National Semiconductor LMX9820A Technical data

LMX9820A Bluetooth

Seria l Port Modul e

LMX9820A Bluetooth Serial Port Module

APRIL 2005

Revision 1.0

1.0 General Description

The National Semiconductor LMX9820A Bluetooth Serial Port module is a highly integrated radio, baseband controller, and memory device implemented on an FR4 substrate. All hardware and firmware is included to provide a complete solution from antenna from the complete lower and upper layers of the Bluetooth stack, up to the application support layers including the Generic Access Profile (GAP), the Service Discovery Application Profile (SDAP), and the Serial Port Profile (SPP). The module includes a configurable service database to fulfill service requests for additional profiles on the host. The LMX9820A features a small form factor (10.1 x 14.1 x 2.0 mm) design, which solves many of the challenges associated with compact system integration. Moreover, the LMX9820A is pre-qualified as a Bluetooth Integrated Component. Conformance testing through the Bluetooth qualification program enables a fast time to market after system integration by ensuring a high degree of compliance and interoperability.

2.0 Functional Block Diagram

Based on National’s CompactRISC

™

16-bit processor architecture and Digital Smart Radio technology, the LMX9820A is optimized to handle the data and link management processing requirements of a Blueto oth node.

The firmware supplied with this device offers a complete Bluetooth (v1.1) stack including profiles and command interface. This firmware features point-to-point and pointto-multipoint link management supporting data rates up to the theoretical maximum over RFComm of 704 kbps. The internal memory supports up to three active Bluetooth data links and one active SCO link .

1.1 APPLICATIONS

■ Personal Digital Assistants

■ POS Terminals

■ Data Logging Systems

■ Audio Gateway applicati ons

LINK

MGMNT

PROCESSOR

(LMP)

LNA

ANTENNA

CompactRISC is a trademark of National Semiconductor Corporation. Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor.

DIGITAL

SMART

RADIO

SYNTHESIZER

CRYSTAL/OSCILLATOR

BASEBAND

CONTROLLER

AUDIO INTERFACE

AAI_STD

AAI_SRD

ADVANCED

AAI_SFS

AAI_SCLK

FIRMWARE (INCLUDES

PROFILES AND

COMMAND

INTERFACE)

COMPACTRISC™

CORE

JTAGRAMFLASH

VOLTAGE

REGULATORS

UART_RX

UART

AUX

PORTS

SELECT

ANALOG

DIGITAL

DIG_GND[1:2]VCC

UART_TX UART_RTS# UART_CTS#

IOVCC TX_SWITCH_P ENV0 ENV1

LSTAT_0 LSTAT_1 HOST_WU RESET_B# RESET_5100#

ISEL1INTERFACE ISEL2

VDD_ANA_OUT VDD_DIG_OUT

VDD_DIG_PWR_D#

3.0 Features

■ Bluetooth version 1.1 qualified

■ Implemented in CMOS technology on FR4 substrat e

■ Temperature Range: -40°C to +85°C

■ FCC certified on LMX9820ADONGLE,

FCC ID ED9LMX9820ASM.

3.1 DIGITAL HARDW ARE

■ Baseband and Link Management processors

■ CompactRISC Core

■ Integrated Memory:

–Flash –RAM

■ UART Command/Data Port: – Support for up to 921.6k baud rate

■ Auxiliary Host Interface Ports:

LMX9820A Bluetooth Serial Port Module

– Link Status – Transceive r Status (Tx or Rx) – Operating Environm ent Control:

– Default Bluetooth mode – In System Programming (ISP) mode

■ Advanced Power Management (APM) features

■ Advanced Audio Interface for external PCM codec

3.2 FIRMWARE

■ Complete Bluetooth Stack including: – Baseband and Link Manager – L2CAP, RFCOMM, SDP –Profiles:

–GAP –SDAP – SPP

■ Additional Profile support on host fo r any SPP based profile, like

– Dial Up Networking (DUN) – Facsimile Profile (FAX)

– File Transfer Protocol (FTP) – Object Push Profile (OPP) – Headset (HSP)

– Handsfree Profile (HFP)

■ On-chip application support including: – Command Interface:

– Link setup and configuration (also Multipoint) – Configuration of the module – In-System Programming (ISP) – Service database modifications

– Default connections – UART Transparent mode – Different Operation modes:

– Automatic mode

– Command mode

3.3 DIGITAL SMART RADIO

■ Accepts external clock or crystal input: – 12 MHz – 20 ppm cumulative clock error required for Bluetooth

■ Synthesizer: – Integrated VCO and loop filter – Provides all clocking f or radio and baseband func-

tions

■ Antenna Port (50 ohms nominal impedance): – Embedded front-end filter for enhanced out of band

performance

■ Integrated transmit/ receive switch (full-duplex operation via antenna port)

■ Typical -81 dBm input sensitivity

■ 0 dBm typical output power

3.4 PHYSICAL DIMENSIONS

■ Compact size: 10.1mm x 14.1mm x 2.0mm

■ Complete system interface provi ded in Land Grid Array

on underside for surface-mount assembly

■ Metal shield included

Figure 1. Physical Illustrati o n

www.national.com 2 Revision 1.0

Table of Cont ents

LMX9820A Bluetooth Serial Port Module

1.0 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . .1

2.0 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 1

3.0 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

3.1 DIGITAL HARDWARE . . . . . . . . . . . . . . . . . . . . . . 2

3.2 FIRMWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3.3 DIGITAL SMART RADIO . . . . . . . . . . . . . . . . . . . . 2

3.4 PHYSICAL DIMENSIONS . . . . . . . . . . . . . . . . . . .2

4.0 Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

5.0 Pad Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.0 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . .8

6.1 GENERAL SPECIFICATIONS . . . . . . . . . . . . . . . .8

6.2 DC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . 9

6.3 RF PERFORMANCE CHARACTERISTICS . . . .10

6.4 PERFORMANCE DATA (TYPICAL) . . . . . . . . . .12

7.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.1 BASEBAND AND LINK MANAGEMENT PROCESSORS 14

7.1.1 Bluetooth Lower Link Controller . . . . . . . . . . . .14

7.1.2 Bluetooth Upper Layer Stack . . . . . . . . . . . . . . 14

7.1.3 Profile Support . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.1.4 Application with Command Interface . . . . . . . .14

7.2 MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

7.3 CONTROL AND TRANSPORT PORT . . . . . . . . . 15

7.4 AUXILIARY PORTS . . . . . . . . . . . . . . . . . . . . . . . 15

7.4.1 Reset_5100 and Reset_b# . . . . . . . . . . . . . . .15

7.4.2 Operating Environment Pads (Env0 and Env1) 15

7.4.3 Interface Select Inputs (ISEL1, ISEL2) . . . . . .15

7.4.4 Module and LInk Status Outputs . . . . . . . . . . . 15

7.5 AUDIO PORT . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.0 Digital Smart Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

8.1 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . .17

8.2 RECEIVER FRONT END . . . . . . . . . . . . . . . . . . . 17

8.2.1 Poly-Phase Bandpass Filter . . . . . . . . . . . . . . .17

8.2.2 Hard Limiter and RSSI . . . . . . . . . . . . . . . . . . . 17

8.3 RECEIVER BACK END . . . . . . . . . . . . . . . . . . . .17

8.3.1 Frequency Discriminator . . . . . . . . . . . . . . . . .17

8.3.2 Post-Detection Filter and Equalizer . . . . . . . . . 17

8.4 AUTOTUNING CIRCUITRY . . . . . . . . . . . . . . . . .17

8.5 SYNTHESIZER . . . . . . . . . . . . . . . . . . . . . . . . . . 17

8.5.1 Phase-Frequency Detector . . . . . . . . . . . . . . . 17

8.6 TRANSMITTER CIRCUITRY . . . . . . . . . . . . . . . .18

8.6.1 IQ-DA Converters and TX Mixers . . . . . . . . . .18

8.7 CRYSTAL REQUIREMENTS . . . . . . . . . . . . . . .18

8.7.1 Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

8.7.2 TCXO (Te m perature Compensated Crystal Oscillator) 21

8.7.3 ESR (Equivalent Series Resistance) . . . . . . . .22

9.0 System Power-Up Sequence . . . . . . . . . . . . . . . . . . . 23

10.0 Integrated Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.1 FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.1.1 Operation Modes . . . . . . . . . . . . . . . . . . . . . . 24

10.1.2 Default Connections . . . . . . . . . . . . . . . . . . . . 24

10.1.3 Event Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

10.1.4 Default Link Policy . . . . . . . . . . . . . . . . . . . . . 24

10.1.5 Audio Support . . . . . . . . . . . . . . . . . . . . . . . . . 24

11.0 Power Reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

11.1 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . 26

11.2 UART TRANSPOR T LAYER CO NTRO L . . . . . . 26

11.2.1 Hardware Wake-Up Functionality . . . . . . . . . . 26

11.2.2 Disabling the UART Transport Layer . . . . . . . 26

11.2.3 LMX9820A Enabling the UART Interface . . . . 26

11.2.4 Enabling the UART Transport Layer from Host 26

12.0 Command Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

12.1 FRAMING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

12.1.1 Start and End Delimiters . . . . . . . . . . . . . . . . . 27

12.1.2 Packet Type ID . . . . . . . . . . . . . . . . . . . . . . . . 27

12.1.3 Opcode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

12.1.4 Data Length . . . . . . . . . . . . . . . . . . . . . . . . . . 27

12.1.5 Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

12.2 COMMAND SET OVERVIEW . . . . . . . . . . . . . . 28

13.0 Usage Scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

13.1 SCENARIO 1: POINT-TO-POINT CONNECTION 32

13.2 SCENARIO 2: AUTOMATIC POINT-TO-POINT CONNECTION 33

13.3 SCENARIO 3: POINT-TO-MULTIPOINT CONNECTION 34

14.0 Application Information . . . . . . . . . . . . . . . . . . . . . . . 35

14.1 MATCHING NETWORK . . . . . . . . . . . . . . . . . . . 35

14.2 FILTERED POWER SUPPLY . . . . . . . . . . . . . . . 35

14.3 HOST INTERFACE . . . . . . . . . . . . . . . . . . . . . . 35

14.4 CLOCK INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . 35

14.5 SCHEMATIC AND LAYOUT EXAMPLES . . . . . 35

15.0 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

16.0 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 41

17.0 Datasheet Revision History . . . . . . . . . . . . . . . . . . . . 42

Revision 1.0 3 www.national.com

4.0 Connection Diagram

12345678910111213

NC NC NC NC NC NC NC PI1_ NC Tx_rx_ CCB_ BBCLK PI2_TP12

NC RF GND RF GND RF GND RF GND RF GND RF GND Clk- Clk+ AAI_srd Env1 AAI_std 32kHz_CLKI

NC RF GND RF GND RF GND RF GND RF GND RF GND Tx_rx_ Uart_rx Uart_rts# AAI_sfs AAI_sclk 32kHz_CLKO

NC RF GND RF GND RF GND RF GND RF GND RF GND CCB_data Uart_tx Uart_cts# Reset_ Dig_gnd_1 NC

LMX9820A Bluetooth Serial Port Module

NC RF GND RF GND RF GND RF GND RF GN D RF GND Lstat_0 Env0 J_rdy USB_D+ USB_D- NC

NC RF GND RF GND RF GND RF GND RF GND RF GND Lstat_1 Host_wu J_tdi J_tdo USB_VCC PH3_TP9

NC RF GND RF GND RF GND RF GND RF GND NC Reset_b# J_tms J_tck Dig_gnd_2 USB_Gnd PH2_TP8

RF_CE_TP11 synch Clock

data

5100#

NC VCC TX_ NC RF GNDRF GNDRF GNDRF_inoutRF GNDRF GNDRF GND IOVCC ISEL2

NC VDD_ANA_OUT

Switch_P

VDD_DIG_PWR_D#

VDD_DIG_OUTNC NC NC NC NC NC CCB_ ISEL1

latch

X-Ray (Top View)

Figure 2. Connection Diagram

Table 1. Ord e ring Infor m a t io n

Order Number Shipment Method

LMX9820ASM Tape & Reel 250 pcs

LMX9820ASMX Tape & Reel 2000 pcs

www.national.com 4 Revision 1.0

5.0 Pad Descriptions

Table 2. System Interface Signals

Pad Name

Pad

Location

Clk- B8 Input Xtal g or Negative Clock Input. Typically connected along with

Clk+ B9 Input Xtal d or Positive Clock Input. Typically connected along with

32kHz_CLKI B13 Input 32 kHz Clock input . Not supported b y LMX9820A. Connect to ground.

32kHz_CLKO C13 Output 32 kHz Clock Output. Not supporte d by LM X9820A. Tre at as no con-

RF_inout H8 Input/Output RF Antenna Port. 50Ω nominal impedance. Typi call y co nnected to an

ISEL2 H13 Input Module Interface Select Input Bit 1 ISEL1 J13 Input Module Interface Select Input Bit 0

Direction Description

XTAL_D to an external surface-mount AT-cut crysta l. Leave not connected in case Clk+ i s connected to external crystal oscillator.

XTAL_G to an e xternal s urface -mount AT-cut crys tal. Can a lso be c onfigured as a frequency input when using an external crystal oscillator. When configured as a fr equency in put , typical ly connect ed t o an external Temperature Compensated Crystal Oscillator (TCXO) through an Alternating Curr ent (AC) coupling capacitor.

Pad required for mechanical stability.

nect. Pad required for mechanical stabili ty.

antenna through a 6.8 pF capacitor.

LMX9820A Bluetooth Serial Port Module

T able 3. USB Interface Signals (not supported by LMX9820A firmware)

Pad Name

Pad

Location

USB_VCC F12 Input USB Transceiver Power Supply + USB_D+ E11 Input/Output USB Data Positive USB_D- E12 Input/Output USB Data Negative

Direction Description

USB_Gnd G12 Input USB Transceiver Ground. Connect to GND.

1. Treat as no connect. Pad required for mechanical stability.

Table 4. UART Interface Signals

Pad Name

Pad

Location

Direction Description

Uart_tx D9 Output UART Host Control Interface Transport, Transmit Data Uart_rx C9 Input UART Host Control Interface Transport, Receive Data

Uart_rts# C10 Output UART Host Control Interface Transport, Request to Send Uart_cts# D10 Input UART Host Control Interface Transport, Clear to Send

1. Treat as no connect if not used. Pad required for mechanic al st ability.

2. Connect GND if not used.

Revision 1.0 5 www.national.com

5.0 Pad Descriptions (Continued)

T able 5. Auxiliary Ports Interface Signal s

Pad Name

Pad

Location

IOVCC H12 Input 2.85V to 3.6V Logi c Threshold Program Input. Reset_b# G8 Input Reset_5100# D11 Input

Lstat_0 E8 Output Link Status Bit 0 Lstat_1 F8 Output Link S tatus Bit 1 Host_wu F9 Output Host Wakeup Env0 E9 Input Module Operating Environment Bit 0 Env1 B11 Input Module Operating Environment Bit 1 TX_Switch_P H3 Output Transceiver Status. 0 = Receive; 1 = Transmit.

LMX9820A Bluetooth Serial Port Module

Pad Name

Pad

Location

AAI_srd B10 Input Advanced Audio Interface Rece ive Data Input AAI_std B12 Output Advanced Audio Interf ace Transmit Data Output AAI_sfs C11 Input/Output Advanced Audio Interface Frame Synchronization AAI_sclk C12 Input/Output Advanced Audio Interface Clock

Direction Description

Reset for Smart Radio Reset for Baseband processor.

use pull-up with max. 1K

. Connect to Reset_5100.

Low active, either connect to host or

Ω

resistor.

T able 6. Audio Port Interf ace Signals

Direction Description

1. Treat as no connect if not used. Pad required for mechanic al st ability.

Table 7. Test Interface Signals

Pad Name

Pad

Location

J_rdy E10 Output JTAG Ready J_tdi F10 Input JTAG Test Data J_tdo F11 Input/Output JT AG Test Data

Direction Description

J_tms G9 Input/Output JTAG Test Mode Select J_tck G10 Input JTAG Test Clock PI1_RFCE_TP11

A8 Test Pin Module Test Point PI2_TP12 A13 Test Pin Module Test Point Tx_rx_data C8 Test Pin Module Test Point Tx_rx_synch A10 Test Pin Module Test Point CCB_Clock A11 Test Pin Module Test Point CCB_data D8 Test Pin Modu le Test Point CCB_latch J12 Test Pin Module Test Point BBCLK A12 Test Pin Module Test Point PH3_TP9 F13 Test Pin Module Test Point PH2_TP8 G13 Test Pin Module Test Point

www.national.com 6 Revision 1.0

5.0 Pad Descriptions (Continued)

1. Treat as no connect. Pad required for mechanical stability.

Table 8. Power, Ground, and No Connect Signals

Pad Name

NC A1, A2, A3, A4, A5,

A6, A7, A9, B1, C1, D1, D13, E1 , E 1 3, F1, G1, G7, H1, H4, J1, J3, J6, J7, J9, J10, J11

RF GND

Dig_gnd_1 Dig_gnd_2

VCC H2 Input 2.85V to 3.6V Input for Intern al Power Supply Regula-

VDD_ANA_OUT J2 Out put Voltage Regulator Output/Power Supply for Analog

VDD_DIG_OUT J5 Output Voltage Regulator Output/Power Supply for Digital

VDD_DIG_PWR_D# J4 Input Power Down for the Internal Power Supply Regulator

B2, B3, B4, B5, B6, B7, C2, C3, C4, C5, C6, C7, D2, D3, D4, D5, D6, D7, E2 , E3, E4, E5, E6, E7, F2, F3, F4, F5, F6, F7, G2, G3, G4, G5, G6, H5, H6, H7, H9, H10, H11

Pad

Location

D12 Input Digital Ground G11 Input Digital Ground

Direction Description

No Connect No Connect. Pad required for mechanical stability.

Input Radio System Ground. Must be connected to RF

Ground plane. Thermal relief required for proper soldering.

tors

Circuitry. If not used, place pad and do not connect to

VCC or Ground.

Circuitry. If not used, place pad and do not connect to VCC or Ground.

for the Digital Circuitry. Place pad and do not connect to VCC or Ground.

LMX9820A Bluetooth Serial Port Module

1. Connect RF GND, Dig_gnd_1, and Dig_gnd_2 to a single ground plane.

Revision 1.0 7 www.national.com

6.0 Electrical Specifications

6.1 GENERAL SPECIFI CATIONS

Absolute Maximum Ratings (see Table 9) indicate limits beyond which damage to the device may occur. Operating Ratings (see Table 10) indicate conditions for which the device is intended to be fu nctional.

This device is a high performance RF integrated circuit an d

The following conditions apply unless otherwise stated in the tables be low:

• T

= -40°C to +85°C

• VCC = 3.3V, IOVCC = 3.3V

• RF system performa nce specifications are guaranteed

on National Semicondu ctor Austin Board rev1.0b refer-

ence design platform. is ESD sensitive. Handling and assembly of this device should be performed at ESD free workstations.

Table 9. Absolu te Maximum Ratings

Symbol Parameter Min Max Unit

VCC Core Logic Power Supply Voltag e -0.3 4.0 V IOVCC I/O Power Supply Voltage -0.3 4.0 V

USB_VCC V

LMX9820A Bluetooth Serial Port Module

PinRF RF Input Power +15 dBm T

ESD-HBM ESD, Human Body Model 2000

USB Power Supply Voltage -0.5 3.63 V Voltage on any pad with GND = 0V -0.5 3.6 V

Storage Temperatur e Range -65 +125 Lead Temperature (solder 4 sec) +235

ESD-MM ESD, Machine Model 200 V

1. USB Interface not supported by LMX9820A firmware. Treat as no connect . Pad required for mechanical stability.

2. Antenna pin passes 1500V HBM.

T able 10. Recommended Operating Conditions

Symbol Parameter Min Typ

VCC IOVCC

HUM

NONOP Humidity (non-op erating, 38.7

Module Power Supply Voltage 2.85 3.3 3.6 V

I/O Power Supply Voltage 2.85 3.3 3.6 V Module Power Supply Rise Time 50 ms Operating Temperat ure Range -40 +85 °C Humidity (operating, across operating

10 90 %

temperature range)

C web bulb

595%

Max Unit

temperature)

1. Maximum voltage difference allowed between VCC and IOVCC is 500 mV.

2. Typical operating conditions are VCC = 3.3V, IOVCC = 3.3V operating voltage and 25°C ambient temperature.

3. VCC internally regulated to VDD_ANA (see Table 11)

4. IOVCC internally regulated to VDD_DIG (see Table 11)

T able 11. Power Supply Electrical Specifications (Analog and Digit al LDOs)

Symbol Parameter Min

VDD_ANA_OUT VDD_DIG_OUT

Analog Voltage Output Range 2.8 V

Digital Voltage Ou tput Range 2.5 V

Typ

Max Unit

1. Typical operating conditions are VCC = 3.3V, IOVCC = 3.3V o perating voltage and 25°C ambient temper ature. Values

reflect voltage s of i nter nally generated, regulated voltages VDD_ANA and VDD_DIG

2. Output of internally generated regulated vol tage VDD_ANA

3. Output of internally generated regulated voltage VDD_DIG

www.national.com 8 Revision 1.0

6.0 Electrical Specifications (Continued)

LMX9820A Bluetooth Serial Port Module

Note: The voltage regulators are optimized for the internal

operation of the LMX9820A. Because any noise coupled

mance, it is highly recommended to have no additional load on their outputs.

into these supplies can have influence on the radio perfor-

Table 12. Power Supply Requirements

Symbol Parameter Min Typ

CC-TX

CC-RX

CC-Inq

RXSL Receive Data in SPP Link, slave

RXM

HV3

SnM Sniff Mode, snif f interval 1 second

SC-TLDIS

Idle Idle, scanning disabled, TL disabled

Power supply curre nt for continuous transmi t 68 mA Power supply curre nt for continuous receive 62 mA Inquiry 31 mA

3,4

Receive Data in SPP Link, master

3,4

Active HV3 SCO Audio Link 22 mA

Scanning, no active link, TL disabled

3,5

1. Power supply requirements based on Class II output power.

2. VCC = 3.3V, IOVCC = 3.3V, Ambient Temperature = +25°C.

3. Average values.

4. Based on UART Baudrate 115.2kbit/s.

5. TL: Transport Layer

Max Unit

23 mA 18 mA

8mA

2.5 mA

0.15 mA

6.2 DC CHARACTERISTICS

T able 13. Digital DC Charact eristics

Symbol Parameter Condition Min Max Units

VCC IOVCC

HYS Hysteresis Loop Width

OHW

O(Off)

Core Logic Supply Voltage 2.85 3. 6 V

IO Supply Voltage 2.85 3. 6 V Logical 1 Input Voltag e 0.7 x

VDD_ANA

VDD_ANA +

0.5

Logical 0 Input Voltag e -0.5 0.2 x

VDD_ANA

0.1 x

VDD_ANA

Logical 1 Output Current VDD_ANA = 2.8V -1.6 mA Logical 0 Output Current VDD_ANA = 2.8V 1.6 mA Weak Pull-up Current VDD_ANA = 2.8V -10 µA High-level Input Current VIH = VDD_ANA = 2.8V - 10 10 µA Low-level Input Current VIL = 0 - 10 10 µA High Impedance Input Lea kage

0V ≤ VIN ≤ VDD_ANA -2.0 2.0 µA

Current Output Leakage Current (I/O pins in

input mode)

0V ≤ V

≤ VDD_DIG -2.0 2.0 µA

OUT

1. VCC internally regulated to VDD_ANA (see Table 11)

2. IOVCC internally regulated to VDD_DIG (see Table 11)

3. Guaranteed by design.

Revision 1.0 9 www.national.com

6.0 Electrical Specifications (Continued)

• T

6.3 RF PERFORMANCE CHARACTERISTICS

In the performance characteristics tables the following applies:

• All tests per for m ed are based on Bluetooth Test Specifi-

cation rev 0.92.

• All tests are measured at antenna port unless ot herwise

specified

Ta ble 14. Receiver Performance Characterist ics

Symbol Parameter Condition Min Typ

sense

PinRF Maximum Input Level -10 0 dBm C/I

C/I

IMP

ACI

-1MHz Carrier to Interf erer Ratio in

IMAGE

3,4

LMX9820A Bluetooth Serial Port Module

RSSI RSSI Dynamic Range at L NA

RFIN

Return Loss

OOB

1. Typical operating conditions are at 2.85V operating voltage and 25°C ambient temperature.

2. The receiver sensi tivity is measured at the dev ice interface.

3. Not tested in producti on.

Receive Sensitivity BER < 0.001 2.402 GHz -81 -77 dBm

Carr ie r to Inter ferer Ratio in the Presence of Adjacent Channel Interfer er

∆F

= + 1 MHz,

ACI

RF = -60 dBm,

BER < 0.001

= + 2 MHz.

∆F

ACI

RF = -60 dBm,

BER < 0.001

= + 3 MHz,

∆F

ACI

RF = -67 dBm,

BER < 0.001

∆f = -3 MHz, the Presence of Image-1 MHz Interferer

PinRF = -67 dBm,

BER < 0.001 Intermodul ation Performance F1= + 3 MHz,

= + 6 MHz,

RF = -64 dBm

Input Input Impedance of RF Port

(RF_inout)

Return Loss Out Of Band Blocking

Performance

Single input impedance

= 2.45 GHz

PinRF = -10 dBm,

30 MHz < F

BER < 0.001

RF = -27 dBm,

2000 MHz < F

BER < 0.001

RF = -27 dBm,

2498 MHz < F

BER < 0.001

RF = -10 dBm,

3000 MHz < F

BER < 0.001

= -40°C to +85°C

• VCC = 3.3V, IOVCC = 3.3V unless otherwise speci fied RF system performance specifications are guaranteed on

National Semiconductor Austin Board rev1.0b reference design platform.

2.441 GHz -81 -77 dBm

2.480 GHz -81 -77 dBm

-38 -36 dBm

-72 -52 dBm

50 Ω

-10 dBm

< 2 GHz,

CWI

-27 dBm

< 2399 MHz,

CWI

-27 dBm

< 3000 MHz,

CWI

-10 dBm

< 12.75 GHz,

CWI

Max Unit

-1 dB

-37 dB

-47 dB

-32 dB

-8 dB

www.nationa l.c om 10 R ev is io n 1.0

6.0 Electrical Specifications (Continued)

4. The f0 = -64 dBm Bluetooth modulated signal, f1 = -39 dbm sine wave, f2 = -39 dBm Bluetooth modulated signal, f

= 2f1 - f2, and |f2 - f1| = n x 1 MHz, in which n is 3, 4, or 5. For the typical case, n = 3.

T able 15. Transmitter Performance Characteristics

Symbol Parameter Condi tion Min Typ

OUT

Transmit Output Power 2.402 GHz -3 +1 +4 dBm

2.441 GHz -3 +1 +4 dBm

2.480 GHz -3 +1 +4 dBm

Power Density

∆F1

MOD

AVG

∆F2

MOD

MAX

∆F2

AVG

/∆F1

AVG

Power Density Modulation Charac teristics Data = 00001111 140 165 175 kHz

Modulation Charac teristics Data = 10101010 1 15 125 kHz

Modulation Characteristics 0.8

-4 1 2 dBm

20 dB Bandwidth 1000 kHz ACP

OUT

RFOUT

2*fo

3*fo

Adjacent Channel Power (In-band Spurious)

PA 2nd Harmonic Suppression

PA 3rd Harmonic Suppression

RF Output Impedance/I nput

| M - N | = 2 -48 -20 dBm | M - N | >

3-51-40dBm

Maximum gain setting: f

= 2402 MHz,

= 4804 MHz

out

Maximum gain setting: f

= 2402 MHz,

= 7206 MHz

out

@ 2.5 GHz 50 Ω

out

Impedance of RF Port (RF_inout)

Return Loss

Return Loss -14 dB

1. Typical operating conditions are at VCC = 3.3V, IOVCC = 3.3V operating voltage and 25°C ambient temperature.

2. The output power is measure at the device interface.

3. ∆F2max > 115 kHz for at least 99.9% of all ∆f2max.

4. Modulation index set bet ween 0.28 and 0.35.

5. Not tested in producti on.

6. Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.

Max Unit

-30 dBm

-32 dBm

LMX9820A Bluetooth Serial Port Module

T able 16. Synthesize r Perf orm ance Characteristics

Symbol Parameter Condition Min Typ Max Unit

VCO

LOCK

∆f

offset drift

VCO Frequency Range 5000 MHz Lock Time f0 + 20 kHz 120 µs

1,2

Initial Carrier Fr equency Tolerance During preamble -75 0 75 kHz

2,3

Initial Carrier Frequency Drift DH1 data packet -25 0 25 kHz

DH3 data packet -40 0 40 kHz DH5 data packet -40 0 40 kHz Drift Rate -20 0 20 kHz/50µs

-Tx Transmitter Delay Time From Tx data to antenna 4 µs

Revision 1.0 11 www.national.com

6.0 Electrical Specifications (Continued)

1. Frequency ac curacy is dependent on crystal oscill ator chos en. The cry stal must have a cumulativ e accuracy o f <20 pp m to meet Bluetooth specifications.

2. Not tested in producti on.

3. Frequency ac curacy is dependent on crystal oscill ator chos en. The cry stal must have a c umulative accuracy of <20 pp m to meet Bluetooth specifications.

6.4 PERFORMANCE DATA (T YPICAL)

IL(dB)

LMX9820A Bluetooth Serial Port Module

Figure 5. Corresponding Eye Diagram

Figure 3. Modulation

Figure 6. Synthesizer Phase Noise

Figure 4. Transmit Spectrum

-2

-4

-6

-8

-10

Filter Insertion Loss

Frequency (Hz)

2.8E+0

2.7E+092.2E+092.1E+09 2.3E+09 2.4E+09 2.5E+09 2.6E+09

Figure 7. Front-End Bandpass Filter Response

www.nationa l.c om 12 R ev is io n 1.0

6.0 Electrical Specifications (Continued)

LMX9820A Bluetooth Serial Port Module

1.00

2.00

0.50

S(1.1)

m2 freq = 2.402 GHz S(1.1) = 0.093/-29.733 impedance = Z0* (1.170 - j0.109)

m1 freq = 2.500 GHz S(1.1) = 0.035/175.614 impedance = Z0* (0.933 + j0.005)

Figure 8. TX and RX Pin 50Ω Impedance Characteristics

0.00

-0.50

0.50

1.00

freq(2.400 GHz to 2.500 GHz)

-1.00

2.00

-2.00

Revision 1.0 13 www.national.com

7.0 Functional Description (Continued)

LMX9820A Bluetooth Serial Port Module

Figure 9. Transceiver Return Loss

7.0 Functional Description

7.1 BASEBAND AND LINK MANAGEMENT

PROCESSORS

Baseband and Lower Link control functions are implemented using a combination of National Semiconductor’s CompactRISC 16-bit processor and the Bluetooth Lower Link Controller. These processors operate from integrated Flash memory and RAM and execute on-board firmware implementing all Bl uetooth functions.

7.1.1 Bluetooth Lower Link Controller

The integrated Bluetooth Lower Link Controller (LLC) complies with the Bluetooth Specification version 1.1 and implements the f oll owing functions:

• Support for 1, 3, and 5 slot packet types

• 79-channel hop frequency generation circuitry

• Fast frequency hopping at 1600 hops per second

• Power management control

• Access code corr elation and slot timing recovery

7.1.2 Bluetooth Upper Layer Stack

The integrated upper layer stack is prequalified and includes the following protocol layers:

• L2CAP

• RFComm

• SDP

7.1.3 Profile Support

The on-chip applicati on of th e LMX982 0A all ows ful l standalone operation, without any Bluetooth protocol layer necessary outside the module. It supports the Generic Access Profile (GAP), the Service Discovery Application Profile (SDAP), and the Serial Port Profile (SPP) .

The on-chip prof il es can be used as inter faces to additional profiles executed on the host. The LMX9820A includes a configurable service database to answer requests with the profiles suppo rted.

7.1.4 Application with Command Int erface

The module supports automatic slave operation eliminating the need for an external control unit. The implemented transparent option enables the chip to handle incoming data raw, without the need for packaging in a special format. The device uses a fixed pin to block unallowed connections.

Acting as master, the application offers a simple but versatile command interface for standard Bluetooth operations such as inquiry, service discovery, and serial port connection. The firmware supports up to three slaves. Default L ink Policy settings and a specific master mode allow optimized configuration for the application specific requirements. See also Section "Integrated Firmware" on page 24.

www.nationa l.c om 14 R ev is io n 1.0

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