NEC N8 Service Manual

N8

Service Manual

(Level 3)

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Introduction

This is the Electronic Service Manual for the N8 Tri Band GSM Digital
Cellular Telephone from NEC. It contains specific information on repair and test
procedures.

For details of user functions, general operation and installation, please
refer to the User Guide.

The Service Manual is set out in the following sections.

1. Precautions for Repair Work: provides general guidelines for

undertaking safe and efficient repair work.

2. Unit Specification: provides the technical specifications for the

N8 GSM Digital Cellular Telephone.

3. Introduction of Service Level:

a) Service Level 1:describes definition of Service Level 1, equipment and

tools required for this level.

b) Service Level 2:describes definition, equipment and tools required for

Service Level 2.

4. Circuit Description: provides functional details of the circuits, block

diagrams and component purpose descriptions.

5. Servicing : defines the jigs, fixtures and test configurations required for

servicing the product; and describes the processes of assembly and

disassembly.

6. Troubleshooting : provides an aid to fault finding the product. Includes,

using the signal levels and plots at various parts of the circuit.

7. Device Information : provides functional information and pin-outs of most of

the semiconductor devices within the HHP.

8. Circuit Diagrams : contains all the schematics diagrams.

9. Board Maps : contains all component layout diagrams.

10. Parts List : provides information for the ordering of replacement parts.

11. Glossary : terms used in this manual.

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Section 1

Precautions

for Repair Work

1

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Important

Please read the following cautions, notes and warnings

before progressing through this manual or undertaking

any repair action.

Remember: SAFETY FIRST!

CAUTION:

AC Power Cord:

Care must be taken not to damage the AC power cord as fire or electric shock may
result.

Battery Pack:

Only use the specified batteries and chargers with this equipment.
Do not short the battery terminals together.
Keep the battery pack away from fire and sources of ignition.
Remember to recharge the battery pack after each use.

Before Powering up the Equipment:

• Only switch on the telephone’s power once the test or installation set-up is complete.

• Switching on at the wrong time may result in electric shock or damage to system

components.

• Always ensure that the power is switched off before making connections /

disconnection’s.

• It is important to check that the correct DC voltage is applied to the equipment to

prevent electrical damage.

Component Polarity:

Always check the polarity of connections and components before soldering. Particular

attention must be paid to IC.s, diodes, transistors, capacitors and any other
semiconductor device that is polarity dependent.

Electrostatic Damage (ESD):

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Semiconductor devices are easily damaged by electrostatic discharge. Many of the

procedures detailed in this manual involve disassembly of the equipment and therefore
handling of the printed circuit boards.

To protect these devices from ESD a wrist strap connected to ground must be worn. In

addition to this the work surface must be covered with an anti-electrostatic mat, which
should also be grounded.

If printed circuit boards are to be stored without being re-assembled into their

equipment, then they must be kept in an anti-electrostatic bag.

Grounding:

Each piece of test equipment should be electrically grounded. A third (grounding) pin is

provided as a safety feature. Ensure that the electrical outlet also contains this feature.

Cosmetic Protection during Repair Work:

Always ensure that the working surface is kept clean and free from abrasive materials.
The LCD is very susceptible to scratches and damage. It should be covered with clear

adhesive vinyl while the equipment is disassembled.

Storage of Faulty Components:

Any components that are replaced due to failure should be kept safely in an anti-

electrostatic container. NEC’s Quality or Research & Development Departments may
require them to make quality and reliability investigations.

No Fault Found Equipment:

In some cases the reported symptom may not be apparent. You may subject the

equipment to a controlled amount of stress, vibration and temperature variation to see
if the fault occurs.

Care should be taken not to apply excessive stress or vibration or extreme temperature

variations as further faults may develop.

Soldering and Disordering :

Fast, accurate and high quality soldering is required to minimise the risk of heat damage

to the electronic components.

The soldering tip should not be in contact with components or PCB tracks for longer than

2 seconds.

Heat the pad on the PCB and the lead, quickly apply solder, remove heat and cool.
After soldering is complete, ensure that all solder joints are of good quality - no dry

joints, solder bridges, cracks or excess solder.

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The majority of chip components are machine mounted using solder paste. Removal of

the solder is not sufficient for chip component removal. Each solder point must be
heated simultaneously and quickly (to prevent component and PCB damage). When the
solder has melted, remove the component with tweezers.

Short Circuits:

Care must be taken to avoid short circuits. Soldering, solder dust, screws, metal

clippings, metal wrist watches etc. can cause short circuits on PCBs which may result in
component damage.

Test Equipment Calibration:

Your test equipment should be calibrated before use. Frequent calibration is essential
to ensure high quality and reliable repairs.

Cleaning:

Before cleaning ensure that the telephone is switched off and disconnected from the

power source. Cleaning should be done using a soft dry cloth. If the equipment is
heavily soiled a soft cloth soaked in a mild synthetic detergent diluted in water may be
used.

Never use benzene or any other chemicals to clean the equipment.

RF Shielding:

It is advisable to carry out detailed measurements and repair (in particular RX) in a

shielded area to minimise RF interference.

AC Adapter and Battery Charger:

The AC adapter and battery chargers are for indoor use only. Ensure that the devices

are not exposed to rain or moisture.

Electrical Safety:

Electrical equipment is hazardous if misused. Any repairs must be carried out with care

and only by authorised personnel.

Ensure all power sources are switched off and power cords removed before undertaking

any repairs.

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Hazardous Waste:

The battery pack, if incorrectly disposed of, is an environmental hazard. It must be

disposed of in accordance with the regulations of the country concerned.

Never dispose of the battery pack in fire or water.

Confidentiality:

The circuitry within this equipment contains several components that are regarded as

company confidential. Only use NEC specified parts as replacements.

RF Injury:

To avoid RF injury, direct exposure to radio frequency energy should be avoided. In

particular, exposed parts of your body (especially the eyes and face) should not come
into contact with the antenna while the equipment is transmitting.

Storage Conditions:

It is recommended that the following storage conditions should be avoided to prevent

damage to the equipment: -

Dusty.

Humid.

Near to magnetic equipment

In direct sunlight

.

Ventilation:

Repair areas should be well ventilated and fume extraction systems should be installed

where necessary. Potential hazardous substances are solder fumes, flux, alcohol etc.

PCB Handling:

It is recommend that cotton gloves are worn during repair work. This is to protect your

hands from chemical contamination and to protect the PCBs from fingerprints and
humidity.

SIM Card:

• Do not bend.

• Clean by using a soft dry cloth.

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Section 2

Unit Specifications

2

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PRODUCT FEATURE AND SPECIFICATION

Weight Approx. 112g
Volume Approx. 93cc
Form Factor Clamshell
Active flip Yes
LCD 120 x 160 TFT 65536(16bit) colours
2nd LCD 80 x 108 4096 colours
Antenna Build in
Navigation 4 way navigation key

Design

Camera 352Hx288V resolution
Type Li-ion
Voltage 3.7V (Max4.2V Min3.2V)
Capacity 780mAH (Min), 810mAh (Typ.)
Talk time Approx. 130 - 200 min *

Battery

Standby time Approx. 100 - 200 Hours *
Band GSM 900, DCS1800, DCS1900
GPRS Class 8
Voice codec FR, HR, EFR,
Multi-party Yes

Network

ALS Yes
Ring tones 23 pre-stored, 10 download
Ring tone format MIDI
Text input T9
Browser WML/xHTML/cHTML

Application

Phone book 500 + SIM
Harmony Ringer 40 PolyphonicMulti Media
Ring tone download Yes

* Battery life is Network dependent; variations may occur.
The N8800 HHP works closely with the network and the standby and talk times achieved
depend upon this. In particular the location of the HHP within the network, the type of
SIM, reception of area messages, the use of AMR, Full Rate speech, Half Rate speech or
Enhanced Full Rate speech and other factors will affect both standby and talk times.

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Transmitting Frequency
Range:

GSM : 890 - 915MHz
EGSM : 880 - 915MHz
DCS1800 : 1710 - 1785MHz
DCS1900 : 1850 - 1910MHz

Receiving Frequency Range: GSM : 935 - 960MHz

EGSM : 925 - 960MHz
DCS1800 : 1805 - 1880MHz
DCS1900 : 1930 - 1990MHz

TX - RX Duplex Spacing: GSM/EGSM : 45MHz

DCS1800 : 95MHz
DCS1900 : 80MHz

Channel Spacing: GSM/EGSM : 200KHz

DCS1800 : 200KHz
DCS1900 : 200KHz

Number of Channels: GSM : 124 (Numbered 1 to 124)

EGSM : 50 (Numbered 975 to 1023 & 0)
DCS1800 : 374 (Numbered 512 to 885)
DCS1900 : 299 (Numbered 512 to 810)

Power Class: GSM/EGSM : Class 4 (33 +/- 2dBm)

DCS1800 : Class 1 (30 +/- 2dBm)
DCS1900 : Class 1 (30 +/- 2dBm)

Data Rates (Packet): GSM/EGSM/DCS1800/DCS1900 :

Uplink : Up to 42.8Kbps (2 slot)

Downlink : Up to 85.6Kbps (4 slots)

Data Rates
(Circuit Switch):

GSM/EGSM/DCS1800/DCS1900 : Up to 14.4 Kbps

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TRANSMITTER (EGSM)

RF Power Output

Power Levels 15, decrementing in 2dB steps

Power Control Level 5 33dBm +/-2dB
Power Control Level 6 31dBm +/-3dB
Power Control Level 7 29dBm +/-3dB
Power Control Level 8 27dBm +/-3dB
Power Control Level 9 25dBm +/-3dB
Power Control Level 10 23dBm +/-3dB
Power Control Level 11 21dBm +/-3dB
Power Control Level 12 19dBm +/-3dB
Power Control Level 13 17dBm +/-3dB
Power Control Level 14 15dBm +/-3dB
Power Control Level 15 13dBm +/-3dB
Power Control Level 16 11dBm +/-5dB
Power Control Level 17 9dBm +/-5dB
Power Control Level 18 7dBm +/-5dB
Power Control Level 19 5dBm +/-5dB

TX Frequency Output

Low Channel (Ch 975) 880.2 MHz
Mid Channel (Ch 62) 902.4 MHz
High Channel (Ch 124) 914.8 MHz

TX Frequency Calculation (Ftx)MHz

(0 - 124)
(975 - 1023)

890 + (ARFCN x 0.2)MHz
890 + 0.2x(ARFCN - 1024)MHz

Phase and Frequency Error

Peak Phase Error < 20 degrees
RMS Phase Error < 5 degrees
Frequency Stability < +/- 90Hz

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TRANSMITTER (DCS1800)

RF Power Output

Power Levels 16, decrement in 2dB steps

Power Control Level 0 30dBm +/-2dB
Power Control Level 1 28dBm +/-3dB
Power Control Level 2 26dBm +/-3dB
Power Control Level 3 24dBm +/-3dB
Power Control Level 4 22dBm +/-3dB
Power Control Level 5 20dBm +/-3dB
Power Control Level 6 18dBm +/-3dB
Power Control Level 7 16dBm +/-3dB
Power Control Level 8 14dBm +/-3dB
Power Control Level 9 12dBm +/-4dB
Power Control Level 10 10dBm +/-4dB
Power Control Level 11 8dBm +/-4dB
Power Control Level 12 6dBm +/-4dB
Power Control Level 13 4dBm +/-4dB
Power Control Level 14 2dBm +/-5dB
Power Control Level 15 0dBm +/-5dB

TX Frequency Output

Low Channel (Ch 512) 1710.2 MHz
Mid Channel (Ch 699) 1747.6 MHz
High Channel (Ch 885) 1784.8 MHz
TX Frequency Calculation (Ftx)MHz 1710.2 + 0.2 x (ARFCN - 512) = Ftx MHz

Phase and Frequency Error

Peak Phase Error < 20 degrees
RMS Phase Error < 5 degrees
Frequency Stability < +/- 180Hz

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TRANSMITTER (DCS1900)

RF Power Output

Power Levels 16, decrement in 2dB steps

Power Control Level 0 30dBm +/-2dB
Power Control Level 1 28dBm +/-3dB
Power Control Level 2 26dBm +/-3dB
Power Control Level 3 24dBm +/-3dB
Power Control Level 4 22dBm +/-3dB
Power Control Level 5 20dBm +/-3dB
Power Control Level 6 18dBm +/-3dB
Power Control Level 7 16dBm +/-3dB
Power Control Level 8 14dBm +/-3dB
Power Control Level 9 12dBm +/-4dB
Power Control Level 10 10dBm +/-4dB
Power Control Level 11 8dBm +/-4dB
Power Control Level 12 6dBm +/-4dB
Power Control Level 13 4dBm +/-4dB
Power Control Level 14 2dBm +/-5dB
Power Control Level 15 0dBm +/-5dB

TX Frequency Output

Low Channel (Ch 512) 1850.2MHz
Mid Channel (Ch 657) 1879.2MHz
High Channel (Ch 810) 1909.8MHz
TX Frequency Calculation (Ftx)MHz 1850.2 + 0.2 x (ARFCN - 512) = Ftx MHz

Phase and Frequency Error

Peak Phase Error < 20 degrees
RMS Phase Error < 5 degrees
Frequency Stability < +/- 185Hz

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RECEIVER (EGSM)

RX Frequency Input

Low Channel (Ch 975) 925.2 MHz
Mid Channel (Ch 62) 947.4 MHz
High Channel (Ch 124) 959.8 MHz
RX Frequency Calculation (Frx)MHz
(0 - 124)
(975 - 1023)

935 + (ARFCN x 0.2)MHz
935 + 0.2x(ARFCN - 1024)MHz

BER (Bit Error Ratio) Type II BER <2.4% at -102dBm

Type II BER <0.1% at -15dBm

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RECEIVER (DCS1800)

RX Frequency Input

Low Channel (Ch 512) 1805.2 MHz
Mid Channel (Ch 699) 1842.6 MHz
High Channel (Ch 885) 1879.8 MHz
RX Frequency Calculation (Frx) Ftx + 95 Mhz = F

rx

MHz

BER (Bit Error Ratio) Type II BER <2.4% at -102dBm

Type II BER <0.1% at -23dBm

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RECEIVER (DCS1900)

RX Frequency Input

Low Channel (Ch 512) 1930.2MHz
Mid Channel (Ch 657) 1959.2MHz
High Channel (Ch 810) 1989.8 MHz
RX Frequency Calculation (Frx) Ftx + 80 Mhz = F

rx

MHz

BER (Bit Error Ratio) Type II BER <2.4% at -102dBm

Type II BER <0.1% at -23dBm

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Section 3

Introduction of

Service Level

Introduction of Service Level 1
Introduction of Service Level 2

3

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INTRODUCTION OF SERVICE LEVEL 1

The dealers at service level 1 will have to do the following:

1. Attend to the subscriber’s complaint. Receive the equipment for servicing from the

customer and checking that the warranty period is valid or not.

2. Check the external appearance of the main equipment, peripheral units, and accessories.

3. Check the normal operation and performance of the main equipment, peripheral unit,

and accessories.

4. If necessary, replace detachable parts, peripheral units, and accessories that cannot

be repaired. Keep a stock of good replacement phone and accessories.

5. If necessary, explain the correct method of operation to the customer.

6. Verify any faulty reported by the end-user at 2. and 3. Above.

7. Specify the symptom and fill out the fault report.

8. Send the fault report and faulty equipment to service level 2. Ask the subscriber to

wait for the equipment to be repaired.

9. In certain cases, replace the entire main equipment.

10. Receive back the repaired equipment and carry out a final check.

11. Return the repaired and correctly functioning equipment to the end-user.

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Receive the equipment for servicing

Is warranty period valid?
If not, charge the repair fee.

Physically inspect the equipment.
Check normal operation. Try to
verify the fault.

Fill out a fault report.

If necessary, replace
any detachable
peripheral parts or
accessories. Discard
consumable
accessories.

If necessary,
explain the
correct method
of operation to

the customer.

Fault

cleared?

Adequate stock of
good replacement
peripheral parts &

accessories

Send the fault report, faulty
main unit and / or repairable

accessories to Level 2.

Tell the customer to wait the
estimated maximum down time.

Is the case

urgent?

Wait to receive repaired
equipment from level 2.

Physical inspects the equipment.
Check normal operation.

Return the equipment to the
customer.

Replace the
entire main
unit and

accessories.

Adequate stock
of good
replacement
main units and

accessories.

Flow of Service Level 1

Go to Level 2

Return From Level 2

Y

es

No

Y

es

No

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TEST EQUIPMENT AND TOOLS FOR SERVICE LEVEL 1

No GSM tester and soldering are required for Service Level 1. The following

equipment and tools are recommended for this level.

1. Fully charged battery :
Use as a power source or a temporary replacement of original battery for faulty
equipment.

2. Workable SIM card :
Use to test the performance and functions of faulty equipment.

3. Rubber :
Use to clean electronic contacts, such as battery terminals, etc.

4. AC Adapter :
Use to test the charging function of faulty equipment and / or battery.

5. Simple Handsfree Kit.
Use to test the Handsfree relevant functions of faulty equipment.

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INTRODUCTION TO SERVICE LEVEL 2

The tasks at Service Level 2 will have to :

1. Receive the fault report and faulty equipment from Service Level 1.

2. Verify the faults reported at Level 1 and check the doubtful modular sub-units.

3. Identify the faulty modular sub-unit.

4. Disassemble the equipment. Temporarily replace the faulty modular sub-unit with a
good one to see if this clears the trouble. Specify the faulty modular sub-unit in the
faulty report.

5. Send the fault report and faulty modular sub-unit together to Service Level 3. In
certain cases, replace the faulty modular sub-unit in the equipment with the good one
for quick repair.

6. Receive back the repair report, the repaired modular sub-unit from Service Level 3 and
re-install it in the equipment. Or keep this repaired modular sub-unit for next replacement,
if the faulty modular sub-unit had been replaced with a good one in step 5.

7. Perform the final test with a workable SIM card. Fill out the repair report.

8. Return the equipment to Service Level 1 with the repair report.

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Receive the fault report, faulty equipment.

Verify the faults reported at Service Level 1 and

identify the doubtful modular sub-units.

Temporarily replace the faulty modular sub-unit
with a good one to see if this clears the trouble.

Fault

cleared?

Disassemble the equipment.

Fill out the fault report. Send the fault report and

faulty modular sub-unit together to Service Level 3.

In certain cases, replace the faulty modular sub­unit in the equipment with the good one.

Receive back the repair report, the repaired modular
sub-unit from Service Level 3.

Had the faulty equipment

been replaced with a

g

ood one?

Re-install the repaired

modular sub-unit in the

equipment. Perform

final test and fill out the

repair report.

Return the equipment

to Service Level 1 with

the repair report.

Keep as buffer stock for next replacement.

No

Y

es

Go to Level 3

Return from Level 3

Flow of Service Level 2

Y

es

No

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TEST EQUIPMENT AND TOOLS FOR SERVICE LEVEL 2

No GSM tester and soldering are required for Service Level 2.
The following equipment and tools are recommended for this level :

1. All equipment and tools for Service Level 1

2. Special screw driver
Used for assembling and disassembling.

3. Data cable
Used for upgrade software.

SCREW DRIVER

Use to open and tighten the machine screw of N8800.

Screw Driver Tip NEM-J-000006-00

A special Tip with Y type head.

Variable Torque Driver NEM-J-000002-00

Used for control the torque of screws of N8800.

Y

TYPE TIP

VARIABLE TORQUE DRIVER

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PROGRAMMING CABLE

Picture

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Section 4

Circuit

Description

Structure
RF
Logic

4

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N8 STRUCTURE

The N8 HHP is a tri band GSM fold phone, which consists of two main sub-assemblies.
The Lower assembly contains the Tx, Rx & Logic circuit and an integrated antenna. Two
LCD display which house in the Upper assembly.

Front View Back View

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TRX BOARD ASSEMBLY

The lower board consists of the following circuits:­Tri band GPRS GSM Transceiver Unit
SIM connection socket
System I/O connection with charge capability
Multiple contacts battery terminals
Power supply and battery charging circuitry
Hands free jack
Full functions keypad with illumination
Ringer tone sounder
Embedded dual band antenna
IrDA compatibles infra red transceiver
USB connection to PC

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UPPER BOARD ASSEMBLY

The upper board consists of the following circuits:­Large (162x216) pixel 16bit colour LCD mounting
80x108 pixels 4096 colour sub-LCD
White backlight illumination
Ear piece connection
LED control and LCD driver circuit
Tri-colour LED provide 12 types of colours for group indication of CLI

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KEY SHEET ASSEMBLY

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INTER-CONNECTION

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RF BLOCK DIAGRAM

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RF PORTION

1. ANTENNA SWITCH AND DIPLEXER SWITCH

Antenna switch

The RF receiver 3 bands signal (GSM 925MHz – 960MHz, DCS 1805MHz – 1880 MHz
and PCS 1930MHz – 1990MHz) is input via the antenna or coaxial connector J100, The
coaxial connector has a built in mechanical switch, which is used to switch between the
antenna and auxiliary RF input. In normal status, the antenna of the HHP connected
directly to the diplexer.

L101 is employed to block the DC signal from outside. For example: static charge which
may cause harmful to the front-end amplifier or Final power amplifier.

The Diplexer of U101 splits the frequency band of signals, and the switches is used to
control all the Tx and Rx paths. This is achieved using the band selection line FEM1,
FEM2, FEM3.

The received signals passed through the band pass filters and went into receiver circuits.

External

TX from 900, 1800 &1900

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2. THE RECEIVER

The receiver employs a direct-conversion architecture. The incoming RF signals pass via
a suitable front-end filter into the balanced low-noise preamplifier. The receiver has 3
separate front-end blocks, optimized for 900MHz, 1.8GHz and 1.9GHz operation
respectively. Each front-end block has 3 discrete gain settings: normal operation, -32dB
for GSM900 (-24dB for DCS1800 and PCS1900) , and ‘maximum isolation’. These
settings allow the signal levels in the receiver to be optimized, particularly under high
signal conditions. The front-end is controlled by the state machine and several control
registers. The IC121 consists of three build in LNAs (low noise amplifier), One operate in
GSM 900MHz band and one to operate in the PCN 1800MHz & 1900MHz band. Only
one operates at a time. These two build in LNAs with external matching networks are
balanced input type. Switching between the differences band’s LNA is determined by the
programming information from Logic circuit, as well as the gain of these amplifiers. The
signal passing through these two amplifiers was directly to the mixers. IC121 used direct
conversion type receiving method. It simplified the receiver circuitry. This is followed by a
balanced buffer amplifier and a pair of Gilbert Cell mixers. The mixers convert the RF
signal directly down to baseband frequencies. The I/Q local oscillator signals for the
mixers are derived from a 3.6~4GHz RFLO, divided down by high speed BiCMOS flip­flops. The mixer is followed by the I/Q baseband lowpass filters and programmable gain
amplifiers. Each 3 stage PGA is DC coupled and has a gain range (1x0.125x0.125 up to
8x8x8). The baseband PGA has 2dB gain steps and 90dB control range. The PGA is
followed by a fixed gain amplifier (x3) to give 2.4 volt p-p (diff) output swing. The
baseband filtering is distributed in the PGA and comprises a single R/C lowpass section
and 2 second order Butterworth filters. The majority of the baseband filtering is
implemented on-chip. The baseband PGA includes a DC offset cancellation system. The
auto-calibration system uses a successive approximation technique and requires around
20usec to perform a three stage calibration to 6 bit (+ sign) accuracy. The system
calibrates out the offsets arising in both I and Q receive channels. The precision I/Q
demodulator splits the signal into its in-phase and quadrature signals. The I/Q signals
are low pass filtered and further amplified. The I/Q amplifier contains integrated DC
offset calibration circuitry. The outputs (I/Q) are fed to the ADC for further signal
processing.

In the GSM path the RF signal passes into the BPF221 900MHz band pass filter, through
a matching circuit and go into IC121 #10, 11. And for the DCS and PCS path the RF
signal passes into the BPF211,BPF201 1800MHz &1900MHz band pass filter to the
IC121#4, 5, 7 &8.
The IC121 was a highly integrated GSM transceiver circuit designed to operate in Tri­band (900MHZ 1800MHz). IC121 RF transceiver have been design in conjunction with
IC400 CSP (Code Signal Processor)(radio interface and DSP) to provide a complete GSM
transceiver function.
The operating voltage (V_RF) of IC121 is 2.75V to 3.0V, which provided by the battery
powered supply circuit on the logic portion.

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Block diagram of IC121

3. THE MICERS AND PLL SYTHESISER

The RF VCO (voltage controlled oscillator) generated the frequency for each band as:
GSM 3780-3840MHz
DCS 3610-3760MHz
PCS 3860-3980MHz

The frequency from the RF VCO was further divided to lower frequency. GSM band divide
by 4 and the PCN band divide by 2.

GSM 945-960MHz
PCN 1805-1880MHz
PCS 1930-1990MHz

It was because of direct conversion receiving, the local oscillation frequency was same as
the receiving frequency.

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4. TRANSMITTER

The IC121 generates a modulated signal at IF with a quadrature modulator and converts
it to final frequency with an Offset Phase Locked Loop (OPLL).
The Offset Phase Locked Loop is simply a PL L with a down conversion mixer in the
feedback path. Using a down converter in the feedback path acts as an up-converter in
the forward path. This allows the output frequency to be different from the comparison
frequency without affecting the normal operation of the loop. Phase/frequency changes
in the reference signal are not scaled, as they would be if a divider were used in the
feedback path, hence the modulation is faithfully reproduced at the final frequency.
The main advantage of the OPL L in this application is that it forms a tracking band pass
filter around the modulated signal. This is because the loop cannot respond to phase
variations at the reference that are outside its closed loop bandwidth. Thus the broad
band phase noise from the quadrature modulator is shaped by the frequency response
of the closed loop allowing the T X noise specification to be met without further filtering.
A secondary advantage of the OPLL is that the output signal, coming from a VCO, is truly
constant envelope. This removes the problem of spectral spreading caused by AM to AM
and AM to PM conversion in the power amplifier. The OPLL is formed from an on chip
Gilbert cell down converter, limiter and phase detector with off chip passive loop filter
and VCO. The phase detector is implemented as a Gilvert cell with current source output
stage. The current output allows an integrator to be included in the passive loop filter.
This is similar to the technique commonly used in PL L synthesizers. The closed loop
bandwidth of the OPL L should be designed to be around 1.0 ~ 1.5MHz. The bandwidth
should be large enough to allow rapid locking and accurate tracking of the modulation. If
the bandwidth is too large, the OPLL will not reject the noise from the modulator
sufficiently. The ideal bandwidth will be a compromise between these factors depending
on the noise performance of the VCO and amplifier chain. Moreover, the OPLL phase
detector current automatically changes between GSM900, DCS1800 and PCS1900
typically in the ratio 2:1:1 This can afford to use the same values for the external passive
components of loop filter in each band (GSM900, DCS1800 and PCS1900) without any
change.

IC121 includes two frequency synthesizers. The synthesizers control the RF VCO which
sets the operating channel and the fixed IF VCO. Charge-pump phase comparators are
used. The phase detector currents are programmable. The RF synthesizer has a
programmable fastlock system to reduce the acquisition time. During fastlock the phase
detector output current is increased from the normal current to the fastlock current, and
a MOS transistor connects a second resistor into the loop filter. At the end of the fastlock
period, the phase detector current reverts to the normal value and the MOS switch
opens. The fastlock period is set by a 6 bit number in the RF synthesizer reference word.
Moreover, the transition from fastlock to normal operation should occur synchronously
with the charge pump output to minimize the disturbance to the loop.
The synthesizers are programmed with 24 bit or 20 bit control words. The output current
of the phase detector is also programmed through the RF synthesizer control registers.
Therefore, the same VCO and loop filter can be used on each bands.

NEC Confidential & Proprietary

Mixer and IF

Ref 26MHz

from TCXO

880-915MHz

1710-1785MHz
1850-1910MHz

NEC Confidential & Proprietary

5. MODULATOR

The Transmitter shared the RF VCO (OSC121). When in transmission mode, the VCO
generated frequency as:

GSM 3840-3980MHz
DCS 3580-3730MHz
PCS 3860-3980MHz

These two groups of frequency will further divided by a factor of two or four. Which

help to generate the Tx frequency of GSM and PCN band.

The Tx VCO (OSC111) operated on two frequency ranges which is the GSM and

PCN bands.

GSM 880-915MHz
DCS 1710-1785MHz
PCS 1850-1910MHz

These two frequency signals feed back to the PLL circuit of IC121 to achieve the
frequency control task. These feed back signals mixed with the divided frequency signal
from RF VCO. After mixed, a low frequency signal 80MHz came out and sent to the PD
(phase discriminator) to compare with the IF from the modulator circuit.

Modulator and Tx IF

Two differentials I/Q signal. The modulator uses an indirect I/Q modulator, which suitable
for dual band operation. The series transmit IF filters allow improved wide-band noise,
which enables duplexer removal. The I/Q modulator requires no amplitude or phase
calibration to achieve high phase accuracy. It designs for easy for maintenance. The
modulator shared IF frequency (TX IF = 80MHz for GSM900 PCS1900 and DCS1800).
These IF signal will further mixed with Tx synthesiser to pull up the operation frequency to
GSM 900 band,PCS1900 band and DCS 1800 band.

26MHz

Reference

640MHz

80MHz

+pos / -neg

I / Q

NEC Confidential & Proprietary

6. POWER AMPLIFIER

TX power amplifier

A Tri band RF power amplifier (U111) is employed to this circuit. It has high-efficiency
output power 2W maximum for GSM900 band, and 1W maximum for DCS1800 band
and PCS1900 band. The power control function is also incorporated, eliminating the
need for directional couplers, detector diodes, power control ASICs and other power
control circuitry; this allows the module to be driven directly from the DAC output. The
VRAMP (TXP) is controlled the maximum power output and the power template as well as
power levels. On-board power control provides over 35dB of control range with an analog
voltage input; and, power down with a logic “low” for standby operation

The output is fed to the diplexer (U605) for sharing the antenna with Rx for duplex
operation.

Power &

Ramp control

From VCO

RF Power
O/P

TRX

VIB

HeadSet

Jack

CSP1093C

IC401

SRAM

MIC

UART1

McBSP2

ACC0

Confidential

12MHz

X'tal

26MHz

TCX

O

32K

Key Backlight

Battery

(Full duplex)

MCSI1McBSP1

EMI

NSCS0

SCLK

SDO

SDI

DIN

DOUT

BCLK

SY NC

CLKS

BCLK

DOUT

DIN

SY NC

RSY NC

CLKX

XSY NC

DOUT

CLKR

DIN

D[15:0]

A[ 23:0]

CS[4:0]

OEN

WEN

CSROMEN

CSRAMEN

TX1

RX1

CT S1

RT S1

Tx0

Rx0

audio

NSRA S

NSCA S

SADD[11:0]

SDATA[15:0]

SBANK[1:0]

NSWE

SDCLK

SDCLK_EN

NSDQML

NSDQMU

OEN

WEN

D[15:0]

A[ 24:1]

NF WP

NF RP

UART2

TX2

RX2

CT S2

RT S2

DP

DM

USB

NF CS0,2

F_RESET

IrDA

Gigacell

UART

RX

TX

AFC

NFBE[1:0]

Flash I/F

(full duplex)

32KHz

X'tal

32K_OUT

COM_CLK_OUT

AB[8:0]

AB[8:0]

DB[15:0]DB[15:0]

CLK_32K_IN

1
2
3
4
5
6
7
8
9

10

GND

D-/TXD

D+/RXD

VBUS
Power Supply

Reserved

128Mbits

4Mbits

SIM

VSIM

SIM_RST

SIM_CLK

SIM_DATA

RXAF/RTS

TXAF/CTS

RTS

CTS

AUMCLK

CKI

X1RTC

OSC32OUTXTALB

MC

ACC1

Tx1

Rx1

Hall IC

MITSUBISHI

IC651

32 voices

YAMAHA

Speaker

NFCS3

SHARP

PSC2011C SRAM

32Mbits

8Mbits

SDRAM

64Mbits

OKI

Flash ROM

Flash ROM

IC501

packet

RTC

AUBCLK

AULRCLK

AUDAT2

AUDAT1

MICIN

AOUTAP

command

GND

Manufacturer Specific

SCS

SERLE2

SELCK

SELDA

SERLE

SCLK
SDI

NSCS3

IC421

MITSUBISHI

13MHz

CPTSTSTOP/CKO

26MHz

KEY1LED

KEY2LED

VIBR

CKREF12M

NFCS1

YGYG

12MHz

uwire

IO03

DODICLK

CE

Temp.sensor

ADIN1

LCD

65Kcolors 162x216

EPSON

Emblem

7 colors

LCD Backlight

A[2:1]

ROHM

XA0

SD[15:0]

XCS1

XWR

LCD Backlight

cont.

Camera

Papaya

D[15:0]

OEB

WEB

SUB-LCD

4,096colors 80x108

OPTREX

CSB

XCS2

SDA

SDC

CAMD[7:0]

CAMHS

CAMVS

CAMCKI

CIF(352Hx288V)

PWM1
PWM2
PWM3

PWM0

HITACHI

12MHz

X'tal

REC

R-side

R-side

Key
matrix

26 keys

R-side

KBR_[4:0]

KBC_[5:0]

UP

DOWN

Power

KEY

IO05

12MHz

4MHz

SDRAM I/F

NEC Confidential & Proprietary

LOGIC PORTION

The circuit comprises the following main functional blocks:

 Helen 1 IC401
 Papaya IC852
 Hawk IC501
 PSC2011C
 Trident 2 IC301
 CSP1093C IC351
 Warbler 2
 Charge
 Keypad

These are described in more detail below.

HELEN 1 IC401

The Helen 1 is a single chips microprocessor that consists of ARM 9 core, Flash
ROM I/O, SDRAM I/O, and USB I/O. It operates at 90MHz which is multiplied the 12MHz
crystal from external. The core works in the voltage of 1.5V from V29 of Hawk. V21,

2.85V and VUSB, 3.3V from Hawk supply power to the I/O and USB of Helen 1
respectively.

The Helen 1 performs the following functions :

 Main CPU and Application CPU functions
 Control Papaya to perform all the display and image functions
 Infra Red data interface
 Keypad interface

PAPAYA IC852

Papaya is located at upper board. It is a camera and LCD control IC. An
independent 12MHz crystal provides the operating system clock and an independent
regulator supplies a stable 2.5V to the logic core. The power supply of I/O is 2.85V
supplied by V28 of Hawk.

The Papaya performs the following functions :

 Camera control interface
 Images capture control
 LCD control interface
 LCD backlight control
 7 colors emblem control
 Accept commands from Helen 1

NEC Confidential & Proprietary

HAWK IC501

Hawk is a power supply and peripherals interface IC. It performs most of the
power supply requirements of the application portion of HHP. The device consists of 11
voltage regulators and is supplied directly from battery. There is a Voltage detector inside
Hawk to monitor the Voltage of battery. If the voltage of the battery is lower than 2.9V. A
reset signal will be sent from Hawk to Helen 1, and all the internal regulators will be
turned off as well. Then the HHP is going to power off automatically.

The Hawk performs the following functions :
 Supply power for the application portion

Hawk provides the following outputs :

V21 2.85V : supply for Peripherals, Flash I/O and Com I/O of Helen 1,

Flash ROM, MA-3D (Melody IC) and Hall IC (Fold detect IC).

V25 1.85V : supply for SDRAM I/O of Helen 1 and SDRAM.

V28 2.85V : supply for Main LCD, SUB LCD, Warbler 2, Camera and

Papaya

V29 1.5V : supply for Core of Helen 1

V33 2.85V : supply for IrDA

MICBIAS 2.2V : Supply for the bias of microphone

JACKBIAS 2.2V : Supply for Simple handsfree Jack

V43 2.9V : supply for audio amplifiers

VIBD 3.0V : supply for Vibrator

VUSB 3.3V : supply for USB I/O of Helen 1

 Receiver amplifier
 Microphone amplifier
 Melody ring tune amplifier
 Key backlight control
 Vibrator control
 Battery charge and management
 Back up Battery charge
 Real time clock
 Fold detection via Hall IC
 Head set interface

NEC Confidential & Proprietary

PSC2011C

The PSC2011C is another power supply device for communication portion of logic
and RF circuitry , which consists of seven Low Drop Out (LDO) and is supplied directly
from battery.

The power function of PSC2011C is as follows :

Output voltage Current Limits

Source name

Typ(v) min(mA)

Output to

VLDO 1 (LDO_1) 1.800

±3%

100 Trident 2 (core)

VLDO 2 (LDO_2) 2.85

±3%

160

Trident 2 (I/O),
CSP1093C (digital),
Flash ROM

VLDO 3 (LDO_3) 2.85

±3%

160 RF

VLDO 4 (LDO_4) 2.85

±3%

85 TXBUF

VLDO 5 (LDO_5) 2.85

±3%

85 TCXO

VLDO 6 (LDO_6) 2.85

±3%

85 CSP1093C (analog)

VLDO 7 (LDO_7) 2.85

±3%

35 No use

VRTC 2.85

±3%

3 Trident 2 RTC

VSIM 3.0

±0.2v

40(max) SIM

The PSC2011C provides the following functionality :

 Seven low-dropout (LDO) regulators
 3V SIM power supply and logic level shifters
 Three-wire serial interface unit

NEC Confidential & Proprietary

TRIDENT 2 IC301

The Trident 2 is a single chip that consists of an ARM7TDMI baseband CPU, a DSP
16000 core and internal ROM and RAM. It is designed for wireless terminals. The CPU is
a 32-bit processor, operates from the 26MHz small signal system clock which is obtained
by double the frequency of 13MHz from TRX portion.

Trident2 performs the following functions :

 Communication protocol of GSM
 Interface for data to / from Helen 1
 Signal coding / decoding
 Data interleaving / de interleaving
 Error detection / correction

20

DMA

CONTROLLER

PERIPHERAL

BRIDGE

PIC

ROM

ICE,

JTAG

EMIGPRS

TIMERS

SIMCARD

KEYBOARD
INTERFACE

SMARTCARD0

TIC

RESET,APLL,

POWERDOWN

RTC

A/D

ACC1

ACC0

SSI

PPI

ICP/PDP

DUAL-PORT RAM

512

×16

EMI

RAM

ROM

SWPATCH

JTAG,HDS

BIO

TIME

R

DPLL

POWER

T_REQA,
T_REQB

RESET

RAM

ARM7TDMI CORE

(IACK) (VEC[4:0])

SMALL-

SIGNALB

UFFER

POWE

R

UP

RESET

DSP16000 CORE

IDB

XYB

T_ACK,
TICMODE

(PLLTOA)

(CKO)

RSTB

CKI1

DB[15:0]

PA[36:0]

(MI)

(MO)

(SCLK)

(IRDATx)

A

B[8:0],RWN,

Rx0

(IM0)
(IOM1)
(IOM0)

(OM0)
(OM1)

(IRDARx)

(Tx1)

X1RTC
/CKI

32X

OSC32

(Rx1)

X2RTC

BSWN

(RTC

ALARM

)

(AG[3:0])

(V

REF

)

IOBIT1

TDO

TDI,TCK,
TMS,TRST

DINTR

A

[21:0],BE[1:0],OEN,
WEN,CSROME N,
CS[5:0]N,CSRAMEN

D[15:0]
(WAITN),BOOTSEL

(DRQ0/CKO)

(DRQ1)

IRQ[6:1]

EMULATION[71],
(TRACE[10])

TDI

CP

,TCK

CP

,

TMS

CP

,TRSTN

CP

(PWM1)

(PWM2)

(PWM3)

SIM_CLK

SIM_DATA

(KEYBOARD[9:0])

(APB)

(ASB)

9

22

GSM MEMORY
(FlashROM,StaticRA M)

JTAG

JTAG

To or from
Each block

TRX

OSC

13MHz

A

FC_SW

IOBIT2

TP

DPRAM

A

[22:1],MWRB,RDZ,
BENZ[1:0],CS[11:0]
D[15:0]

PHEASANT

I/O

TDO

CP

15

21

23

from GSM DPRAM

CSP1093C

Tritent2 Block Diagram

NEC Confidential & Proprietary

AOUTAP
AOUTAN

(+30dB)

CSP1093

0

1

AUDIS

16bit

ADC

GAIN

CONTROL

16bit

DAC

0

1

AUDIG

6dB(0) or
16dB(1)

AUDOG[3:0]
0dB `-45dB
(3dB step)

AOUTBP
AOUTBN

100K

AUDCHR

1=Exit capacitor charge

VCM

AUDIE?1=input section power up

MUTE

AUDOM

0=MUTE

VOICE INPUT VOICE OUTPUT

AUDOE F1=output section power up

DITHER

AUDITH

0=DITHER

Audio

PGA

AUDPGA[2:0]

impedance

15¤25¤30

DIGITAL AUDIO

INTERFACE

POWER AMP DAC

TRANSMIT

BUFFER(

160bits

)

GSM STANDARD

GMSK MODULATOR

9-bit DAC

AND PGA

9-bit DAC

AND PGA

A5.1/A5.2

32-word

BUFFER

11-bit AD

C

11-bit AD

C

PGA

PGA

AAF

AAF

TIMING AND CONTROL

REGISTERS

EXTERNAL

CONTROL

SERIAL
OUTPUT

CLOCK

RATE

SELECT

1/4-bit
COUNTER

FRAME

COUNTER

PLL

SLEEP

MODE LOGIC

JTAG

AUXOUT

MICOUT

MICIN

VREG

AUXIN

22ƒ Ê

INTERFACE

AB[8:0]

DB[15:0]

R/W

I/O

INT

‡

TRIDENT

OCTL

*

12

CSP1093C

The CSP1093C is a analog BaseBand IC for GSM. It integrates the timing and
control function for GSM 2+ mobile application with the ADC and DAC function. The
CSP1093C interface to the DSP portion of Trident2 via a 16-bit interface. It service as the
interface that connects the DSP to the RF circuitry in the GSM part of e606

CSP1093C performs the following GSM functions :

 Tx I and TX Q output to Tx modulator
 Rx I and Rx Q input from Rx demodulator
 RF LNA ON / OFF control
 Rx AFC control
 TRx ON / OFF control
 Tx burst and power control
 A/D and D/A conversion for voiceband and baseband signal
 GMSK modulation / demodulation

CSP1093C Block Diagram

NEC Confidential & Proprietary

WARBLER 2 IC421

The Warbler 2 is a bus converter. It converts the serial bus from Helen 1 to
parallel bus for Trident 2, and also converts the parallel bus from Trident 2 to serial bus
for Helen 1. The power supply for Warbler 2 is 2.85V which is supplied by V28 of Hawk.
Warbler 2 operates in 26MHz which comes from Trident 2.

CHARGE

The main charging circuit is incorporated inside Hawk. Below shows the
equivalent block diagram :

Charging Equivalent Block Diagram

NEC Confidential & Proprietary

Charger

Phoenix uses two types of chargers shown as below :

AC Adapter :

5.3V at 600mA, 6.0V at no load

Ciger Lighter Adapter :

720mA +/-40mA.

Battery Pack

Only one type of battery pack is used for N8. The pack contains Li-ion cells, a
protection circuit that protects the cell, and a thermistor that checks the temperature
inside the battery pack. One end of the thermistor is connected to “-“ terminal of battery
pack and the other connected to TBAT of Hawk.

Thermistor

The thermistor is a component to detect the temperature for temporarily
interrupting the charge or moving the quick charge mode to trickle mode if the
temperature is out of the temperature range specification. The thermistor has a Negative
Temperature Coefficient characteristic. The resistance value decrease if the temperature

increase. The thermistor using in N8 has a resistance value of 10KΩ at temperature
25°C.

Fuse

A 1.25A fuse is inserted on the current path to protect over-current during
charging.

Diode

A diode is used for prevent the reverse direction current flowing from HHP to
charger.

Charging Control FET

Charging control switch uses Dual FET made by Vishay, Si3905DV. This FET is
controlled to obtain a constant current in CC charge state and a constant voltage in CV
charge state.

Current Control Resister

Fixed resistance of 1.3Ω parallel with 1.5Ω works as a program resistor to select
a charge current value in the CC charge state. Where 1.3//1.5=0.7Ω, it takes 600mA.

This resistance has the rating value of 1/4W.

Battery Charging

No charging current flow is output from Hawk. For this propose, two charge
control signal are prepared to turn FET On/Off for charge control as described below

a). VCHG

Power supply pin from charger. This pin supplies the power to Hawk internal
charging circuitry. It also monitors Charger voltage, and judges over voltage, if 6.5V or
more is detected, and charge will be stopped.

NEC Confidential & Proprietary

b) ISENSE

Charging current monitor pin. Because the voltage of ISENSE is according

to the voltage drop of resistors 1.3Ω and 1.5Ω in parallel. Monitoring the ISENSE
voltage can monitor the charging current.

c) CHG

Charge control pin : Hawk controls the conductivity of FET Via this pin in

order to maintain the constant charging current to 600mA.

d) CHG2

Charge On/Off control pin : If charger voltage on VCHG within normal

range, set CHG2 to logic low to turn on FET.

e) VMONI

Charge voltage monitor pin : To monitor the voltage of battery being

charging.

f) TBAT

Battery pack temperature monitor pin : The battery pack includes an
internal thermister, which is used to produce an analogue signal. TBAT enable the HHP
and external charger to determine the battery temperature, which is used to protect the
battery from overheating while charging

g) GCHG

GND pin of charge control circuit.

h) CHGINT

When charge control circuit state moves, an interrupt signal (high pulse)
generates at this pin. Notified to CPU.

NEC Confidential & Proprietary

KEY SWITCH

The key switch are the metal domes which make contact between two concentric
pads when pressed. There are 24 switches (SW901 – SW24), connected in a matrix of 5
rows by 5 columns, as shown in figure below, except for the power switch (SW924) which
is connected independently.

NEC Confidential & Proprietary

VOLUME KEY

The Volume key is located on the upper board. It consists two metal domes and
connected in a matrix of 2 X 1 as shown below.

NEC Confidential & Proprietary

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Main Menu

Section 5

Servicing

Tools, Cables, Jigs and Fixtures
Accessories
Exploded Diagram
Assembly
Disassembly

5

NEC Confidential & Proprietary

TOOLS, CABLES, JIGS AND FIXTURES

SCREW DRIVER

Used to open and tighten the machine screw of N8.

Screw Driver Tip NEM-J-000006-00

A special Tip with Y type head.

Variable Torque Driver NEM-J-000002-00

Used for control the torque of screws of N8.

Y

TYPE TIP

VARIABLE TORQUE DRIVER

NEC Confidential & Proprietary

DATA CABLE

NEC Confidential & Proprietary

ACCESSORIES

BATTERY

MAY-BD0009-A002

Norminal Voltage : 3.8V (4.2Vmaximum to 3.2Vminimum)
Capacity : 710mAHr minimum.

AC ADAPTER

Input: 110V-240V~ 50/60Hz 0.12A

NEC Confidential & Proprietary

Output: 5.3V DC 0.6A

POWER CORD

UK type Europe type PRC type

CIGER LIGHT ADAPTER

Input Voltage 12V-24V
2A fused

NEC Confidential & Proprietary

SIMPLE HANDSFREE

DESKTOP CHARGER

Input 5.3V 0.51A
Two charge slots

NEC Confidential & Proprietary

ASSEMBLY

INSIDE REAR COVER(M)

1. Speaker

VERTICALLY LOWER SPEAKER INTO THE RECESS AT REAR COVER(M) UNTIL IT IS

CLIPED INTO PLACE

SPEAKER

REAR COVER(M)

SPEAKER

ANTENNA

VIBRATOR

COVER (H/J)

PACKING(RM)

WATER SENSITIVE LABEL
15T-000544Y

WATER SENSITIVE LABEL

15T-000970

COVER (I/O)

REAR COVER (M)
15Y-001057-XX

15Y-001065

15Y-001006

15Y-000827

NEC Confidential & Proprietary

2. Vibrator

Step 1

OPEN VIBRATOR HOLDER AT SPLIT AND INSERT VIBRATOR

Step 2

INSERT VIBRATOR ASSY INTO RECESS AT REAR COVER(M)

REAR COVER(M)

VOBRATOR ASSY

VIBRATOR

HOLDER(V))

NEC Confidential & Proprietary

3. Antenna

cSILDE ENGAGE CLIP 1 INTO REAR COVER(M)

dLOWER THE OTHER SIDE UNTIL ENGAGE CLIP 2 IS CLIPED INTO THE

APERTURES OF REAR COVER(M)

ANT UNIT REAR COVER(M)

NEC Confidential & Proprietary

4. Water Sensitive Label

STICK WATER SENSITIVE LABELS 15T-000544Y AND 15T-00097 INTO AREAS OF

REAR COVER(M) AS THE FIGURE SHOWN BELOW

5. Packing(MR)

INSERT PACKING(MR) INTO THE RECESS OF REAR COVER(M)

WATER SENSIVIVE LABEL
15T-000544Y

WATER SENSIVIVE LABEL
15T-000970

REAR COVER(M)

PACKING(MR)

NEC Confidential & Proprietary

6. Cover(H/J)

INSERT COVER (H/J) INTO REAR COVER(M).SLOT. NOTE WHICH PART GOES

INSIDE AND OUTSIDE COVER.

7. Cover(I/O)

INSERT COVER(I/O) INTO THE SLOT IN REAR COVER(M)

REAR COVER(M)

Cover(H/J)

REAR COVER(M)

REAR COVER(M)

NEC Confidential & Proprietary

INSIDE REAR COVER (R)

1. Water Sensitive Label

STICK TWO WATER SENSITIVE LABELS TO THE AREAS AS THE FIGURE SHOWN

2. Cushion(BATT)

FIT CUSHION(BATT) INTO THE RECESS AT REAR COVER(R)

WATER SENSITIVE LABEL

15T-000544Y

REAR COVER(R)

CUSHION(BATT)

REAR COVER(R)

NEC Confidential & Proprietary

3. Lens(LED)

INSERT LENS(LED) INTO THE APERTURE OF REAR COVER(R). MAKE SURE THE

TWO POSITION PINS SHOULD GO THROUGH THE APERTURES OF LENS.

LENS(LED)

POSITION PIN

NEC Confidential & Proprietary

FRONT COVER ASSEMBLY

1. Hinge Unit

Step 1

BRING FRONT COVER(R) AND FRONT COVER(M) TOGETHER AND LINE THEM UP

Step 2

INSERT HINGE UNITS PUSH FIRMLY ONTO EACH UNIT TO ENGAGE THE CLIPS.

2. Cushion(L)

STICK CUSHION(L) OVER THE APERTURE AT FRONT COVER(R), LINE UP WITH THE

EDGE OF THE APERTURE

CUSHION(L)

HINGE UNIT

FRONT COVER(R)

HINGE UNIT

FRONT COVER(M)

FRONT COVER(R)

NEC Confidential & Proprietary

3. Tape(RF) and Sheet(F)

STICK TAPE(RF) AND SHEET(F) TO THE AREAS AS THE FIGURE SHOWN BELOW

4. Magnet

FIT DOUBLE FACE(MG) TAPE INTO RECESS IN REAR COVER

THEN FIT MAGNET ONTO TAPE

TAPE(RF)

SHEET(F)

NEC Confidential & Proprietary

5. Water Sensitive Label

STICK TWO WATER SENSITIVE LABELS TO THE AREAS AS THE FIGURE SHOWN

WATER SENSITIVE LABEL

15T-000544Y

FRONT COVER(M)

NEC Confidential & Proprietary

6. Packing(MF)

PLACE THE PACKING(MF) IN THE AREA AT FRONT CASE(M) AS FIGURE SHOWN

BELOW

7. Lenz(IR)

INSERT LENZ(IR) INTO SLOT AT FRONT COVER(M)

NEC Confidential & Proprietary

8. Key Sheet Assy

LOWER KEY SHEET ASSY INTO FRONT COVER(M)

NEC Confidential & Proprietary

LOWER ASSEMBLY

1. Metal Dome Sheet

FIT METALDOME SHEET ONTO KEY BOARD ASSY ALIGN WITH POSITIONING

HOLES. PRESS AND FIX TO ADHESIVE

NOTE : A SPECIAL TOOL IS REQUIRED

2. Sheet(key)

STICK SHEET(KEY) ONTO THE KEY BOARD AS FIGURE SHOWN

METAL DOME SHEET

KEY BOAR

NEC Confidential & Proprietary

3. Mic

INSERT MIC UNIT THE APERTURE OF KEY FRAME ASSY.

4. Key Frame

LOWER KEY FRAME ONTO THE KEY BOARD AND CLIP INTO PLACE

NEC Confidential & Proprietary

5. Lower board and upper board connection

Step 1

TAKE UPPER PCB AND INSERT THE SHORT FPC FULLY INTO THE CONNECTOR AT

LOWER BOARD, THEN CLOSE LOCKING TAB

Step 2

INSERT THE LONG FPC FULLY INTO CONNECTOR, THEN CLOSE THE LOCKING TAB

NEC Confidential & Proprietary

6. Key frame assembly

Step 1

CONNECTE KEY SHEET ASSEMBLY TO THE LOWER BOARD BY FPC AND THEN

FOLD THE KEY SHEET ASSEMBLY OVER LOWER BOARD AS SHOWN BELOW

Step 2

c. CLIP ONE SIDE OF LOWER BOARD ONTO THE KEY FRAME AS SHOWN IN THE

FIGURE

d. LOWER AND CLIP ANOTHER SIDE

NEC Confidential & Proprietary

CORE ASSEMBLY

1. Lower and Upper Assembly

Step 1

FOLD LOWER AND UPPER ASSEMBLY AS SHOWN TO PRODUCE A LOOP IN THE

FPC’S. THE LOOP MUST BE ON LCD AND KEYPAD SIDES AND BOARDS MUST BE

IN LINE.

IF THEY ARE NOT THEN YOU HAVE PROBABLY FOLDED THE WRONG WAY

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Step 2

LOWER UPPER AND LOWER ASSEMBLY INTO FRONT COVER ASSEMBLY

Step 3

FIT AND TIGHTEN MACHINE SCREW

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2. Rear cover(M)

c. FIT RETAINING TAB OF REAR COVER(M) INTO THE RECESS OF FRONT

COVER(M)

dLOWER THE OTHER END OF REAR COVER(M) AND CLIP IT INTO PLACE

3. Rear Cover(R)

c. FIT RETAINING TAB OF REAR COVER(R) INTO THE RECESS OF FRONT COVER(R)

dLOWER THE OTHER END OF REAR COVER(R) AND CLIP IT INTO PLACE

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OUTSIDE FRONT COVER(R)

1. Machine Screw

FIT 3 MACHINE SCREWS AND TIGHTEN TO 16 +/-2 CNM

2. Screen(F)

BLOW OUT LCD RECESS WITH IONIZED AIR. CHECK RECESS FOR DUST AND

MARKS ON LCD. IF LCD IS OK, THEN FIT SCREEN(F). ONLY LIGHTLY PLACE

SCREEN IN RECESS, THEN CHECK FOR DUST AND MARKS AGAIN. IF OK PRESS

SCREEN FIRMLY DOWN AROUND ITS EDGE.

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3. Caps

STICK TWO SCREW CAP CUSHIONS AND TWO SCREW CAP(R) INTO THE RECESSES

AS FIGURE SHOWN

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OUTSIDE REAR COVER(R)

1. Lenz

FIT LENZ DOBLE FACE TAPE INTO THE RECESS AT REAR COVER(R)

FIT LENZ3 ONTO THE TAPE

THEN FIT LENZ1, 2 OVER THE LENZ3 AND PRESS TO FIX ADHESIVE

2. Key Sheet(R) Assy

PLACE KEY SHEET(R) ASSY INTO THE RECESS AT REAR COVER(R).

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3.Screen & Plate

BLOW OUT LCD RECESS WITH IONIZED AIR. CHECK RECESS FOR DUST AND

MARKS ON LCD. IF LCD IS OK, THEN FIT SCREEN(R). ONLY LIGHTLY PLACE

SCREEN IN RECESS, THEN CHECK FOR DUST AND MARKS AGAIN. IF OK, THEN FIT

PLATE DOWN, PRESS PLATE FIRMLY AROUND ITS EDGE.

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OUTSIDE REAR COVER(M)

1. Machine screw

FIT AND TIGHTEN 4 MACHINE SCREWS TO A TORQUE OF 215.6 +/- 19.6 MNM AS

SHOWN BELOW.

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2. Cap(M

FIT TWO CAP(M)’S INTO THE RECESSES AS THE FIGURE SHOW

3. Warranty label(M) and IMEI label

STICK WARRANTY LABEL(M) AND IMEI LABEL IN THE AREA AS THE FIGURE

SHOWN BELOW

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DISASSEMBLY

AFTER SCREWS HAVE BEEN REMOVED, SEPARATE FRONT AND REAR COVER BY

FOLLOWING THE STEPS BELOW :

Note : All used screws are not recommended to use again. Brand new screws should be

applied for assembling.

1. Rear Cover(R)

Step 1

SLIGHTLY LIFT THE TOP OF REAR COVER(R) TO EXPOSE A GAP BETWEEN REAR

COVER(R) AND FRONT COVER(R).

Step 2

INSERT SIM CARD OR THUMBNAIL INTO THIS GAP, THEN SLIDE TOWARED TO THE

HINGE UNTILL THE COVER POP APART.UNCLIP OTHER SIDE.

Step 3

LIFT THE COVER AWAY VERTICALLY FROM THE TOP.

2. Rear Cover(M)

THE PROCEDURE IS SAME AS FOR REAR COVER(R)

Dissassembly is done in reverse order of assembly.

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Main Menu

Section 6

Troubleshooting

6

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TESTING

1. OVERVIEW

Product overview and frequency assignment

TX E-GSM 880MHz to 915MHz (deltaF=200KHz)
RX E-GSM 925MHz to 960MHz (deltaF=200KHz)
TX DCS1800 1710MHz to 1785MHz
RX DCS1800 1805MHz to 1880MHz
TX PCS1900 1850MHz to 1910MHz

Radio Frequency Band

RX PCS1900 1930MHz to 1990MHz

Ful(n) = 890 + 0.2 x n at ( 0 <= n <= 124 )
Ful(n) = 880 + 0.2 x (n-1024) at ( 975 <= n <= 1023)

E-GSM

Fdl(n) = Ful(n) + 45
Ful(n) = 1710.2 + 0.2 x (n-512) at ( 512 <= n <= 885 )DCS1800
Fdl(n) = Ful(n) + 95
Ful(n) = 1850.2 + 0.2 x (n-512) at ( 512 <= n <= 810 )

ARFCN

PCS1900

Fdl(n) = Ful(n) + 80
Access form 8 channel multiple TDMA
Multiple 8 channel / carrier (E-GSM/DCS1800/PCS1900)
Modulation 270.8333Kbit/s GMSK

E-GSM 2W(33dBm) Class4 MTS
DCS1800 1W(30dBm) Class1 MTS

Peak output power

PCS1900 1W(30dBm) Class1 MTS
Nominal supply voltage +3.8V
TX peak current 2500mA max.
GPRS Class Class8 (max 1UL/4DL) Operation class B
GPRS Coding scheme CS1/CS2/CS3/CS4

Channel selection conditions

Verify that there is no interference from other radio devices or neighboring measurement systems
in the frequencies to be used for the test. If there is interference, select the test channels within the range
of the following channels. Especially in case of bit error tests, make sure that there is no influence from
outside before the test. If necessary, use a shielded box or take other channel measures.

E-GSM DCS1800 PCS1900
ch

975ch to 980ch 513ch to 523ch 512ch to 522ch

ch

60ch to 65ch 690ch to 710ch 657ch to 667ch

ch

120ch to 124ch 874ch to 884ch 800ch to 810ch

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Product Specification

Based on GSM 11.10-1 / 3G TS 51.110

Measurement adapter

Dummy battery

Dummy battery should be used shown as follows:

C1

R1

C2 C3

C6

C4 C8

C9

C7C5

C10

C12

C11

D1

Vin

GND

Te m p-ID

Vout

GND

Dummy battery ci rcu i t

100uF
16V

100uF

16V

33pF 0.1uF100uF

16V

100uF
16V

100uF
16V

100uF
16V

100uF
16V

100uF
16V

100uF
16V

10uF
25V

SA5.0A 10k

Test SIM card

In confidence test, general Phase2 (or Phase2+) test SIM should be used.

Serial Link cable with RF cable

Please refer to ************ specification.

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2. FUNCTION TEST

Test purpose

a) To verify Appearance by visual check

b) To verify Charger working

c) To verify recognition of SIM card

d) To verify operation of USB

e) To verify Function Test in the table shown as below

f) To verify power down phone

g) To verify connection of IrDA

Test Conducted Verifying item

LED 7-color LED, RED, GREEN, BLUE

Backlight (High, Low, Very Low,OFF)
Check 65,000 color LCD (Check all element are ON)

Screen

LCD contrast (UP, DOWN)
RTC RTC Alarm test
KEY operation Keyboard test
OPEN/CLOSE Open/close test (hall IC)
Speaker Volume test (UP, DOWN)
AUDIO Audio testverify microphone and receiver)
SHF SHF operation (Checking audio and switch of SHF)
Vibrator Vibrator test ON, OFF
IrDA IrDA test
PC Link AT Command operation

USB USB connection

Test System

1.PSU

2.Test SIM Card (Spec: GSM Phase 2+ Test SIM Standard 1(3.1))

3.Dummy battery

4.AC charge

5.SLC

6.SHF

7.USB

8.IrDA tester

NEC Confidential & Proprietary

1.PSU

HHP

3. Dummy Battery

2. Test

SIM

4. AC Charge

5. PC Link

6. SHF

7. USB

8. IrDA Tester

Test Procedure

Appearance Test

Verify appearance by visual check

Charging Test

Verify charging action on display and LED at connecting charger

SIM Test

Verify recognition of SIM card

If “Insert SIM” indicated on Display, it is NG.

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MMI Tests

Operate key according to direct message on screen.
During the test, the test operator has to validate (Pass key) or not (NG key) each
function tested. Each test result is written in the non-volatile memory.

Test item Detail

LED Test Verify the 7-color LED emblem ( RED, GREEN, BLUE )
Vibrator Verify vibrator ON/OFF
Screen Display Test
(65,000 colour
LCD)

Backlight (High, Low, very Low, OFF), LCD Display (check all elements are
ON), Contrast test (Verify menu UP to increase contrast, menu DOWN to
decrease contrast)

Camera Test Verify the image on main display, Zoom function and image on back

display
IrDA Test Verify connection of IrDA
Open/Close check Verify display and backlight ON/OFF (check hall IC)
Keyboard Test When the key is pressed, check whether the corresponding numbers/sign

is disappeared
Speaker Test Verify volume UP/DOWN
AUDIO Test Verify whether input voice from microphone can be heard from receiver
SHF Test Verify detection of a SHF jack and switch of SHF and AUDIO loop back

operation

Operation :

Start test mode :

PC Link test

After connecting a PC Link cable, check AT commands established

USB Test

After connecting a USB cable, check USB connection established.

Close Down

When all tests are finished, power down the phone by holding the POWER key

down manually.

Normal mode

*#*#170

Test SIM?

Test mode

Yes

Yes

No

No

Shift to test mode when Test SIM

is inserted

NEC Confidential & Proprietary

3. CONFIDENCE TEST

Test purpose

This test is for check RF characteristics.

Test system

1. PC

2. Printer

3. PSU

4. GSM Test Set

5. SLC

6. Equipment Fixture

7. Dummy Battery

8. RF cable

Measurement setup is shown as follows:

1.PC

2.PRINTER

4.GSM Test Set

E5515B(HP8960)

3.PSU

HPE3631A or HP6038A

HHP

6.Equipment Fixture

5..SLC

7..Dummy Battery

8..RF Cable

NEC Confidential & Proprietary

Test Specification

Measurement item and specification is defined as follows:

Specification

Test Item

E-GSM DCS1800 PCS1900

TX Maximum Power 30dBm +/-2dB
TX Power

31dBm +/- 3dB @ PL6
29dBm +/- 3dB @ PL7
27dBm +/- 3dB @ PL8

25dBm +/- 3dB @ PL9
23dBm +/- 3dB @ PL10
21dBm +/- 3dB @ PL11
19dBm +/- 3dB @ PL12
17dBm +/- 3dB @ PL13
15dBm +/- 3dB @ PL14
13dBm +/- 3dB @ PL15
11dBm +/- 5dB @ PL16

9dBm +/- 5dB @ PL17

7dBm +/- 5dB @ PL18

5dBm +/- 5dB @ PL19

28dBm +/- 3dB @ PL1
26dBm +/- 3dB @ PL2
24dBm +/- 3dB @ PL3
22dBm +/- 3dB @ PL4
20dBm +/- 3dB @ PL5
18dBm +/- 3dB @ PL6
16dBm +/- 3dB @ PL7
14dBm +/- 3dB @ PL8
12dBm +/- 4dB @ PL9

10dBm +/- 4dB @ PL10

8dBm +/- 4dB @ PL11
6dBm +/- 4dB @ PL12
4dBm +/- 4dB @ PL13
2dBm +/- 5dB @ PL14

0dBm +/- 5dB @ PL15
RMS Phase error <5deg
PEAK Phase error <20deg
Frequency Error < 90Hz < 180Hz < 185Hz
Power Vs Time pass/fail indication. Detail specification is shown as table 4.1
RX Class2 RBER

<2.4% @ -102.5dBm (avg 10000bit)

RX Level

8 +/-4 @ -102.5dBm

RX Quality

<3 @ -102.5dBm

NEC Confidential & Proprietary

Power Vs Time mask specification

dB

t

- 6

- 30

+ 4

8 µs 10 µs 10 µs 8 µs

(147 bits)

7056/13 (542.8) µs

10 µs

(*)

10 µs

- 1

+ 1

(***)

(**)

Time mask for normal duration bursts(NB,FB,dB and SB) at GMSK modulation

For GSM 900 MS : -59 dBc or -54 dBm, whichever is the

greater, except for the time slot
preceding the active slot, for which the
allowed level is -59 dBc or -36 dBm
whichever is the greater

(*)

For DCS 1 800 and PCS 1900 MS : -48 dBc or -48 dBm, whichever is the

higher.

-4 dBc for power control level 16;

-2 dBc for power level 17;

For GSM 900 MS :

-1 dBc for power level controls levels
18 and 19.

-4dBc for power control level 11,

-2dBc for power level 12,

(**)

For DCS 1 800 and PCS 1900 MS :

-1dBc for power control levels 13,14
and 15

For GSM 900 MS : -30 dBc or -17 dBm, whichever is the

higher.

(***)

For DCS 1800 and PCS 1900 MS : -30dBc or -20dBm, whichever is the

higher.

NEC Confidential & Proprietary

Test Procedure

Test items should be sequential in the table shown as below. Due to limitation of
GSM test set, test should be started under E-GSM mode, for hand over to DCS1800 or
PCS1900.

Default setting of GSM test set and PSU is shown as follows:

(Internal Loss) (Please measure cable loss on first set-up and calibrate it.)
CALL STATUS IDLE
CELL STATUS ACTIVE CELL
OPERATING MODE E-GSM
Expected input level TX Level 5 : 33dBm
Control Base station Broadcast Broadcast ON
Control Base station Channel 20
Control Base station Amplitude -85dBm
Mobile Phone Channel 62 ( could be changed ARFCN Mch )
Mobile Phone TX Level 5
Mobile Phone Timeslot 4
PSU output voltage +3.8V +/- 0.05V
PSU maximum current limit 2500mA

Test item MODE Procedure
Start up E-GSM 1. Set SIM card and dummy battery to HHP

2. Power on HHP

3. Wait to indicate “GSM Test Net 001”

Call setup E-GSM 1. Press “1” “2” “3” to connect

2. Wait to indicate “Active” to establish call

TX Power E-GSM

DCS1800
or
PCS1900

1. ARFCN is assign to Mch ( and Lch/Hch )

2. Set PL to 5(E-GSM) or 0(DCS1800) or 0(PCS1900)

3. Wait to establish hand over

4. Measure output power

RMS Phase error E-GSM

DCS1800
or
PCS1900

1. ARFCN is assigned to Mch ( or Lch/Hch )

2. Set PL to 5(E-GSM) or 0(DCS1800) or 0(PCS1900)

3. Wait to establish hand over

4. Change mode of GSM tester to “Phase/FREQ”

5. Set analyze burst number to 50

6. Read “RMS average” window

PEAK Phase error E-GSM

DCS1800
or
PCS1900

1. ARFCN is assigned to Mch ( or Lch/Hch )

2. Set PL to 5(E-GSM) or 0(DCS1800) or 0(PCS1900)

3. Wait to establish hand over

4. Change mode of GSM tester to “Phase/FREQ”

5. Set analyze burst number to 50

6. Read “PEAK maximum” window

Frequency Error E-GSM

DCS1800
or
PCS1900

1. ARFCN is assigned to Mch ( or Lch/Hch )

2. Set PL to 5(E-GSM) or 0(DCS1800) or 0(PCS1900)

3. Wait to establish hand over

4. Change mode of GSM tester to “Phase/FREQ”

5. Set analyze burst number to 50

6. Read “Frequency error maximum” window

Power Vs Time E-GSM

DCS1800
or
PCS1900

1. ARFCN is assigned to Mch

2. Set PL to 5(E-GSM) or 0(DCS1800) or 0(PCS1900)

3. Wait to establish hand over

4. Change mode of GSM tester to “Power Ramp”

5. To check pass/fail indication under three mode “TOP 2dB”
“Rise edge” and “Fall edge”

NEC Confidential & Proprietary

RX Class2 RBER E-GSM

DCS1800
or
PCS1900

1. ARFCN is assigned to Mch*1

2. Set PL to 5(E-GSM) or 0(DCS1800) or 0(PCS1900)

3. Wait to establish hand over

4. Change mode of GSM tester to “Bit error”

5. To define sampling value to 10000

6. To define measure “Res Type 2”

7. To adjust base station output level to –102.5dBm

8. Wait to indicate BE Ratio and read it.

RX Level E-GSM

DCS1800
or
PCS1900

1. Same setting and procedure as RX RBER

2. Wait to indicate “Mobile reported Rxlev” and read it.

RX Quality E-GSM

DCS1800
or
PCS1900

1. Same setting and procedure as RX RBER

2. Wait to indicate “Mobile reported RX Qual” and read it.

Hand over E-GSM

DCS1800
or
PCS1900

1. Change mode of GSM tester to “DUAL BAND”

2. To define DCS1800 or PCS1900 parameter. ARFCN to Mch,
Base station output level to –85dBm, Mobile power level to PL0.

3. Push “Execute” and check establish hand over.

( Test is repeated under DCS1800 or PCS1900 band)

Close down E-GSM

DCS1800
or
PCS1900

1. Push “END Call” of GSM tester

2. Wait to indicate “Call End” and change to idle screen.

3. Push “Power” to check shut down.

*1 Refer to 1.Overview Channel selection condition

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Antenna test

Test purpose

This test is for check contact between antenna and circuit board.

Test system

1. PC

2. Printer

3. PSU

4. Antenna

5. SLC

6. Equipment Fixture

7. Dummy Battery

8. I/O Cable

9. Power Meter

10. PM Sensor

11. Shield Box

Measurement setup is shown as follows

11.Shield Box

1.PC

2.PRINTER

3.PSU

HPE3631A

HHP

6.Equipment Fixture

5.SLC

8.I/O Cable

9.Power Meter
ML2438A

Test Instruments

4.Antenna

PM Sensor

MA2472A

7.Dummy Battery

NEC Confidential & Proprietary

Test Specification

Measurement item and specification is shown as below :

Test item MODE Specification

TX Maximum Power E-GSM 30dBm +/- 3dB

Test Procedure

Test items should be sequential in the table shown as below :

Test item MODE Procedure
Start up E-GSM 1. Set dummy battery to HHP

2. Power on HHP

3. Put Into test mode

TX Power E-GSM 1. ARFCN is assign to Mch

2. Set PL to 5(E-GSM)

3. Measure output power

NEC Confidential & Proprietary

COMMON FAULT TROUBLE SHOOTING

1. RX PORTION

RX level
OK?

Check
V_RF,V_OSC,
V_L01,V_L02
=2.7V ?

Check IC121
#38 26MHz
clock

Check IC121
#36 13MHz
clock

Check
OSC121 #4
frequency

IC121 is dead
or check
Logic Circuit

No RX

Check IC351
or IC251 of
Logic Circuit

OSC171
TCXO is
dead

IC121 is dead

OSC121 or
IC121 is dead

Bad RX

Check U101
#3,#4,#5 level

Check
BPF221 #1,
BPF211 #2,
BPF201 #2 level

Check BPF201 #4,
#6,BPF211
#4,#6,BPF221
#3,HYB221 #2
level

Check IC121
#4,#5,#7,#8,
#10,#11 level

Replace IC121

Replace
C205,C206,L213,
L212,HYB221,
L226,L227,C229
or C230

Replace BPF201,
BPF211, BPF221,
C223 or C228

Replace C201,
C202,C211,
C212,C221 or
C222

Replace U101 or
check ANT circuit

YesY

es

YesY

es

No

No

No

No

Low

Low

Low

Low

Normal

Normal

Normal

Normal

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2. TX PORTION

No TX

Check VBAT=3.8V,
V_TX,V_L01,V_L02,
V_OSC=2.7V?

Check IC121 #38
26MHz clock

Check IC121 #36
13MHz clock

Check OSC121 #4
frequency

Check OSC111
#6,#10 frequency

Check U111 #1,#7
power level

Check U111
#9,#11 power level

Check U101 #10

Check ANT circuit

Check IC351 or
IC251 of Logic
Circuit

OSC171 TCXO is
dead

IC121 is dead

OSC121 or IC121
is dead

Replace U111 or
IC351 of Logic
Circuit

Replace C151 or
C152

OSC111 or IC121
is dead

Replace
U101,C112,C114
or IC351 of Logic

YesYesYesYesYesYesYesY

es

No

No

No

No

No

No

No

No

NEC Confidential & Proprietary

3. LOGIC PORTION

3.1. Can not power on

3.2. Can not charge battery

Is I/O connector (Z601)
bad contact ?

Replace or clean Z601

Is X606 or F601 open?

Y

es

No

Check IC501 (Hawk)
VBAT = 4.2V ?

Check IC501 (Hawk)
V21 = 2.85V and
V29=1.5V

Check XTL401
12MHz of IC401
(Helen1)

Check C523 (maybe
Short)

IC501 (Hawk) is dead
or bad contact

Reflash program
OK ?

Try to restart mobile
phone

Replace XTL401

Reinstall Key PCB or
replace DOME switch

Key PCB and
DOME switch OK?

Y

es

YesY

es

No

No

No No

Y

es

When pressing ON,
IC501 (Hawk)
Reset_A = “H” ?

Check battery
contacts and circuit

Mobile phone High
Current ?

IC401 (Helen1) is
dead or bad contact

YesY

es

No

No

No

Y

es

Replace X606 or F601

IC501 (Hawk) is bad
contact or dead

Is the battery dead?
(eg, no current drawn)

Replace battery

YesY

es

No

No

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3.3. No backlight

3.4. No display (Main LCD or Sub LCD)

Is L853 or X852 open ?

Is LCD backlight bad contact
or dead ?

Is IC853 #4 = “H” when LCD
is ON ?

Reinstall or replace LCD
backlight

No

Y

es

Resolder or replace L853 or
X852

IC853 (Step-up IC) is dead

IC852 (Papaya) is dead

YesY

es

No

No

Check FPC ,Z610 & Z611,
Connection OK ?

Check IC852 (Papaya)
V28=2.85V & V_CORE=2.5V?

Check XTL851 at IC852
#60,#61 12MHz ?

Replace Main LCD
or Sub LCD, still no display ?

IC501 (Hawk) is bad contact or
dead

Replace XTL851 (12MHz)

YesYesY

es

No

No

IC852 (Papaya) is bad contact
or dead

Y

es