Document No. 0170EMDD03VOL01E
Date Published July 2002 P
Printed in Japan
MINIATURE SIGNAL RELAYS
EC2 SERIES (DIP TYPE)
EE2 SERIES (SMD TYPE)
TECHNICAL DATA
No part of this document may be copied or reproduced in any form or by any means without the
prior written consent of NEC/TOKIN Corporation. NEC/TOKIN Corporation assumes no resposibility
for any errors which may appear in this document.
NEC/TOKIN Corporation does not assume any liability for infringement of patents, copyrights or
other intellectual property rights of third parties by or arising from use of a device described herein
or any other liability arising from use of such device. No license, either express, implied or
otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC
/TOKIN Corporation or others.
While NEC/TOKIN Corporation has been making continuous effort to enhance the reliability of its
electronic components, the possibility of defects cannot be eliminated entirely. To minimize risks
of damage or injury to persons or property arising from a defect in an NEC/TOKIN electronic component,
customers must incorporate sufficient safety measures in its design, such as redundancy,firecontainment, and anti-failure features. NEC/TOKIN devices are classified into the following three
quality grades:
"Standard," "Special," and "Specific". The Specific quality grade applies only to devices
developed based on a customer designated "quality assurance program" for a specific
application. The recommended applications of a device depend on its quality grade, as indicated
below. Customers must check the quality grade of each device before using it in a particular
application.
Standard: Computers, office equipment, communications equipment, test and measurement
equipment, audio and visual equipment, home electronic appliances, machine tools,
personal electronic equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems,
anti-disaster systems, anti-crime systems, safety equipment and medical
equipment (not specifically designed for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control
systems, life support systems or medical equipment for life support, etc.
The quality grade of NEC/TOKIN devices is "Standard" unless otherwise specified in NEC/TOKIN’s
Data Sheets or Data Books. If customers intend to use NEC/TOKIN devices for applications other
than those specified for Standard quality grade, they should contact an NEC/TOKIN sales representative
in advance.
(Note)
(1) "NEC/TOKIN" as used in this statement means NEC/TOKIN Corporation and also includes
its majority-owned subsidiaries.
(2) "NEC/TOKIN electronic component products" means any electronic component product developed
or manufactured by or for NEC/TOKIN (as defined above).
3.1Switching power .....................................................................................................................................3
3.3Maximum coil voltage .............................................................................................................................4
3.4Coil temperature rise ..............................................................................................................................4
3.5Driving power vs. timing .........................................................................................................................5
3.6Driving pulse width vs. set & reset voltages ...........................................................................................6
3.12 Resistance to surge voltage ...................................................................................................................12
3.13 Current surge interrupt test ....................................................................................................................13
3.14 Resistance to carrying current ................................................................................................................13
4. Distribution of Characteristics ....................................................................................................14
4.2Operate & release times (set & reset times) ..........................................................................................15
4.3Transfer time ..........................................................................................................................................16
4.4Timing and details ..................................................................................................................................17
4.6Breakdown voltage .................................................................................................................................22
4.7Thermal Electromotive Force (EMF) (offset voltage between contacts) ................................................22
5. Test Data .......................................................................................................................................23
5.1.1 High-temperature test .................................................................................................................24
5.1.2 Low-temperature test .................................................................................................................27
5.1.3 Moisture resistance test .............................................................................................................29
5.1.4 Heat shock test ...........................................................................................................................31
5.1.5 Vibration test ..............................................................................................................................33
5.1.6 Shock test ...................................................................................................................................35
5.1.7 Resistance to solder heat test (only EC2 series) .......................................................................37
5.1.8 Resistance to reflow solder heat test (only EE2 series) .............................................................38
5.1.9 Terminal strength test (only EC2 series) ....................................................................................40
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5.2Contact life tests .....................................................................................................................................41
5.2.1 Non-load test A (Mechanical life test, Ta = 25˚C) .......................................................................41
5.2.2 Non-load test B (Mechanical life test, T
5.2.3 Resistive load test A (10 m Vdc, 10
a = 85˚C) .......................................................................42
µ
A, Ta = 25˚C) ...................................................................42
5.2.4 Resistive load test B (10 Vdc, 10 mA, Ta = 85˚C) ......................................................................43
5.2.5 Resistive load test C (28 Vdc, 100 mA, T
5.2.6 Resistive load test D (50 Vdc, 100 mA, T
a = 85˚C) ....................................................................43
a = 25˚C) ....................................................................44
5.2.7 Resistive load test E (50 Vdc, 100 mA, Ta = 85˚C) ....................................................................44
5.2.8 Inductive load test (48 Vdc, 110 mA, Ta = 25˚C) ........................................................................45
5.2.9 Resistive load test F (220 Vdc, 0.14 A, Ta = 25˚C) ....................................................................45
5.2.10 Resistive load test G (125 Vdc, 0.5 A, T
5.2.11 Resistive load test H (30 Vdc, 1 A, T
a = 25˚C) ......................................................................46
a = 25˚C) ...........................................................................46
- ii -
1. Preface
Miniature signal relays are used in a wide range of application fields including communication, measurement, and
factory automation. This document gives the basic characteristics and test data of NEC’s EC2 and EE2 series
miniature signal relays.
Notes 1. The symbol
shown in the graphs throughout this document indicates the maximum value of the data.
Likewise, indicates the minimum value, and indicates the mean value.
2. When a relay is driven by an IC, a protective element such as a diode may be connected in parallel
with the relay coil to protect the IC from damage caused by the counter-electromotive force (EMF) due
to the inductance of the coil. However, unless otherwise specified, the operate time and release time
(set and reset times) shown in this document are measured without such a protective element.
Relay Coil
Tr
Diode
Power Supply
For Right Use of Miniature Relays
DO NOT EXCEED MAXIMUM RATINGS.
Do not use relays under exceeding conditions such as over ambient temperature, over voltage and over
current. Incorrect use could result in abnormal heating, damage to related parts or cause burning.
READ CAUTIONS IN THE SELECTION GUIDE.
Read the cautions described in NEC/TOKIN’s “Miniature Relays” (0123EMDD03VOL01E) when you choose
relays for your application.
1
2. Structure
Figure 2.1 shows the structures of the EC2 and the EE2 series relays. EC2 series relay has a terminal configuration
called dual in-line leads (DIL), and EE2 series relay has a resistibility to solder heat, and a terminal configuration that
conforms to surface mounting. Table 2.1 lists the parts constituting relay.
EC2 series and EE2 series relays have a common structure except difference of a terminal configuration and some
parts.
11
[EC2 series]
12
10
13
7
5
3
14
[EE2 series]
14
1
1
8
9
2
4
6
Figure 2.1 Structure of the EC2/EE2 Series Relay
Table 2.1 Parts of EC2/EE2 Series Relay
No.Parts
EC2 SeriesEE2 Series
1CoverPolybutylene telephthalate
2BaseLiquid crystalline polymer
3Base padLiquid crystalline polymer
4Coil wirePolyurethane copper wire
5Coil spoolPolyphenylene sulfide
#
6CorePure iron
7TerminalPhosphor bronze (surface is treated with preparatory solder)