LM4906
1W, Bypass-Capacitor-less Audio Amplifier with Internal
Selectable Gain
LM4906 1W, Bypass-Capacitor-less Audio Amplifier with Internal Selectable Gain
May 2003
General Description
The LM4906 is an audio power amplifier primarily designed
for demanding applications in mobile phones and other portable communication device applications. It is capable of
delivering 1W of continuous average power to an 8Ω BTL
load with less than 1% distortion (THD+N) from a +5V power
supply.
The LM4906 is the first National Semiconductor Boomer
Power Amplifier that does not require an external PSRR
bypass capacitor. The LM4906 also has an internal selectable gain of either 6dB or 12dB. In addition, no output
coupling capacitors or bootstrap capacitors are required
which makes the LM4906 ideally suited for cell phone and
other low voltage portable applications.
The LM4906 contains advanced pop and click circuitry that
eliminates noise, which would otherwise occur during
turn-on and turn-off transitions.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4906 features a low -power
consumption shutdown mode (the part is enabled by pulling
the SD pin high). Additionally, the LM4906 features an internal thermal shutdown protection mechanism.
Typical Application
Key Specifications
j
Improved PSRR at 217Hz for +3V71dB
j
Power Output at +5V, THD+N = 1%, 8Ω1.0W (typ)
j
Power Output at +3V, THD+N = 1%, 8Ω 390mW (typ)
j
Total shutdown power supply current0.1µA (typ)
Features
n Selectable gain of 6dB (2V/V) or 12dB (4V/V)
n No output or PSRR bypass capacitors required
n Improved “Click and Pop” suppression circuitry
n Very fast turn on time: 5ms (typ)
n Minimum external components
n 2.6 - 5.5V operation
n BTL output can drive capacitive loads
n Ultra low current shutdown mode (SD Low)
Applications
n Portable computers
n Desktop computers
n Multimedia monitors
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 10)6.0V
Thermal Resistance
θ
(MSOP)56˚C/W
JC
θ
(MSOP)190˚C/W
JA
θ
(LLP)12˚C/W
JC
θ
(LLP)63˚C/W
JA
Storage Temperature−65˚C to +150˚C
Input Voltage−0.3V to V
DD
+0.3V
Operating Ratings
Power Dissipation (Notes 3, 11)Internally Limited
ESD Susceptibility (Note 4)2000V
ESD Susceptibility (Note 5)200V
Junction Temperature150˚C
Temperature Range
T
≤ TA≤ T
MIN
MAX
Supply Voltage2.6V ≤ V
Electrical Characteristics VDD=5V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for T
LM4906
SymbolParameterConditions
= 0V, Io= 0A, No Load3.57mA (max)
V
I
DD
I
SD
V
OS
P
o
T
WU
Quiescent Power Supply Current
Shutdown CurrentVSD= GND0.12µA (max)
Output Offset Voltage735mV (max)
Output Power
Wake-up time5ms
THD+NTotal Harmonic Distortion+NoiseP
PSRRPower Supply Rejection Ratio
IN
V
= 0V, Io= 0A, 8Ω Load48mA (max)
IN
THD+N = 1% (max);f=1kHz
=8Ω
R
L
= 0.4 Wrms; f = 1kHz0.2%
o
V
= 200mV sine p-p
ripple
Input terminated with 10Ω
Gain at 6dB
V
SDIH
V
SDIL
Shutdown Voltage Input HighSD Pin High = Part On1.5V (min)
Shutdown Voltage Input LowSD Pin Low = Part Off1.3V (max)
TypicalLimit
(Note 6)(Notes 7, 8)
1.00.9W (min)
67 (f =
217Hz)
70 (f = 1kHz)
−40˚C ≤ TA≤ 85˚C
≤ 5.5V
DD
= 25˚C.
A
Units
(Limits)
dB
Electrical Characteristics VDD=3V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for T
LM4906
SymbolParameterConditions
= 0V, Io= 0A, No Load2.66mA (max)
V
I
DD
I
SD
V
OS
P
o
T
WU
Quiescent Power Supply Current
Shutdown CurrentVSD= GND0.12µA (max)
Output Offset Voltage735mV (max)
Output Power
Wake-up time4ms
THD+NTotal Harmonic Distortion+NoiseP
PSRRPower Supply Rejection Ratio
IN
V
= 0V, Io= 0A, 8Ω Load37mA (max)
IN
THD+N = 1% (max);f=1kHz
=8Ω
R
L
= 0.15 Wrms; f = 1kHz0.1%
o
V
= 200mV sine p-p
ripple
Input terminated with 10Ω
Gain at 6dB
V
SDIH
V
SDIL
Shutdown Voltage Input HighSD Pin High = Part On1.1V (min)
Shutdown Voltage Input LowSD Pin Low = Part Off0.9V (max)
TypicalLimit
(Note 6)(Notes 7, 8)
390mW
71 (f =
217Hz)
73 (f = 1kHz)
= 25˚C.
A
Units
(Limits)
dB
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Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC andAC electrical specifications under particular test conditions which
LM4906
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given; however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
allowable power dissipation is P
curves for additional information.
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF–240pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: R
Note 10: If the product is in Shutdown mode and V
If the source impedance limits the current to a max of 10mA, then the device will be protected. If the device is enabled when V
6.5V, no damage will occur, although operation life will be reduced. Operation above 6.5V with no current limit will result in permanent damage.
Note 11: Maximum power dissipation in the device (P
Equation 1 shown in the Application Information section. It may also be obtained from the power dissipation graphs.
is measured from the output pin to ground. This value represents the parallel combination of the 10kΩ output resistors and the two 20kΩ resistors.
OUT
DMAX
=(T
)/θJAor the number given inAbsolute Maximum Ratings, whichever is lower. For the LM4906, see power derating
JMAX–TA
exceeds 6V (to a max of 8V VDD), then most of the excess current will flow through the ESD protection circuits.
DD
) occurs at an output power level significantly below full output power. P
DMAX
, θJA, and the ambient temperature TA. The maximum
JMAX
is greater than 5.5V and less than
DD
can be calculated using
DMAX
External Components Description
ComponentsFunctional Description
1.C
2.C
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a
2
highpass filter with R
for an explanation of how to determine the value of C
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
1
at fc=1/ (2πRiCi). Refer to the section, Proper Selection of External Components,
i
.
i
section for information concerning proper placement and selection of the supply bypass capacitor.
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Typical Performance Characteristics
LM4906
THD+N vs Frequency
= 5V, RL=8Ω,
V
DD
f = 1kHz, PWR = 500mW
THD+N vs Power Out
= 5V, RL=8Ω, f = 1kHz
V
DD
THD+N vs Frequency
VDD= 3V, RL=8Ω,
f = 1kHz, PWR = 250mW
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THD+N vs Power Out
VDD= 3V, RL=8Ω, f = 1kHz
Power Supply Rejection Ratio
vs Frequency
= 5V, RL=8Ω
V
DD
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Power Supply Rejection Ratio
vs Frequency
VDD= 3V, RL=8Ω
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Typical Performance Characteristics (Continued)
LM4906
Noise Floor
V
= 5V, RL=8Ω
DD
80kHz Bandwith, Input to GND
Power Dissipation
vs Output Power, V
DD
=5V
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Power Derating Curve
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Power Dissipation
vs Output Power, VDD=3V
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Shutdown Hysteresis Voltage
= 5V, SD Mode = VDD(High)
V
DD
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Shutdown Hysteresis Voltage
VDD= 5V, SD Mode = VDD(Low)
Typical Performance Characteristics (Continued)
LM4906
Shutdown Hysteresis Voltage
V
= 3V, SD Mode = VDD(High)
DD
Output Power
vs Supply Voltage, R
L
=8Ω
Shutdown Hysteresis Voltage
VDD= 3V, SD Mode = GND (Low)
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Output Power
vs Supply Voltage, RL=16Ω
Output Power
vs Supply Voltage, R
=32Ω
L
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Frequency Response
vs Input Capacitor Size
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Typical Performance Characteristics (Continued)
LM4906
PSRR Distribution
V
= 5V, f = 1kHz, RL=8Ω
DD
PSRR Distribution
= 3V, f = 1kHz, RL=8Ω
V
DD
PSRR Distribution
VDD= 5V, f = 217Hz, RL=8Ω
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PSRR Distribution
VDD= 3V, f = 217Hz, RL=8Ω
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Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 2, the LM4906 has two internal operational amplifiers. The first amplifier’s gain is either 6dB or
12dB depending on the gain select input (Low = 6dB, High =
12dB). The second amplifier’s gain is fixed by the two internal 20kΩ resistors. Figure 2 shows that the output of amplifier one serves as the input to amplifier two which results in
both amplifiers producing signals identical in magnitude, but
out of phase by 180˚. Consequently, the differential gain for
the IC is
= 2 * (20k / 20k) or 2 * (40k / 20k)
A
VD
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configuration where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing excessive clipping, please refer to the Audio Power AmplifierDesign section.
A bridge configuration, such as the one used in LM4906,
also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased
at half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configuration. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal
IC power dissipation and also possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4906 has two operational amplifiers in one package, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
The maximum power dissipation for a given application can
be derived from the power dissipation graphs or from Equation 1.
=4*(VDD)2/(2π2RL)(1)
P
DMAX
sinking. If T
still exceeds 150˚C, then additional
JMAX
changes must be made. These changes can include reduced supply voltage, higher load impedance, or reduced
ambient temperature. Internal power dissipation is a function
of output power. Refer to the Typical Performance Charac-teristics curves for power dissipation information for different output powers and output loading.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on the power supply pin should be as
close to the device as possible. Typical applications employ
a 5V regulator with 10µF tantalum or electrolytic capacitor
and a ceramic bypass capacitor which aid in supply stability.
This does not eliminate the need for bypassing the supply
nodes of the LM4906.
TURNING ON THE LM4906
The power supply must first be applied before the application
of an input signal to the device and the ramp time to V
DD
must be less than 4ms, otherwise the wake-up time of the
device will be affected. After applying V
, the LM4906 will
DD
turn-on after an initial minimum threshold input signal of
7mV
An input signal of less than 7mV
, resulting in a generated output differential signal.
RMS
will result in a negligible
RMS
output voltage. Once the device is turned on, the input signal
can go below the 7mV
however, SHUTDOWN or V
without shutting the device off. If,
RMS
is cycled, the minimum
DD
threshold requirement for the input signal must first be met
again, with V
ramping first.
DD
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4906 contains shutdown circuitry that is used to turn off
the amplifier’s bias circuitry. The device is placed into shutdown mode by toggling the Shutdown pin Low/ground. The
trigger point for shutdown low is shown as a typical value in
the Supply Current vs Shutdown Voltage graphs in the Typi-cal Performance Characteristics section. It is best to
switch between ground and supply for maximum performance. While the device may be disabled with shutdown
voltages in between ground and supply, the idle current may
be greater than the typical value of 0.1µA. In either case, the
shutdown pin should be tied to a definite voltage to avoid
unwanted state changes.
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry, which provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction with an
external pull-up resistor (or pull-down, depending on shutdown high or low application). This scheme guarantees that
the shutdown pin will not float, thus preventing unwanted
state changes.
LM4906
It is critical that the maximum junction temperature T
150˚C is not exceeded. T
power derating curves by using P
can be determined from the
JMAX
and the PC board foil
DMAX
JMAX
area. By adding copper foil, the thermal resistance of the
application can be reduced from the free air value of θ
resulting in higher P
values without thermal shutdown
DMAX
JA
protection circuitry being activated. Additional copper foil can
be added to any of the leads connected to the LM4906. It is
especially effective when connected to V
, GND, and the
DD
output pins. Refer to the application information on the
LM4906 reference design board for an example of good heat
of
SELECTION OF INPUT CAPACITOR SIZE
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenu-
,
ation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 100Hz to 150Hz. Thus, using a
large input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor,
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Application Information (Continued)
C
LM4906
A larger input coupling capacitor requires more charge to
i.
reach its quiescent DC voltage (nominally 1/2 V
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
AUDIO POWER AMPLIFIER DESIGN
A 1W/8Ω Audio Amplifier
Given:
Power Output1 Wrms
Load Impedance8Ω
Input Level1 Vrms
Input Impedance20 kΩ
Bandwidth100 Hz– 20 kHz
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-formance Characteristics section, the supply rail can be
easily found.
DD
±
0.25 dB
). This
Extra supply voltage creates headroom that allows the
LM4906 to reproduce peaks in excess of 1W without producing audible distortion. At this time, the designer must
make sure that the power supply choice along with the
output impedance does not violate the conditions explained
in the Power Dissipation section.
The gain of the LM4906 is internally set at either 6dB or
12dB.
The final design step is to address the bandwidth requirements which must be stated as a pair of −3dB frequency
points. Five times away from a −3dB point is 0.17dB down
from passband response which is better than the required
±
0.25dB specified.
fL= 100Hz/5=20Hz
= 20kHz*5=100kHz
f
H
As stated in the External Components section, Rin(20k) in
conjunction with C
≥ 1/(2π*20kΩ*20Hz) = 0.397µF; use 0.39µF
C
2
create a highpass filter.
2
FIGURE 2. REFERENCE DESIGN BOARD SCHEMATIC
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Application Information (Continued)
LM4906 MSOP DEMO BOARD ARTWORK
LM4906
Top Layer
Bottom Layer
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Application Information (Continued)
LM4906 LD DEMO BOARD ARTWORK
LM4906
Top Layer
Bottom Layer
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Application Information (Continued)
Mono LM4906 Reference Design Boards
Bill of Material
Part DescriptionQuantityReference Designator
LM4906 Audio Amplifier1U1
Tantalum Capcitor, 1µF1C1
Ceramic Capacitor, 0.39µF1C2
Jumper Header Vertical Mount 2X1 0.100“ spacing5J1, J2, Input, Output, V
LM4906
DD
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
GENERAL MIXED SIGNAL LAYOUT
RECOMMENDATION
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a
major impact on low level signal performance. Star trace
routing refers to using individual traces to feed power and
ground to each circuit or even device. This technique will
require a greater amount of design time but will not increase
the final price of the board. The only extra parts required will
be some jumpers.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing High Frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital and analog ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signal traces
should be located as far away as possible from analog
components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces
parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
LM4906 1W, Bypass-Capacitor-less Audio Amplifier with Internal Selectable Gain
LLP
Order Number LM4906LD
NS Package Number LDA10B
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
labeling, can be reasonably expected to result in a
significant injury to the user.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
www.national.com
National Semiconductor
Europe Customer Support Center
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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