LMH6678
Low Power 2-Channel Central-Office xDSL Driver
LMH6678 Low Power 2-Channel Central-Office xDSL Driver
December 2003
General Description
The LMH6678 is a low power 2-channel differential output
driver utilizing dual current feedback op amps with a fixed
gain of A
The LMH6678 utilizes high integration with low power consumption to provide 580 mW at 19.8 dBm line output. The
LMH6678 can also be put into a listen mode to maintain the
termination for receive signals with 100 mW/Ch power dissipation.
The LMH6678 has two separate 2-bit power control inputs
compatible with 3.3V CMOS for each channel that enable
independent control of line status. When the drivers for both
channels are shut off, power consumption drops to only 6
mW.
Thermal Shutdown function protects the IC from a shorted
line fault or system over temperature.
The LMH6678 is available in a 5mm x 4mm 24-lead LLP
package.
= +5.4.
V
Block Diagram
Features
AV
=AV
CC1
2/3 Power Mode, Typical values unless specified.
n Low power consumption
— Line power P
— No signal185 mW/Ch
— Listen mode100 mW/Ch
— Shutdown mode3 mW/Ch
n Power Supply
— Analog (AV
— Digital (DV
n Output voltage swing
— Single ended11.5 V
— Differential23 V
n Multi tone power ratio, f = 500 kHz72 dB
n Output current580 mA
n Thermal shutdown protection
n 5mm x 4mm LLP package
n Low thermal resistance36˚C/W (θ
n Small PCB footprint
= +12V, AVDD=DVDD= +3.3V, TA= 25˚C,
CC2
= 100 mW580 mW/Ch
LINE
,AV
CC1
,AVDD)+3.3V
DD
)+12V
CC2
@
RL=31Ω
PP
PP
JA
Application
n Full rate ADSL, ADSL+, ADSL++ or G. Lite linecard
n Remote DSLAMs
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
LMH6678
Distributors for availability and specifications.
ESD Tolerance
Human Body Model2KV (Note 2)
Machine Model200V (Note 8)
Differential
V
IN
Supply Voltages
AV
– AGND or AV
CC1
AGND+13.2V
– DGND+3.6V
DV
DD
AV
– AGND+3.6V
DD
DGND − AGND
AV
–AV
AV
CC1
DD
–DV
CC2
DD
Voltage at Input Pin
Analog InputAV
CC2
–
(AV
CC1
±
3V
±
0.2V
±
0.2V
±
0.2V
) +0.8V,
CC2
AGND −0.8V
Digital Control InputDV
DD
+0.8V,
DGND −0.8V
Soldering Information
Infrared or Convection (20 sec.)235˚C
Storage Temperature Range−65˚C to +150˚C
Junction Temperature (Note 4)+150˚C
Operating Ratings (Note 1)
Supply Voltage
AV
to AGND+12V±10%
CC1
AV
to AGND+12V±10%
CC2
DV
to DGND+3.3V±10%
DD
AV
to AGND+3.3V±10%
DD
Operating Temperature Range
(Note 3), (Note 4)
Package Thermal Resistance (θ
(Note 4)
)
JA
−40˚C to +85˚C
36˚C/W
Electrical Characteristics Unless otherwise specified, all limits guaranteed for T
+12V, DV
SymbolParameterConditionsMin
=AVDD= +3.3V. DGND = AGND = 0V, 2/3 Power Mode. See (Note 9).
DD
(Note 6)
= 25˚C, AV
J
Typ
(Note 5)
CC1
Max
(Note 6)
=AV
CC2
Units
Dynamic Performance
f
CL
SRSlew Rate (Note 7)V
−3 dB BWRL= 100Ω50MHZ
=±2.4V, RL= 100Ω700V/µs
IN_DIFF
Distortion and Noise Response
HD22nd Harmonic Distortionfc = 1 MHz, V
fc = 200 kHz, V
HD33
rd
Harmonic Distortionfc = 1 MHz, VO=2VPP,RL=31Ω−57
fc = 200 kHz, V
=2VPP,RL=31Ω−91
O
=2VPP,RL=31Ω−98
O
=2VPP,RL=31Ω−71
O
dBc
dBc
MTPRMulti-Tone Power Ratiof = 500 kHz72dBc
V
IN
Differential Output Noise100 kHz to 10 MHz57nV/
Input Characteristics
V
IN
R
IN
Input DC VoltageCommon Mode6.046.16.16V
Input ResistanceDifferential
= 10 µA from +IN to −IN
I
DIFF
14.42028.4kΩ
Transfer Characteristics
A
V
Voltage GainV
= −1 to 1V, No Load+5.37+5.40+5.48V/V
IN_DIFF
PSRRPower Supply Rejection Ratio−108dB
XtCross Talkf = 1 MHz, R
V
O
I
SC
Output Voltage Swing HighV
Output Voltage Swing LowV
IN_DIFF
IN_DIFF
V
IN_DIFF
IN_DIFF
IN_DIFF
V
IN_DIFF
Output Short Circuit CurrentSourcing to Ground+800
Sinking to Ground−800
= 100Ω−95
L
=±2.4V, No Load11.85
=±2.4V, RL=31Ω11.6811.75
=±2.4V, I
= 580 mA11.6411.74
OUT
=±2.4V, No Load0.15
=±2.4V, RL=31Ω0.250.36
=±2.4V, I
= 580 mA0.310.39
OUT
VV
VV
mA
=
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LMH6678
Electrical Characteristics Unless otherwise specified, all limits guaranteed for T
+12V, DV
SymbolParameterConditionsMin
I
OUT
V
OC
V
OS
Power Supply (Note 10), (Note 11)
I
CC
I
DV
I
AV
Logic Inputs
V
IH
V
IL
I
IH
I
IL
Charge Pump
f
CP
V
HIGH
V
LOW
=AVDD= +3.3V. DGND = AGND = 0V, 2/3 Power Mode. See (Note 9). (Continued)
DD
(Note 6)
Output CurrentV
Sourcing, R
Sinking, R
IN_DIFF
=±2.4V
=20Ω
L
=20Ω
L
Output Common Mode Voltage5.8966.05V
Output Offset Voltage−400+40mV
AVCCQuiescent Supply CurrentB01B11B02B12
Full PowerLLLL28.63336.9
2/3 PowerHLHL18.62225.4
1/3 PowerLHLH9.21214.3
ShutdownHHHH0.2.95
DVDDQuiescent Supply CurrentB01B11B02B12
Full PowerLLLL111619
2/3 PowerHLHL71215
1/3 PowerLHLH3710.3
ShutdownHHHH0.05.14
AVDDQuiescent Supply CurrentAll Power Modes.81.11.4mA
Input High Voltage2.73.3V
Input Low Voltage00.5V
Input High Current
Input Low Current
@
VIH= 3.3V−0.50.02+0.5µA
@
VIH= 0V−0.50.02+0.5µA
Charge Pump FrequencyMeasure at DRIVE at Full Power2.432.75MHz
Charge Pump High Average
Measure at CstoreH at Full Power+14.6V
Voltage
Charge Pump Low Average
Measure at CstoreL at Full Power−2.7VV
Voltage
= 25˚C, AV
J
Typ
(Note 5)
±
580mA
=AV
CC1
Max
(Note 6)
CC2
=
Units
mA
mA
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5kΩ in series with 100pF.
Note 3: Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚ C.
Note 4: The maximum power dissipation is a function of T
(T
J(MAX)-TA
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Slew rate is the slowest of the rising and falling slew rates.
Note 8: Machine Model, 0Ω in series with 200 pF.
Note 9: Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
Absolute maximum ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
Note 10: Quiescent supply current specification apply for the condition of no input signal. See application section for information on power consumption as a
function of output power, power control bit settings and external resistor R
Note 11: “L” is V
)/θJA. All numbers apply for packages soldered directly onto a PC board. Die attach pad is electrically connected to AGND.
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where T
J=TA
and “H” is VIH.
IL
, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD=
J(MAX)
.
ADJ
>
TA.
J
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Connection Diagram
LMH6678
Note: Die attach pad is electrically connected to AGND