Turn-on Time
Turn-off Time
Isolation ResistanceR
Isolation CapacitanceC
*1
*1
F
F
F
R
Loff
out
FonIL
on1IF
on2IF
R
on
t
off
t
I-O
I-O
21020mA
00.5V
C)
°°°°
IF = 10 mA1.21.4V
VR = 5 V5.0
VD = 40 V0.1100nA
VD = 0 V, f = 1 MHz3.0pF
= 100 mA2.0mA
= 10 mA, IL = 10 mA9.312
= 10 mA, IL = 100 mA, t ≤ 10 ms
IF = 10 mA, VO = 5 V, PW ≥ 10 ms0.010.5ms
I-O
V
= 1.0 kV
DC
V = 0 V, f = 1 MHz0.5pF
C)
°°°°
µ
A
Ω
0.070.2
10
9
Ω
*1 Test Circuit for Switching Time
I
F
Pulse Input
Input monitormonitorV
R
in
V
L
Input
50 %
0
O
VO = 5 V
90 %
Output
R
L
t
on
10 %
t
off
4
Data Sheet P12636EJ4V0DS00
PS7200A-1A
TYPICAL CHARACTERISTICS (TA = 25
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
100
(mA)
80
F
60
40
20
Maximum Forward Current I
0
–2502550
Ambient Temperature T
A
(˚C)
75
80
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
1.6
1.4
(V)
F
IF = 50 mA
1.2
1.0
Forward Voltage V
C, unless otherwise specified)
°°°°
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
150
(mA)
L
100
50
Maximum Load Current I
100
30 mA
20 mA
10 mA
5 mA
1 mA
0
–2502550
5.0
4.0
(pF)
out
3.0
2.0
1.0
Output Capacitance C
80
75
Ambient Temperature TA (˚C)
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
f = 1 MHz
100
0.8
–2502550
A
Ambient Temperature T
(˚C)
OFF-STATE LEAKAGE CURRENT vs.
APPLIED VOLTAGE
–6
10
–7
(A)
10
Loff
–8
10
–9
10
–10
10
–11
10
Off-state Leakage Current I
–12
10
010
20
Applied Voltage VD (V)
TA = 80 ˚C
25 ˚C
30
75
100
4050
Data Sheet P12636EJ4V0DS00
10
15
2030
D
(V)
0
5
Applied Voltage V
LOAD CURRENT vs. LOAD VOLTAGE
100
(mA)
L
–2.0–1.01.02.00
Load Current I
50
–50
–100
Load Voltage VL (V)
25
IF = 10 mA
5
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
3.0
on
2.5
2.0
Normalized to 1.0
at T
A
= 25 ˚C,
F
= 10 mA,
I
I
L
= 10 mA
PS7200A-1A
ON-STATE RESISTANCE DISTRIBUTION
30
25
20
n = 50 pcs,
I
F
= 10 mA,
L
= 10 mA
I
1.5
1.0
0.5
Normalized On-state Resistance R
0.0
–2502550
Ambient Temperature T
A
(˚C)
75
TURN-ON TIME vs. FORWARD CURRENT
0.05
V
O
= 5 V
0.04
(ms)
on
0.03
0.02
Turn-on Time t
0.01
0
5
Forward Current IF (mA)
1520
2510
100
30
15
Number (pcs)
10
5
0
8.89.2
9.09.4
9.6
On-state Resistance Ron (Ω)
TURN-OFF TIME vs. FORWARD CURRENT
0.5
VO = 5 V
0.4
(ms)
off
0.3
0.2
Turn-off Time t
0.1
0
5
152030
10
Forward Current IF (mA)
25
30
25
20
15
Number (pcs)
10
5
0
6
TURN-ON TIME DISTRIBUTION
0.01
0.03
0.04
Turn-on Time ton (ms)
n = 50 pcs,
F
= 10 mA,
I
O
= 5 V
V
0.050.02
Data Sheet P12636EJ4V0DS00
TURN-OFF TIME DISTRIBUTION
30
25
20
15
Number (pcs)
10
5
0
0.06
Turn-off Time t
0.08
off
(ms)
n = 50 pcs,
I
F
= 10 mA,
O
= 5 V
V
PS7200A-1A
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
3.0
Normalized to 1.0
on
2.5
2.0
1.5
1.0
0.5
Normalized Turn-on Time t
0.0
–25
0
Ambient Temperature T
25
Remark The graphs indicate nominal characteristics.
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
50
A
(˚C)
75
100
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
3.0
Normalized to 1.0
off
2.5
2.0
1.5
1.0
0.5
Normalized Turn-off Time t
0.0
–25
0
Ambient Temperature T
25
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
50
A
(˚C)
75
100
Data Sheet P12636EJ4V0DS00
7
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
1.75±0.1
PS7200A-1A
2.4±0.1
1.55±0.1
8.0±0.1
Tape Direction
PS7200A-1A-E3PS7200A-1A-E4
Outline and Dimensions (Reel)
4.6±0.1
5.5±0.1
12.0±0.2
7.4±0.1
0.3
2.0
2.0±0.5
13.0±0.5
15˚
15˚
21.0±0.8
180
60
13.0±0.5
13.0±1.0
Packing: 900 pcs/reel
8
Data Sheet P12636EJ4V0DS00
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
1.75±0.1
PS7200A-1A
2.4±0.1
1.55±0.1
8.0±0.1
Tape Direction
PS7200A-1A-F3
Outline and Dimensions (Reel)
4.6±0.1
1
2
0
5.5±0.1
˚
12.0±0.2
0.3
PS7200A-1A-F4
7.4±0.1
1.5
2.0±0.5
1.5±0.5
6
0
˚
Packing: 3 500 pcs/reel
Data Sheet P12636EJ4V0DS00
21.0±0.8
φ
6.0±1
330
φ
80±5.0
13.0±0.5
φ
φ
12.4
+2.0
–0.0
9
PS7200A-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature235 °C (package surface temperature)
• Time of temperature higher than 210 °C30 seconds or less
• Number of reflowsTwo
• FluxRosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Package Surface Temperature T (˚C)
Time (s)
(2) Dip soldering
• Temperature260 °C or below (molten solder temperature)
• Time10 seconds or less
• Number of timesOne
• FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
10
Data Sheet P12636EJ4V0DS00
[MEMO]
PS7200A-1A
Data Sheet P12636EJ4V0DS00
11
PS7200A-1A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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