The µPC8119T and µPC8120T are silicon monolithic integrated circuits designed as variable gain amplifier. Due to
100 MHz to 1.9 GHz operation, these ICs are suitable for RF transmitter AGC stage of digital cellular telephone. Two
types of gain control let users choose in accordance with system design. 3 V supply voltage and mini mold package
contribute to make system lower voltage, decreased space and fewer components.
The µPC8119T and µPC8120T are manufactured using NEC’s 20 GHz fT NESATTM III silicon bipolar process. This
process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external
pollution and prevent corrosion / migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Recommended operating frequency : f = 100 MHz to 1.92 GHz
• Supply voltage : VCC = 2.7 to 3.3 V
• Low current consumption: ICC = 11 mA
• Gain control voltage : V
• Two types of gain control:µPC8119T = V
• AGC control can be constructed by external control circuit.
• High-density surface mounting
AGC
= 0.6 to 2.4 V (recommended)
PC8120T = V
µ
TYP
. @ VCC = 3.0 V
AGC
up vs. Gain down (Forward control)
AGC
up vs. Gain up (Reverse control)
APPLICATIONS
• 1.9 GHz cordless telephone (PHS base-station and so on)
• 800 MHz to 900 MHz or 1.5 GHz Digital cellular telephone (PDC800M, PDC1.5G and so on)
ORDERING INFORMATION
Part NumberPackageMarkingSupplying FormGain Cont rol Type
µ
PC8119T-E3C2MForward control
µ
PC8120T-E3
Remark
Document No. P11027EJ2V0DS00 (2nd edition)
Date Published October 1998 N CP(K)
Printed in Japan
6-pin minimold
To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order:
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforat i on side of the tape.
PC8119T2.7 to 3.3110.6 to 2.4down0.1 t o 1.92+3Excellent VCC fluctuation
µ
PC8120T2.7 to 3.3110.6 to 2.4up0.1 to 1.92+3
µ
PC8130TA2.7 to 3.3110.6 to 2.4up0.8 to 1.5+5Low distortion
µ
PC8131TA2.7 to 3.3110 to 2.4down0.8 to 1.5+5Low distor tion
µ
Remark
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
AGC
(V)V
AGC
up vs.Gainf (GHz)P
O (1 dB)
Features
To know the associated product, please refer to each latest data sheet.
CC
AGC
SYSTEM APPLICATION EXAMPLE
LNA
RX
SW
µ
µ
TX
PA
PC8119T
or
PC8120T
÷NPLL
DEMO
PLL
0°
φ
90°
I
Q
I
Q
2
PIN EXPLANATION
µµµµ
PC8119T,
µµµµ
PC8120T
Pin
Pin Name
No.
1IN–1.2RF input pin. This pin should be
2
3
4OUTVoltage
5VCC2.7 to 3.3–Supply voltage pin. This pin must
6V
GND0–Ground pin. This pin should be
AGC
Applied
Voltage
V
as same
CC
as V
through
external
inductor
0 to 3.3–
Pin
Voltage
Note
V
–
Function and ApplicationsInternal Equivalent Circ ui t
coupled with capacitor (eg 1000
pF) for DC cut. This pin can be
input from 50 Ω impedance signal
source without matching circuit.
connected to system ground with
minimum inductance. Ground
pattern on the board should be
formed as wide as possible.
RF output pin. This pin is
designed as open collector of
high impedance.
This pin must be externall y
equipped with matching circ ui t s.
be externally equipped with low
pass filter (eg π type) in order to
suppress leakage from input pi n.
This pin also must be equipped
with bypass capacit or (eg 1000
pF) to minimize ground
impedance.
Gain control pin. The relation
between product number and
control performance is s hown
below;
Part No.V
PC8119T
µ
PC8120T
µ
AGC
up vs. Gain
down
up
Control
circuit
6
5
4
1
Bias
circuit
2
3
5
Control
circuit
2
3
Pin voltage is measured at V
Note
CC
= 3.0 V.
3
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionsRatingsUnit
µµµµ
PC8119T,
µµµµ
PC8120T
AGC
T
CC
TA = +25°C3.6V
TA = +25°C3.6mA
A
40 to +85°C
−
Supply VoltageV
Gain Control VoltageV
Operating Ambient
Temperature
Storage TemperatureT
Power Dissipation of
Package
stg
D
P
Mounted on double-sided copper-clad 50 × 50 × 1.6
–55 to +150°C
mm epoxy glass PWB
A
= +85°C
T
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolMIN.TYP.MAX.UnitNotice
AGC
T
AGC
CC
2.73.03.3VSame voltage should be applied to 4 and 5
pins.
TEST CIRCUIT2 (f = 1440 MHz, both products in common)
Vcc line low pass filter
C6
Pattern L
V
AGC
IN
1000 pF
1000 pF
C4
C1
1
1000 pF
6
C3
5
2, 3
4
C5
1000 pF
L2 nH
Output matching circuit
1000 pF
C2
1 pF
ILLUSTRATION OF TEST CIRCUIT2 ASSEMBLED ON EVALUATION BOARD
TYPE2
PC8119/20T
µ
C7
1000 pF
OUT
OUT
µµµµ
PC8120T
V
CC
VAGC
1
VAGC
IN
C1
IN
COMPONENT LIST
FormSymbolValue
C1, C3 to C71000 pFChip capacitor
C2
Chip inductorL
Printed on boardPat t ern L5 nH
2 nH (4.7 nH + 6.8 nH × 2 pcs parallel)
1 pF
C4
C3
Note 1
Pattern L
C4
C5
(5 nH)
C2
L
C6
C7
C7
Vcc
Note 2
GND
OUT
CC
V
(Monitor
of Vcc pin)
Notes 1.
1 pF : Murata Mfg. Co., Ltd. GR40CK010C
4.7 nH: Murata Mfg. Co., Ltd. LQP31A4N7J04
2.
6.8 nH: Murata Mfg. Co., Ltd. LQP31A6N8J04
7
µµµµ
PC8119T,
APPLICATION CIRCUIT EXAMPLE (f = 1900 MHz, both products in common)
Vcc line low pass filter
C6
Jumper wire
V
AGC
IN
1000 pF
1000 pF
C4
C1
1
1000 pF
6
C3
2, 3
C5
1000 pF
L100 nH
5
4
1000 pF
1000 pF
C2
Output matching circuit
C8
2 to 2.5 pF
C7
1000 pF
OUT
ILLUSTRATION OF APPLICATION CIRCUIT EXAMPLE ASSEMBLED ON EVALUATION BOARD
TYPE1
PC8119/20T
µ
OUT
µµµµ
PC8120T
V
CC
C1
IN
IN
COMPONENT LIST
FormSymbolValue
C1 to C71000 pFChip capacitor
C82 to 2.5 pF
Chip inductorL
Printed on boardJumper wire5 nH
100 nH
Note
C4
L
C5
VAGC
C8
C2
C6
Jumper wire
V
AGC
C7
GND
OUT
CC
V
8
100 nH: Murata Mfg. Co., Ltd. LQP31A10NG04
Note
LLUSTRATION AND EXPLANATIONS OF EVALUATION BOARD
TYPE2
PC8119/20T
µ
VAGC
1
µµµµ
PC8119T,
OUT
OUT
µµµµ
PC8120T
IN
IN
Vcc
V
AGC
V
CC
EXPLANATION
<1> This board prints the pattern inductor which inductance is as same as jumper wire in TEST CIRCUITs
(inductance: approx. 5 nH to 6 nH).
<2> Input leakage to V
type low pass filter attached to VCC pin. The filter performance depends on parallel capacitors.
<3> After adjusted low pass filter, monitor line should be removed before output matching circuit is attached.
EVALUATION BOARD CHARACTERS
(1) 35 µm thick double-sided copper clad 35 × 42 × 0.4 mm polyimide board
(2) Back side: GND pattern
(3) Solder plated patterns
(4): Through holes
ATTENTION
Test circuit or print pattern in this sheet is for testing IC characteristics.
In the case of actual system application, external circuits including print pattern and matching circuit
constant of output port should be designed in accordance with IC’s S parameters and environmental
components.
CC
pin can be monitored through ‘VCC monitor line’. This leakage can be suppressed with
Vcc monitor line
π
9
µµµµ
PC8119T,
µµµµ
PC8120T
APPLICATION for
1. TO GET MINIMUM GAIN
–1.VCC line filtering
A low pass filter must be attached to V
filter: for example π type.) This filter must be inserted between VCC pin and matching inductor. If the low
pass filter is not attached to this point, minimum output level would not go down under the leakage level.
For example, µPC8119T’s RF input leakage level to VCC shows –30 dBm at 950 MHz and –17 dBm at 1440
dBm.
type low pass filter constant example
π
Pattern L = 5 to 6 nH, C5 = C6 = 1000 pF (Refer to TEST CIRCUIT1, 2 and APPLICATION CIRCUIT
EXAMPLE)
In the case of testing on ‘µPC8119/20T TYPE2’ board, monitor the input leakage to VCC pin through ‘V
monitor line’ and adjust parallel capacitors to suppress leakage.
–2.Capacitor feed-back between V
Feed-back capacitor between V
impedance difference.
PC8119T,
µµµµ
µµµµ
PC8120T
CC
line in order to suppress RF input leakage to VCC. (The low pass
AGC
and VCC pins
AGC
and VCC pins must be externally attached in order to decrease
CC
2. TO GET MAXIMUM GAIN
–1.Output matching
As for external matching circuit, only output port should be equipped in order to get maximum gain. Output
port matching in accordance with impedance of these ICs and next stage must keep the points as follows;
<1> AC points
• IC output impedance at maximum gain must be used.
• Inductance of L must be chosen to get S22 ~ –20 dBm at maximum gain.
<2> DC point
• On LC matching, L of low DC resistance must be chosen to apply voltage as same as VCC to output
pin.
3. OTHERS
–1.Input connection
Input port does not need to match externally. These ICs can be connected to front stage through coupling
capacitor (eg 1000 pF) for DC cut.
CC
–2.V
ON/OFF while voltage applied to V
Due to internal transistor’s voltage rating, ON/OFF can be controlled with VCC voltage while 3.0 V or less is
applied to V
AGC
.
AGC
10
For the usage and application of µPC8119T and µPC8120T, please refer to the application note (Document
No. P12763E).
TYPICAL CHARACTERISTICS (TA = +25°C)
PC8119T
µµµµ
µµµµ
PC8119T,
µµµµ
PC8120T
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
14
no signals
V
cc
= V
12
10
(mA)
CC
8
out
6
4
Circuit Current I
2
0
01234
Supply Voltage VCC (V)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
18
no signals
16
V
cc
= V
out
14
(mA)
12
CC
Vcc = 3.3 V
10
8
6
Circuit Current I
4
Vcc = 2.7 V
Vcc = 3.0 V
2
0
–50–250+25+50+5+100
Operating Ambient Temperature TA (°C)
GAIN CONTROL CURRENT vs. GAIN CONTROL VOLTAGE
150
no signals
V
cc
= V
125
µ
( A)
AGC
100
75
50
25
Gain Control Current I
0
00.511.522.533.5
out
Vcc = 3.0 V
Vcc = 3.3 V
Gain Control Voltage V
Vcc = 2.7 V
AGC
(V)
CURRENT INTO OUTPUT PIN AND CURRENT INTO V
vs. GAIN CONTROL VOLTAGE