NEC UPC8002GR-E2, UPC8002GR-E1, UPC8002GR Datasheet

DATA SHEET

BIPOLAR ANALOG INTEGRATED CIRCUIT

µ

PC8002

SECOND MIXER + IF AMPLIFIER

FOR DIGITAL CORDLESS TELEPHONES

The µPC8002 is a monolithic IC developed for use in digital cordless telephones. Its internal equivalent circuits

comprise a double balanced mixer (DBM), IF amplifier circuit, and RSSI (Received Signal Strength Indicator) circuit.

µ

PC8002 can operate on a wide range of power supply voltages from 2.7 V to 5.5 V, and incorporates a power-

The
off function, making it ideal for achieving low set power consumption.

The package is a 20-pin plastic shrink SOP (225 mil) suitable for high-density surface mounting.

FEATURES

• Low-voltage, low-consumption-current operation possible (VCC = 2.7 to 5.5 V, ICC = 3.4 mA at VCC = 3 V)

• Wide mixer input frequency range (fMIX = 250 MHz (TYP.) to 500 MHz (MAX.))

• Wide IF amplifier input frequency range (fIF = 8 MHz (MIN.) to 12 MHz (MAX.), 10.7 MHz (TYP.))

• High limiting sensitivity (S

• Wide RSSI dynamic range (DR = 85 dB (TYP.))

• On-chip power-off function

• Use of 20-pin plastic shrink SOP (225 mil) allows high-density surface mounting

L = –100 dBm (TYP.))

BLOCK DIAGRAM

BYPASS1

Power ON/OFF

IF1 IN19BYPASS218IF1 OUT17BYPASS416IF2 IN15BYPASS3

20

IF Amp 1

RSSI

2nd MIXER

1 1023456789

PD

LO IN

GND(IF) GND(MIX) MIX IN2MIX IN1

ORDERING INFORMATION

Part Number Package

µ

PC8002GR 20-pin plastic shrink SOP (225 mil)

µ

PC8002GR-E1 20-pin plastic shrink SOP (225 mil)

Embossed carrier taping (pin 1 is tape unwinding direction)

µ

PC8002GR-E2 20-pin plastic shrink SOP (225 mil)

Embossed carrier taping (pin 1 is tape winding direction)

14

GND

(IF OUT)

13

IF Amp 2

RSSI

VCC

(IF OUT)

12

Output Stage

IF2 OUT

11

RSSI OUTMIX OUT VCC (IF) VCC (MIX)

The information in this document is subject to change without notice.

Document No. S10717EJ2V0DS00 (2nd edition)
Date Published March 1997 N
Printed in Japan

©

1997

Application Circuit Example 1 (Using 2 BPFs)

V

CC

PD

1

BYPASS1

20

1000 pF

µ

PC8002

BPF

(MURATA)

CFEC10.7MK1

Lo OSC

1st Mixer

V

CC

1000 pF

V

CC

1000 pF

470 pF

470 pF

µ

1 F

1 F

µ

MIX OUT

2

V

3

V

4

LO IN

5

GND (IF)

6

GND (MIX)

7

MIX IN1

8

CC

CC

(IF)

(MIX)

IF1 IN

BYPASS2

IF1 OUT

BYPASS4

IF2 IN

BYPASS3

GND (IF OUT)

19

18

17

16

15

14

13

1000 pF

0.01 F

µ

0.01 F

µ

BPF

(MURATA)

CFEC10.7MK1

470 pF

9

MIX IN2

CC

(IF OUT)

V

12

1000 pF

ADC

10

RSSI OUT

IF2 OUT

11

Caution Ensure that the pin voltage does not exceed the power supply voltage.

Remark The V

CC pass capacitors (1

µ

F, 1000 pF) should be located close to the respective VCC pins.

Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.

2

1 F

µ

V

CC

DEM

Application Circuit Example 2 (Using 1 BPF)

µ

PC8002

Lo OSC

V

CC

V

CC

1 F

1000 pF

V

CC

1 F

1000 pF

470 pF

1

2

3

PD

MIX OUT

CC

(IF)

V

BYPASS1

IF1 IN

BYPASS2

20

19

18

1000 pF

1000 pF

330 pF

µ

CC

(MIX)

V

4

IF1 OUT

17

µ

LO IN

5

GND (IF)

6

GND (MIX)

7

BYPASS4

BYPASS3

IF2 IN

16

15

14

0.01 F

µ

0.01 F

µ

BPF

(MURATA)

CFEC10.7MK1

1st Mixer

ADC

470 pF

470 pF

8

9

10

MIX IN1

MIX IN2

RSSI OUT

GND (IF OUT)

CC

(IF OUT)

V

IF2 OUT

13

12

1000 pF

11

µ

1 F

Cautions 1. Ensure that the pin voltage does not exceed the power supply voltage.

2. With this application circuit, confirm that there is not problem with interfering wave
characteristics.

Remark The V

CC pass capacitors (1

µ

F, 1000 pF) should be located close to the respective VCC pins.

Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.

V

CC

DEM

3

Application Circuit Example 3 (Using 1 BPF)

V

CC

PD

1

BYPASS1

20

1000 pF

µ

PC8002

BPF

(MURATA)

CFEC10.7MK1

Lo OSC

1st Mixer

V

CC

1000 pF

V

CC

1000 pF

470 pF

470 pF

µ

1 F

1 F

µ

MIX OUT

2

V

3

V

4

LO IN

5

GND (IF)

6

GND (MIX)

7

MIX IN1

8

CC

(IF)

CC

(MIX)

IF1 IN

BYPASS2

IF1 OUT

BYPASS4

IF2 IN

BYPASS3

GND (IF OUT)

19

18

17

16

15

14

13

1000 pF

390 Ω

µ

0.01 F

1000 pF

0.01 F

µ

V

1 F

µ

CC

ADC

470 pF

9

10

MIX IN2

RSSI OUT

CC

(IF OUT)

V

IF2 OUT

12

1000 pF

11

Cautions 1. With this application circuit, good interfering wave characteristics are obtained with a single

BPF. However, there is a drop in sensitivity.

2. Ensure that the pin voltage does not exceed the power supply voltage.

Remark The V

CC pass capacitors (1

µ

F, 1000 pF) should be located close to the respective VCC pins.

Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.

4

DEM

Application Circuit Example 4 (Using 1 BPF)

V

Lo OSC

CC

V

CC

1000 pF

V

CC

1000 pF

470 pF

1 F

µ

1 F

µ

1

2

3

4

5

PD

MIX OUT

CC

(IF)

V

V

CC

(MIX)

LO IN

BYPASS1

IF1 IN

BYPASS2

IF1 OUT

BYPASS4

20

19

18

17

16

1000 pF

1000 pF

390 Ω

µ

0.01 F

µ

PC8002

BPF

(MURATA)

CFEC10.7MK1

1000 pF

GND (IF)

1st Mixer

ADC

470 pF

470 pF

6

7

8

9

10

GND (MIX)

MIX IN1

MIX IN2

RSSI OUT

BYPASS3

GND (IF OUT)

CC

(IF OUT)

V

IF2 OUT

IF2 IN

15

14

13

12

1000 pF

11

µ

1 F

1000 pF

µ

0.01 F

V

CC

µ

1.5 H

150 pF

DEM

Cautions 1. With this application circuit, good interfering wave characteristics are obtained with a single

BPF (and sensitivity is better than in Application Circuit Example 3).

2. Ensure that the pin voltage does not exceed the power supply voltage.

Remark The V

Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) and a chip coil (MURATA LQHIN
or equivalent) should be used.

CC pass capacitors (1

µ

F, 1000 pF) should be located close to the respective VCC pins.

5

µ

PC8002

CONTENTS

1. PIN CONFIGURATION AND PIN FUNCTIONS....................................................................................7

2. INPUT/OUTPUT EQUIV ALENT CIRCUIT DIAGRAMS ........................................................................9

3. ELECTRICAL SPECIFICATIONS .......................................................................................................10

4. CHARACTERISTIC DIAGRAMS ........................................................................................................13

5. LEVEL DIAGRAMS.............................................................................................................................17

6. TEST METHODS ................................................................................................................................18

7. TEST CIRCUIT EXAMPLES ...............................................................................................................19

8. EV ALUATION BOARD MOUNTING EXAMPLE .................................................................................25

9. WIRING P A TTERN CAPACITANCE DIAGRAM (REFERENCE) ........................................................28

10. P ACKAGE DRA WINGS.......................................................................................................................29

11. RECOMMENDED SOLDERING CONDITIONS..................................................................................30

6

1. PIN CONFIGURATION AND PIN FUNCTIONS

(1) Pin Configuration (Top View)

• 20-pin plastic shrink SOP (225 mil)

µ

PC8002

PD

MIX OUT

V

CC

(IF)

CC

(MIX)

V

LO IN

GND (IF)

GND (MIX)

MIX IN1
MIX IN2

RSSI OUT

1
2
3
4
5
6
7
8
9
10

20
19
18
17
16
15
14
13
12
11

Pin Names

BYPASS1-BYPASS4 : Bypass
GND (IF) : Ground (Intermediate Frequency Amp.)
GND (IF OUT) : Ground (Intermediate Frequency Amp. Output)
GND (MIX) : Ground (Mixer)
IF1 IN, IF2 IN : Intermediate Frequency Amp. Input
IF1 OUT, IF2 OUT : Intermediate Frequency Amp. Output
LO IN : Local Input
MIX IN1, MIX IN2 : Mixer Input
MIX OUT : Mixer Output
PD : Power Down
RSSI OUT : Received Signal Strength Indicator Output

CC (IF) : Power Supply (Intermediate Frequency Amp.)

V
VCC (IF OUT) : Power Supply (Intermediate Frequency Amp. Output)
VCC (MIX) : Power Supply (Mixer)

BYPASS1
IF1 IN
BYPASS2
IF1 OUT
BYPASS4
IF2 IN
BYPASS3
GND (IF OUT)

CC

(IF OUT)

V
IF2 OUT

7

(2) Pin Functions

No. Pin Name I/O Function

1 PD I Power on/off control signal input
2 MIX OUT O Mixer output
3VCC (IF) – IF amplifier and RSSI power supply pin
4VCC (MIX) – Mixer power supply pin
5 LO IN I Local input
6 GND (IF) – IF amplifier and RSSI ground pin
7 GND (MIX) – Mixer ground pin
8 MIX IN1 I Mixer input

9 MIX IN2 I Filter capacitor connection
10 RSSI OUT O RSSI output
11 IF2 OUT O IF amplifier 2 output
12 VCC (IF OUT) – IF amplifier output stage power supply pin
13 GND (IF OUT) – IF amplifier output stage ground pin
14 BYPASS3 – Filter capacitor connection (IF2 side)
15 IF2 IN I IF amplifier 2 input
16 BYPASS4 – Filter capacitor connection (IF2 side)
17 IF1 OUT O IF amplifier 1 output
18 BYPASS2 – Filter capacitor connection (IF1 side)
19 IF1 IN I IF amplifier 1 input
20 BYPASS1 – Filter capacitor connection (IF1 side)

µ

PC8002

8

2. INPUT/OUTPUT EQUIVALENT CIRCUIT DIAGRAMS

µ

PC8002

Mixer Input

1 kΩ

Local Input

1 kΩ

1 kΩ

5

IF Amplifier 1 Input

Mixer Output

276 Ω

1 kΩ

700 A

µ

8

9

2

IF Amplifier 1 Output

207 Ω

µ

250 A

17

IF Amplifier 2 Output

19

330 Ω

18

14.9 kΩ

IF Amplifier 2 Input

15

330 Ω

14

11.8 kΩ

Power On/Off Input

1

50 kΩ

150 kΩ

330 Ω

14.9 kΩ

330 Ω

11.8 kΩ

20

16

RSSI Output

V

CC

32 kΩ

2 kΩ

290 A

µ

11

10

9

µ

PC8002

3. ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings (TA = 25 °C)

Parameter Symbol Test Condition Rating Unit
Power supply voltage VCC 7V
Total power dissipation PT TA = 85 °C 120 mW
Storage temperature Tstg –40 to +125 °C
Pin voltage VPIN VCC+0.2 V

Caution Product quality may suffer if the absolute rating is exceeded for any parameter, even momentarily.

In other words, an absolute maximum rating is a value at which the possibility of physical damage
to the product cannot be ruled out. Care must therefore be taken to ensure that the these ratings
are not exceeded during use of the product.

Recommended Operating Ratings (T

Parameter Symbol Test Condition MIN. TYP. MAX. Unit
Power supply voltage VCC 2.7 3.0 5.5 V
Operating ambient temperature TA –30 +25 +85 °C
Mixer input level VMIX 50 Ω resistance termination –98 –18 dBm

Local input level VLOC 50 Ω resistance termination –5 +5 dBm

IF amplifier input level VIF –99 –14 dBm
Mixer input frequency fMIX 250 500 MHz
Mixer output frequency fOM 8 10.7 12 MHz
IF amplifier input frequency fIF 8 10.7 12 MHz
RSSI output load capacitance COI 10
IF2 output load capacitance COR 10

A = 25 °C) 0 dBm = 223.6 mVrms (at 50 Ω)

LC matching (reference value) –107 –27

LC matching (reference value) –20 –10

Note

Note

Note Includes all capacitances (board, pattern, etc.) applied to the pin.

pF
pF

10

Electrical Specifications (TA = 25 °C, VCC = 3 V)

µ

PC8002

(1) Mixer Section (f

MIX = 250 MHz, fLOC = 239.3 MHz, VLOC = –5 dBm) 0 dBm = 223.6 mVrms (at 50 Ω)

(Where not specified in the Test Condition, input has 50 Ω termination)

Parameter Symbol Test Condition MIN. TYP. MAX. Unit
Power supply current ICCM No signal 1.7 2.2 mA
Conversion gain GC 50 Ω resistance termination 4 8 11.0 dB

LC matching (reference value) 17.0
–1 dB compression output level VOM –14 –10 –7 dBm
Third order intercept point IP3 Stipulated by output Note 1 –3 dBm
Noise factor NF 16 dB

LC matching (reference value) 7 dB
Local separation ISL Mixer non-input Note 2 40 54 dB
Mixer input impedance ZINM 31-j156 Ω
Local input impedance ZINL 31-j169 Ω
Output resistance ROM 230 330 430 Ω
Power-on rise time tONM VPO = 3 V
Power-off fall time tOFM VPO = 0 V
Power-off power supply current ILM VPO = 0 V 0 5

Note 3

Note 4

815
13

Notes 1. f1 = 250.3 MHz, f2 = 250.6 MHz

2. Leakage from local input to mixer output

3. Time until the difference between the local input pin power-on and power-off voltages reaches 90 %

Power-on input voltage (V

PO) rise time: 10 ns

4. Time until the power supply current reaches 10 % of the power-on value
Power-on input voltage (V

PO) fall time: 10 ns

µ

s

µ

s

µ

A

11

µ

PC8002

(2) IF Amplifier Section (fIF = 10.7 MHz) 0 dBm = 223.6 mVrms (at 50 Ω)

Parameter Symbol Test Condition MIN. TYP. MAX. Unit
Power supply current ICCI No signal 1.7 2.3 mA
Limiting sensitivity SL –3 dB point –100 –97 dBm
IF amplifier phase fluctuation SP VIF = –70 to –14 dBm Note 1 10 deg
IF amplifier output amplitude VO IF2 OUT, VIF = –14 dBm 0.2 0.3 0.4 Vp-p
IF amplifier output amplitude rise time
IF amplifier output amplitude fall time tF IF2 OUT, VIF = –14 dBm 15 25 ns
IF amplifier input resistance Rin IF1 IN, IF2 IN 230 330 430 Ω
IF amplifier input capacitance Cin IF1 IN, IF2 IN 3.5 6.0 pF
IF amplifier output resistance RO IF1 OUT 230 330 430 Ω
RSSI linearity LR VIF = –94 to –14 dBm ±2dB
RSSI slope SR 18 20 22 mV/dB
RSSI intercept IR –164.7 –148 –134.4 dBm
RSSI output voltage 1 VR1 VIF = –14 dBm 2.58 2.68 2.78 V
RSSI output voltage 2 VR2 VIF = –54 dBm 1.76 1.88 2.0 V
RSSI output voltage 3 VR3 VIF = –94 dBm 0.88 1.08 1.28 V
RSSI output voltage 4 VR4 No signal 0.96 1.23 V
RSSI output temperature stability ST VIF = –94 to –14 dBm Note 2 ±2dB
RSSI output dynamic range DR Note 3 80 90 dB
RSSI rise time trf1 VIF = –14 dBm Note 4 1.0 4
RSSI fall time trf2 VIF = –14 dBm Note 4 1.6 4
RSSI output ripple RR VIF = –14 dBm 20 mVp-p
RSSI output resistance ROR 25.6 32 38.4 kΩ
Power-on rise time tONI VPO = 3 V, no signal
Power-off fall time tOFI VPO = 0 V
Power-off power supply current ILI VPO = 0 V 6 10

tR IF2 OUT, VIF = –14 dBm 8 20 ns

µ
µ

Note 5

Note 6

510
13

µ
µ
µ

s
s

s
s

A

Notes 1. Network analyzer RBW = 3 Hz

A = –30 °C to +85 °C

2. T

3. Input level range for which drift from the regression expression with VIF = –94 to –14 dBm is ≤ 2 dB

4. Time until the RSSI output reaches the final value ±10 %

5. Time until the RSSI output is within ±10 % of the power-on value

Power-on input voltage (V

PO) rise time: 10 ns

6. Time until the power supply current reaches 10 % of the power-on value
Power-on input voltage (V

PO) fall time: 10 ns

(3) Power-On/Off Section

Parameter Symbol Test Condition MIN. TYP. MAX. Unit
Power-on input voltage VON Power-on at VON or above, VCC or below 1.5 2.4 V
Power-off input voltage VOF Power-off at VOF or below, GND or above 0.6 1.2 V
Power-on input current ION VPO = 3 V 40 60

12

µ

A

4. CHARACTERISTIC DIAGRAMS

(1) Power supply current vs power supply voltage (IF amplifier section)

4

3

2

[mA]

Power supply current

1

µ

PC8002

0

01234567

[V]

Power supply voltage

(2) Power supply current vs power supply voltage (Mixer section)

5

4

3

[mA]

2

Power supply current

1

0

01234567

[V]

Power supply voltage

13

(3) IF amplifier output level vs IF amplifier input level

0

_

3dB

_

10

[dBm]

_

20

IF amplifier output level

µ

PC8002

_

30

_

120

Limiting sensitivity

_

100

_

80

IF amplifier input level

_

[dBm]

(4) IF amplifier output phase vs IF amplifier input level

140

130

120

[deg]

Phase fluctuation

110

Input/output phase difference

100

_

70

_

60

Test input level range

_

50

IF amplifier input level

_

[dBm]

60

40

_

40 0

_

30

_

20

_

20

_

14

_

10

14

(5) RSSI characteristics (a)

3

2.5

2

1.5

[V]

1

RSSI output voltage

0.5

µ

PC8002

Regression line

0

_

120

Regression line

(6) RSSI characteristics (b)

5
4
3
2
1
0

[dB]

_

RSSI error

1

_

2

_

3

_

4

_

5
_

120

_

100 0

_

100 0

_

80

_

80

IF amplifier input level

_

60

[dBm]

IF amplifier input level

_

60

[dBm]

_

40

_

40

_

20

_

20

15

(7) Mixer output level vs mixer input level

µ

PC8002

0

_

10

_

20

_

30

_

40

[dBm]

_

50

Mixer output level

_

60

_

70

_

80

_

70

50 Ω resistance termination

[dBm]

_

30

_

20

_

10

_

60 0

_

50

_

40

Mixer input level

16

5. LEVEL DIAGRAMS

(1) For Application Circuit 1

µ

PC8002GR

µ

PC8002

MIXER

Note 1

+ 8 dB

Note 2

+ 17 dB

18 dBm
27 dBm

Note 1
Note 2

_
_

80 dB

98 dBm

Note 1
Note 2

_

_

107 dBm

(2) For Application Circuit 2

µ

PC8002GR

_

10 dBm

_

90 dBm

BPF

_

4 dB

_

14 dBm

80 dB

_

94 dBm

IF Amp1

+ 42 dB

_

12 dBm

_

52 dBm

BPF

_

4 dB

_

16 dBm

_

56 dBm

IF Amp2

+ 66 dB

IF OUT

0.3 V

_

6.5 dBm

p-p

MIXER

Note 1

+ 8 dB

Note 2

+ 17 dB

_

10 dBm

_

18 dBm

_

27 dBm

Note 1
Note 2

80 dB

_

98 dBm

_

107 dBm

Note 1
Note 2

_

90 dBm

Notes 1. 50 Ω resistance termination

2. LC matching (reference value)

330 pF

80 dB

IF Amp1

+ 42 dB

_

12 dBm

_

48 dBm

BPF

_

4 dB

_

16 dBm

_

52 dBm

IF Amp2

+ 66 dB

IF OUT

0.3 V

_

6.5 dBm

p-p

17

6. TEST METHODS

(1) Mixer input section

(a) With 50 Ω resistance termination (b) With 50 Ω LC matching

µ

PC8002

470 pF

MIX IN1

V

MIX

50 Ω

V

MIX

Note

C

Note

L

470 pF

Note Since the values of L and C are affected by the board’s parasitic capacitance and inductance, L and

C should be adjusted so that the impedance looking at the MIX IN pin side from the signal source is
50 Ω.

(2) Third order intercept

MIX IN1

8

MIX OUT

2

LO IN

5

88

MIX IN1

18

470 p

50 Ω

V

16.7 Ω

16.7 Ω

f1 = 250.3 MHz f2 = 250.6 MHz

MIX

16.7 Ω

82 pF

f

OSC

= 239.3 MHz

470 p

50 Ω

7. TEST CIRCUIT EXAMPLES

In test circuit example 2 onward, only the portion that differs from test circuit example 1 is shown.

Test Circuit Example 1.

µ

PC8002

VCC

VCC

VCC

50 Ω

µ

1 F

µ

1 F

82 pF

1000 pF

1000 pF

470 pF

1

2

3

4

5

6

PD

MIX OUT

CC (IF)

V

CC (MIX)

V

LO IN

GND (IF)

BYPASS1

IF1 IN

BYPASS2

IF1 OUT

BYPASS4

IF2 IN

20

19

18

17

16

15

330 pF

1000 pF

50 Ω

1000 pF

0.01 F

µ

BPF

(MURATA)

CFEC10.7MK1

50 Ω

470 pF

470 pF

10 pF

7

8

9

10

GND (MIX)

MIX IN1

MIX IN2

RSSI OUT

BYPASS3

GND (IF OUT)

CC (IF OUT)

V

IF2 OUT

14

13

12

11

1000 pF

0.01 F

µ

1 F

µ

1000 pF

10 pF

10 kΩ

VCC

Caution The 10 pF capacitor value for IF2 OUT and RSSI OUT includes all the capacitances (board,

pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not
exceeded for IF2 OUT and RSSI OUT.

Remark Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used.

19

Test Circuit Example 2. (Power supply current, power-off power supply current)

CC

(IF)

V

3

CC

(IF OUT)

V

12

V

CC

(MIX)

4

µ

PC8002

1000 pF

A

1000 pF1 F

µ

V

CC

A

µ

1000 pF1 F

V

CC

Test Circuit Example 3. (Limiting sensitivity, IF amplifier output amplitude, IF amplifier output amplitude rise

time, IF amplifier output amplitude fall time, RSSI linearity, RSSI slope, RSSI
intercept, RSSI output voltage, RSSI temperature stability, RSSI output ripple)

IF1 IN

19

330 pF

50 Ω

SG (Signal generator)

10.7 MHz

10 pF

RSSI OUT

10

Digital voltmeter

Oscilloscope

IF2 OUT

11

1000 pF

10 kΩ

10 pF

Spectrum
analyzer

Oscilloscope

Caution The 10 pF capacitor value for IF2 OUT and RSSI OUT includes all the capacitances (board,

pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not
exceeded for IF2 OUT and RSSI OUT.

20

Test Circuit Example 4. (IF amplifier phase fluctuation)

µ

PC8002

330 pF

50 Ω

IF1 IN

19

Attenuator

Network
analyzer

IF2 OUT

11

1000 pF

10 pF

10 kΩ

Caution The 10 pF capacitor value for IF2 OUT includes all the capacitance (board, pattern, etc.) applied

to the pin. Ensure that the recommended load condition (10 pF) is not exceeded.

Test Circuit Example 5. (RSSI rise time, RSSI fall time)

... Time until RSSI output is within

IF1 IN

19

IF1 OUT

17

±10 % of the final value)

IF2 IN

15

RSSI OUT

10

330 pF

50 Ω

SG

10.7 MHz, _14 dBm

Input signal from SG

1 SEC 50 SEC

Storage
oscilloscope 1

µ

330 pF

50 Ω

SG

10.7 MHz, _14 dBm

10 pF

For IF2 input

Storage
oscilloscope 2

For IF1 input

Caution The 10 pF capacitor value for RSSI OUT includes all the capacitances (board, pattern, etc) applied

to the pin.

21

Test Circuit Example 6. (Power-on rise time)

Mixer section : Time until the difference between the local input pin power-on and

power-off voltage reaches 90 %

IF section : Time until RSSI output is within

µ

±10 % of the power-on value.

PC8002

LO IN

5

RSSI OUT

10

10 pF

Storage
oscilloscope 2

0 V

PD

1

SG

Input signal from SG

3 V

1 SEC

Storage
oscilloscope 1

µ

50 SEC

Remark Power-on input voltage (VPO) rise time: 10 ns

Caution The 10 pF capacitor value for RSSI OUT includes all the capacitances (board, pattern, etc.)

applied to the pin. Ensure that the recommended load condition (10 pF) is not exceeded.

Test Circuit Example 7. (Power-off fall time)

CC

PD

1

SG

Input signal from SG

3 V

0 V

1 SEC

(IF OUT)

V

12

Storage
oscilloscope

µ

50 SEC

CC

V

V

CC

Current probe

(IF)

3

V

V

CC

CC

(MIX)

4

22

Test Circuit Example 8. (Conversion gain, –1 dB compression level)

µ

PC8002

MIX OUT

2

82 pF

50 Ω

Spectrum
analyzer

LO IN

5

470 pF

SG

239.3 MHz

Test Circuit Example 9. (Third order intercept output level)

MIX OUT

2

82 pF

50 Ω

LO IN

5

470 pF

MIX IN1

8

470 pF

See 6. TEST METHODS (1)

SG
250 MHz

MIX IN1

8

470 pF

See 6. TEST METHODS (2)

Spectrum
analyzer

Test Circuit Example 10. (Local separation)

MIX OUT

2

82 pF

Spectrum
analyzer

SG

239.3 MHz

LO IN

5

470 pF

50 Ω

SG

239.3 MHz

23

Test Circuit Example 11. (Power-on input voltage, power-off input voltage, power-on input current)

PD

1

A

V

V

CC

Test Circuit Example 12. (Noise factor)

µ

PC8002

82 pF

MIX OUT

NF meter

470 pF

50 Ω

LO IN

52 8

470 pF

Noise Source

MIX IN1

See 6. TEST METHODS (1)

24

Remark indicates a through-hole.

50 mm

VCC

C2
C3

C1

70 mm

1

PC8002

µ

8. EVALUATION BOARD MOUNTING EXAMPLE

C5

25

C4

KC-8002GR

C6

Plated wire

IF2 OUT

C7 R1

µ

PC8002

26

Remark indicates a through-hole.

IF1 IN

IF2 OUT

R2

BPF

C

8

C9

BPF

C

C11

10

MIX OUT

VCC

1

C

C
9

C10

C12

C

13

10

C11

R4

RSSI OUT

R3

LOCAL IN

L2

L1

MIX IN

µ

PC8002

µ

PC8002

C1 : 1 µF R1 : 10 kΩ
C2 : 1000 pF R2 : 50 Ω
C3 : 1000 pF R3 : 50 Ω

µ

C4 : 1
C5 : 1 µF L1 : 58 nH (reference value)
C6 : 1000 pF L2 : 10 nH (reference value)
C7 : 10 pF
C8 : 330 pF
C9 : 0.01
C10 : 0.01 µF
C11 : 470 pF
C12 : 470 pF
C13 : 10 pF

Note For the IF2 OUT and RSSI OUT capacitance values, see 9. WIRING PATTERN CAPACITANCE DIAGRAM

Remarks 1. Both L in the case of LC matching and R in the case of 50 Ω termination are connected to MIX IN.

F R4 : 50 Ω

Note

µ

F

Note

(REFERENCE).

Remove

2. Change the location of the plated wires according to the evaluation items.

3. Cut the wiring pattern to connect

in the case of LC matching, and and in the case of 50 Ω termination.

R4

L2

.

L1

L2

27

9. WIRING PATTERN CAPACITANCE DIAGRAM (REFERENCE)

The wiring pattern capacitances to ground are shown here.
For pin 11, the capacitance is 8.1 pF when the entire pattern (from pin 11 to point B) is used. In this case,

the usable probe input capacitance is 1.9 pF (MAX.).

From pin 11 up to point A, the capacitance is 1.4 pF, and therefore an 8.6 pF (MAX.) probe can be used.
For pin 10, the capacitance is 4 pF when the entire pattern is used.

µ

PC8002

Pin 11

0.9 pF 0.5 pF

Pin 10

A

IF2 OUT

3.0 pF

2.9 pF

0.8 pF
B

28

RSSI OUT

10. PACKAGE DRAWINGS

20 PIN PLASTIC SHRINK SOP (225mil)

µ

PC8002

20

110

GE

F

C

D

11

A

K

N

B

M

M

detail of lead end

P

H

I

J

L

NOTE

Each lead centerline is located within 0.10 mm (0.004 inch) of
its true position (T.P.) at maximum material condition.

ITEM MILLIMETERS INCHES

A

7.00 MAX.

B

0.575 MAX.

C

0.65 (T.P.)
D
E

F

G
H

I

J

K

L 0.5±0.2 0.020

M

P3˚ 3˚

+0.10

0.22

–0.05

0.1±0.1

1.45 MAX.

1.15±0.1

6.4±0.2

4.4±0.1

1.0±0.2

+0.10

0.15

–0.05

0.10

0.10N 0.004

+7˚
–3˚

0.276 MAX.

0.023 MAX.

0.026 (T.P.)
+0.004

0.009

–0.003

0.004±0.004

0.057 MAX.
+0.005

0.045

–0.004

0.252±0.008
+0.005

0.173

–0.004
+0.009

0.039

–0.008
+0.004

0.006

–0.002
+0.008

–0.009

0.004

+7˚
–3˚

P20GR-65-225C-1

29

11. RECOMMENDED SOLDERING CONDITIONS

The following conditions ( see table below) must be met when soldering this product.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (C10535E).
Please consult with our sales offices in case other soldering process or condition is used.

TYPE OF SURFACE MOUNT DEVICE

µ

PC8002GR

µ

PC8002

Soldering process

Infrared Ray Reflow

VPS

Partial heating
method

Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions : 25 ˚C and relative humidity at 65 % or less.

Caution Do not apply more than one soldering method at any one time, except for " Partial heating
method".

Peak package's surface temperature: 235 ˚C or below.
Reflow time : 30 seconds or below (210 ˚C or higher),
Number of reflow processes : MAX.2

Note

Exposure limit
(10 hours pre-baking is required at 125 ˚C afterwards)

Peak package's temperature: 215 ˚C or below.
Reflow time : 40 seconds or below (200 ˚C or higher),
Number of reflow processes : MAX. 2
Exposure limit
(10 hours pre-baking is required at 125 ˚C afterwards)

Terminal temperature : 300 ˚C or below,
Time : 3 seconds or below (Per side of pin position)

: 7 days

Note

: 7 days

Soldering conditions

Symbol

IR35-107-2

VP15-107-2

30

[MEMO]

µ

PC8002

31

µ

PC8002

The application circuits and their parameters are for references only and are not intended for use in actual design-in's.

No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.

32

M4 96.5