National Semiconductor LMK01000 Technical data

July 15, 2009
LMK01000 Family
LMK01000 Family 1.6 GHz High Performance Clock Buffer, Divider, and Distributor
LMK01000 Family 1.6 GHz High Performance Clock Buffer, Divider, and Distributor

General Description

The LMK01000 family provides an easy way to divide and distribute high performance clock signals throughout the sys­tem. These devices provide best-in-class noise performance and are designed to be pin-to-pin and footprint compatible with LMK03000/LMK02000 family of precision clock condi­tioners.
The LMK01000 family features two programmable clock in­puts (CLKin0 and CLKin1) that allow the user to dynamically switch between different clock domains.
Each device features 8 clock outputs with independently pro­grammable dividers and delay adjustments. The outputs of the device can be easily synchronized by an external pin (SYNC*).

Target Applications

High performance Clock Distribution
Wireless Infrastructure
Medical Imaging
Wired Communications
Test and Measurement
Military / Aerospace

System Diagram

Features

30 fs additive jitter (100 Hz to 20 MHz)
Dual clock inputs
Programmable output channels (0 to 1600 MHz)
External synchronization
Pin compatible family of clocking devices
3.15 to 3.45 V operation
Package: 48 pin LLP (7.0 x 7.0 x 0.8 mm)
Device
LMK01000 3 5
LMK01010 8 0
LMK01020 0 8
LVDS
Outputs
LVPECL Outputs
30042806
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© 2009 National Semiconductor Corporation 300428 www.national.com

Functional Block Diagram

LMK01000 Family
30042801

Connection Diagram

48-Pin LLP Package
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30042802

Pin Descriptions

Pin # Pin Name I/O Description
1, 25 GND - Ground
2, 7, 9,10, 32 NC - No Connect. Pin is not connected to the die.
3, 8, 13, 16, 19, 22, 26,
30, 31, 33, 37, 40, 43, 46
4 CLKuWire I MICROWIRE Clock Input
5 DATAuWire I MICROWIRE Data Input
6 LEuWire I MICROWIRE Latch Enable Input
11 GOE I Global Output Enable
12 Test O
14, 15 CLKout0, CLKout0* O Clock Output 0
17, 18 CLKout1, CLKout1* O Clock Output 1
20, 21 CLKout2, CLKout2* O Clock Output 2
23, 24 CLKout3, CLKout3* O Clock Output 3
27 SYNC* I Global Clock Output Synchronization
28, 29 CLKin0,CLKin0* I CLKin 0 Input; Must be AC coupled
34, 35 CLKin1, CLKin1* I CLKin 1 Input; Must be AC coupled
36 Bias I Bias Bypass
38, 39 CLKout4, CLKout4* O Clock Output 4
41, 42 CLKout5, CLKout5* O Clock Output 5
44, 45 CLKout6, CLKout6* O Clock Output 6
47, 48 CLKout7, CLKout7* O Clock Output 7
DAP DAP - Die Attach Pad should be connected to ground.
Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7,
Vcc8, Vcc9, Vcc10, Vcc11, Vcc12, Vcc13, Vcc14
- Power Supply
This is an output pin used strictly for test purposes and should be not connected for normal operation. However, any load of an impedance of more than 1 kΩ is acceptable.
LMK01000 Family
The LMK01000 family is footprint compatible with the LMK03000/02000 family of devices. All CLKout pins are pin-to-pin compatible, and CLKin0 and CLKin1 are equivalent to OSCin and Fin, respectively.

Device Configuration Information

Output LMK01000 LMK01010 LMK01020
CLKout0 LVDS LVDS LVPECL
CLKout1 LVDS LVDS LVPECL
CLKout2 LVDS LVDS LVPECL
CLKout3 LVPECL LVDS LVPECL
CLKout4 LVPECL LVDS LVPECL
CLKout5 LVPECL LVDS LVPECL
CLKout6 LVPECL LVDS LVPECL
CLKout7 LVPECL LVDS LVPECL
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Absolute Maximum Ratings (Note 1, Note 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Parameter Symbol Ratings Units
Power Supply Voltage
LMK01000 Family
Input Voltage
Storage Temperature Range
Lead Temperature (solder 4 s)
Junction Temperature
V
CC
V
IN
T
STG
T
L
T
J
-0.3 to 3.6 V
-0.3 to (VCC + 0.3)
-65 to 150 °C
+260 °C
125 °C

Recommended Operating Conditions

Parameter Symbol Min Typ Max Units
Ambient Temperature
Power Supply Voltage
Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
Note 2: This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
T
A
V
CC
-40 25 85 °C
3.15 3.3 3.45 V

Package Thermal Resistance

V
Package
θ
JA
θ
J-PAD (Thermal Pad)
48-Lead LLP (Note 3) 27.4° C/W 5.8° C/W
Note 3: Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in the board layout.
Electrical Characteristics (Note 4)
(3.15 V Vcc 3.45 V, -40 °C TA 85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
Current Consumption
I
CC
ICCPD
f
CLKin
SLEW
DUTY
P
CLKin
CLKin
CLKin
All outputs enabled, no divide or delay
Power Supply Current (Note 5)
( CLKoutX_MUX = Bypassed )
Per channel, no divide or delay (CLKoutX_MUX = Bypassed )
Power Down Current POWERDOWN = 1 1
CLKin0, CLKin0*, CLKin1, CLKin1*
CLKin Frequency Range 1 1600 MHz
CLKin Frequency Input Slew Rate (Note 6, Note 8) 0.5 V/ns
f
800 MHz
CLKin Frequency Input Duty Cycle
Input Power Range for CLKin or CLKin*
CLKin
f
> 800 MHz
CLKin
AC coupled -13 5 dBm
LMK01000 271
LMK01010 160
LMK01020 338
LVDS 17.8
LVPECL (Includes Emitter
40
Resistors)
30 70
40 60
mA
%
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Symbol Parameter Conditions Min Typ Max Units
Clock Distribution Section--Delays
f
1 GHz
Delay
CLKout
Maximum Allowable Delay(Note 8)
CLKoutX
(Delay is limited to maximum programmable value)
f
> 1 GHz
CLKoutX
(Delay is limited to 1/2 of a period)
2250
0.5/
f
CLKoutX
Clock Distribution Section - Divides
Divide
CLKoutX
Allowable divide range. (Note that 1 is the only allowable odd divide value)
f
1300 MHz
CLKinX
1300 MHz < f
CLKinX
1600 MHz
1 510
1 2
Clock Distribution Section - LVDS Clock Outputs
f
Jitter
ADD
Additive RMS Jitter (Note 7)
Noise Floor Divider Noise Floor(Note 7)
RL = 100 Ω Bandwidth = 100 Hz to 20 MHz Vboost = 1
RL = 100 Ω Vboost = 1
CLKoutX
f
CLKoutX
f
CLKoutX
f
CLKoutX
f
CLKoutX
f
CLKoutX
= 200 MHz
= 800 MHz
= 1600 MHz
= 200 MHz
= 800 MHz
= 1600 MHz
80
30
25
-156
-153
-148
Equal loading and identical clock
t
SKEW
CLKoutX to CLKoutY (Note 8)
configuration
-30 ±4 30 ps
RL = 100 Ω
V
ΔV
V
ΔV
I
SA
I
SB
I
SAB
OD
OS
OD
OS
Differential Output Voltage (Note 9)
Change in magnitude of VOD for complementary output states
Output Offset Voltage
Change in magnitude of VOS for complementary output states
Clock Output Short Circuit Current single ended
Clock Output Short Circuit Current differential
RL = 100 Ω
RL = 100 Ω
RL = 100 Ω
Single ended outputs shorted to GND -24 24 mA
Complementary outputs tied together -12 12 mA
Vboost=0 250 350 450
Vboost=1 390
-50 50 mV
1.070 1.25 1.370 V
-35 35 mV
LMK01000 Family
ps
n/a
fs
dBc/Hz
mV
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Symbol Parameter Conditions Min Typ Max Units
Clock Distribution Section - LVPECL Clock Outputs
f
Jitter
ADD
Additive RMS Jitter(Note 7)
LMK01000 Family
Noise Floor Divider Noise Floor(Note 7)
RL = 100 Ω Bandwidth = 100 Hz to 20 MHz Vboost = 1
RL = 100 Ω Vboost = 1
CLKoutX
f
CLKoutX
f
CLKoutX
f
CLKoutX
f
CLKoutX
f
CLKoutX
= 200 MHz
= 800 MHz
= 1600 MHz
= 200 MHz
= 800 MHz
= 1600 MHz
65
25
25
-158
-154
-148
Equal loading and identical clock
t
SKEW
CLKoutX to CLKoutY (Note 8)
configuration
-30 ±3 30 ps
Termination = 50 Ω to Vcc - 2 V
V
OH
Output High Voltage
Termination = 50 Ω to Vcc - 2 V
V
OL
V
OD
Output Low Voltage
Differential Output Voltage (Note 9)
Vboost = 0 660 810 965
Vboost = 1 865
Vcc -
0.98
Vcc -
1.8
Digital LVTTL Interfaces (Note 10)
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
High-Level Input Voltage 2.0 Vcc V
Low-Level Input Voltage 0.8 V
High-Level Input Current
Low-Level Input Current
High-Level Output Voltage
Low-Level Output Voltage
VIH = Vcc
VIL = 0
IOH = +500 µA
IOL = -500 µA
-5.0 5.0 µA
-40.0 5.0 µA
Vcc -
0.4
V
0.4 V
fs
dBc/Hz
V
V
mV
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Symbol Parameter Conditions Min Typ Max Units
Digital MICROWIRE Interfaces (Note 11)
V
IH
V
IL
I
IH
I
IL
High-Level Input Voltage 1.6 Vcc V
Low-Level Input Voltage 0.4 V
High-Level Input Current
Low-Level Input Current
VIH = Vcc
VIL = 0
-5.0 5.0 µA
-5.0 5.0 µA
MICROWIRE Timing
t
CS
t
CH
t
CWH
t
CWL
t
ES
t
CES
t
EWH
Note 4: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 5: See section 3.2 for more current consumption / power dissipation calculation information.
Note 6: For all frequencies the slew rate, SLEW
Note 7: The noise floor of the divider is measured as the far out phase noise of the divider. Typically this offset is 40 MHz, but for lower frequencies this
measurement offset can be as low as 5 MHz due to measurement equipment limitations. If the delay is used, then use section 1.3.
Note 8: Specification is guaranteed by characterization and is not tested in production.
Note 9: See characterization plots to see how this parameter varies over frequency.
Note 10: Applies to GOE, LD, and SYNC*.
Note 11: Applies to CLKuWire, DATAuWire, and LEuWire.
Data to Clock Set Up Time See Data Input Timing 25 ns
Data to Clock Hold Time See Data Input Timing 8 ns
Clock Pulse Width High See Data Input Timing 25 ns
Clock Pulse Width Low See Data Input Timing 25 ns
Clock to Enable Set Up Time See Data Input Timing 25 ns
Enable to Clock Set Up Time See Data Input Timing 25 ns
Enable Pulse Width High See Data Input Timing 25 ns
, is measured between 20% and 80%.
CLKin1
LMK01000 Family

Serial Data Timing Diagram

30042803
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the CLKuWire signal. On the rising edge of the LEuWire signal, the data is sent from the shift register to the addressed register determined by the LSB bits. After the programming is complete the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state. The slew rate of CLKuWire, DatauWire, and LEuWire should be at least 30 V/µs.
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