National Semiconductor LMS4684 Technical data

LMS4684

0.5Ω Low-Voltage, Dual SPDT Analog Switch

LMS4684 0.5Ω Low-Voltage, Dual SPDT Analog Switch

June 2004

General Description

The LMS4684 is a low on-resistance, low voltage dual SPDT
(Single-Pole/Double-Throw) analog switch that operates
from a 1.8V to 5.5V supply. The LMS4684 features a 0.5Ω

for its NC switch and 0.8Ω RONfor its NO switch at a

R

ON

2.7V supply. The digital logic inputs are 1.8V logic­compatible with a 2.7V to 3.3V supply.

The LMS4684 is available in the 12 bump micro SMD and
the 10 lead LLP miniature packages. These PCB real estate
saving packages offer extreme performance while saving
money with small footprints.

Connection Diagrams

10-LLP Package 12-Bump micro SMD Package

Features

n NC switch R
n NO switch R
n 50nA (max) supply current T
n 1.8 to 5.5V single supply operation
n 12-Bump micro SMD package
n LLP-10 package, 3x4mm
n See AN-1112 for micro SMD package considerations
n See AN-1187 for LLP package considerations

ON

ON

0.5Ω max@2.7V

0.8Ω max@2.7V
= 25˚C

A

Applications

n Power routing
n Battery-operated equipment
n Communications circuits
n Modems
n Cell phones

DAP needs to be connected to pin 6 on the board

20077501

Top View

IN NO NC

0 Off On

1 On Off

Switches shown for Logic "0" input

© 2004 National Semiconductor Corporation DS200775 www.national.com

Center Bumps B2 and C2 are Not Electrically Connected

Top View

(Bumped Side Down)

20077502

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

LMS4684

please contact the National Semiconductor Sales Office/

Storage Temperature Range −65˚C to 150˚C

Junction Temperature (Note 3) 150˚C Max

Distributors for availability and specifications.

+

, IN −0.3V to 6.0V

V

COM, NO, NC −0.3V to (V

Continuous Current NO, NC,

+

+ 0.3V)

±

400mA

COM

ESD Tolerance (Note 2)

Human Body Model 2000V

Operating Ratings

Nominal Supply Voltage 1.8V to 5.5V

Temperature Range −40˚C to 85˚C

Thermal Resistance θ

LLP-10 TBD

micro SMD-12 TBD

JA

Machine Model 200V

Electrical Characteristics

Unless otherwise specified, V+= 2.7 to 3.3V, VIH= 1.4V, VIL= 0.5V. Typical values are measured at 3V, and TJ= 25˚C.

Boldface limits apply at temperature extremes.

Symbol Parameter Conditions Min Typ Max Units

,

V

NO

V

NC

V

COM

R

ON (NC)

R

ON (NO)

∆R

R

FLAT(NC)

Analog Signal Range 0 V

,

NC-On-Resistance (Note 4) V+=2.7, I

NO-On-Resistance (Note 4) V+=2.7, I

On-Resistance Match Between

ON

Channels (Note 4), (Note 5)

NC-On-Resistance Flatness (Note 6) V+=2.7V,

=0 to V

V

NC

=0 to V

V

NO

V+=2.7, I

or VNO=1.5V

V

NC

=100mA,

I

COM

=0 to V

V

NC

COM

COM

COM

=100ma,

+

=100ma,

+

=100ma,

+

LLP

=0˚C to 85˚C

T

J

micro SMD

0.3 0.5 Ω

0.45 0.8 Ω

TJ=0˚C to 85˚C

LLP

= −40˚C to +85˚C

T

J

micro SMD

= −40˚C to +85˚C

T

J

R

FLAT(NO)

I

NO(OFF)

or
I

NC(OFF)

I

COM

(ON)

NO-On Resistance Flatness (Note 6) V+=2.7V, I

= 0 to V

V

NO

COM

+

=100mA,

NO or NC Off-Leakage Current V+=3.3V, VNOor VNC=3V,

COM

=0.3V, 3V

COM

=3V, or floating

COM On-Leakage Current V

0.3V; V

+

=3.3V, VNOor VNC=3V,

0.3V, or floating; V

−1 1

−10 10

−2 2

−20 20

Dynamic Characteristics

t

t

t

ON

OFF

BBM

Turn-On Time V+=2.7V, VNOor VNC=1.5V;

=50Ω;CL=35pF;

R

L

Turn-Off Time V+=2.7V, VNOor VNC=1.5V;

=50Ω;CL=35pF;

R

L

Break-Before-Make-Delay V+=2.7V, VNOor VNC=1.5V;

=50Ω;CL=35pF;

R

L

Q Charge Injection COM =0; R

2 15 ns

=0; CL= 1nF; 200 pC

S

35 55

25 30

Digital I/O

V

IH

V

IL

I

IN

Input Logic High 1.4 V

Input Logic Low 0.5 V

IN Input Leakage Current VIN=0 or V

+

−1 1 µA

+

0.06 Ω

0.15

0.17

0.18

0.20

0.35 Ω

65

40

V

Ω

nA

nA

ns

ns

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Electrical Characteristics (Continued)

Unless otherwise specified, V+= 2.7 to 3.3V, VIH= 1.4V, VIL= 0.5V. Typical values are measured at 3V, and TJ= 25˚C.

Boldface limits apply at temperature extremes.

Symbol Parameter Conditions Min Typ Max Units

Power Supply

+

V

I+ Supply Current (Note 4) −50 0.04 50

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed.

Note 2: Human body model: 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 200pF.

Note 3: The maximum power dissipation is a function of T

Note 4: Guaranteed by design.

Note 5: ∆R

Note 6: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges.

Power-Supply Range 1.8 5.5 V

−200 200

J(max)θJA

is equal to the difference between NC1/NC2 RONor NO1/NO2 RONat a specified voltage.

ON

and TA.

nA

Symbolic Diagram

LMS4684

20077503

Ordering Information

Package Part Number Package Marking Transport Media NSC Drawing

12-Bump

micro SMD

10-Pin LLP LMS4684LD

LMS4684ITL

LMS4684ITLX 3k Units Tape and Reel

LMS4684LDX 4.5k Units Tape and Reel

F09A

L4684

250 Units Tape and Reel TLA12DPA

1k Units Tape and Reel LDA10B

Pin Descriptions

Name Pin ID Description

LLP micro SMD

NC 5, 7 D3, D1 Analog switch normally closed terminal

IN 4, 8 C3, C1 Digital control input

COM 3, 9 B3, B1 Analog switch common terminal

NO 2, 10 A3, A1 Analog switch normally open terminal

+

V

GND 6, GND D2 Ground

1 A2 Positive supply voltage

B2, C2 Not electrically connected. Can be used to help dissipate heat by connecting to GND

pin.

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Typical Performance Characteristics

LMS4684

Supply Current vs. Supply Voltage NO ON Resistance vs. COM Voltage

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20077505

NC ON Resistance vs. COM Voltage Logic Threshold Voltage vs. Supply Voltage

20077506

Turn-on / Turn-off Times vs. Temperature Charge Injection vs. COM Voltage

20077508

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20077507

20077509

Typical Performance Characteristics (Continued)

NC On-Resistance vs. COM Voltage NC On-Resistance vs. COM Voltage

LMS4684

20077515

NO On-Resistance vs. COM Voltage NO On-Resistance vs. COM Voltage

20077517 20077518

20077516

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Application Notes

PRODUCT DESCRIPTION

LMS4684

The LMS4684 is a low voltage dual analog switch with
extremely low On-Resistance operating with a supply volt­age range of 1.8V to 5.5V. National has fully characterized
the LMS4684 to operate in applications with 3V nominal
supply voltage. The LMS4684 also features fast switching
times for Turn-Off (40ns max over temp) and Turn-On (65ns
max over temp).

The switch operates asymmetrically, one terminal is normally
closed (NC) and the other terminal normally open (NO).

Both NC and NO terminals are connected to a common
terminal (COM). This configuration is ideal for applications
with asymmetric loads such as speaker handsets and inter­nal speakers.

ANALOG SIGNAL LEVELS

+

The Analog signal ranges from GND to V

and are passed
through the switch with very little change. Each switch is
bidirectional so any pin can be an input or output.

DIGITAL CONTROL INPUTS

The IN pin can be driven to 5.5V regardless of the voltage
level of the supply pin V

+

. For example if you wanted to have
a supply of 2V you could still drive the IN digital control input
to 5V. Minimum power is lost when the IN pin, is driven
rail-to-rail.

SUPPLY VOLTAGE SEQUENCING

It is good general practice to first apply the supply voltage to
a CMOS device before any other supply on other pins.This is
also true for the LMS4684 analog switch which is a CMOS
device.

However if it is necessary to have an analog signal applied
before the supply voltage is applied and the analog signal
supply is not limited to 20mA max, a diode connected be­tween the supply voltage and the V
figure below will supply adequate input protection. This will
limit the max analog voltage to a diode drop below V

+

pin as shown in the

+

. This
diode D1 will also provide protection against some overvolt­age situations.

20077519

FIGURE 1. Overvoltage Protection Circuitry

PCB LAYOUT

Both the LLP and micro SMD packages offer enhanced
board real estate savings because of their tiny footprints.
These tiny packages are capable of supporting up to an
absolute maximum of 400mA of continuous current because
of the advanced thermal handling capabilities.

The LLP package has the exposed die attach pad internally
connected to the internal circuit GND. When this pad is
soldered to copper on the PCB board according to Applica­tion Note AN-1187 the full thermal capability of the LLP
package can be achieved without additional bulky heat sinks
to dissipate the heat generated. The micro SMD package
has a similar capability to help dissipate heat generated
through Bumps B2 and C2 which are not electrically con­nected. To enhance heat dissipation of the micro SMD pack­age B2 and C2 could be connected to the GND pin and
through copper traces on the board.

Please see Application Note AN-1112 for micro SMD pack­age considerations.

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Parameter Measuring Information

LMS4684

20077510

FIGURE 2. tON/t

OFF

Time

FIGURE 3. Break-Before Make Delay

20077511

FIGURE 4. Charge Injection

20077513

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Parameter Measuring Information (Continued)

LMS4684

FIGURE 5. Channel Capacitance

20077514

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Physical Dimensions inches (millimeters) unless otherwise noted

LMS4684

10-Lead LLP

NS Package Number LDA10B

X1 = 1590±30 µm; X2 = 2327±30 µm; X3 = 600±75 µm

12-Bump micro SMD

NS Package Number TLA12DPA

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Notes

LMS4684 0.5Ω Low-Voltage, Dual SPDT Analog Switch

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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

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whose failure to perform when properly used in
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(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.

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