The µPC8139GR-7JH is a silicon microwave monolithic IC (SiMMIC) developed as a transceiver for Personal
Handyphone System (PHS).
This IC is a highly integrated single chip, suitable for PHS, including a quadrature modulator, up converter, and
AGC circuit for adjusting the output level in the transmitter block, a 2nd down converter and RSSI circuit in the
receiver block, and a transistor for 2nd VCO.
This low power IC employs NEC’s proprietary bipolar process NESATTM IV (fT = 20 GHz) and also has a built-in
power save function, which contributes to lowering power consumption of the RF block.
This IC is packaged in a small, thin 30 pin plastic TSSOP (225 mil).
FEATURES
• Low voltage operation, low current consumption
VCC = 2.7 to 4.0 V, ICC = 32.5 mA at transmitter, ICC = 4.8 mA at receiver, 3.2 mA/@VCC = 3 V at 2nd VCO block
• LPF is installed to suppress leakage of transmitter’s local (L01) harmonics.
Spurious within transmission band (LO1 × 7, 8): –55 dBc (MAX.)
• On-chip AGC circuit for adjusting the output level: GCR = 20 dB (MIN.) /@f
• High-performance
Output level: P
Error vector magnitude: EVM = 1.0% rms (TYP.)
Adjacent channel leak power: P
RSSI output dynamic range: 83 dB
• CR phase shifter is adopted.
RFout
= –13 dBm (TYP.) /@f
adj
= –68 dBc (TYP.) /@∆f = ±600 kHz
RFout
= 1906.55 MHz, V
RFout
I/Q
= 500 mV
= 1906.55 MHz
P-P
(Differential phase)
APPLICATION
• Digital cordless telephone: PHS
• PHS application equipment: PDA, PC card, etc.
ORDERING INFORMATION
Part NumberPackageSupplying Form
µ
PC8139GR-7JH-E130-pin plastic TSSOP (225 m i l)Embossed tape 16 mm-wide. P i n 1 is in pull-out direction. 2.5
kp/reel
Remark
Caution This product is an electrostatic sensitive device.
Document No. P13117EJ1V0DS00 (1st edition)
Date Published December 1998 N CP(K)
Printed in Japan
To order evaluation samples, contact your local NEC sales office. (Part Number for sample order:
PC8139GR-7JH)
µ
The information in this document is subject to change without notice.
input type IF
quadrature modulator
+ RF up converter
PC8158KOn-chip AGC function
µ
RF up converter + IF
quadrature modulator
CC
(mA)
15
/@2.7 V
28
/@3.0 V
/@3.0 V
36
/@3.0 V
35
/@3.0 V
28
/@3.0V
28
/@3.0 V
LO1in
f
(MHz)
100 to
300
MODout
f
(MHz)UpConverter
50 to
150
100 to 400900 to 1900
100 to 400External
800 to 1000
220 to 270
915 to 960
200 to
800
100 to
400
100 to 300800 to 1500CR
10.8 MHz
2nd MIX BPF
φ
2nd LO
0˚
(CR)
90˚
233.15 MHz
or
259.25 MHz
Phase
Application
Shifter
RFout
f
(MHz)
Type
ExternalF/FCT-2, etc.
Various
Multiplier
+ F/F
digital
communica-
tions
Various
Multiplier
+ F/F
digital
communica-
tions
Direct
modulation
1800 to
2000
Direct
modulation
Multiplier
+ F/F
Multiplier
+ F/F
Multiplier
+ F/F
PDC800
MHz, etc.
PHS
PDC800
MHz, etc.
GSM,
800 to 1900F/F
DCS1800,
etc.
PDC800
M/1.5 G
To DEMOD.
RSSI OUTRSSI
I
Q
Package
Field
20 pin
SSOP
(225 mil)
16 pin
SSOP
(225 mil)
20 pin
SSOP
(225 mil)
28 pin
QFN
20 pin
SSOP
(225 mil)
28 pin
QFN
For an outline of the quadrature modulator IC series, see the application note “Usage of µPC8101, 8104, 8105, 8125,
and 8129” (document number P13251E).
2
Preliminary Data Sheet
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View)
µµµµ
PC8139GR-7JH
1I
2Ib
IQ Mix.
3Q
Adder
4Qb
5V
CC
1
6GND1
CC
2
7V
90˚ Phase shifter
(CR)
8VCOout
LO Buff.
9GND2
10VCO-E
11VCO-B
2nd VCO
12VCO-C
CC
3
13V
LO Buff.
14IFout
15RSSIout
Up Con.
LPF
2nd IF Amp
RSSI
AGC
2nd Mix
24
21
TX MIXout30
CC
629
V
TX MIX-LOin28
GND527
TX MIX-LOinb26
V
CC
525
VPS (TX) /V
VPS (RX)23
2nd MIXin22
2nd MIXinb
2nd MIXout20
CC
419
V
GND318
IFin217
IFin116
AGC
Note
Pin 21 was specified to function as the GND4 in the initial design sample, however in subsequent design
Note
samples and commercial products it functions as the 2nd MIXinb.
Preliminary Data Sheet
3
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionRatingUnit
µµµµ
PC8139GR-7JH
Power supply voltageV
CC
Pins 5, 7, 12, 13, 19, 25,
29, 30
A
T
= +25°C
Power save pin voltageV
Power dissipationP
Operating ambient temperatureT
Storage temperatureT
Pin current of Pin 8I
Pin current of Pin 10I
Collector to base voltage in VCOV
Collector to emitter voltage in VCOV
Emitter to base voltage in VCOV
When mounted on 50 × 50 × 1.6 mm double sided copper clad epoxy glass board
Power save pin voltageV
Operating ambient temperatureT
TX up converter output frequencyf
TX up converter LO input frequencyf
TX up converter input frequencyf
IQ-MOD output frequencyf
2nd VCO oscillating frequency
TX up converter LO input levelP
2nd MIX input levelP
2nd IF amplifier input levelP
I/Q input amplitudeV
CC
PS
A
TX • MIXout
TX • MIX-LOin
TX • MIXin
MODout
2ndVCO
f
MOD • LOin,
(f
2ndMIX-LOin
f
2ndMIXin
2ndMIXout
2ndIFin
2ndIFout
I/Qin
TX • MIX-LOin
2ndMIXin
2ndIFin
I/Qin
Pins 5, 7, 12, 13, 19, 25,
29, 30
Pin 23, Pin 240–V
TX • MIX-LOin
P
= –10 dBm1500–1800MHz
)
I/Qin
V
= 600 mV
P-P
(MAX.),
Double phase
Double phase input
I/Q (DC) = Ib/Qb (DC) =
CC
V
/2
4.5V
TBDmW
–30 to +80
–55 to +150
C
°
C
°
4mA
4mA
2.73.04.0V
CC
V
–30+25+80°C
1800–2000MHz
220–270MHz
810.812 MHz
810.812 MHz
DC–10MHz
–15–10–5dBm
–90––10dBm
23–108dBµ VEMF
–500600mV
P-P
4
Preliminary Data Sheet
ELECTRICAL SPECIFICATIONS (1)
µµµµ
PC8139GR-7JH
TA = +25°C, VCC = 3.0 V, unless otherwise specified, V
= VCC/2 = 1.5 V, V
I/Qin
= 500 mV
P-P
(double phase input) , f
PS-TX/VAGC
= 3.0 V, V
I/Qin
Transmission rate: 384 kbps, Filter roll-off rate : α = 0.5, MOD pattern: all zero, f
MODLOin
P
= –7 dBm, f
TX
MIX-LOin
•
= 1673.4 MHz, P
TX
MIX-LOin
•
= –10 dBm, f
PS-RX
= 3.0 V (high), I/Q (DC) = Ib/Qb (DC)
= 24 kHz, π/4DQPSK modulated wave input
MOD
LOin
= 233.15 MHz,
•
TX
MIXout
= 1906.55 MHz + f
•
I/Qin
ParameterSymbolConditionMIN.TYP.MAX.Unit
Total characteristics
Total circuit current (TX + RX +
ICC
(TOTAL)
No signal input3340.549mA
VCO)
Transmitter block total characteristics (quadrature modulator + up converter + AGC circuit)
Total circuit current (TX)ICC
Dark current at power save (TX)I
(TX-TOTAL)
CC (PS) TX-TOTALVPS
No signal input2732.539.5mA
≤ 0.5 V (Low), No
–0.15µA
signal input
Transmitter block (quadrature modulator + up converter + AGC circuit)
Total output levelP
TX • MIXout
Local carrier leakLOLf
AGC
V
= 3.0 V–17–13–dBm
MODin • LOin
TX • MIX-LOin
+ f
––40–30dBc
Image rejection (side-band leak)ImR––40–30dBc
I/Q 3rd order inter-modulation