NEC UPC8139GR-7JH-E1, UPC8139GR-7JH Datasheet

PRELIMINARY DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

µµµµ

PC8139GR-7JH

Single Chip Transceiver Silicon MMIC for PHS

DESCRIPTION

The µPC8139GR-7JH is a silicon microwave monolithic IC (SiMMIC) developed as a transceiver for Personal

Handyphone System (PHS).

This IC is a highly integrated single chip, suitable for PHS, including a quadrature modulator, up converter, and
AGC circuit for adjusting the output level in the transmitter block, a 2nd down converter and RSSI circuit in the
receiver block, and a transistor for 2nd VCO.

This low power IC employs NEC’s proprietary bipolar process NESATTM IV (fT = 20 GHz) and also has a built-in
power save function, which contributes to lowering power consumption of the RF block.

This IC is packaged in a small, thin 30 pin plastic TSSOP (225 mil).

FEATURES

• Low voltage operation, low current consumption

VCC = 2.7 to 4.0 V, ICC = 32.5 mA at transmitter, ICC = 4.8 mA at receiver, 3.2 mA/@VCC = 3 V at 2nd VCO block

• LPF is installed to suppress leakage of transmitter’s local (L01) harmonics.

Spurious within transmission band (LO1 × 7, 8): –55 dBc (MAX.)

• On-chip AGC circuit for adjusting the output level: GCR = 20 dB (MIN.) /@f

• High-performance

Output level: P
Error vector magnitude: EVM = 1.0% rms (TYP.)
Adjacent channel leak power: P
RSSI output dynamic range: 83 dB

• CR phase shifter is adopted.

RFout

= –13 dBm (TYP.) /@f

adj

= –68 dBc (TYP.) /@∆f = ±600 kHz

RFout

= 1906.55 MHz, V

RFout

I/Q

= 500 mV

= 1906.55 MHz

P-P

(Differential phase)

APPLICATION

• Digital cordless telephone: PHS

• PHS application equipment: PDA, PC card, etc.

ORDERING INFORMATION

Part Number Package Supplying Form

µ

PC8139GR-7JH-E1 30-pin plastic TSSOP (225 m i l) Embossed tape 16 mm-wide. P i n 1 is in pull-out direction. 2.5

kp/reel

Remark

Caution This product is an electrostatic sensitive device.

Document No. P13117EJ1V0DS00 (1st edition)
Date Published December 1998 N CP(K)
Printed in Japan

To order evaluation samples, contact your local NEC sales office. (Part Number for sample order:

PC8139GR-7JH)

µ

The information in this document is subject to change without notice.

©

1998

SYSTEM APPLICATION EXAMPLE

µµµµ

PC8139GR-7JH

[PHS]

243.95 MHz
or

248.45 MHz

PLL1

LPFBPFPA

SAW

PLL2

PC8139GR-7JH

µ

1895.15 to 1917.95 MHz
or

(1906.55±11.4 MHz)

MAIN ANT

PC8112

µ

LNAATT BPF

1651.2 to 1674.0 MHz
or

1646.7 to 1669.5 MHz

1662.0 to 1684.8 MHz
or

1635.9 to 1658.7 MHz

1st MIX

1st LO

SWSW

2SC5006

AGC

QUADRATURE MODULATOR IC SERIES PRODUCT LIST

Part Number Function I

PC8101GR 150-MHz quadrature

µ

modulator

PC8104GR RF up converter + IF

µ

quadrature modulator

PC8105GR 400-MHz quadrature

µ

modulator 16

PC8110GR 1-GHz direc t

µ

quadrature modulator24/@3.0 V

PC8125GR On-chip AGC function

µ

RF up converter + IF
quadrature modulator

PC8126GR

µ

On-chip local PreMIX
1-GHz direct

PC8126K

µ

PC8129GR LO × 2 frequency

µ

quadrature modulator

input type IF
quadrature modulator
+ RF up converter

PC8158K On-chip AGC function

µ

RF up converter + IF
quadrature modulator

CC

(mA)

15
/@2.7 V

28
/@3.0 V

/@3.0 V

36
/@3.0 V

35
/@3.0 V

28
/@3.0V

28
/@3.0 V

LO1in

f

(MHz)

100 to

300

MODout

f
(MHz)UpConverter

50 to

150

100 to 400 900 to 1900

100 to 400 External

800 to 1000

220 to 270

915 to 960

200 to

800

100 to

400

100 to 300 800 to 1500 CR

10.8 MHz

2nd MIX BPF

φ

2nd LO

0˚

(CR)

90˚

233.15 MHz
or

259.25 MHz

Phase

Application

Shifter

RFout

f

(MHz)

Type

External F/F CT-2, etc.

Various
Multiplier
+ F/F

digital

communica-

tions

Various
Multiplier
+ F/F

digital

communica-

tions

Direct

modulation

1800 to

2000

Direct

modulation

Multiplier
+ F/F

Multiplier
+ F/F

Multiplier
+ F/F

PDC800

MHz, etc.

PHS

PDC800

MHz, etc.

GSM,

800 to 1900 F/F

DCS1800,

etc.

PDC800

M/1.5 G

To DEMOD.

RSSI OUTRSSI

I

Q

Package

Field

20 pin
SSOP
(225 mil)

16 pin
SSOP
(225 mil)

20 pin
SSOP
(225 mil)

28 pin
QFN

20 pin
SSOP
(225 mil)

28 pin
QFN

For an outline of the quadrature modulator IC series, see the application note “Usage of µPC8101, 8104, 8105, 8125,
and 8129” (document number P13251E).

2

Preliminary Data Sheet

INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View)

µµµµ

PC8139GR-7JH

1I

2Ib

IQ Mix.

3Q

Adder

4Qb

5V

CC

1

6GND1

CC

2

7V

90˚ Phase shifter

(CR)

8VCOout

LO Buff.

9GND2

10VCO-E

11VCO-B

2nd VCO

12VCO-C

CC

3

13V

LO Buff.

14IFout

15RSSIout

Up Con.

LPF

2nd IF Amp

RSSI

AGC

2nd Mix

24

21

TX MIXout30

CC

629

V

TX MIX-LOin28

GND527

TX MIX-LOinb26

V

CC

525

VPS (TX) /V

VPS (RX)23

2nd MIXin22

2nd MIXinb

2nd MIXout20

CC

419

V

GND318

IFin217

IFin116

AGC

Note

Pin 21 was specified to function as the GND4 in the initial design sample, however in subsequent design

Note

samples and commercial products it functions as the 2nd MIXinb.

Preliminary Data Sheet

3

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

µµµµ

PC8139GR-7JH

Power supply voltage V

CC

Pins 5, 7, 12, 13, 19, 25,
29, 30

A

T

= +25°C
Power save pin voltage V
Power dissipation P

Operating ambient temperature T
Storage temperature T
Pin current of Pin 8 I
Pin current of Pin 10 I
Collector to base voltage in VCO V
Collector to emitter voltage in VCO V
Emitter to base voltage in VCO V

When mounted on 50 × 50 × 1.6 mm double sided copper clad epoxy glass board

Note

PS

D

A

stg

8 pin

10 pin

CBO

CEO

EBO

Pin 23, Pin 24, TA = +25°C 4.5 V
TA = +80°C

Note

Pin 12 → Pin 11 4.5 V
Pin 12 → Pin 10 4.5 V
Pin 10 → Pin 11 3.0 V

RECOMMENDED OPERATING RANGE

Parameter Symbol Condition MIN. TYP. MAX. Unit

Power supply voltage V

Power save pin voltage V
Operating ambient temperature T
TX up converter output frequency f
TX up converter LO input frequency f
TX up converter input frequency f
IQ-MOD output frequency f
2nd VCO oscillating frequency

(IQ-MOD LO, 2nd MIX LO input
frequency)

2nd MIX input frequency f
2nd MIX output frequency f
2nd IF amplifier input frequency f
2nd IF amplifier output frequency f
I/Q input frequency f

TX up converter LO input level P
2nd MIX input level P
2nd IF amplifier input level P
I/Q input amplitude V

CC

PS

A

TX • MIXout

TX • MIX-LOin

TX • MIXin

MODout

2ndVCO

f

MOD • LOin,

(f

2ndMIX-LOin

f

2ndMIXin

2ndMIXout

2ndIFin

2ndIFout

I/Qin

TX • MIX-LOin

2ndMIXin

2ndIFin

I/Qin

Pins 5, 7, 12, 13, 19, 25,
29, 30

Pin 23, Pin 24 0 – V

TX • MIX-LOin

P

= –10 dBm 1500 – 1800 MHz

)

I/Qin

V

= 600 mV

P-P

(MAX.),

Double phase

Double phase input
I/Q (DC) = Ib/Qb (DC) =

CC

V

/2

4.5 V

TBD mW

–30 to +80

–55 to +150

C

°

C

°

4mA
4mA

2.7 3.0 4.0 V

CC

V

–30 +25 +80 °C

1800 – 2000 MHz

220 – 270 MHz

810.812 MHz

810.812 MHz

DC – 10 MHz

–15 –10 –5 dBm
–90 – –10 dBm

23 – 108 dBµ VEMF

– 500 600 mV

P-P

4

Preliminary Data Sheet

ELECTRICAL SPECIFICATIONS (1)

µµµµ

PC8139GR-7JH

TA = +25°C, VCC = 3.0 V, unless otherwise specified, V
= VCC/2 = 1.5 V, V

I/Qin

= 500 mV

P-P

(double phase input) , f

PS-TX/VAGC

= 3.0 V, V

I/Qin

Transmission rate: 384 kbps, Filter roll-off rate : α = 0.5, MOD pattern: all zero, f

MODLOin

P

= –7 dBm, f

TX

MIX-LOin

•

= 1673.4 MHz, P

TX

MIX-LOin

•

= –10 dBm, f

PS-RX

= 3.0 V (high), I/Q (DC) = Ib/Qb (DC)

= 24 kHz, π/4DQPSK modulated wave input

MOD

LOin

= 233.15 MHz,

•

TX

MIXout

= 1906.55 MHz + f

•

I/Qin

Parameter Symbol Condition MIN. TYP. MAX. Unit
Total characteristics
Total circuit current (TX + RX +

ICC

(TOTAL)

No signal input 33 40.5 49 mA

VCO)
Transmitter block total characteristics (quadrature modulator + up converter + AGC circuit)
Total circuit current (TX) ICC
Dark current at power save (TX) I

(TX-TOTAL)

CC (PS) TX-TOTALVPS

No signal input 27 32.5 39.5 mA

≤ 0.5 V (Low), No

–0.15µA

signal input
Transmitter block (quadrature modulator + up converter + AGC circuit)
Total output level P

TX • MIXout

Local carrier leak LOL f

AGC

V

= 3.0 V –17 –13 – dBm

MODin • LOin

TX • MIX-LOin

+ f

– –40 –30 dBc
Image rejection (side-band leak) ImR – –40 –30 dBc
I/Q 3rd order inter-modulation

IM

3 (I/Q)

– –50 –30 dBc
distortion

AGC circuit gain control range GCR V

AGC

= 3 V → 1 V 20 35 – dB
Error vector magnitude (vector error) EVM MOD pattern: PN 9 – 1.0 5 %rms
Adjacent channel leak power P

adj

f = ±600 kHz,

∆

– –68 –60 dBc

MOD pattern: PN 9

Spurious within transmission band 1 Pout

(7 MOD

LO)

MOD • LOin

f

MOD • LOin

f

= 259.25 MHz

MOD • LOin

× 7, f

× 7

– –65 –55 dBc

(Image)

Spurious within transmission band 2 Pout

(8 MOD

LO)

MOD • LOin

f

MOD • LOin

f

= 233.15 MHz

MOD • LOin

× 8, f

× 8

– –65 –55 dBc

(Image)

Rise time T

response time

Fall time T

I/Q input impedance Z

PS-TX (Rise)

PS-TX (Fall)

I/Q

PS-TX

V

= 0 V → 3 V –25µsPower saving

PS-TX

V

= 3 V → 0 V –25µs

Value between Pins I/Ib and

– 180 – k

Q/Qb

I/Q input bias current I

Power save low
Power save high

Note 1

Note 2

I/Q

PS-TX (Low)

V

PS-TX (High)

V

Value of each pin when

I

V

= VIb = VQ = V

Qb

3.5 7 16

0–0.5V

0.9 – V

CC

Ω

A

µ

V

Notes 1.

2.

Power save pin applied voltage in sleep mode

Power save pin applied voltage in active mode

Preliminary Data Sheet

5

ELECTRICAL SPECIFICATIONS (2)

µµµµ

PC8139GR-7JH

TA = +25°C, VCC = 3.0 V, unless otherwise specified, VPS = 3.0 V (high), f

2ndMIX-LOin

f

2ndIFout

f

= 233.15 MHz, P

= 10.8 MHz

Parameter Symbol Condition MIN. TYP. MAX. Unit
Receiver block total characteristics
Total circuit current (RX) I

Dark current at power save I

Rise time T

response time

Power save low
Power save high

Fall time T

Note 1

Note 2

Receiver block 1 (2nd down converter)
2nd MIX conversion gain CG
1-dB compression output level P
Input 3rd order intercept point IIP3

2nd MIX noise figure NF
2nd MIX local leak 1 ISL

2nd MIX local leak 2 ISL

2ndMIX-LOin

CC (RX-TOTAL)

CC (PS-RX

TOTAL)

PS-RX (Rise)

PS-RX (Fall)

PS-RX (Low)

V

PS-RX (High)

V

1dB2ndMIX

= –7 dBm, f

2ndMIX

(2ndMIX)

2ndMIX

(2ndLO)1

(2ndLO)2

2ndMIXout

= 10.8 MHz, f

No signal input 3.5 4.8 6 mA

PS-RX

V

≤ 0.3 V (Low), No signal

input
VPS-RX = 0 V → 3 V – 2 5

VPS-RX = 3 V → 0 V – 2 5

Combining capacitance with SG 6 10 14 dB

2ndMIXin1

f

= 243.95 MHz,

2ndMIXin2

f

= 244.25 MHz

At I/O LC matching – 8 – dB
Pin 10 input –7-dBm input
Pin 10 input –7-dBm input

Note 3

Note 4

2ndMIXin

= 243.95 MHz, P

2ndIFin

= 10.8 MHz, P

2.5 – V

2ndMIXin

= –40 dBm,

2ndIFin

= –15 dBm,

–0.15µA

sPower save

µ

s

µ

0–0.3 V

CC

–93– dB
–94– dB

–52– dB
–24– dB

V

V

µ

V

µ

V

µ

V

µ

2nd MIX output resistance Z

2ndMIXout

Pin 20 – 330 –
Receiver block 2 (IF amplifier)
Limiting sensiti v ity S

2nd IF amplifier gain G
2nd IF amplifier phase shift S

2nd IF amplifier output amplitude V
2nd IF amplifier output

L

V

P

O

R

t

–3 dB point – 27 32 dBµVEM

2ndIFin

P

= 13 dBµVEMF – 80 – dB

2ndIFin

P

= 63 to 98 dBµVEMF

10 kΩ//10 pF

Note 6

Note 5

– 6 – deg

0.5 0.62 0.75 V
–1325 ns

rise time
2nd IF amplifier output

F

t

–1020 ns

fall time
2nd IF amplifier input resistance R

2nd IF amplifier input

in

in

C

Pin 16, Pin 17 – 330 –
Pin 16, Pin 17 – TBD – pF

capacitance
2nd IF amplifier output duty ratio VO (duty) – 52 – %

2nd IF amplifier output bias level VO (DC) – 1.5 – V

Notes 1.

Power save pin applied voltage in sleep mode
Power save pin applied voltage in active mode

2.

Leak to 2nd MIX output pin (Pin 20) of 2nd MIX-LO

3.

Leak to 2nd MIX input pin (Pin 22) of 2nd MIX-LO

4.

RBW of network analyzer = 3 Hz

5.

10 pF is a value including all capacitance connected to the pins (wiring pattern)

6.

Ω

F

P-P

Ω

6

Preliminary Data Sheet