LMK01000 Family 1.6 GHz High Performance Clock Buffer,
Divider, and Distributor
LMK01000 Family 1.6 GHz High Performance Clock Buffer, Divider, and Distributor
General Description
The LMK01000 family provides an easy way to divide and
distribute high performance clock signals throughout the system. These devices provide best-in-class noise performance
and are designed to be pin-to-pin and footprint compatible
with LMK03000/LMK02000 family of precision clock conditioners.
The LMK01000 family features two programmable clock inputs (CLKin0 and CLKin1) that allow the user to dynamically
switch between different clock domains.
Each device features 8 clock outputs with independently programmable dividers and delay adjustments. The outputs of
the device can be easily synchronized by an external pin
(SYNC*).
Target Applications
High performance Clock Distribution
■
Wireless Infrastructure
■
Medical Imaging
■
Wired Communications
■
Test and Measurement
■
Military / Aerospace
■
System Diagram
Features
30 fs additive jitter (100 Hz to 20 MHz)
■
Dual clock inputs
■
Programmable output channels (0 to 1600 MHz)
■
External synchronization
■
Pin compatible family of clocking devices
■
3.15 to 3.45 V operation
■
Package: 48 pin LLP (7.0 x 7.0 x 0.8 mm)
■
Device
LMK0100035
LMK0101080
LMK0102008
LVDS
Outputs
LVPECL
Outputs
30042806
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
2, 7, 9,10, 32NC-No Connect. Pin is not connected to the die.
3, 8, 13, 16, 19, 22, 26,
30, 31, 33, 37, 40, 43, 46
4CLKuWireIMICROWIRE Clock Input
5DATAuWireIMICROWIRE Data Input
6LEuWireIMICROWIRE Latch Enable Input
11GOEIGlobal Output Enable
12TestO
14, 15CLKout0, CLKout0*OClock Output 0
17, 18CLKout1, CLKout1*OClock Output 1
20, 21CLKout2, CLKout2*OClock Output 2
23, 24CLKout3, CLKout3*OClock Output 3
27SYNC*IGlobal Clock Output Synchronization
28, 29CLKin0,CLKin0*ICLKin 0 Input; Must be AC coupled
34, 35CLKin1, CLKin1*ICLKin 1 Input; Must be AC coupled
36BiasIBias Bypass
38, 39CLKout4, CLKout4*OClock Output 4
41, 42CLKout5, CLKout5*OClock Output 5
44, 45CLKout6, CLKout6*OClock Output 6
47, 48CLKout7, CLKout7*OClock Output 7
DAPDAP-Die Attach Pad should be connected to ground.
Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7,
Vcc8, Vcc9, Vcc10, Vcc11, Vcc12, Vcc13, Vcc14
-Power Supply
This is an output pin used strictly for test purposes
and should be not connected for normal operation.
However, any load of an impedance of more than 1
kΩ is acceptable.
LMK01000 Family
The LMK01000 family is footprint compatible with the LMK03000/02000 family of devices. All CLKout pins are pin-to-pin compatible,
and CLKin0 and CLKin1 are equivalent to OSCin and Fin, respectively.
Device Configuration Information
OutputLMK01000LMK01010LMK01020
CLKout0LVDSLVDSLVPECL
CLKout1LVDSLVDSLVPECL
CLKout2LVDSLVDSLVPECL
CLKout3LVPECLLVDSLVPECL
CLKout4LVPECLLVDSLVPECL
CLKout5LVPECLLVDSLVPECL
CLKout6LVPECLLVDSLVPECL
CLKout7LVPECLLVDSLVPECL
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Absolute Maximum Ratings (Note 1, Note 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors
for availability and specifications.
ParameterSymbolRatingsUnits
Power Supply Voltage
LMK01000 Family
Input Voltage
Storage Temperature Range
Lead Temperature (solder 4 s)
Junction Temperature
V
CC
V
IN
T
STG
T
L
T
J
-0.3 to 3.6V
-0.3 to (VCC + 0.3)
-65 to 150°C
+260°C
125°C
Recommended Operating Conditions
ParameterSymbolMinTypMaxUnits
Ambient Temperature
Power Supply Voltage
Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 2: This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD protected work
stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
T
A
V
CC
-402585°C
3.153.33.45V
Package Thermal Resistance
V
Package
θ
JA
θ
J-PAD (Thermal Pad)
48-Lead LLP (Note 3)27.4° C/W5.8° C/W
Note 3: Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key
role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in the board layout.
Electrical Characteristics (Note 4)
(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most likely
parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product characterization
and are not guaranteed).
SymbolParameterConditionsMinTypMaxUnits
Current Consumption
I
CC
ICCPD
f
CLKin
SLEW
DUTY
P
CLKin
CLKin
CLKin
All outputs
enabled, no
divide or delay
Power Supply Current
(Note 5)
( CLKoutX_MUX
= Bypassed )
Per channel, no
divide or delay
(CLKoutX_MUX
= Bypassed )
Power Down CurrentPOWERDOWN = 11
CLKin0, CLKin0*, CLKin1, CLKin1*
CLKin Frequency Range11600MHz
CLKin Frequency Input Slew Rate(Note 6, Note 8)0.5V/ns
f
≤ 800 MHz
CLKin Frequency Input Duty Cycle
Input Power Range for CLKin or
CLKin*
CLKin
f
> 800 MHz
CLKin
AC coupled-135dBm
LMK01000271
LMK01010160
LMK01020338
LVDS17.8
LVPECL
(Includes Emitter
40
Resistors)
3070
4060
mA
%
www.national.com4
SymbolParameterConditionsMinTypMaxUnits
Clock Distribution Section--Delays
f
≤ 1 GHz
Delay
CLKout
Maximum Allowable Delay(Note 8)
CLKoutX
(Delay is limited to maximum
programmable value)
f
> 1 GHz
CLKoutX
(Delay is limited to 1/2 of a period)
2250
0.5/
f
CLKoutX
Clock Distribution Section - Divides
Divide
CLKoutX
Allowable divide range. (Note that 1 is
the only allowable odd divide value)
Note 4: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 5: See section 3.2 for more current consumption / power dissipation calculation information.
Note 6: For all frequencies the slew rate, SLEW
Note 7: The noise floor of the divider is measured as the far out phase noise of the divider. Typically this offset is 40 MHz, but for lower frequencies this
measurement offset can be as low as 5 MHz due to measurement equipment limitations. If the delay is used, then use section 1.3.
Note 8: Specification is guaranteed by characterization and is not tested in production.
Note 9: See characterization plots to see how this parameter varies over frequency.
Note 10: Applies to GOE, LD, and SYNC*.
Note 11: Applies to CLKuWire, DATAuWire, and LEuWire.
Data to Clock Set Up TimeSee Data Input Timing25ns
Data to Clock Hold TimeSee Data Input Timing8ns
Clock Pulse Width HighSee Data Input Timing25ns
Clock Pulse Width LowSee Data Input Timing25ns
Clock to Enable Set Up TimeSee Data Input Timing25ns
Enable to Clock Set Up TimeSee Data Input Timing25ns
Enable Pulse Width HighSee Data Input Timing25ns
, is measured between 20% and 80%.
CLKin1
LMK01000 Family
Serial Data Timing Diagram
30042803
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the CLKuWire signal. On
the rising edge of the LEuWire signal, the data is sent from the shift register to the addressed register determined by the LSB bits.
After the programming is complete the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state. The slew
rate of CLKuWire, DatauWire, and LEuWire should be at least 30 V/µs.
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