LMX2525 PLLatinum Dual Frequency Synthesizer System with Integrated VCOs
April 2004
PLLatinum
™
Dual Frequency Synthesizer System
with Integrated VCOs
General Description
LMX2525 is a highly integrated, high performance, low
power frequency synthesizer system optimized for dualband Japan PDC mobile handsets. Using a proprietary digital phase locked loop technique, LMX2525 generates very
stable, low noise local oscillator signals for up and down
conversion in wireless communications devices.
LMX2525 includes dual voltage controlled oscillators (VCOs)
for the upper and lower Japan PDC frequency bands, a loop
filter, and a fractional-N RF PLL based on a delta sigma
modulator. In concert, these blocks form a closed loop RF
synthesizer system. The RF synthesizer system supports
two frequency bands: PDC1500 and PDC800.
Serial data is transferred to the device via a three-wire
MICROWIRE interface (DATA, LE, CLK).
Operating supply voltage ranges from 2.5 V to 3.3 V.
LMX2525 features low current consumption: 10 mA at 2.8 V
when operating in the PDC800 mode.
LMX2525 is available in a 24-pin leadless leadframe package (LLP).
Features
n Small Size
5.0 mm X 4.0 mm X 0.75 mm 24-Pin LLP Package
n RF Synthesizer System
Two Integrated VCOs
Integrated Loop Filter
Low Spurious, Low Phase Noise Fractional-N RF PLL
Based on 10-Bit Delta Sigma Modulator
Frequency Resolution Down to 20 kHz
n Supports Various Reference Frequencies
12.6 MHz, 14.4 MHz, 25.2MHz, and 26.0 MHz
n Fast Lock Time: 300 µs
n Low Current Consumption
10 mA at 2.8 V in PDC800 Mode
n 2.5 V to 3.3 V Operation
n Digital Filtered Lock Detect Output
n Hardware and Software Power Down Control
Applications
n Japan PDC Systems at 800 MHz and 1500 MHz
Frequency Bands.
Functional Block Diagram
20068907
FastLock™is a trademark of National Semiconductor Corporation.
is a registered trademark of National Semiconductor Corporation.
™
is a trademark of National Semiconductor Corporation.
Connection Diagram
LMX2525
Note: Analog ground connected through exposed die attached pad.
Pin Descriptions
Pin NumberNameI/ODescription
1L1—RF2 VCO tank pin. An external inductor is required between pins
2L2—RF2 VCO tank pin. An external inductor is required between pins
3NC—Do not connect to any node on the printed circuit board.
4NC—Do not connect to any node on the printed circuit board.
5V
6RF1outORF output of RF1 VCO for PDC1500
7V
8RF2outORF output of RF2 VCO for PDC800
9V
10V
11GND—Ground for digital circuitry
12V
13LEIMICROWIRE Latch Enable
14DATAIMICROWIRE Data
15CLKIMICROWIRE Clock
16CEIChip enable control pin
17BSIBand select control pin
18LDOLock detect pin
19V
20OSCinIReference frequency input
21GND—Ground for digital circuitry
22V
23GND—Ground for analog circuitry
24V
DD
DD
DD
CC
CC
CC
DD
DD
24-Pin 5x4 LLP (LQ) Package
20068902
L1 and L2 to set the resonant frequency of RF2 VCO (PDC800).
L1 and L2 to set the resonant frequency of RF2 VCO (PDC800).
—Supply voltage for RF analog circuitry
—Supply voltage for RF analog circuitry
—Supply voltage for analog circuitry
—Supply voltage for digital circuitry
—Supply voltage for digital circuitry
—Supply voltage for digital circuitry
—Supply voltage for analog circuitry
—Supply voltage for RF analog circuitry
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Ordering Information
Part NumberRF1 Min.
(MHz)
LMX2525LQX13211270.221394.95~1321633.15768.00252513214500 units on
LMX2525LQ13211270.221394.95~1321633.15768.00252513211000 units on
RF1 Max.
(MHz)
RF1
Center
(MHz)
RF2 Min.
(MHz)
RF2 Max.
(MHz)
Package
Marking
Part Number Description
20068903
Typical Application Circuit (Note 1)
LMX2525
Supplied As
tape and reel
tape and reel
20068904
Note 1: Refer to RF2 VCO Tuning Range vs. External Inductance plot to aid in selecting the appropriate external inductance, PCB trace and L1, for the desired
frequency range.
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Absolute Maximum Ratings (Notes 2, 3,
4)
LMX2525
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ParameterSymbol RatingsUnits
Supply VoltageV
Voltage on any pin
to GND
Storage Temperature Range T
CC,VDD
V
I
STG
-0.5 to 3.6V
-0.3 to VCC+ 0.3V
-0.3 to V
-65 to 150˚C
+ 0.3V
DD
Recommended Operating
Conditions
ParameterSymbolMin Typ Max Unit
Ambient TemperatureT
Supply Voltage (to GND) V
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to
the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee
specific performance limits. For guaranteed specifications and test conditions, refer to the Electrical Characteristics section. The guaranteed specifications apply only for the conditions listed.
Note 3: This device is a high performance RF integrated circuit with an ESD
<
rating
2 kV and is ESD sensitive. Handling and assembly of this device
should be done at ESD protected workstations.
Note 4: GND=0V.
A
CC,VDD
-30 2585˚C
2.53.3V
Electrical Characteristics (V
= 25 ˚C; Limits in boldface type apply over the operating temperature range from -20 ˚C ≤ TA≤ 75 ˚C unless other-
for T
A
= 2.8 V, refer to Typical Application Circuit; Limits in standard typeface are
IN
wise noted.)
SymbolParameterConditionMinTypMaxUnits
I
PARAMETERS
CC
I
CC+IDD
Supply Current (Note 5)OB_CRL [1:0] = 1010.612.0
mA
12.3
OB_CRL [1:0] = 0010.011.5
mA
11.8
I
CC+IDD
Supply Current (Note 6)OB_CRL [1:0] = 1015.016.5
mA
16.8
OB_CRL [1:0] = 0014.215.6
mA
15.9
I
PD
Power Down CurrentCE = LOW or
20µA
RF_PD = 1
REFERENCE OSCILLATOR PARAMETERS
f
OSCin
V
OSCin
Reference Oscillator Input Frequency
(Note 7)
Supports 12.6, 14.4, 25.2
and 26.0 MHz.
12.614.426.0MHz
Reference Oscillator Input Sensitivity0.5V
CC
Vp-p
RF1 VCO FOR PDC1500
f
RF1out
P
RF1out
Frequency Range (Note 8)RF1 VCO for PDC15001270.221394.95MHz
Output PowerOB_CRL [1:0] = 11-5-21dBm
OB_CRL [1:0] = 10-7-4-1dBm
OB_CRL [1:0] = 01-10-7-4dBm
OB_CRL [1:0] = 00-13-10-7dBm
Lock TimeFull frequency span within
each band in High Speed
300
(Note 9)
µs
Mode (HS = 1).
Between bands High Speed
Mode (HS = 1).
Full frequency span within
each band in Normal Mode
(HS = 0).
(Note 11)
Between bands in Normal
Mode (HS = 0).
300
(Note 9)
500
(Note 9)
375
(Note 10)
500
(Note 9)
400
µs
µs
µs
µs
µs
(Note 10)
RMS Phase Error1.3degrees
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LMX2525
Electrical Characteristics (V
= 25 ˚C; Limits in boldface type apply over the operating temperature range from -20 ˚C ≤ TA≤ 75 ˚C unless otherwise
T
A
= 2.8 V, refer to Typical Application Circuit; Limits in standard typeface are for
IN
noted.) (Continued)
SymbolParameterConditionMinTypMaxUnits
RF1 VCO FOR PDC1500
L(f)
RF1out
Phase Noise when RF1 VCO for
PDC1500 is activated in Normal
Mode (HS = 0).
= 25 ˚C; Limits in boldface type apply over the operating temperature range from -20 ˚C ≤ TA≤ 75 ˚C unless otherwise
T
A
noted.) (Continued)
LMX2525
= 2.8 V, refer to Typical Application Circuit; Limits in standard typeface are for
IN
SymbolParameterConditionMinTypMaxUnits
RF2 VCO FOR PDC800
Spurious Tones
@
≤ 25 kHz offset-45dBc
@
25 kHz<offset ≤ 50 kHz-60dBc
@
50 kHz<offset ≤ 100 kHz-69dBc
@
offset>100 kHz-75dBc
DIGITAL INTERFACE (DATA, CLK, LE, LD, CE, BS)
V
IH
V
IL
I
IH
I
IL
High-Level Input Voltage0.8 V
0.8 V
CC
DD
Low-Level Input Voltage-0.30.2 V
-0.30.2 V
V
CC
V
DD
CC
DD
High-Level Input Current-1010µA
Low-Level Input Current-1010µA
Input Capacitance3pF
Rise/Fall Time30ns
V
OH
V
OL
High-Level Output VoltageVCC- 0.4V
V
- 0.4V
DD
Low-Level Output Voltage0.4V
Output Capacitance5pF
MICROWIRE INTERFACE TIMING
t
CS
t
CH
t
CWH
t
CWL
t
DS
Data to Clock Set Up Time50ns
Data to Clock Hold Time10ns
Clock Pulse Width HIGH50ns
Clock Pulse Width LOW50ns
Latch Enable LOW to Data Set Up
50ns
Time
t
ES
t
EW
Note 5: RF PLL and VCO in PDC800 mode.
Note 6: RF PLL and VCO in PDC1500 mode.
Note 7: The reference frequency must be programmed using the OSC_FREQ control bit. For other reference frequencies, please contact National Semiconductor.
Note 8: For other frequency ranges, please contact National Semiconductor.
Note 9: Lock time is defined as the time difference between the beginning of the frequency transition and the point at which the frequency remains within +/-1 kHz
of the final frequency.
Note 10: Lock time is defined as the time difference between the beginning of the frequency transition and the point at which the frequency remains within +/-3 kHz
of the final frequency.
Note 11: Lock time specification also applies to power up with MICROWIRE serial interface.
Note 12: All limits are guaranteed. All electrical characteristics having room temperature limits are tested during production with T
Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations
and applying statistical process control.
Clock to Latch Enable Set Up Time50ns
Latch Enable Pulse Width50ns
= 25 ˚C or correlated using
A
V
V
V
V
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MICROWIRE Interface Timing Diagram
LMX2525
20068901
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Typical Performance Characteristics (Note 13)
LMX2525
Note 13: Typical performance characteristics do not guarantee specific performance limits. For guaranteed specifications, refer to the Electrical Characteristics
section.
Note 14: The frequency range is defined as the difference between the highest frequency and the lowest frequency of a given unit. For a chosen external
inductance, the typical frequency range equals the difference between the Typical Maximum Frequency and the Typical Minimum Frequency. Typical frequency
range may be assumed on any unit with that chosen external inductance, even if the unit has worst case Maximum Frequency or worst case Minimum Frequency.
RF2 VCO Tuning Range vs. External Inductance (Note 14)
= 2.8 V
V
IN
20068911
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Functional Description
GENERAL
The LMX2525 is a highly integrated frequency synthesizer
system for Japan PDC wireless communication systems.
The LMX2525 supports dual band operation for 800 MHz
and 1500 MHz.
The LMX2525 includes all functional blocks for the RF PLL
including RF VCOs, frequency dividers, PFDs, and loop
filters. Only external passive elements for the RF2 VCO tank
and supply bypassing are required to complete the RF synthesizer.
The LMX2525 uses a patent pending Fractional-N synthesizer architecture based on a delta sigma modulator to support fine frequency resolution. Four of the most common
reference frequencies for PDC applications, 12.6 MHz, 14.4
MHz, 25.2 MHz and 26.0 MHz, are supported. The unique
feature of this architecture is its low spurious modulation
effect.
The use of a fractional synthesizer based on a delta sigma
modulator allows for faster lock and system set-up times,
which reduces system power consumption. The loop filter is
included on chip to minimize the external noise coupling and
to reduce the form factor applicable to the board level application. Only one of the two RF VCOs is activated at a given
time, and each output is provided through its own output pin.
20068910
where C
is the total capacitance of the VCO, including
total
the parasitic capacitance and the nominal self-tuning capacitance. Note, the external inductance consists of the PCB
traces and lumped element inductor. The output frequency
tuning range can be optimized for the specific application by
selecting the appropriate external inductance. Refer to RF2
VCO Tuning Range vs. External Inductance plot to aid in
selecting the appropriate external inductance. Care should
be taken to ensure proper frequency coverage when choosing the tolerance of the lumped element inductor. For the
1500 MHz band, the internal bonding-wires provide the necessary inductance to set the VCO center frequency.
LMX2525
RF PLL SECTION
Frequency Selection
The divide ratio can be calculated using the following equations:
= {8 x RF_B + RF_A+ (RF_FN / FD)} x (f
f
VCO
<
(RF_A
f
VCO
(RF_A
f
VCO
RF_B) for PDC1500
= {4 x RF_B + RF_A+ (RF_FN / FD)} x (f
<
RF_B) for PDC800
: Output frequency of voltage controlled oscillator (VCO)
OSC
OSC
/ R) where
/ R) where
RF_B: Preset divide ratio of binary 4-bit programmable
counter (2 ≤ RF_B ≤ 15)
RF_A: Preset divide ratio of binary 3-bit swallow counter (0 ≤
RF_A ≤ 7 for PDC1500 and 0 ≤ RF_A ≤ 3 for PDC800)
RF_FN: Preset numerator of binary 10-bit modulus counter
<
(0 ≤ RF_FN
FD: Preset denominator for modulus counter (FD = f
) where fCHis the channel spacing)
Xf
CH
: Reference oscillator frequency
f
OSC
FD)
OSC
/(R
R: Internal reference oscillator frequency divider (1 for 12.6
MHz and 14.4 MHz, 2 for 25.2 MHz and 26.0 MHz)
The denominator, FD, in the above equation is dependent on
the channel spacing and reference oscillator frequency. The
channel spacing will change based on the Rx/Tx and BS
bits. Table 6 in the R0 Register section summarizes the
values of FD.
VCO Frequency Tuning
The center frequency of the RF VCOs are determined by the
resonant frequency of the tank circuit, illustrated in Figure 1.
With an internal fixed bonding-wire inductor and an external
inductance, the center frequency of the VCO is given as
follows:
20068905
FIGURE 1. External Inductor Connection
In real implementation, the inductance of L
fixed
and L
external
can vary from its nominal value. The LMX2525 utilizes a
built-in tracking algorithm to compensate for variations up to
±
15% and tunes the VCO to the required frequency. During
the frequency acquisition period, the loop bandwidth is extended to achieve the frequency lock. After the frequency
lock, the loop bandwidth of the PLL is set to the nominal
value and the phase lock is achieved. The transition between the two operating modes is very smooth and extremely fast to meet the stringent PDC requirements for lock
time and phase noise.
POWER DOWN MODE
The LMX2525 includes the power down mode to reduce the
power consumption. The LMX2525 enters the power down
mode either by taking the CE pin LOW or by setting the
RF_PD bit in the R0 register. If the CE pin is set LOW, the
circuit is powered down regardless of the register values.
When the CE pin is HIGH, the RF_PD bit controls power to
the RF circuitry. Data can be written to the registers even
when the CE pin is set LOW. The following truth table
summarizes the power down logic.
TABLE 1. Power Down Modes
CE PinRF_PD BitMode
HIGH0Active
HIGH1Not Active
LOW0Not Active
LOW1Not Active
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Functional Description (Continued)
BAND SELECT MODE
LMX2525
The BS pin and BS bit can be used to select one of the two
RF VCO outputs. When using the BS pin, the BS bit must be
set to 0, and when using the BS bit, the BS pin must be tied
to ground. When using the BS pin, the state of the input must
exceed the minimum band select set up time prior to the LE
signal transition. The truth table summarizing the band select
logic is as follows:
on the LD pin. When the PLL is not locked, the LD pin
remains LOW. After obtaining phase lock, the LD pin will
have a logical HIGH level. The LD output is always LOW
when the LD register bit is 0 and in power down mode.
TABLE 3. Lock Detect Modes
LD BitMode
0Disable (GND)
1Enable
TABLE 2. Band Select Modes
BS PinBS BitMode
HIGH0PDC1500
LOW0PDC800
LOW1PDC1500
LOCK DETECT MODE
The LD output can be used to indicate the lock status of the
PLL. Bit 6 in Register R1 determines the signal that appears
Note 15: LD output becomes LOW when the phase error is larger than tW2.
Note 16: LD output becomes HIGH when the phase error is less than t
four or more consecutive cycles.
Note 17: Phase Error is determined on the leading edge. Only errors greater
than t
and tW2are labeled.
W1
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W1
for
Note 18: t
both bands.
Note 19: The lock detect comparison occurs with every 64
f
.
N
is 5 ns for PDC1500 and 10 ns for PDC800. tW2is 10 ns for
W1
th
cycle of fRand
Functional Description (Continued)
LMX2525
FIGURE 3. Lock Detect Flow Diagram
LOCKING MODES
Two frequency-locking modes are provided: a Normal mode
and a High Speed mode for faster lock times. The HS bit in
register R0 controls the locking mode.
TABLE 5. Locking Modes
HS BitMode
0Normal mode
1High Speed mode
20068909
MICROWIRE INTERFACE
The programmable register set is accessed via the
MICROWIRE serial interface. The interface is comprised of
three signal pins: CLK, DATA, and LE (Latch Enable). Serial
data is clocked into the 24-bit shift register on the rising edge
of the clock. The last bits decode the internal control register
address. When the latch enable (LE) transitions from LOW
to HIGH, data stored in the shift registers is loaded into the
corresponding control register. The data is loaded MSB first.
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Programming Description
GENERAL PROGRAMMING INFORMATION
LMX2525
The serial interface has a 24-bit shift register to store the incoming data bits temporarily. The incoming data is first loaded into the
shift register from MSB to LSB. The data is shifted at the rising edge of the clock signal. When the latch enable signal transitions
from LOW to HIGH, the data stored in shift register is transferred to the proper register depending on the address bit setting. The
selection of the particular register is determined by the control bits indicated in boldface text.
At initial start-up, the MICROWIRE loading requires three default words (registers R2, loaded first, to R0, loaded last). After the
device has been initially programmed, the RF VCO frequency can be changed using a single register (R0).
The control register content map describes how the bits within each control register are allocated to the specific control functions.
COMPLETE REGISTER MAP
MSBSHIFT REGISTER BIT LOCATIONLSB
Register
R0
(Default)
R1
(Default)
R2
(Default)
R31 0 0 00 1101000000000 0 1 1 01 1
R40 0 0 00 0111010001100 1 0 011 1
R50 0 0 00 0000000000000 0 0111 1
Note: R0 control register will be used when hot start frequency change.
Note: Boldface text represent address bits.
23 22 21 2019 1817161514131211109876 5 4 3 2 1 0
RX/TXRF_PDHS 0BSRF_B
[3:0]
SPI_
0 0 10 010100000010LDOB_
DEF
1 1 0 01 0000111100000 0 0 0 1 10
RF_A
[2:0]
RF_FN
[9:0]
CRL
[1:0]
OSC_
FREQ
[1:0]
00
01
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Programming Description (Continued)
R0 REGISTER
The R0 register address bits (R0 [1:0]) are “00”.
The Rx/Tx bit selects between receive and transmit modes and, in conjunction with the band select bit (BS), the channel spacing
to be synthesized.
The RF_PD bit selects the power down mode of the RF PLL and selected VCO.
The HS bit selects between normal and high speed locking mode.
The BS bit determines which of the two internal VCOs (PDC800 or PDC1500) is active.
The RF N counter consists of the 4-bit programmable counter (RF_B counter), the 3-bit swallow counter (RF_A counter) and the
10-bit delta sigma modulator (RF_FN counter). The equations for calculating the counter values are presented below.
R0 REGISTER
MSBSHIFT REGISTER BIT LOCATIONLSB
23 22 21 2019 1817161514131211109876543210
Data FieldAddress
Register
R0
(Default)
RX/TXRF_PDHS 0BSRF_B
[3:0]
NameFunctions
RX/TXRX/TX Mode
RF_PDPower Down of RF Synthesizer
HSLocking Mode
BSBand Select
RF_B [3:0]RF_B Counter
RF_A [2:0]RF_A Counter
RF_FN [9:0]RF_FN Counter
RF_A
[2:0]
0=Rx
1=Tx
0 = RF synthesizer on (Active mode)
1 = RF synthesizer powered down
0 = Normal Mode
1 = High Speed Mode
1 = RF1 VCO (PDC1500)
0 = RF2 VCO (PDC800)
4-bit programmable counter
0 ≤ RF_B ≤ 15 for both bands
3-bit swallow counter
0 ≤ RF_A ≤ 7 for PDC1500
0 ≤ RF_A ≤ 3 for PDC800
: Output frequency of voltage controlled oscillator (VCO)
f
VCO
RF_B: Preset divide ratio of binary 4-bit programmable counter (2 ≤ RF_B≤ 15)
RF_A: Preset divide ratio of binary 3-bit swallow counter (0 ≤ RF_A ≤ 7 for PDC1500 and 0 ≤ RF_A ≤ 3 for PDC800)
RF_FN: Preset numerator of binary 10-bit modulus counter (0 ≤ RF_FN
FD: Preset denominator for modulus counter (FD = f
f
: Reference oscillator frequency
OSC
R: Internal reference oscillator frequency divider
OSC_FREQ [1:0]Reference Oscillator Frequency (MHz)R Divider
0012.61
0114.41
1025.22
1126.02
The value of the denominator (FD) is depended on the channel spacing and reference oscillator frequency. Table 6 summarizes
the denominator values based on the settings of the Rx/Tx, BS, and OSC_FREQ [1:0] bits.
Rx/TxBSOSC_FREQ [1:0]Reference Oscillator Frequency (MHz)RfCH(kHz)Denominator(FD)
000012.6125.0504
000114.4125.0576
001025.2225.0504
001126.0225.0520
010012.6125.0504
010114.4125.0576
011025.2225.0504
011126.0225.0520
100012.6120.0630
100114.4120.0720
101025.2220.0630
101126.0220.0650
110012.6122.22567
110114.4122.22648
111025.2222.22567
111126.0222.22585
/ R where (RF_A<RF_B) for PDC1500
OSC
/ R where (RF_A<RF_B) for PDC800
OSC
<
FD)
/(RxfCH) where fCHis the channel spacing)
OSC
TABLE 6. Demonimator Values
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Programming Description (Continued)
R1 REGISTER
The R1 register address bits (R1 [1:0]) are “01”.
The SPI_DEF bit allows for the programming of words R3 to R5. Under most circumstances, the SPI_DEF bit should be set to
1.
The LD bit sets the function of the lock detect pin. Enabling the lock detect function provides a digital lock detect output of the
active RF synthesizer at the LD pin.
The OB_CRL [1:0] bits determine the power level of the RF output buffer. The power level can be adjusted to best meet the
system requirement. Refer to the Electrical Characteristics section for power output specifications.
The reference frequency selection bits, OSC_FREQ [1:0], are used to set the reference clock and R divider for use with one of
the following reference frequencies: 12.6 MHz, 14.4 MHz, 25.2 MHz or 26.0 MHz. The LMX2525 uses the OSC_FREQ bits along
with the BS and RX/TX bits to determine the correct divide ratios needed to meet the required channel spacing for the mode of
operation selected. Refer to Table 6 for a summary of denominator values.
R1 REGISTER
MSBSHIFT REGISTER BIT LOCATIONLSB
23 222120191817161514131211109876 5 4 3 2 10
Data FieldAddress
Register
R1
(Default)
SPI_
0010010100000010LDOB_
DEF
CRL
[1:0]
OSC_
FREQ
[1:0]
Field
01
LMX2525
NameFunctions
SPI_DEFDefault Register Selection
0 = OFF (Use values set in R0 to R5)
1 = ON (Use default values set in R0 to R2)
LDLock Detect
0 = Disable (GND)
1 = Enable
OB_CRL [1:0]Output Buffer Control
00 = Minimum Output Power
01 =
10 =
11 = Maximum Output Power
LMX2525 PLLatinum Dual Frequency Synthesizer System with Integrated VCOs
24-Pin Leadless Leadframe Package (LLP)
Order Number LMX2525
NSC Package Number LQA24A
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