National Semiconductor LMK03000 Technical data

LMK03000 Family Precision Clock Conditioner with Integrated VCO
LMK03000 Family Precision Clock Conditioner with Integrated VCO
September 4, 2008

General Description

The LMK03000 family of precision clock conditioners com­bine the functions of jitter cleaning/reconditioning, multiplica­tion, and distribution of a reference clock. The devices integrate a Voltage Controlled Oscillator (VCO), a high per­formance Integer-N Phase Locked Loop (PLL), a partially integrated loop filter, and up to eight outputs in various LVDS and LVPECL combinations.
The VCO output is optionally accessible on the Fout port. In­ternally, the VCO output goes through a VCO Divider to feed the various clock distribution blocks.
Each clock distribution block includes a programmable di­vider, a phase synchronization circuit, a programmable delay, a clock output mux, and an LVDS or LVPECL output buffer. This allows multiple integer-related and phase-adjusted copies of the reference to be distributed to eight system com­ponents.
The clock conditioners come in a 48-pin LLP package and are footprint compatible with other clocking devices in the same family.

Target Applications

Data Converter Clocking
Networking, SONET/SDH, DSLAM
Wireless Infrastructure
Medical
Test and Measurement
Military / Aerospace

Features

Integrated VCO with very low phase noise floor
Integrated Integer-N PLL with outstanding normalized
phase noise contribution of -224 dBc/Hz VCO divider values of 2 to 8 (all divides)
Channel divider values of 1, 2 to 510 (even divides)
LVDS and LVPECL clock outputs
Partially integrated loop filter
Dedicated divider and delay blocks on each clock output
Pin compatible family of clocking devices
3.15 to 3.45 V operation
Package: 48 pin LLP (7.0 x 7.0 x 0.8 mm)
200 fs RMS Clock generator performance (10 Hz to 20
MHz) with a clean input clock
VCO
Device Outputs
LMK03000C
LMK03000 800
LMK03000D 1200
LMK03001C
LMK03001 800
LMK03001D 1200
LMK03033C
LMK03033 800
3 LVDS
5 LVPECL
4 LVDS
4 LVPECL
Tuning Range
(MHz)
1185 - 1296
1470 - 1570
1843 - 2160
RMS Jitter
(fs)
400
400
500

System Diagram

20211440
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© 2008 National Semiconductor Corporation 202114 www.national.com

Functional Block Diagram

LMK03000 Family
20211401
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Connection Diagram

LMK03000 Family
48-Pin LLP Package
20211402
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Pin Descriptions

Pin # Pin Name I/O Description
1, 25 GND - Ground
2 Fout O Internal VCO Frequency Output
3, 8, 13, 16, 19, 22,
LMK03000 Family
26, 30, 31, 33, 37,
40, 43, 46
4 CLKuWire I MICROWIRE Clock Input
5 DATAuWire I MICROWIRE Data Input
6 LEuWire I MICROWIRE Latch Enable Input
7, 34, 35 NC - No Connection to these pins
9, 10 LDObyp1, LDObyp2 - LDO Bypass
11 GOE I Global Output Enable
12 LD O Lock Detect and Test Output
14, 15 CLKout0, CLKout0* O LVDS Clock Output 0
17, 18 CLKout1, CLKout1* O LVDS Clock Output 1
20, 21 CLKout2, CLKout2* O LVDS Clock Output 2
23, 24 CLKout3, CLKout3* O
27 SYNC* I Global Clock Output Synchronization
28, 29 OSCin, OSCin* I
32 CPout O Charge Pump Output
36 Bias I Bias Bypass
38, 39 CLKout4, CLKout4* O LVPECL Clock Output 4
41, 42 CLKout5, CLKout5* O LVPECL Clock Output 5
44, 45 CLKout6, CLKout6* O LVPECL Clock Output 6
47, 48 CLKout7, CLKout7* O LVPECLClock Output 7
DAP DAP - Die Attach Pad is Ground
Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7, Vcc8, Vcc9, Vcc10,
Vcc11, Vcc12, Vcc13, Vcc14
- Power Supply
Clock Output 3 (LVDS for LMK03033C/LMK03033 LVPECL for all other parts)
Oscillator Clock Input; Should be AC coupled
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Absolute Maximum Ratings (Notes 1, 2)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Parameter Symbol Ratings Units
Power Supply Voltage
Input Voltage
Storage Temperature Range
Lead Temperature (solder 4 s)
Junction Temperature
V
CC
V
IN
T
STG
T
L
T
J
-0.3 to 3.6 V
-0.3 to (VCC + 0.3)
-65 to 150 °C
+260 °C
125 °C
V

Recommended Operating Conditions

Parameter Symbol Min Typ Max Units
Ambient Temperature
Power Supply Voltage
Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
Note 2: This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
T
A
V
CC
-40 25 85 °C
3.15 3.3 3.45 V
LMK03000 Family

Package Thermal Resistance

Package
48-Lead LLP (Note 3) 27.4° C/W 5.8° C/W
Note 3: Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in the board layout.
θ
JA
θ
J-PAD (Thermal Pad)
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Electrical Characteristics (Note 4)

(3.15 V Vcc 3.45 V, -40 °C TA 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
LMK03000 Family
I
CC
ICCPD
f
square
OSCin
V
square
OSCin
f
PD
I
CPout
SRCE
I
CPout
SINK
I
TRI Charge Pump TRI-STATE® Current 0.5 V < V
CPout
I
%MIS
CPout
I
VTUNE
CPout
I
TEMP
CPout
PN10kHz
PN1Hz
Power Supply Current (Note 5)
Power Down Current POWERDOWN = 1 1 mA
Reference Oscillator Input Frequency Range for Square Wave
Square Wave Input Voltage for OSCin and OSCin*
Phase Detector Frequency 40 MHz
Charge Pump Source Current
Charge Pump Sink Current
Magnitude of Charge Pump Sink vs. Source Current Mismatch
Magnitude of Charge Pump Current vs. Charge Pump Voltage Variation
Magnitude of Charge Pump Current vs. Temperature Variation
PLL 1/f Noise at 10 kHz Offset (Note 6) Normalized to 1 GHz Output Frequency
Normalized Phase Noise Contribution (Note 7)
Current Consumption
Entire device; one LVDS and one LVPECL clock enabled; no divide; no
161.8
delay.
Entire device; All Outputs Off (no emitter resistors placed)
86
Reference Oscillator
1 200 MHz
AC coupled; Differential (VOD)
0.2 1.6 Vpp
PLL
V
= Vcc/2, PLL_CP_GAIN = 1x
CPout
V
= Vcc/2, PLL_CP_GAIN = 4x
CPout
V
= Vcc/2, PLL_CP_GAIN = 16x
CPout
V
= Vcc/2, PLL_CP_GAIN = 32x
CPout
100
400
1600
3200
PLL (Continued)
V
= Vcc/2, PLL_CP_GAIN = 1x
CPout
V
= Vcc/2, PLL_CP_GAIN = 4x
CPout
V
= Vcc/2, PLL_CP_GAIN = 16x
CPout
V
= Vcc/2, PLL_CP_GAIN = 32x
CPout
< Vcc - 0.5 V
CPout
V
= Vcc / 2
CPout
TA = 25°C
0.5 V < V
< Vcc - 0.5 V
CPout
TA = 25°C
-100
-400
-1600
-3200
2 10 nA
3 %
4 %
4 %
PLL_CP_GAIN = 1x -117
PLL_CP_GAIN = 32x -122
PLL_CP_GAIN = 1x -219
PLL_CP_GAIN = 32x -224
mA
µA
μA
dBc/Hz
dBc/Hz
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Symbol Parameter Conditions Min Typ Max Units
VCO
LMK03000C/LMK03000/LMK03000D 1185 1296
f
Fout
VCO Tuning Range
LMK03033C/LMK03033 1843 2160
After programming R15 for lock, no
TCL|
Allowable Temperature Drift for Continuous Lock
changes to output configuration are permitted to guarantee continuous
125 °C
lock. (Note 8)
LMK03000C/LMK03000/LMK03000D; TA = 25 °C
p
Fout
Output Power to a 50 load driven by Fout (Note 10)
LMK03001C/LMK03001/LMK03001D; TA = 25 °C
LMK03033C/LMK03033;TA = 25 °C
3.3
2.7
-5 to 0
LMK03000C/LMK03000/LMK03000D 7 to 9
K
VCO
Fine Tuning Sensitivity (Note 9)
LMK03033C/LMK03033 14 to 26
LMK03000C/LMK03001C 400
LMK03000/LMK03001 800
LMK03000D/LMK03001D 1200
LMK03033C 500
J
RMS
Fout
Fout RMS Period Jitter (12 kHz to 20 MHz bandwidth)
LMK03033 800
10 kHz Offset -91.4
100 kHz Offset -116.8
1 MHz Offset -137.8
10 MHz Offset -156.9
10 kHz Offset -93.5
100 kHz Offset -118.5
1 MHz Offset -139.4
10 MHz Offset -158.4
10 kHz Offset -89.6
100 kHz Offset -115.2
1 MHz Offset -136.5
10 MHz Offset -156.0
10 kHz Offset -91.6
100 kHz Offset -116.0
1 MHz Offset -137.9
10 MHz Offset -156.2
10 kHz Offset -83
100 kHz Offset -109
1 MHz Offset -131
10 MHz Offset -152
10 kHz Offset -86
100 kHz Offset -111
1 MHz Offset -134
10 MHz Offset -153
L(f)
Fout
Fout Single Side Band Phase Noise
LMK03000C f
= 1296 MHz
Fout
(Note 11)
LMK03000C f
= 1185 MHz
Fout
(Note 11)
LMK03001C f
= 1570 MHz
Fout
(Note 11)
LMK03001C f
= 1470 MHz
Fout
(Note 11)
LMK03033C f
= 2160 MHz
Fout
(Note 11)
LMK03033C f
= 1843 MHz
Fout
(Note 11)
LMK03000 Family
MHzLMK03001C/LMK03001/LMK03001D 1470 1570
dBm
MHz/VLMK03001C/LMK03001/LMK03001D 9 to 11
fs
dBc/Hz
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Symbol Parameter Conditions Min Typ Max Units
Clock Distribution Section (Notes 12, 13) - LVDS Clock Outputs
CLKoutX_MUX
Jitter
LMK03000 Family
ADD
Additive RMS Jitter (Note 12)
RL = 100 Ω Distribution Path = 765 MHz Bandwidth = 12 kHz to 20 MHz
= Bypass (no divide or delay)
CLKoutX_MUX = Divided (no delay) CLKoutX_DIV =
20
75
4
Equal loading and identical clock
t
SKEW
CLKoutX to CLKoutY (Note 14)
configuration
-30 ±4 30 ps
RL = 100 Ω
V
ΔV
V
ΔV
I
SA
I
SB
I
SAB
OD
OD
OS
OS
Differential Output Voltage
Change in magnitude of VOD for complementary output states
Output Offset Voltage
Change in magnitude of VOS for complementary output states
Clock Output Short Circuit Current single-ended
Clock Output Short Circuit Current differential
RL = 100 Ω
RL = 100 Ω
RL = 100 Ω
RL = 100 Ω
250 350 450 mV
-50 50 mV
1.070 1.25 1.370 V
-35 35 mV
Single-ended outputs shorted to GND -24 24 mA
Complementary outputs tied together -12 12 mA
Clock Distribution Section (Notes 12, 13) - LVPECL Clock Outputs
CLKoutX_MUX
Jitter
ADD
Additive RMS Jitter (Note 12)
RL = 100 Ω Distribution Path = 765 MHz Bandwidth = 12 kHz to 20 MHz
= Bypass (no divide or delay)
CLKoutX_MUX = Divided (no delay) CLKoutX_DIV =
20
75
4
Equal loading and identical clock
t
SKEW
CLKoutX to CLKoutY (Note 14)
configuration
-30 ±3 30 ps
Termination = 50 Ω to Vcc - 2 V
V
OH
Output High Voltage
Termination = 50 Ω to Vcc - 2 V
V
OL
V
OD
Output Low Voltage
Differential Output Voltage
RL = 100 Ω
660 810 965 mV
Vcc -
0.98
Vcc -
1.8
Digital LVTTL Interfaces (Note 15)
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
High-Level Input Voltage 2.0 Vcc V
Low-Level Input Voltage 0.8 V
High-Level Input Current
Low-Level Input Current
High-Level Output Voltage
Low-Level Output Voltage
VIH = Vcc
VIL = 0
IOH = +500 µA
IOL = -500 µA
-5.0 5.0 µA
-40.0 5.0 µA
Vcc -
0.4
V
0.4 V
Digital MICROWIRE Interfaces (Note 16)
V
IH
V
IL
I
IH
I
IL
High-Level Input Voltage 1.6 Vcc V
Low-Level Input Voltage 0.4 V
High-Level Input Current
Low-Level Input Current
VIH = Vcc
VIL = 0
-5.0 5.0 µA
-5.0 5.0 µA
fs
fs
V
V
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Symbol Parameter Conditions Min Typ Max Units
MICROWIRE Timing
t
CS
t
CH
t
CWH
t
CWL
t
ES
t
CES
t
EWH
Note 4: The Electrical Characteristics table lists guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 5: See 3.5 for more current consumption / power dissipation calculation information.
Note 6: A specification in modeling PLL in-band phase noise is the 1/f flicker noise, L
dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = L (f) is the single side band phase noise of only the flicker noise's contribution to total noise, L(f). To measure L slope close to the carrier. A high compare frequency and a clean crystal are important to isolating this noise source from the total phase noise, L(f). L can be masked by the reference oscillator performance if a low power or noisy source is used. The total PLL inband phase noise performance is the sum of L
PLL_flicker
Note 7: A specification in modeling PLL in-band phase noise is the Normalized Phase Noise Contribution, L L
PLL_flat
detector frequency of the synthesizer. L smaller then the loop bandwidth of the PLL, and yet large enough to avoid a substantial noise contribution from the reference and flicker noise. L masked by the reference oscillator performance if a low power or noisy source is used.
Note 8: Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction and stay in lock from the ambient temperature and programmed state at which the device was when register R15 was programmed. The action of programming the R15 register, even to the same value, activates a frequency calibration routine. This implies that the device will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reprogram the R15 register to ensure that the device stays in lock. Regardless of what temperature the device was initially programmed at, the ambient temperature can never drift outside the range of -40 °C TA 85 °C without violating specifications. For this specification to be valid, the programmed state of the device must not change after R15 is programmed.
Note 9: The lower sensitivity indicates the typical sensitivity at the lower end of the tuning range, the higher sensitivity at the higher end of the tuning range
Note 10: Output power varies as a function of frequency. When a range is shown, the higher output power applies to the lower frequency and the lower output
power applies to the higher frequency.
Note 11: VCO phase noise is measured assuming the VCO is the dominant noise source due to a 75 Hz loop bandwidth. Over frequency, the phase noise typically varies by 1 to 2 dB, with the worst case performance typically occurring at the highest frequency. Over temperature, the phase noise typically varies by 1 to 2 dB, assuming the device is not reprogrammed. Reprogramming R15 will run the frequency calibration routine for optimum phase noise.
Note 12: The Clock Distribution Section includes all parts of the device except the PLL and VCO sections. Typical Additive Jitter specifications apply to the clock distribution section only and this adds in an RMS fashion to the shaped jitter of the PLL and the VCO.
Note 13: For CLKout frequencies above 1 GHz, the delay should be limited to one half of a period. For 1 GHz and below, the maximum delay can be used.
Note 14: Specification is guaranteed by characterization and is not tested in production.
Note 15: Applies to GOE, LD, and SYNC*.
Note 16: Applies to CLKuWire, DATAuWire, and LEuWire.
Data to Clock Set Up Time See Data Input Timing 25 ns
Data to Clock Hold Time See Data Input Timing 8 ns
Clock Pulse Width High See Data Input Timing 25 ns
Clock Pulse Width Low See Data Input Timing 25 ns
Clock to Enable Set Up Time See Data Input Timing 25 ns
Enable to Clock Set Up Time See Data Input Timing 25 ns
Enable Pulse Width High See Data Input Timing 25 ns
(f), which is dominant close to the carrier. Flicker noise has a 10
(f) and L
(f) – 20log(N) – 10log(f
PLL_flat
(f).
COMP
PLL_flicker
). L
(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz Bandwidth and f
PLL_flat
(f) contributes to the total noise, L(f). To measure L
PLL_flat
PLL_flat
(10 kHz) - 20log(Fout / 1 GHz), where L
PLL_flicker
(f) the offset frequency, f, must be chosen sufficiently
(f) it is important to be on the 10 dB/decade
PLL_flicker
(f), of the PLL and is defined as PN1Hz =
PLL_flat
is the phase
COMP
PLL_flat
PLL_flicker
PLL_flicker
(f) can be
LMK03000 Family
(f)

Serial Data Timing Diagram

20211403
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the CLKuWire signal. On the rising edge of the LEuWire signal, the data is sent from the shift register to the addressed register determined by the LSB bits. After the programming is complete the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state. It is rec­ommended that the slew rate of CLKuWire, DATAuWire, and LEuWire should be at least 30 V/μs.
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