching circuit

1

6

50 Ω

IN OUT

C

1

L

C

4

50 Ω

2

2, 3, 5

V

CC

µµµµ

PC8179TB

<3> f = 2.4 GHz

C

4

C

5

C

6

Output port matching circuit

L

6

50 Ω

IN OUT

1

C

1

C

4

50 Ω

2

C

3

2, 3, 5

V

CC

C

3

C

4

C

5

Output port matching circuit

L

6

50 Ω

IN OUT

C

1

4

1

50 Ω

C

L

2

2, 3, 5

6

Data Sheet P14730EJ2V0DS00

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

<1> f = 1.0 GHz

AMP-4

Top View

OUT

C3C

Connector

L

C

2

IN

C

1

µµµµ

PC8179TB

Connector

Mounting direction

COMPONENT LIST

1.0 GHz Output Port Matc hi ng

1

C

2

C

3

C

1

L

1 000 pF

0.75 pF 10 pF

12 nH

C

3

Data Sheet P14730EJ2V0DS00

7

<2> f = 1.9 GHz

Top View

C3C

Mounting direction

Connector

µµµµ

PC8179TB

AMP-4

L

C

2

C

IN

C

1

C

4

C

5

1

C

3

6

OUT

Connector

COMPONENT LIST

1.9 GHz Output Port Matc hi ng

C1, C3, C5, C

2

C

4

C

1

L

6

1 000 pF

0.75 pF 10 pF

3.3 nH

8

Data Sheet P14730EJ2V0DS00

<3> f = 2.4 GHz

Top View

C3C

Mounting direction

Connector

µµµµ

PC8179TB

AMP-4

L

C

L

IN

C

1

C

2

3

4

2

1

C

5

OUT

Connector

COMPONENT LIST

2.4 GHz Output Port Matc hi ng

C1, C2, C4, C

3

C

1

L

2

L

NOTES

(∗1) 42 × 35 × 0.4 mm double sided copper clad polyimide board (∗2) Solder plated on pattern (∗3) Back side: GND pattern (∗4) : Through holes

5

1 000 pF

10 pF

1.8 nH

2.7 nH

Data Sheet P14730EJ2V0DS00

9