National Semiconductor LMH6678 Technical data

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LMH6678 Low Power 2-Channel Central-Office xDSL Driver
LMH6678 Low Power 2-Channel Central-Office xDSL Driver
December 2003
General Description
The LMH6678 is a low power 2-channel differential output driver utilizing dual current feedback op amps with a fixed gain of A
The LMH6678 has two separate 2-bit power control inputs compatible with 3.3V CMOS for each channel that enable independent control of line status. When the drivers for both channels are shut off, power consumption drops to only 6 mW.
Thermal Shutdown function protects the IC from a shorted line fault or system over temperature.
The LMH6678 is available in a 5mm x 4mm 24-lead LLP package.
= +5.4.
V
Block Diagram
Features
AV
=AV
CC1
2/3 Power Mode, Typical values unless specified. n Low power consumption
— Line power P — No signal 185 mW/Ch — Listen mode 100 mW/Ch — Shutdown mode 3 mW/Ch
n Power Supply
— Analog (AV — Digital (DV
n Output voltage swing
— Single ended 11.5 V — Differential 23 V
n Multi tone power ratio, f = 500 kHz 72 dB n Output current 580 mA n Thermal shutdown protection n 5mm x 4mm LLP package n Low thermal resistance 36˚C/W (θ n Small PCB footprint
= +12V, AVDD=DVDD= +3.3V, TA= 25˚C,
CC2
= 100 mW 580 mW/Ch
LINE
,AV
CC1
,AVDD) +3.3V
DD
) +12V
CC2
@
RL=31
PP
PP
JA
Application
n Full rate ADSL, ADSL+, ADSL++ or G. Lite linecard n Remote DSLAMs
)
20084037
© 2003 National Semiconductor Corporation DS200840 www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/
LMH6678
Distributors for availability and specifications.
ESD Tolerance
Human Body Model 2KV (Note 2)
Machine Model 200V (Note 8)
Differential
V
IN
Supply Voltages
AV
– AGND or AV
CC1
AGND +13.2V
– DGND +3.6V
DV
DD
AV
– AGND +3.6V
DD
DGND − AGND
AV
–AV
AV
CC1
DD
–DV
CC2
DD
Voltage at Input Pin
Analog Input AV
CC2
(AV
CC1
±
3V
±
0.2V
±
0.2V
±
0.2V
) +0.8V,
CC2
AGND −0.8V
Digital Control Input DV
DD
+0.8V,
DGND −0.8V
Soldering Information
Infrared or Convection (20 sec.) 235˚C
Storage Temperature Range −65˚C to +150˚C
Junction Temperature (Note 4) +150˚C
Operating Ratings (Note 1)
Supply Voltage
AV
to AGND +12V±10%
CC1
AV
to AGND +12V±10%
CC2
DV
to DGND +3.3V±10%
DD
AV
to AGND +3.3V±10%
DD
Operating Temperature Range (Note 3), (Note 4)
Package Thermal Resistance (θ (Note 4)
)
JA
−40˚C to +85˚C
36˚C/W
Electrical Characteristics Unless otherwise specified, all limits guaranteed for T
+12V, DV
Symbol Parameter Conditions Min
=AVDD= +3.3V. DGND = AGND = 0V, 2/3 Power Mode. See (Note 9).
DD
(Note 6)
= 25˚C, AV
J
Typ
(Note 5)
CC1
Max
(Note 6)
=AV
CC2
Units
Dynamic Performance
f
CL
SR Slew Rate (Note 7) V
−3 dB BW RL= 100 50 MHZ
=±2.4V, RL= 100 700 V/µs
IN_DIFF
Distortion and Noise Response
HD2 2nd Harmonic Distortion fc = 1 MHz, V
fc = 200 kHz, V
HD3 3
rd
Harmonic Distortion fc = 1 MHz, VO=2VPP,RL=31 −57
fc = 200 kHz, V
=2VPP,RL=31 −91
O
=2VPP,RL=31 −98
O
=2VPP,RL=31 −71
O
dBc
dBc
MTPR Multi-Tone Power Ratio f = 500 kHz 72 dBc
V
IN
Differential Output Noise 100 kHz to 10 MHz 57 nV/
Input Characteristics
V
IN
R
IN
Input DC Voltage Common Mode 6.04 6.1 6.16 V
Input Resistance Differential
= 10 µA from +IN to −IN
I
DIFF
14.4 20 28.4 k
Transfer Characteristics
A
V
Voltage Gain V
= −1 to 1V, No Load +5.37 +5.40 +5.48 V/V
IN_DIFF
PSRR Power Supply Rejection Ratio −108 dB
Xt Cross Talk f = 1 MHz, R
V
O
I
SC
Output Voltage Swing High V
Output Voltage Swing Low V
IN_DIFF
IN_DIFF
V
IN_DIFF
IN_DIFF
IN_DIFF
V
IN_DIFF
Output Short Circuit Current Sourcing to Ground +800
Sinking to Ground −800
= 100 −95
L
=±2.4V, No Load 11.85
=±2.4V, RL=31 11.68 11.75
=±2.4V, I
= 580 mA 11.64 11.74
OUT
=±2.4V, No Load 0.15
=±2.4V, RL=31 0.25 0.36
=±2.4V, I
= 580 mA 0.31 0.39
OUT
VV
VV
mA
=
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LMH6678
Electrical Characteristics Unless otherwise specified, all limits guaranteed for T
+12V, DV
Symbol Parameter Conditions Min
I
OUT
V
OC
V
OS
Power Supply (Note 10), (Note 11)
I
CC
I
DV
I
AV
Logic Inputs
V
IH
V
IL
I
IH
I
IL
Charge Pump
f
CP
V
HIGH
V
LOW
=AVDD= +3.3V. DGND = AGND = 0V, 2/3 Power Mode. See (Note 9). (Continued)
DD
(Note 6)
Output Current V
Sourcing, R Sinking, R
IN_DIFF
=±2.4V
=20
L
=20
L
Output Common Mode Voltage 5.89 6 6.05 V
Output Offset Voltage −40 0 +40 mV
AVCCQuiescent Supply Current B01 B11 B02 B12
Full Power L L L L 28.6 33 36.9
2/3 Power H L H L 18.6 22 25.4
1/3 Power L H L H 9.2 12 14.3
Shutdown H H H H 0.2 .95
DVDDQuiescent Supply Current B01 B11 B02 B12
Full Power L L L L 11 16 19
2/3 Power H L H L 7 12 15
1/3 Power L H L H 3 7 10.3
Shutdown H H H H 0.05 .14
AVDDQuiescent Supply Current All Power Modes .8 1.1 1.4 mA
Input High Voltage 2.7 3.3 V
Input Low Voltage 0 0.5 V
Input High Current
Input Low Current
@
VIH= 3.3V −0.5 0.02 +0.5 µA
@
VIH= 0V −0.5 0.02 +0.5 µA
Charge Pump Frequency Measure at DRIVE at Full Power 2.43 2.75 MHz
Charge Pump High Average
Measure at CstoreH at Full Power +14.6 V
Voltage
Charge Pump Low Average
Measure at CstoreL at Full Power −2.7V V
Voltage
= 25˚C, AV
J
Typ
(Note 5)
±
580 mA
=AV
CC1
Max
(Note 6)
CC2
=
Units
mA
mA
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5kin series with 100pF.
Note 3: Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚ C.
Note 4: The maximum power dissipation is a function of T
(T
J(MAX)-TA
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Slew rate is the slowest of the rising and falling slew rates. Note 8: Machine Model, 0in series with 200 pF.
Note 9: Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T Absolute maximum ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
Note 10: Quiescent supply current specification apply for the condition of no input signal. See application section for information on power consumption as a function of output power, power control bit settings and external resistor R
Note 11: “L” is V
)/θJA. All numbers apply for packages soldered directly onto a PC board. Die attach pad is electrically connected to AGND.
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where T
J=TA
and “H” is VIH.
IL
, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD=
J(MAX)
.
ADJ
>
TA.
J
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Connection Diagram
LMH6678
Note: Die attach pad is electrically connected to AGND
20084038
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
LLP
LMH6678LQ
LMH6678LQX 4.5k Units Tape and Reel
L6678LQ
1k Units Tape and Reel
LQA24A
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Typical Performance Characteristics
LMH6678
Single-Ended Small Signal Frequency Response
@
RL= 100
20084010
Medium Signal Pulse Response
@
RL= 100, 1 MHz
Single-Ended Small Signal Frequency Response
@
RL=36
20084011
Medium Signal Pulse Response
@
RL=36Ω, 1 MHz
Large Signal Pulse Response
@
RL= 100, 1 MHz
20084005
20084006
Large Signal Pulse Response
@
RL=36Ω, 1 MHz
20084008 20084007
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Typical Performance Characteristics (Continued)
LMH6678
Single-Ended Small Signal Frequency Response
@
ZL= 100||100 pF
20084014
Single-Ended Small Signal Frequency Response
@
ZL=36Ω||100 pF
Output Swing@ZL= 100||100 pF, 1 MHz Output Swing@ZL=36Ω||100 pF, 1 MHz
20084013
20084003
20084001
Output Swing@ZL= 100||100 pF, 5 MHz Output Swing@ZL=36Ω||100 pF, 5 MHz
20084004
20084002
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