NEC NE6501077 Datasheet

PRELIMINARY DATA SHEET
NE6501077
10 W L, S-BAND POWER GaAs FET
N-CHANNEL GaAs MES FET
GaAs MES FET
DESCRIPTION
To reduce thermal resistance, the device has a PHS (Plated Heat Sink) structure.
FEATURES
• Class A operation
• High output power: 39.5 dBm (typ)
• High gain: 10.5 dB (typ)
• High power added efficiency: 40 % (typ)
• Hermetically sealed ceramic package
2.26 ±0.4
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C)
Drain to Source Voltage VDSX 15 V
Gate to Drain Voltage VGDX –18 V
Gate to Source Voltage V
Drain Current ID 9.0 A
Gate Current IG 50 mA
Total Power Dissipation P
Channel Temperature Tch 175 ˚C
Storage Temperature Tstg –65 to +175 ˚C
Temperature Cycling T –40 to +120 ˚C
C = 25 ˚C
* T
GSX –12 V
T(*) 50 W
PACKAGE DIMENSIONS (UNIT: mm)
17.5 ±0.5
14.3
1.0 ±0.1
DRAIN
8.9 ±0.4
GATE
6.35 ±0.4
4.0 MIN BOTH LEADS
1.0
SOURCE
2.5
R1.25, 2 PLACES
+0.06
0.1
–0.02
0.2 MAX.
3.8 MAX.
Caution Please handle this device at a static-free workstation, because this is an electrostatic sensitive
device.
Document No. P10978EJ1V0DS00 (1st edition) Date Published June 1996 P Printed in Japan
©
1996
MAXIMUM OPERATION RANGE
CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT Drain to Source Voltage VDS –1010V Channel Temperature Tch 130 ˚C Input Power Gcomp 3 dBcomp Gate Resistance Rg 100
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)
CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS Saturated Drain Current Idss 2.0 4.5 7.0 A Vds = 1.5 V, Vgs = 0 V Pinch-off Voltage VP –3.5 –2.0 –0.5 V Vds = 2.5 V, Ids = 30 mA Transconductance gm 2600 mS Vds = 2.5 V, Ids = 2 A Thermal Resistance Rth 3.5 4.0 ˚C/W Channel to Case
PERFORMANCE SPECIFICATIONS (TA = 25 ˚C)
NE6501077
CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION Output Power Pout 39.0 39.5 dBm f = 2.3 GHz, Vds = 10 V Gate to Source Current Igs –10 10 mA Power Added Efficiency Linear Gain GL 9.5 10.5 dB Pin 23 dBm(*)
η
add 40 %
Ids 1.0 A, Pin = 31.0 dBm Rg = 100
* The other are the same as the above conditions.
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